JPS58157190A - Method of producing substrate for flexible printed circuit - Google Patents

Method of producing substrate for flexible printed circuit

Info

Publication number
JPS58157190A
JPS58157190A JP3992182A JP3992182A JPS58157190A JP S58157190 A JPS58157190 A JP S58157190A JP 3992182 A JP3992182 A JP 3992182A JP 3992182 A JP3992182 A JP 3992182A JP S58157190 A JPS58157190 A JP S58157190A
Authority
JP
Japan
Prior art keywords
printed circuit
flexible printed
minutes
producing substrate
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3992182A
Other languages
Japanese (ja)
Other versions
JPH0231516B2 (en
Inventor
康夫 宮寺
正俊 吉田
古新居 進
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP3992182A priority Critical patent/JPS58157190A/en
Publication of JPS58157190A publication Critical patent/JPS58157190A/en
Publication of JPH0231516B2 publication Critical patent/JPH0231516B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0346Organic insulating material consisting of one material containing N
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Structure Of Printed Boards (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明はフレキシブル印刷回路用基板の製造法に関する
。特に耐熱性、可撓性、電気絶縁性、■燃性のすぐれた
フレキシプル印廟回路恭板の表遺汰に−する・ 塊在、ポリインドフィルムと9I14箔とt−法膚銅t
mいてa9甘せてフレキシブル−刷回路用i似1cm捩
壇しているか、ポリイミド2イルムa十分#r熱性かめ
るが、巌層刑の耐熱性が恐い沈めに、2し中シプル4孜
り隔的注買か不満建て、νりえは牛田耐熱惟aせいぜい
280℃機にでるる0 −tcで、耐熱80丁ぐnた嵌盾酌か資殖されて29本
発明に上述の入点Vc−みてなさnたt   −υでわ
る@ 禰ち、本S11明O脅値C酊熱注■丁ぐn友快層mKめ
る0不発明の蒙漕剤■化字榊造を−奴式同じでめって%
、!J41っていてtLい。R+、Rsにテトラカルボ
ン酸残ゑ、RmrX造富のシアイン’!44s  x 
+ y −1とするとX#ゴ1〜[12、yhO〜u8
であるOnは正数である01次、芳香&壜にm甘さnて
いる水票は他O不箔性島で置洪さnていて%よい。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a flexible printed circuit board. Particularly heat resistant, flexible, electrically insulating, and highly flammable, it is used as the surface of a flexible seal circuit board.
I have a 1cm screw plate similar to I for printing circuits, and polyimide 2 ilm a is sufficiently #r heat resistant, but the heat resistance of the rock layer is scary, so I put 2 and 4 treps apart. Depending on the customer's purchase or dissatisfaction, ν Rie is Ushida heat resistant, which is at most 280℃. Don't look at it - υ to break @ Nechi, book S11 Ming O threatening value C drunkenness note ■ Ding n friendly layer mK meru 0 uninvented Mongolian drug ■ Change the character Sakakizo - the same as the guy type Demette%
,! J41 is tL. R+, Rs has a tetracarboxylic acid residue, RmrX rich sheain'! 44s x
+ y −1 then X#go1~[12, yhO~u8
On is a positive number of the 01st order, and the fragrance and sweetness of the bottle are good because they are placed on other islands.

不発@に用いらnる#配ボリイゼドOM慎浴ジ1iンと
テトクカルボン#無水智とを必資に応じて地布りジアミ
ンを加えて刀口熱反地させることに=9表電場n 4 
Used for unexploded @nru #distributed OM Shinbaji 1in and Tetoku carbon #Musui Satoshi according to the necessity and add diamine to make the sword mouth heat rebound = 9 table electric field n 4
.

一般式 Hs NK二コニ−](−門):コニThX−
(=コニ)−】(7(::::])−NH虐で六わ賂C
るジアンンリ^体例として04,4’−ジ(m−アミノ
ンエノキシ)ジフェニルスルホン。
General formula Hs NK Niconi-] (-gate): Koni ThX-
(=Koni) -] (7 (::::]) - NH torture and six bribes C
An example of a dianhydride is 04,4'-di(m-aminoneenoxy)diphenylsulfone.

