JPS58157190A - Method of producing substrate for flexible printed circuit - Google Patents
Method of producing substrate for flexible printed circuitInfo
- Publication number
- JPS58157190A JPS58157190A JP3992182A JP3992182A JPS58157190A JP S58157190 A JPS58157190 A JP S58157190A JP 3992182 A JP3992182 A JP 3992182A JP 3992182 A JP3992182 A JP 3992182A JP S58157190 A JPS58157190 A JP S58157190A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- flexible printed
- minutes
- producing substrate
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Structure Of Printed Boards (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明はフレキシブル印刷回路用基板の製造法に関する
。特に耐熱性、可撓性、電気絶縁性、■燃性のすぐれた
フレキシプル印廟回路恭板の表遺汰に−する・
塊在、ポリインドフィルムと9I14箔とt−法膚銅t
mいてa9甘せてフレキシブル−刷回路用i似1cm捩
壇しているか、ポリイミド2イルムa十分#r熱性かめ
るが、巌層刑の耐熱性が恐い沈めに、2し中シプル4孜
り隔的注買か不満建て、νりえは牛田耐熱惟aせいぜい
280℃機にでるる0
−tcで、耐熱80丁ぐnた嵌盾酌か資殖されて29本
発明に上述の入点Vc−みてなさnたt −υでわ
る@
禰ち、本S11明O脅値C酊熱注■丁ぐn友快層mKめ
る0不発明の蒙漕剤■化字榊造を−奴式同じでめって%
、!J41っていてtLい。R+、Rsにテトラカルボ
ン酸残ゑ、RmrX造富のシアイン’!44s x
+ y −1とするとX#ゴ1〜[12、yhO〜u8
であるOnは正数である01次、芳香&壜にm甘さnて
いる水票は他O不箔性島で置洪さnていて%よい。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a flexible printed circuit board. Particularly heat resistant, flexible, electrically insulating, and highly flammable, it is used as the surface of a flexible seal circuit board.
I have a 1cm screw plate similar to I for printing circuits, and polyimide 2 ilm a is sufficiently #r heat resistant, but the heat resistance of the rock layer is scary, so I put 2 and 4 treps apart. Depending on the customer's purchase or dissatisfaction, ν Rie is Ushida heat resistant, which is at most 280℃. Don't look at it - υ to break @ Nechi, book S11 Ming O threatening value C drunkenness note ■ Ding n friendly layer mK meru 0 uninvented Mongolian drug ■ Change the character Sakakizo - the same as the guy type Demette%
,! J41 is tL. R+, Rs has a tetracarboxylic acid residue, RmrX rich sheain'! 44s x
+ y −1 then X#go1~[12, yhO~u8
On is a positive number of the 01st order, and the fragrance and sweetness of the bottle are good because they are placed on other islands.
不発@に用いらnる#配ボリイゼドOM慎浴ジ1iンと
テトクカルボン#無水智とを必資に応じて地布りジアミ
ンを加えて刀口熱反地させることに=9表電場n 4
。Used for unexploded @nru #distributed OM Shinbaji 1in and Tetoku carbon #Musui Satoshi according to the necessity and add diamine to make the sword mouth heat rebound = 9 table electric field n 4
.
一般式 Hs NK二コニ−](−門):コニThX−
(=コニ)−】(7(::::])−NH虐で六わ賂C
るジアンンリ^体例として04,4’−ジ(m−アミノ
ンエノキシ)ジフェニルスルホン。General formula Hs NK Niconi-] (-gate): Koni ThX-
(=Koni) -] (7 (::::]) - NH torture and six bribes C
An example of a dianhydride is 04,4'-di(m-aminoneenoxy)diphenylsulfone.
4.4′−ジ(P−7ミノ28ツキV)ジフェニルスル
ホン、4.4’−ジ(m−アξノフエノキシンジフユニ
ルエーテル、 4.4’−ジ(P−7ミノンエノI?
7ンジフエニルエーテル、4.4′−ジ(m−フイノ2
メツキシ)ジノエニルグロノくン、4゜4′−ジ(P−
アミノ7sノキシンジ2エニル7′ロバ7、 4.4’
−シ(m−7tノフェニルスルホニル〕ジ2メニルエー
テル、4.4′−ジ(P−アミンフェニルスル小ニル)
ジンエニルエーテル、4.4′−シ(m−7iノフエニ
ルテオエーテル)シフ島ニルスル2イド、4.4’−ジ
(P−アミノンエニルナオエーテル)シノエニルスルノ
イト、4.4′−シ(m−アにノノメンインンジンエニ
ルケトン、4.4’−ジ(P−アミノンエノキシ)ジノ
エ;ルクト;y、 4.4’−ジ(m−アミノンメッキ
7)ン2Xニルメタ/、 4.4’−ジ(P−アミノ
2エノキシ」ジ2算ニルメタ/、 4.4’−ジ()
1−ア<7フエ/キシ)ジフェニルへキサフルオログロ
バ/勢かめる0
ナトクカルボン酸ジ無水管としてVゴs、;、4.a’
−ベンゾフェノンテトラカルボン赦ジ無水脣、ヒロメリ
ト#2無水1、s、s’、4.4’−ジ2エニルテトラ
カルボン歌ジ無水w、 2.5,6.7−す2タリンテ
トラカルボ/改ジ黒水切、1,4,5.8−ナフタリン
テトフカルボン販ジ無水v、 4.4’−スルホニル
ジスタル誠無水豐、 s、s’、4.4’−ジ2工二
ルエーテルテトラカルボン峡ジ無水智、シクロベ/タ/
テトラカルボン献ジ無水管、ブタンテトラカルボ/酸ジ
熊水管、エチレンビストリメリテートジ無水膏なとかめ
る0
1次併用できる違Nリジアミンとしてr!4.4’−ジ
アミノジフェニルエーテル、4.4’−ジアイノジ2エ
ニルメタン、 4.4’−ジアゼノジフエニルスルホ
7% 5,5′−シアきノジフェニルスルホン、メタフ
ェニレンシアはン、ノ(ラフエニレンシアミン、 4
.4’−ジアミノジンエニルフロ・(ン。4.4'-di(P-7 minoneno28tsuki V) diphenyl sulfone, 4.4'-di(m-anophenoxin diphunyl ether, 4.4'-di(P-7 minoneno I?)
7-diphenyl ether, 4,4'-di(m-phino2
4゜4'-di(P-
amino 7s noxin di2enyl 7' donkey 7, 4.4'
-C(m-7tnophenylsulfonyl)di2menyl ether, 4,4'-di(P-aminephenylsulfonyl)
Dienyl ether, 4,4'-di(m-7i nophenyl theoether) Schiff's island nyl 2ide, 4,4'-di(P-aminone enyl naoether) cinoenyl sulnoite, 4,4'-cy (m-a nomeninjin enylketone, 4.4'-di(P-aminoneenoxy)dinoe; y, 4.4'-di(m-aminone plating 7)n 2 .4'-di(P-amino-2-enoxy" dibivalent nylmeth/, 4.4'-di()
1-a<7phe/xy)diphenylhexafluorogloba/segameru0 Natoccarboxylic acid dianhydride as Vgos,;,4. a'
-benzophenonetetracarboxylic anhydride, hyromerito #2 anhydrous 1, s, s', 4,4'-di2enyltetracarboxylic anhydride w, 2.5,6.7-su2 talintetracarbo/modified Dikuro Mizukiri, 1,4,5.8-Naphthalene Tetofcarvone Sales Dianhydride V, 4.4'-Sulfonyl Distal Seinan Suifuo, s, s', 4.4'-Di2-Dyl Ether Tetracarvone Gorge Jimui Satoshi, Shikurobe/ta/
Tetracarboxylic anhydride tube, butane tetracarbo/acidic anhydride tube, ethylene bistrimelitate dianhydride, etc. 0 As a different N-lysium amine that can be used in combination for the first time! 4.4'-diaminodiphenyl ether, 4.4'-diainodiphenylmethane, 7% 4.4'-diazenodiphenylsulfo 5,5'-cyanodiphenyl sulfone, metaphenylene cyano, no(raphenylene) Renxiamin, 4
.. 4'-Diaminodine enylfuro (n.