4.4′−ジ(P−7ミノ28ツキV)ジフェニルスル
ホン、4.4’−ジ(m−アξノフエノキシンジフユニ
ルエーテル、  4.4’−ジ(P−7ミノンエノI?
7ンジフエニルエーテル、4.4′−ジ(m−フイノ2
メツキシ)ジノエニルグロノくン、4゜4′−ジ(P−
アミノ7sノキシンジ2エニル7′ロバ7、 4.4’
−シ(m−7tノフェニルスルホニル〕ジ2メニルエー
テル、4.4′−ジ(P−アミンフェニルスル小ニル)
ジンエニルエーテル、4.4′−シ(m−7iノフエニ
ルテオエーテル)シフ島ニルスル2イド、4.4’−ジ
(P−アミノンエニルナオエーテル)シノエニルスルノ
イト、4.4′−シ(m−アにノノメンインンジンエニ
ルケトン、4.4’−ジ(P−アミノンエノキシ)ジノ
エ;ルクト;y、 4.4’−ジ(m−アミノンメッキ
7)ン2Xニルメタ/、  4.4’−ジ(P−アミノ
2エノキシ」ジ2算ニルメタ/、  4.4’−ジ()
1−ア<7フエ/キシ)ジフェニルへキサフルオログロ
バ/勢かめる0 ナトクカルボン酸ジ無水管としてVゴs、;、4.a’
−ベンゾフェノンテトラカルボン赦ジ無水脣、ヒロメリ
ト#2無水1、s、s’、4.4’−ジ2エニルテトラ
カルボン歌ジ無水w、 2.5,6.7−す2タリンテ
トラカルボ/改ジ黒水切、1,4,5.8−ナフタリン
テトフカルボン販ジ無水v、  4.4’−スルホニル
ジスタル誠無水豐、  s、s’、4.4’−ジ2工二
ルエーテルテトラカルボン峡ジ無水智、シクロベ/タ/
テトラカルボン献ジ無水管、ブタンテトラカルボ/酸ジ
熊水管、エチレンビストリメリテートジ無水膏なとかめ
る0 1次併用できる違Nリジアミンとしてr!4.4’−ジ
アミノジフェニルエーテル、4.4’−ジアイノジ2エ
ニルメタン、  4.4’−ジアゼノジフエニルスルホ
7% 5,5′−シアきノジフェニルスルホン、メタフ
ェニレンシアはン、ノ(ラフエニレンシアミン、  4
.4’−ジアミノジンエニルフロ・(ン。
4.4'-di(P-7 minoneno28tsuki V) diphenyl sulfone, 4.4'-di(m-anophenoxin diphunyl ether, 4.4'-di(P-7 minoneno I?)
7-diphenyl ether, 4,4'-di(m-phino2
4゜4'-di(P-
amino 7s noxin di2enyl 7' donkey 7, 4.4'
-C(m-7tnophenylsulfonyl)di2menyl ether, 4,4'-di(P-aminephenylsulfonyl)
Dienyl ether, 4,4'-di(m-7i nophenyl theoether) Schiff's island nyl 2ide, 4,4'-di(P-aminone enyl naoether) cinoenyl sulnoite, 4,4'-cy (m-a nomeninjin enylketone, 4.4'-di(P-aminoneenoxy)dinoe; y, 4.4'-di(m-aminone plating 7)n 2 .4'-di(P-amino-2-enoxy" dibivalent nylmeth/, 4.4'-di()
1-a<7phe/xy)diphenylhexafluorogloba/segameru0 Natoccarboxylic acid dianhydride as Vgos,;,4. a'
-benzophenonetetracarboxylic anhydride, hyromerito #2 anhydrous 1, s, s', 4,4'-di2enyltetracarboxylic anhydride w, 2.5,6.7-su2 talintetracarbo/modified Dikuro Mizukiri, 1,4,5.8-Naphthalene Tetofcarvone Sales Dianhydride V, 4.4'-Sulfonyl Distal Seinan Suifuo, s, s', 4.4'-Di2-Dyl Ether Tetracarvone Gorge Jimui Satoshi, Shikurobe/ta/
Tetracarboxylic anhydride tube, butane tetracarbo/acidic anhydride tube, ethylene bistrimelitate dianhydride, etc. 0 As a different N-lysium amine that can be used in combination for the first time! 4.4'-diaminodiphenyl ether, 4.4'-diainodiphenylmethane, 7% 4.4'-diazenodiphenylsulfo 5,5'-cyanodiphenyl sulfone, metaphenylene cyano, no(raphenylene) Renxiamin, 4
.. 4'-Diaminodine enylfuro (n.