4.4′−ジアミノジフェニルスルフィド、 L5−
シアミノナフタリン、2,6−ジアiノナフタリン、2
,6−シアミツビリジン、1,4−ジ(P−アミノンエ
ノキシ)べ/ゼン、1.5−ジ(P−1i)2エノキ7
)ベンゼンなどかめるQ本発明のポリイミドtS解する
温媒としてσクレノール、オルトクロルフェノール、P
−クロル2Xノール、P−ブロム2ネノール、2.4−
ジタロルフエノール、2,4.6− )ジクロル2蒸ノ
ール、ニドμペンゼ/、2エノール、スルホフン、メチ
ルスルホラン、ジメチルスルホキシド、トリ2ルオロ酢
酸、キシレノ′ニル、 N −メチル−2−ピロリドン
、 N、N−ジメチルアセドア建ド、 N、N−ジメデ
ルホルムアイド、ヘキサメチル本スホルアミド勢を用い
ることかできる0
1丸、ボリイイド化す4−に生成する水を共sK工9除
去するためにトルエンやキシレン【用いて一層いQ
#配一般式で水さn4襞′yII創a尚温にすると米慣
し、嘴惚浴縄1C不浴とlるtのもめるか、−ざらに、
必*&L応じて朱輪剤會硝力口することもで@る。乗―
創としてはイン/アイート化せ切、マレイイド化せ勧な
とかめる。4.4'-diaminodiphenyl sulfide, L5-
Cyaminonaphthalene, 2,6-diai nonaphthalene, 2
, 6-cyamitubiridine, 1,4-di(P-aminoneenoxy)ben/zene, 1,5-di(P-1i)2enoki7
) σ-clenol, orthochlorophenol, P as a heating medium that dissolves the polyimide tS of the present invention
-Chlor 2Xnol, P-bromo 2nenol, 2.4-
Dithalolphenol, 2,4.6-) dichlor divaporinol, nido μpenze/, 2enol, sulfofun, methylsulfolane, dimethylsulfoxide, tri2fluoroacetate, xylenonyl, N-methyl-2-pyrrolidone, N , N-dimethylacedoylamide, N,N-dimedelformide, and hexamethylhonsphoramide groups can be used. Xylene [Using more Q # distribution general formula with water n4 folds'yII creation a still warm, it gets used to rice, and the bathing rope 1C is not bathed and it's lt's struggle, - roughly,
If necessary, you can also have a vermilion drug meeting. Riding-
As for the creation, it is in/aito conversion, and maleoid conversion is recommended.
一層剤り一般式IChいてXζ1〜0.2の範囲でめる
か、α2LD%小さいと#悪に対する濤解注が慝くlる
onにN、N−ジメチルアセトア建ド甲で11%のIl
lにで50℃で還元粘![を麹足し7を場曾、遺元粘F
ILか01”わ1以上になる数【示す。こむ値以下友と
2レキシプルM板とし九と龜の可憐性が愚くなる・
本発明には金属箔が必景であるが、一般に鋼箔やフル(
ニクム舶か用いらnる・
接層方法としてrX厚発明む豪層剤をボリイ(ドフィル
五Kll布し7を俵、濤謙【加拳乾諌するO加熱乾燥の
秦件に100〜500℃で50秒〜50分でTo4゜C
tJ後、鳳布、乾燥ざnたポリイミドフィルムと@鳴音
1ね、加熱、加圧することに1りiI層石ぜてフレ中シ
プル印−−路用fi板とする0
δらに、本発明0嵌層剤から一旦フイル五を作り、この
フィルム【ボリイばドフイルムと金J!J角の蘭Klユ
さみ、加熱、加圧することに19法膚ざゼてフレキシブ
ル印at!!1m用着権とすることも町舵である0
以下に倣層剤のIll法及び実施例について睨−する。If the general formula ICh is set in the range of Il
Reduced viscosity at 50℃! [Add koji and add 7 to Baso, Genku F
IL or 01" is a number that is greater than or equal to 1. If the value is less than 1 and the 2 lexical M board, the cuteness of 9 and 9 will become stupid. Metal foil is essential for the present invention, but steel foil is generally used. Ya full (
Nikum ships use nru/ As a layering method, they invent a layering agent with rX thickness (Dofyl 5 Kll cloth and 7 bales, Taoken [Kakken drying] O heat drying at 100 to 500℃) To4°C in 50 seconds to 50 minutes
After tJ, the porcelain cloth, the dried rough polyimide film and @Narion 1 are heated and pressurized, and then the iI layer stone is applied to make a sipple mark in the middle of the road.0 δ et al. First, a film was made from the layering agent of the invention, and this film [Boriba Do Film and Gold J! J-angle Ran Kl Yusami, heating and pressurizing the skin 19 times and flexible stamp at! ! It is also a good idea to use a 1m landing. Below, we will look at the Ill method and examples of the imitation layer agent.