4.4′−ジアミノジフェニルスルフィド、  L5−
シアミノナフタリン、2,6−ジアiノナフタリン、2
,6−シアミツビリジン、1,4−ジ(P−アミノンエ
ノキシ)べ/ゼン、1.5−ジ(P−1i)2エノキ7
)ベンゼンなどかめるQ本発明のポリイミドtS解する
温媒としてσクレノール、オルトクロルフェノール、P
−クロル2Xノール、P−ブロム2ネノール、2.4−
ジタロルフエノール、2,4.6− )ジクロル2蒸ノ
ール、ニドμペンゼ/、2エノール、スルホフン、メチ
ルスルホラン、ジメチルスルホキシド、トリ2ルオロ酢
酸、キシレノ′ニル、 N −メチル−2−ピロリドン
、 N、N−ジメチルアセドア建ド、 N、N−ジメデ
ルホルムアイド、ヘキサメチル本スホルアミド勢を用い
ることかできる0 1丸、ボリイイド化す4−に生成する水を共sK工9除
去するためにトルエンやキシレン【用いて一層いQ #配一般式で水さn4襞′yII創a尚温にすると米慣
し、嘴惚浴縄1C不浴とlるtのもめるか、−ざらに、
必*&L応じて朱輪剤會硝力口することもで@る。乗―
創としてはイン/アイート化せ切、マレイイド化せ勧な
とかめる。
4.4'-diaminodiphenyl sulfide, L5-
Cyaminonaphthalene, 2,6-diai nonaphthalene, 2
, 6-cyamitubiridine, 1,4-di(P-aminoneenoxy)ben/zene, 1,5-di(P-1i)2enoki7
) σ-clenol, orthochlorophenol, P as a heating medium that dissolves the polyimide tS of the present invention
-Chlor 2Xnol, P-bromo 2nenol, 2.4-
Dithalolphenol, 2,4.6-) dichlor divaporinol, nido μpenze/, 2enol, sulfofun, methylsulfolane, dimethylsulfoxide, tri2fluoroacetate, xylenonyl, N-methyl-2-pyrrolidone, N , N-dimethylacedoylamide, N,N-dimedelformide, and hexamethylhonsphoramide groups can be used. Xylene [Using more Q # distribution general formula with water n4 folds'yII creation a still warm, it gets used to rice, and the bathing rope 1C is not bathed and it's lt's struggle, - roughly,
If necessary, you can also have a vermilion drug meeting. Riding-
As for the creation, it is in/aito conversion, and maleoid conversion is recommended.

一層剤り一般式IChいてXζ1〜0.2の範囲でめる
か、α2LD%小さいと#悪に対する濤解注が慝くlる
onにN、N−ジメチルアセトア建ド甲で11%のIl
lにで50℃で還元粘![を麹足し7を場曾、遺元粘F
ILか01”わ1以上になる数【示す。こむ値以下友と
2レキシプルM板とし九と龜の可憐性が愚くなる・ 本発明には金属箔が必景であるが、一般に鋼箔やフル(
ニクム舶か用いらnる・ 接層方法としてrX厚発明む豪層剤をボリイ(ドフィル
五Kll布し7を俵、濤謙【加拳乾諌するO加熱乾燥の
秦件に100〜500℃で50秒〜50分でTo4゜C
tJ後、鳳布、乾燥ざnたポリイミドフィルムと@鳴音
1ね、加熱、加圧することに1りiI層石ぜてフレ中シ
プル印−−路用fi板とする0 δらに、本発明0嵌層剤から一旦フイル五を作り、この
フィルム【ボリイばドフイルムと金J!J角の蘭Klユ
さみ、加熱、加圧することに19法膚ざゼてフレキシブ
ル印at!!1m用着権とすることも町舵である0 以下に倣層剤のIll法及び実施例について睨−する。
If the general formula ICh is set in the range of Il
Reduced viscosity at 50℃! [Add koji and add 7 to Baso, Genku F
IL or 01" is a number that is greater than or equal to 1. If the value is less than 1 and the 2 lexical M board, the cuteness of 9 and 9 will become stupid. Metal foil is essential for the present invention, but steel foil is generally used. Ya full (
Nikum ships use nru/ As a layering method, they invent a layering agent with rX thickness (Dofyl 5 Kll cloth and 7 bales, Taoken [Kakken drying] O heat drying at 100 to 500℃) To4°C in 50 seconds to 50 minutes
After tJ, the porcelain cloth, the dried rough polyimide film and @Narion 1 are heated and pressurized, and then the iI layer stone is applied to make a sipple mark in the middle of the road.0 δ et al. First, a film was made from the layering agent of the invention, and this film [Boriba Do Film and Gold J! J-angle Ran Kl Yusami, heating and pressurizing the skin 19 times and flexible stamp at! ! It is also a good idea to use a 1m landing. Below, we will look at the Ill method and examples of the imitation layer agent.

綾層銅υ展区 1を針、攪拌欅、リービッヒ冷却器、k本ガス尋入tt
Wえytsoo膳l■四ロフラスコに。
Needle, stirring zelkova, Liebig cooler, k gas interrogation tt in the twill layer copper υ expansion area 1
Wytsoo meal ■ Four-loaf flask.

4.4’−シ(m−アミノ2エノキシ)ジンェニルスル
ホ/1 & 2 g、6.j、4.4’−ベンツ2エノ
/テトラカルボン嫉二無*智12.076g、フレノー
ル200g、)ルエン40g1人n170℃、5時閲反
ふし8ぜて水tトルエンと共に共葬vC感9通い出し罠
。生成し尺ポリイばド解歇■不渾弛分は1265%でめ
った。
4.4'-cy(m-amino2enoxy)dinenylsulfo/1 & 2 g, 6. j, 4.4'-benz 2 eno/tetracarvone envy*chi 12.076 g, frenol 200 g, ) 40 g of luene per person n 170℃, 5 o'clock review, 8 times water, t toluene and co-funeral vC feeling 9 times Out trap. The amount of undesirable slack was 1265%.