綾層銅υ展区
1を針、攪拌欅、リービッヒ冷却器、k本ガス尋入tt
Wえytsoo膳l■四ロフラスコに。Needle, stirring zelkova, Liebig cooler, k gas interrogation tt in the twill layer copper υ expansion area 1
Wytsoo meal ■ Four-loaf flask.
4.4’−シ(m−アミノ2エノキシ)ジンェニルスル
ホ/1 & 2 g、6.j、4.4’−ベンツ2エノ
/テトラカルボン嫉二無*智12.076g、フレノー
ル200g、)ルエン40g1人n170℃、5時閲反
ふし8ぜて水tトルエンと共に共葬vC感9通い出し罠
。生成し尺ポリイばド解歇■不渾弛分は1265%でめ
った。4.4'-cy(m-amino2enoxy)dinenylsulfo/1 & 2 g, 6. j, 4.4'-benz 2 eno/tetracarvone envy*chi 12.076 g, frenol 200 g, ) 40 g of luene per person n 170℃, 5 o'clock review, 8 times water, t toluene and co-funeral vC feeling 9 times Out trap. The amount of undesirable slack was 1265%.
*Mtl’il L
厚避α05細りポリイミドフィルム(デニボン社裂力1
トンフィルム)K土−にLDW遺したワニスtm布し%
250℃で60号乾燥し7tucnと、(LQ65m
(Q厚ga圧延鋼晶kitf。*Mtl'il L thick avoidance α05 thin polyimide film (Denibon tear force 1
ton film) LDW varnish tm cloth on K soil
Dry No. 60 at 250℃ to 7tucn (LQ65m)
(Q thick ga rolled steel crystal kitf.
401Q1/mv圧力で280−に、60分プレスし九
〇作成し7t7し中シプル基叡のヒール**U1.6t
q/cmでボリイイドh板が破断し九〇こILt160
℃に46時閾島劣化し*5tpvビールr! L 1
i4/cmでめ57t o I L、650℃、10分
処塩してもふくnり宛gEはなかつ九040℃、湿に9
0%に24時間放置俊の表向抵抗は5×10110であ
った〇
夾J111?I12゜
実施例1で用いたワニスtガ2ス板上KAffiし、2
50℃、50分乾燥して厚@25μυフィルAi作成し
’Ito 74ルムObJ浦性りある丈夫なものであっ
た。401Q1/mv pressure to 280-, press for 60 minutes to create 90, 7t7, medium ciple base heel **U1.6t
The Boliioid h plate broke at q/cm and was 90 times ILt160
℃ 46 o'clock threshold deterioration *5 tpv beer r! L 1
i4/cm, 57t o I L, 650°C, 10 minutes.
The surface resistance of Shun left at 0% for 24 hours was 5 x 10110〇J111? I12゜Kaffi the varnish t gas used in Example 1 on the plate, and
The film was dried at 50° C. for 50 minutes to form a 25 μυ film with a thickness of 74 lumen, which was strong and durable.
このフィルム’t−55μのwI4箔と50μυカ1ト
ン2イルAQJ閣にσ嘔み、280℃、SO0分間ブレ
スて像層した・ビール添置に1.6鵠/cm以上でめり
、耐熱性に350℃、10分でもふ<nの発生はなかっ
7t。This film was coated with a 55μ wI4 foil and a 50μυ load of 1 ton of 2ils AQJ, and was then exposed to SO for 0 minutes at 280°C to create an image layer.When added to beer, it curled at a rate of 1.6cm/cm or more, and was heat resistant. There was no occurrence of f<n even after 10 minutes at 350°C.