*Mtl’il L 厚避α05細りポリイミドフィルム(デニボン社裂力1
トンフィルム)K土−にLDW遺したワニスtm布し%
 250℃で60号乾燥し7tucnと、(LQ65m
(Q厚ga圧延鋼晶kitf。
*Mtl'il L thick avoidance α05 thin polyimide film (Denibon tear force 1
ton film) LDW varnish tm cloth on K soil
Dry No. 60 at 250℃ to 7tucn (LQ65m)
(Q thick ga rolled steel crystal kitf.

401Q1/mv圧力で280−に、60分プレスし九
〇作成し7t7し中シプル基叡のヒール**U1.6t
q/cmでボリイイドh板が破断し九〇こILt160
℃に46時閾島劣化し*5tpvビールr! L 1 
i4/cmでめ57t o I L、650℃、10分
処塩してもふくnり宛gEはなかつ九040℃、湿に9
0%に24時間放置俊の表向抵抗は5×10110であ
った〇 夾J111?I12゜ 実施例1で用いたワニスtガ2ス板上KAffiし、2
50℃、50分乾燥して厚@25μυフィルAi作成し
’Ito 74ルムObJ浦性りある丈夫なものであっ
た。
401Q1/mv pressure to 280-, press for 60 minutes to create 90, 7t7, medium ciple base heel **U1.6t
The Boliioid h plate broke at q/cm and was 90 times ILt160
℃ 46 o'clock threshold deterioration *5 tpv beer r! L 1
i4/cm, 57t o I L, 650°C, 10 minutes.
The surface resistance of Shun left at 0% for 24 hours was 5 x 10110〇J111? I12゜Kaffi the varnish t gas used in Example 1 on the plate, and
The film was dried at 50° C. for 50 minutes to form a 25 μυ film with a thickness of 74 lumen, which was strong and durable.

このフィルム’t−55μのwI4箔と50μυカ1ト
ン2イルAQJ閣にσ嘔み、280℃、SO0分間ブレ
スて像層した・ビール添置に1.6鵠/cm以上でめり
、耐熱性に350℃、10分でもふ<nの発生はなかっ
7t。
This film was coated with a 55μ wI4 foil and a 50μυ load of 1 ton of 2ils AQJ, and was then exposed to SO for 0 minutes at 280°C to create an image layer.When added to beer, it curled at a rate of 1.6cm/cm or more, and was heat resistant. There was no occurrence of f<n even after 10 minutes at 350°C.

実施カ五 m置針、攪拌機、リービッヒ冷4I−お1び嘘累ガス尋
入管t#l見7tlj(lu&!&!ロアjスコに4゜
4′−ジ(m−アミノ2エノキシ)ジフェニルスルホン
4 a 6 g、  4.4’−シアiノジ2エニルエ
ーテル7.5 g、 s、s’、<、*’−ベンゾ2エ
ノンテト2カルボン酸ジ盪水1y4ajg、)リフレゾ
ール750 gm  )ルエン150 gt人ns l
[ガス【壇じ、円讐智111#!P1.なから150℃
で5暗関BL応番ゼて均−准iI液を祷九。
Implementation: 5m needle, stirrer, Liebig cold 4I-O1 and gas interrogation tube t#l see 7tlj (lu &! a 6 g, 4.4'-Cyanodienyl ether 7.5 g, s, s', <, *'-benzo2enonetet2carboxylic acid diluted water 1y4ajg,) Refresol 750 gm) Luene 150 gt person ns l
[Gas [Danji, Enenchi 111#! P1. From 150℃
So 5 dark Seki BL number ze and Hitoshi-juni I liquid was prayed nine times.

褥らr′L7を浴歇tオグトンフィルムに慮布し、25
0℃で60分乾燥し、55μ9廖名の銅麺t1ね、50
0℃でsO0分ブレスて飯眉し几。
Place r'L7 on the bathtub film, and 25
Dry at 0℃ for 60 minutes, 55 μ9 Liao Na copper noodles t1, 50
Breathe for 0 minutes at 0℃ and heat up.

侍らrtたフレキシブルjk板のビール5![跋は1.
6■/cm以上であった・1友、550℃O苧田に10
分閾&漬してもふくnが生じなかりた〇夷J11IN4
゜ ―直針%債拌嶺、リービッヒ冷l!1−1輩累導入盲t
w見7t14り四日22スコに、4,4−ジ(m−アミ
ノフェノ呼シ)ベンゾ2Xノン59゜4 IIs h、
6’、4.4’−シフ具二ルエーテルテト2カルボン敵
ジ熊水−443g、)リフレゾール750g、)ルエン
150g勿人nて輩累ガスを通じながら、150℃、5
時開攪拌し、拘−な解畝を得度0 こむ靜畝tカ1トン2イルムに慮布し、250℃、50
分を識し1次KIII14箔を皿ねて280℃、50号
プレスして豪Mさゼた・2し中タプル111υピール′
*fにt6kg/cm以上でめうた。このjli[は5
50℃の早出に5分間浸漬してもふくno発生になかつ
尺・ *JI科& 実11i?i14とIirlmな装置に4,4′−ジ(
m−アイノンエノキシ)ベンゾ2鼻ノン217g、1.
5−ジ(m−アイノンエノキシ)ベンゼン2L9g、 
4.4’−ヘキt2ルオ曹イソ1鑓ビリデンビス(2タ
ル鐙無水9g ) 6 & 6 g m  )リフレゾ
ール750g、)ルエン15Oit人n%i1嵩ガスを
通じながら150℃、5時間攪拌し、殉−な*aを僧た
・脅らn尺椿筐を力1トン2イルムKIk布し%250
℃% 50分乾燥し2次−で鋼部t][ね、280℃で
50号プレスして畿層畜4を次・2し中ンプルi碩むビ
ール強度にt6kg /(JIJjd上で6j1.55
0℃の牛田浴に5分間浸漬してtふ〈nの発生になかつ
次。
Samurai rt flexible jk board beer 5! [Launch is 1.
6■/cm or more ・1 friend, 10 at 550℃ Oshita
〇夷J11IN4 Did not cause any swelling even after soaking
゜--straight needle % bond mixing ridge, Liebig cold l! 1-1 grade introduction blind t
4,4-di(m-aminophenol)benzo2X non-59°4 IIs h,
6', 4.4'-Schifujiru ethertet 2 carboxylic acid water - 443 g,) Refresol 750 g,) Luene 150 g, while passing through the gas, 150℃, 5
Stirring from time to time, the ridges were placed at 250°C,
Knowing the amount, I plated the primary KIII14 foil, pressed it at 280℃ and No. 50, and peeled the medium tuple 111υ'
*F is over t6kg/cm. This jli [is 5
Even after soaking for 5 minutes at 50 degrees Celsius, no flakes occur. *JI class & fruit 11i? 4,4′-di(
m-ainonenoxy)benzodinasone 217g, 1.
5-di(m-ainonenoxy)benzene 2L9g,
4.4'-hexyl chloride iso1 pyridene bis(2 tal stirrup anhydrous 9g) 6 & 6 gm) Refresol 750g,) Luene 15Oit person n%i1 Bulk gas was passed through the mixture at 150°C for 5 hours with stirring. The *a priest/threatened the n-shaku tsubaki cabinet with 1 ton of force and 2 ilm KIk cloth% 250
℃ % Dry for 50 minutes and then press the steel part with a secondary press at 280℃ and press the steel part 4 and 2. 55
After soaking in the Ushida bath at 0°C for 5 minutes to prevent the occurrence of tfu<n.

Claims (1)

【特許請求の範囲】 1、接層剤として下記一般式 (ここでXはO、SO2、S、CO、CH2、C(CH
2)2、C(CF2)2から選ばれ、それぞれのXは同
じであっても異なってもよい。R1、R2はテトラカル
ボン酸残基、R2はジアミン残基、x+y=1、xは1
〜0.2、yは0〜0.8、nは正数である) で表わされるポリイミドに金属箔とポリイミドフィルム
の接着に用いることを特徴とするフレキシブル印刷回路
用基板の製造法。
[Claims] 1. As a layering agent, the following general formula (where X is O, SO2, S, CO, CH2, C(CH
2)2, C(CF2)2, and each X may be the same or different. R1 and R2 are tetracarboxylic acid residues, R2 is a diamine residue, x+y=1, x is 1
~0.2, y is 0 to 0.8, n is a positive number) A method for producing a flexible printed circuit board, characterized in that the polyimide is used for bonding a metal foil and a polyimide film.
JP3992182A 1982-03-12 1982-03-12 Method of producing substrate for flexible printed circuit Granted JPS58157190A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3992182A JPS58157190A (en) 1982-03-12 1982-03-12 Method of producing substrate for flexible printed circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3992182A JPS58157190A (en) 1982-03-12 1982-03-12 Method of producing substrate for flexible printed circuit

Publications (2)

Publication Number Publication Date
JPS58157190A true JPS58157190A (en) 1983-09-19
JPH0231516B2 JPH0231516B2 (en) 1990-07-13

Family

ID=12566395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3992182A Granted JPS58157190A (en) 1982-03-12 1982-03-12 Method of producing substrate for flexible printed circuit

Country Status (1)

Country Link
JP (1) JPS58157190A (en)