実施カ五
m置針、攪拌機、リービッヒ冷4I−お1び嘘累ガス尋
入管t#l見7tlj(lu&!&!ロアjスコに4゜
4′−ジ(m−アミノ2エノキシ)ジフェニルスルホン
4 a 6 g、 4.4’−シアiノジ2エニルエ
ーテル7.5 g、 s、s’、<、*’−ベンゾ2エ
ノンテト2カルボン酸ジ盪水1y4ajg、)リフレゾ
ール750 gm )ルエン150 gt人ns l
[ガス【壇じ、円讐智111#!P1.なから150℃
で5暗関BL応番ゼて均−准iI液を祷九。Implementation: 5m needle, stirrer, Liebig cold 4I-O1 and gas interrogation tube t#l see 7tlj (lu &! a 6 g, 4.4'-Cyanodienyl ether 7.5 g, s, s', <, *'-benzo2enonetet2carboxylic acid diluted water 1y4ajg,) Refresol 750 gm) Luene 150 gt person ns l
[Gas [Danji, Enenchi 111#! P1. From 150℃
So 5 dark Seki BL number ze and Hitoshi-juni I liquid was prayed nine times.
褥らr′L7を浴歇tオグトンフィルムに慮布し、25
0℃で60分乾燥し、55μ9廖名の銅麺t1ね、50
0℃でsO0分ブレスて飯眉し几。Place r'L7 on the bathtub film, and 25
Dry at 0℃ for 60 minutes, 55 μ9 Liao Na copper noodles t1, 50
Breathe for 0 minutes at 0℃ and heat up.
侍らrtたフレキシブルjk板のビール5![跋は1.
6■/cm以上であった・1友、550℃O苧田に10
分閾&漬してもふくnが生じなかりた〇夷J11IN4
゜
―直針%債拌嶺、リービッヒ冷l!1−1輩累導入盲t
w見7t14り四日22スコに、4,4−ジ(m−アミ
ノフェノ呼シ)ベンゾ2Xノン59゜4 IIs h、
6’、4.4’−シフ具二ルエーテルテト2カルボン敵
ジ熊水−443g、)リフレゾール750g、)ルエン
150g勿人nて輩累ガスを通じながら、150℃、5
時開攪拌し、拘−な解畝を得度0
こむ靜畝tカ1トン2イルムに慮布し、250℃、50
分を識し1次KIII14箔を皿ねて280℃、50号
プレスして豪Mさゼた・2し中タプル111υピール′
*fにt6kg/cm以上でめうた。このjli[は5
50℃の早出に5分間浸漬してもふくno発生になかつ
尺・
*JI科&
実11i?i14とIirlmな装置に4,4′−ジ(
m−アイノンエノキシ)ベンゾ2鼻ノン217g、1.
5−ジ(m−アイノンエノキシ)ベンゼン2L9g、
4.4’−ヘキt2ルオ曹イソ1鑓ビリデンビス(2タ
ル鐙無水9g ) 6 & 6 g m )リフレゾ
ール750g、)ルエン15Oit人n%i1嵩ガスを
通じながら150℃、5時間攪拌し、殉−な*aを僧た
・脅らn尺椿筐を力1トン2イルムKIk布し%250
℃% 50分乾燥し2次−で鋼部t][ね、280℃で
50号プレスして畿層畜4を次・2し中ンプルi碩むビ
ール強度にt6kg /(JIJjd上で6j1.55
0℃の牛田浴に5分間浸漬してtふ〈nの発生になかつ
次。Samurai rt flexible jk board beer 5! [Launch is 1.
6■/cm or more ・1 friend, 10 at 550℃ Oshita
〇夷J11IN4 Did not cause any swelling even after soaking
゜--straight needle % bond mixing ridge, Liebig cold l! 1-1 grade introduction blind t
4,4-di(m-aminophenol)benzo2X non-59°4 IIs h,
6', 4.4'-Schifujiru ethertet 2 carboxylic acid water - 443 g,) Refresol 750 g,) Luene 150 g, while passing through the gas, 150℃, 5
Stirring from time to time, the ridges were placed at 250°C,
Knowing the amount, I plated the primary KIII14 foil, pressed it at 280℃ and No. 50, and peeled the medium tuple 111υ'
*F is over t6kg/cm. This jli [is 5
Even after soaking for 5 minutes at 50 degrees Celsius, no flakes occur. *JI class & fruit 11i? 4,4′-di(
m-ainonenoxy)benzodinasone 217g, 1.