Cited By (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60243120A (en) * 1984-05-18 1985-12-03 Hitachi Ltd Flexible printed base board and production thereof
JPS6195031A (en) * 1984-10-15 1986-05-13 Mitsui Toatsu Chem Inc Production of polyimide film
JPS6195030A (en) * 1984-10-15 1986-05-13 Mitsui Toatsu Chem Inc Production of polyimide film
JPS61143478A (en) * 1984-12-18 1986-07-01 Mitsui Toatsu Chem Inc Heat-resistant adhesive
JPS61250031A (en) * 1985-04-29 1986-11-07 イ−・アイ・デユポン・デ・ニモアス・アンド・カンパニ− Meltable polyimide copolymer
JPS61291669A (en) * 1985-06-18 1986-12-22 Mitsui Toatsu Chem Inc Heat-resistant adhesive
JPS627733A (en) * 1985-03-10 1987-01-14 Nitto Electric Ind Co Ltd Colorless clear polyimide formed body and its production
JPS6215228A (en) * 1985-07-15 1987-01-23 Mitsubishi Petrochem Co Ltd Aromatic thioether imide polymer
JPS6248782A (en) * 1985-08-27 1987-03-03 Mitsui Toatsu Chem Inc Heat-resistant adhesive
WO1987001378A1 (en) * 1985-08-27 1987-03-12 Mitsui Toatsu Chemicals, Incorporated Polyimides and heat-resistant adhesives comprising the same
JPS6284124A (en) * 1985-08-30 1987-04-17 ゼネラル・エレクトリツク・カンパニイ Crystalline polyimide containing cumulative phenylenesulfideunit
JPS6286021A (en) * 1985-10-11 1987-04-20 Mitsui Toatsu Chem Inc Polyimide and heat-resistant adhesive comprising same
JPS62185715A (en) * 1986-02-13 1987-08-14 Mitsui Toatsu Chem Inc Colorless polyimide film
EP0234882A2 (en) * 1986-02-25 1987-09-02 MITSUI TOATSU CHEMICALS, Inc. High-temperature adhesive of polyimide
EP0269319A2 (en) * 1986-11-19 1988-06-01 MITSUI TOATSU CHEMICALS, Inc. Polyimide
JPS63130633A (en) * 1986-11-20 1988-06-02 Kanegafuchi Chem Ind Co Ltd Novel polyamic acid and production of polyimide
JPS63170420A (en) * 1987-01-08 1988-07-14 Nitto Electric Ind Co Ltd Molded article of colorless transparent polyimide and production thereof
JPS63170421A (en) * 1986-11-19 1988-07-14 ゼネラル・エレクトリック・カンパニイ Crystalline polyimide containing built-up phenylensulfide unit
JPS64121A (en) * 1987-02-13 1989-01-05 New Japan Chem Co Ltd Polyimide resin composition and its production
US4797466A (en) * 1985-09-03 1989-01-10 Mitsui Toatsu Chemicals, Inc. High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy)pyridine
JPH0195155A (en) * 1987-10-05 1989-04-13 Mitsubishi Kasei Corp Polyimide resin composition
JPH01131239A (en) * 1987-11-16 1989-05-24 Mitsui Toatsu Chem Inc Production of polyimide of good processability
JPH01268778A (en) * 1988-04-20 1989-10-26 Hitachi Chem Co Ltd Hot-melt adhesive, polyimide film with said adhesive layer and printed circuit board therefrom
JPH01282283A (en) * 1988-05-10 1989-11-14 Hitachi Chem Co Ltd Hot-melt adhesive, polyimide film with hot-melt adhesive layer and board for printed circuit
US4883718A (en) * 1985-02-12 1989-11-28 Mitsui Toatsu Chemicals, Inc. Flexible copper-clad circuit substrate
JPH0260934A (en) * 1988-06-28 1990-03-01 Amoco Corp Polyimide and copolyimide which have low dielectric constant and low moisture absorptivity and are used for both interlayer insulator and base plate coating film
JPH02253551A (en) * 1989-03-27 1990-10-12 Nippon Telegr & Teleph Corp <Ntt> Conditioning method for electron microscope specimen and apparatus therefor
JPH036226A (en) * 1989-05-31 1991-01-11 Shin Etsu Chem Co Ltd Polyimide resin solution composition
JPH0364355A (en) * 1989-08-02 1991-03-19 Shin Etsu Chem Co Ltd Composition for protection of semiconductor element
JPH03166227A (en) * 1989-11-24 1991-07-18 Ube Ind Ltd Thermoplastic aromatic polyimide
JPH05117596A (en) * 1991-10-29 1993-05-14 Sumitomo Bakelite Co Ltd Film adhesive having high thermal conductivity and bondable by hot melt bonding
JPH05125332A (en) * 1991-11-01 1993-05-21 Sumitomo Bakelite Co Ltd Hot melt bonding electrically conductive filmy adhesive
JPH05331424A (en) * 1992-06-04 1993-12-14 Sumitomo Bakelite Co Ltd Film adhesive
US5278276A (en) * 1985-08-27 1994-01-11 Mitsui Toatsu Chemicals, Incorporated Polyimide and high-temperature adhesive of polyimide
JPH06106678A (en) * 1991-10-07 1994-04-19 Internatl Business Mach Corp <Ibm> Multilayer product, its production process, and process for minimizing generation of metallic particle
JPH07278393A (en) * 1995-04-17 1995-10-24 Mitsui Toatsu Chem Inc Polyimide resin composition
JPH07292249A (en) * 1995-03-20 1995-11-07 Mitsui Toatsu Chem Inc Polyimide resin composition
JPH07292247A (en) * 1995-03-20 1995-11-07 Mitsui Toatsu Chem Inc New polyimide resin composition
JPH07292246A (en) * 1995-03-20 1995-11-07 Mitsui Toatsu Chem Inc Polyimide resin composition
JPH0841338A (en) * 1995-03-20 1996-02-13 Mitsui Toatsu Chem Inc Composition for polyimide resin
JPH08225645A (en) * 1995-12-18 1996-09-03 Nitto Denko Corp Colorless clear polyimide molding and production thereof
JPH08231714A (en) * 1996-01-24 1996-09-10 Mitsui Toatsu Chem Inc Polyimide excellent in thermal stability
JPH08231715A (en) * 1996-03-08 1996-09-10 Mitsui Toatsu Chem Inc Polyimide excellent in thermal stability
US6468664B1 (en) 1999-10-19 2002-10-22 Samsung Electronics Co., Ltd. Poly(imide-siloxane) compound for tapeless LOC packaging