5-di(m-ainonenoxy)benzene 2L9g,
4.4'-hexyl chloride iso1 pyridene bis(2 tal stirrup anhydrous 9g) 6 & 6 gm) Refresol 750g,) Luene 15Oit person n%i1 Bulk gas was passed through the mixture at 150°C for 5 hours with stirring. The *a priest/threatened the n-shaku tsubaki cabinet with 1 ton of force and 2 ilm KIk cloth% 250
℃ % Dry for 50 minutes and then press the steel part with a secondary press at 280℃ and press the steel part 4 and 2. 55
After soaking in the Ushida bath at 0°C for 5 minutes to prevent the occurrence of tfu<n.
Claims (1)
2)2、C(CF2)2から選ばれ、それぞれのXは同
じであっても異なってもよい。R1、R2はテトラカル
ボン酸残基、R2はジアミン残基、x+y=1、xは1
〜0.2、yは0〜0.8、nは正数である) で表わされるポリイミドに金属箔とポリイミドフィルム
の接着に用いることを特徴とするフレキシブル印刷回路
用基板の製造法。[Claims] 1. As a layering agent, the following general formula (where X is O, SO2, S, CO, CH2, C(CH
2)2, C(CF2)2, and each X may be the same or different. R1 and R2 are tetracarboxylic acid residues, R2 is a diamine residue, x+y=1, x is 1
~0.2, y is 0 to 0.8, n is a positive number) A method for producing a flexible printed circuit board, characterized in that the polyimide is used for bonding a metal foil and a polyimide film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3992182A JPS58157190A (en) | 1982-03-12 | 1982-03-12 | Method of producing substrate for flexible printed circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3992182A JPS58157190A (en) | 1982-03-12 | 1982-03-12 | Method of producing substrate for flexible printed circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58157190A true JPS58157190A (en) | 1983-09-19 |
JPH0231516B2 JPH0231516B2 (en) | 1990-07-13 |
Family
ID=12566395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3992182A Granted JPS58157190A (en) | 1982-03-12 | 1982-03-12 | Method of producing substrate for flexible printed circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58157190A (en) |
Cited By (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60243120A (en) * | 1984-05-18 | 1985-12-03 | Hitachi Ltd | Flexible printed base board and production thereof |
JPS6195031A (en) * | 1984-10-15 | 1986-05-13 | Mitsui Toatsu Chem Inc | Production of polyimide film |
JPS6195030A (en) * | 1984-10-15 | 1986-05-13 | Mitsui Toatsu Chem Inc | Production of polyimide film |
JPS61143478A (en) * | 1984-12-18 | 1986-07-01 | Mitsui Toatsu Chem Inc | Heat-resistant adhesive |
JPS61250031A (en) * | 1985-04-29 | 1986-11-07 | イ−・アイ・デユポン・デ・ニモアス・アンド・カンパニ− | Meltable polyimide copolymer |
JPS61291669A (en) * | 1985-06-18 | 1986-12-22 | Mitsui Toatsu Chem Inc | Heat-resistant adhesive |
JPS627733A (en) * | 1985-03-10 | 1987-01-14 | Nitto Electric Ind Co Ltd | Colorless clear polyimide formed body and its production |
JPS6215228A (en) * | 1985-07-15 | 1987-01-23 | Mitsubishi Petrochem Co Ltd | Aromatic thioether imide polymer |
JPS6248782A (en) * | 1985-08-27 | 1987-03-03 | Mitsui Toatsu Chem Inc | Heat-resistant adhesive |
WO1987001378A1 (en) * | 1985-08-27 | 1987-03-12 | Mitsui Toatsu Chemicals, Incorporated | Polyimides and heat-resistant adhesives comprising the same |
JPS6284124A (en) * | 1985-08-30 | 1987-04-17 | ゼネラル・エレクトリツク・カンパニイ | Crystalline polyimide containing cumulative phenylenesulfideunit |
JPS6286021A (en) * | 1985-10-11 | 1987-04-20 | Mitsui Toatsu Chem Inc | Polyimide and heat-resistant adhesive comprising same |
JPS62185715A (en) * | 1986-02-13 | 1987-08-14 | Mitsui Toatsu Chem Inc | Colorless polyimide film |
EP0234882A2 (en) * | 1986-02-25 | 1987-09-02 | MITSUI TOATSU CHEMICALS, Inc. | High-temperature adhesive of polyimide |
EP0269319A2 (en) * | 1986-11-19 | 1988-06-01 | MITSUI TOATSU CHEMICALS, Inc. | Polyimide |
JPS63130633A (en) * | 1986-11-20 | 1988-06-02 | Kanegafuchi Chem Ind Co Ltd | Novel polyamic acid and production of polyimide |
JPS63170420A (en) * | 1987-01-08 | 1988-07-14 | Nitto Electric Ind Co Ltd | Molded article of colorless transparent polyimide and production thereof |
JPS63170421A (en) * | 1986-11-19 | 1988-07-14 | ゼネラル・エレクトリック・カンパニイ | Crystalline polyimide containing built-up phenylensulfide unit |
JPS64121A (en) * | 1987-02-13 | 1989-01-05 | New Japan Chem Co Ltd | Polyimide resin composition and its production |
US4797466A (en) * | 1985-09-03 | 1989-01-10 | Mitsui Toatsu Chemicals, Inc. | High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy)pyridine |
JPH0195155A (en) * | 1987-10-05 | 1989-04-13 | Mitsubishi Kasei Corp | Polyimide resin composition |
JPH01131239A (en) * | 1987-11-16 | 1989-05-24 | Mitsui Toatsu Chem Inc | Production of polyimide of good processability |
JPH01268778A (en) * | 1988-04-20 | 1989-10-26 | Hitachi Chem Co Ltd | Hot-melt adhesive, polyimide film with said adhesive layer and printed circuit board therefrom |
JPH01282283A (en) * | 1988-05-10 | 1989-11-14 | Hitachi Chem Co Ltd | Hot-melt adhesive, polyimide film with hot-melt adhesive layer and board for printed circuit |
US4883718A (en) * | 1985-02-12 | 1989-11-28 | Mitsui Toatsu Chemicals, Inc. | Flexible copper-clad circuit substrate |
JPH0260934A (en) * | 1988-06-28 | 1990-03-01 | Amoco Corp | Polyimide and copolyimide which have low dielectric constant and low moisture absorptivity and are used for both interlayer insulator and base plate coating film |
JPH02253551A (en) * | 1989-03-27 | 1990-10-12 | Nippon Telegr & Teleph Corp <Ntt> | Conditioning method for electron microscope specimen and apparatus therefor |
JPH036226A (en) * | 1989-05-31 | 1991-01-11 | Shin Etsu Chem Co Ltd | Polyimide resin solution composition |
JPH0364355A (en) * | 1989-08-02 | 1991-03-19 | Shin Etsu Chem Co Ltd | Composition for protection of semiconductor element |
JPH03166227A (en) * | 1989-11-24 | 1991-07-18 | Ube Ind Ltd | Thermoplastic aromatic polyimide |
JPH05117596A (en) * | 1991-10-29 | 1993-05-14 | Sumitomo Bakelite Co Ltd | Film adhesive having high thermal conductivity and bondable by hot melt bonding |
JPH05125332A (en) * | 1991-11-01 | 1993-05-21 | Sumitomo Bakelite Co Ltd | Hot melt bonding electrically conductive filmy adhesive |
JPH05331424A (en) * | 1992-06-04 | 1993-12-14 | Sumitomo Bakelite Co Ltd | Film adhesive |
US5278276A (en) * | 1985-08-27 | 1994-01-11 | Mitsui Toatsu Chemicals, Incorporated | Polyimide and high-temperature adhesive of polyimide |
JPH06106678A (en) * | 1991-10-07 | 1994-04-19 | Internatl Business Mach Corp <Ibm> | Multilayer product, its production process, and process for minimizing generation of metallic particle |
JPH07278393A (en) * | 1995-04-17 | 1995-10-24 | Mitsui Toatsu Chem Inc | Polyimide resin composition |
JPH07292249A (en) * | 1995-03-20 | 1995-11-07 | Mitsui Toatsu Chem Inc | Polyimide resin composition |