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52153948A (en) * 1976-06-15 1977-12-21 Ciba Geigy Ag Aromatic diamine polyamide compound consisting of said diamine and process for preparing same
JPS5518426A (en) * 1978-07-27 1980-02-08 Asahi Chem Ind Co Ltd Heat-resistant flexible electronic parts

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52153948A (en) * 1976-06-15 1977-12-21 Ciba Geigy Ag Aromatic diamine polyamide compound consisting of said diamine and process for preparing same
JPS5518426A (en) * 1978-07-27 1980-02-08 Asahi Chem Ind Co Ltd Heat-resistant flexible electronic parts

Cited By (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0354971B2 (en) * 1984-05-18 1991-08-21
JPS60243120A (en) * 1984-05-18 1985-12-03 Hitachi Ltd Flexible printed base board and production thereof
JPS6195031A (en) * 1984-10-15 1986-05-13 Mitsui Toatsu Chem Inc Production of polyimide film
JPS6195030A (en) * 1984-10-15 1986-05-13 Mitsui Toatsu Chem Inc Production of polyimide film
JPS61143478A (en) * 1984-12-18 1986-07-01 Mitsui Toatsu Chem Inc Heat-resistant adhesive
US4883718A (en) * 1985-02-12 1989-11-28 Mitsui Toatsu Chemicals, Inc. Flexible copper-clad circuit substrate
JPS627733A (en) * 1985-03-10 1987-01-14 Nitto Electric Ind Co Ltd Colorless clear polyimide formed body and its production
JPS61250031A (en) * 1985-04-29 1986-11-07 イ−・アイ・デユポン・デ・ニモアス・アンド・カンパニ− Meltable polyimide copolymer
JPS61291669A (en) * 1985-06-18 1986-12-22 Mitsui Toatsu Chem Inc Heat-resistant adhesive
JPS6215228A (en) * 1985-07-15 1987-01-23 Mitsubishi Petrochem Co Ltd Aromatic thioether imide polymer
JPH0678431B2 (en) * 1985-07-15 1994-10-05 三菱油化株式会社 Aromatic thioetherimide polymer
US4847349A (en) * 1985-08-27 1989-07-11 Mitsui Toatsu Chemicals, Inc. Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines
US5087689A (en) * 1985-08-27 1992-02-11 Mitsui Toatsu Chemicals, Inc. Polyimide and high-temperature adhesive of polyimide based on meta-phenoxy diamines
US5205894A (en) * 1985-08-27 1993-04-27 Mitsui Toatsu Chemicals, Inc. Polyimide and high-temperature adhesive of polyimide
US5278276A (en) * 1985-08-27 1994-01-11 Mitsui Toatsu Chemicals, Incorporated Polyimide and high-temperature adhesive of polyimide
WO1987001378A1 (en) * 1985-08-27 1987-03-12 Mitsui Toatsu Chemicals, Incorporated Polyimides and heat-resistant adhesives comprising the same
JPS6248782A (en) * 1985-08-27 1987-03-03 Mitsui Toatsu Chem Inc Heat-resistant adhesive
EP0729995A1 (en) * 1985-08-27 1996-09-04 MITSUI TOATSU CHEMICALS, Inc. Polyimide and high-temperature adhesive of polyimide
JPS6284124A (en) * 1985-08-30 1987-04-17 ゼネラル・エレクトリツク・カンパニイ Crystalline polyimide containing cumulative phenylenesulfideunit
US4797466A (en) * 1985-09-03 1989-01-10 Mitsui Toatsu Chemicals, Inc. High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy)pyridine
JPS6286021A (en) * 1985-10-11 1987-04-20 Mitsui Toatsu Chem Inc Polyimide and heat-resistant adhesive comprising same
JPS62185715A (en) * 1986-02-13 1987-08-14 Mitsui Toatsu Chem Inc Colorless polyimide film
US4795798A (en) * 1986-02-25 1989-01-03 Mitsui Toatsu Chemicals, Inc. High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phenoxy)phenyl]1,1,1,3,3,3-hexafluoro propane
EP0234882A2 (en) * 1986-02-25 1987-09-02 MITSUI TOATSU CHEMICALS, Inc. High-temperature adhesive of polyimide
JPS63170421A (en) * 1986-11-19 1988-07-14 ゼネラル・エレクトリック・カンパニイ Crystalline polyimide containing built-up phenylensulfide unit
EP0269319A2 (en) * 1986-11-19 1988-06-01 MITSUI TOATSU CHEMICALS, Inc. Polyimide
JPS63130633A (en) * 1986-11-20 1988-06-02 Kanegafuchi Chem Ind Co Ltd Novel polyamic acid and production of polyimide
JPS63170420A (en) * 1987-01-08 1988-07-14 Nitto Electric Ind Co Ltd Molded article of colorless transparent polyimide and production thereof
JPS64121A (en) * 1987-02-13 1989-01-05 New Japan Chem Co Ltd Polyimide resin composition and its production
JPH0195155A (en) * 1987-10-05 1989-04-13 Mitsubishi Kasei Corp Polyimide resin composition
JPH01131239A (en) * 1987-11-16 1989-05-24 Mitsui Toatsu Chem Inc Production of polyimide of good processability
JPH01268778A (en) * 1988-04-20 1989-10-26 Hitachi Chem Co Ltd Hot-melt adhesive, polyimide film with said adhesive layer and printed circuit board therefrom
JPH01282283A (en) * 1988-05-10 1989-11-14 Hitachi Chem Co Ltd Hot-melt adhesive, polyimide film with hot-melt adhesive layer and board for printed circuit
JPH0260934A (en) * 1988-06-28 1990-03-01 Amoco Corp Polyimide and copolyimide which have low dielectric constant and low moisture absorptivity and are used for both interlayer insulator and base plate coating film
JPH02253551A (en) * 1989-03-27 1990-10-12 Nippon Telegr & Teleph Corp <Ntt> Conditioning method for electron microscope specimen and apparatus therefor
JPH036226A (en) * 1989-05-31 1991-01-11 Shin Etsu Chem Co Ltd Polyimide resin solution composition
JPH0364355A (en) * 1989-08-02 1991-03-19 Shin Etsu Chem Co Ltd Composition for protection of semiconductor element
JPH03166227A (en) * 1989-11-24 1991-07-18 Ube Ind Ltd Thermoplastic aromatic polyimide
JPH06106678A (en) * 1991-10-07 1994-04-19 Internatl Business Mach Corp <Ibm> Multilayer product, its production process, and process for minimizing generation of metallic particle
JPH05117596A (en) * 1991-10-29 1993-05-14 Sumitomo Bakelite Co Ltd Film adhesive having high thermal conductivity and bondable by hot melt bonding
JPH05125332A (en) * 1991-11-01 1993-05-21 Sumitomo Bakelite Co Ltd Hot melt bonding electrically conductive filmy adhesive
JPH05331424A (en) * 1992-06-04 1993-12-14 Sumitomo Bakelite Co Ltd Film adhesive
JPH07292249A (en) * 1995-03-20 1995-11-07 Mitsui Toatsu Chem Inc Polyimide resin composition
JPH07292247A (en) * 1995-03-20 1995-11-07 Mitsui Toatsu Chem Inc New polyimide resin composition
JPH07292246A (en) * 1995-03-20 1995-11-07 Mitsui Toatsu Chem Inc Polyimide resin composition
JPH0841338A (en) * 1995-03-20 1996-02-13 Mitsui Toatsu Chem Inc Composition for polyimide resin
JPH07278393A (en) * 1995-04-17 1995-10-24 Mitsui Toatsu Chem Inc Polyimide resin composition
JPH08225645A (en) * 1995-12-18 1996-09-03 Nitto Denko Corp Colorless clear polyimide molding and production thereof
JPH08231714A (en) * 1996-01-24 1996-09-10 Mitsui Toatsu Chem Inc Polyimide excellent in thermal stability
JPH08231715A (en) * 1996-03-08 1996-09-10 Mitsui Toatsu Chem Inc Polyimide excellent in thermal stability
US6468664B1 (en) 1999-10-19 2002-10-22 Samsung Electronics Co., Ltd. Poly(imide-siloxane) compound for tapeless LOC packaging

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