JPH07292247A (en) * | 1995-03-20 | 1995-11-07 | Mitsui Toatsu Chem Inc | New polyimide resin composition |
JPH07292246A (en) * | 1995-03-20 | 1995-11-07 | Mitsui Toatsu Chem Inc | Polyimide resin composition |
JPH0841338A (en) * | 1995-03-20 | 1996-02-13 | Mitsui Toatsu Chem Inc | Composition for polyimide resin |
JPH08225645A (en) * | 1995-12-18 | 1996-09-03 | Nitto Denko Corp | Colorless clear polyimide molding and production thereof |
JPH08231714A (en) * | 1996-01-24 | 1996-09-10 | Mitsui Toatsu Chem Inc | Polyimide excellent in thermal stability |
JPH08231715A (en) * | 1996-03-08 | 1996-09-10 | Mitsui Toatsu Chem Inc | Polyimide excellent in thermal stability |
US6468664B1 (en) | 1999-10-19 | 2002-10-22 | Samsung Electronics Co., Ltd. | Poly(imide-siloxane) compound for tapeless LOC packaging |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52153948A (en) * | 1976-06-15 | 1977-12-21 | Ciba Geigy Ag | Aromatic diamine polyamide compound consisting of said diamine and process for preparing same |
JPS5518426A (en) * | 1978-07-27 | 1980-02-08 | Asahi Chem Ind Co Ltd | Heat-resistant flexible electronic parts |
-
1982
- 1982-03-12 JP JP3992182A patent/JPS58157190A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52153948A (en) * | 1976-06-15 | 1977-12-21 | Ciba Geigy Ag | Aromatic diamine polyamide compound consisting of said diamine and process for preparing same |
JPS5518426A (en) * | 1978-07-27 | 1980-02-08 | Asahi Chem Ind Co Ltd | Heat-resistant flexible electronic parts |
Cited By (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0354971B2 (en) * | 1984-05-18 | 1991-08-21 | ||
JPS60243120A (en) * | 1984-05-18 | 1985-12-03 | Hitachi Ltd | Flexible printed base board and production thereof |
JPS6195031A (en) * | 1984-10-15 | 1986-05-13 | Mitsui Toatsu Chem Inc | Production of polyimide film |
JPS6195030A (en) * | 1984-10-15 | 1986-05-13 | Mitsui Toatsu Chem Inc | Production of polyimide film |
JPS61143478A (en) * | 1984-12-18 | 1986-07-01 | Mitsui Toatsu Chem Inc | Heat-resistant adhesive |
US4883718A (en) * | 1985-02-12 | 1989-11-28 | Mitsui Toatsu Chemicals, Inc. | Flexible copper-clad circuit substrate |
JPS627733A (en) * | 1985-03-10 | 1987-01-14 | Nitto Electric Ind Co Ltd | Colorless clear polyimide formed body and its production |
JPS61250031A (en) * | 1985-04-29 | 1986-11-07 | イ−・アイ・デユポン・デ・ニモアス・アンド・カンパニ− | Meltable polyimide copolymer |
JPS61291669A (en) * | 1985-06-18 | 1986-12-22 | Mitsui Toatsu Chem Inc | Heat-resistant adhesive |
JPS6215228A (en) * | 1985-07-15 | 1987-01-23 | Mitsubishi Petrochem Co Ltd | Aromatic thioether imide polymer |
JPH0678431B2 (en) * | 1985-07-15 | 1994-10-05 | 三菱油化株式会社 | Aromatic thioetherimide polymer |
US4847349A (en) * | 1985-08-27 | 1989-07-11 | Mitsui Toatsu Chemicals, Inc. | Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines |
US5087689A (en) * | 1985-08-27 | 1992-02-11 | Mitsui Toatsu Chemicals, Inc. | Polyimide and high-temperature adhesive of polyimide based on meta-phenoxy diamines |
US5205894A (en) * | 1985-08-27 | 1993-04-27 | Mitsui Toatsu Chemicals, Inc. | Polyimide and high-temperature adhesive of polyimide |
US5278276A (en) * | 1985-08-27 | 1994-01-11 | Mitsui Toatsu Chemicals, Incorporated | Polyimide and high-temperature adhesive of polyimide |
WO1987001378A1 (en) * | 1985-08-27 | 1987-03-12 | Mitsui Toatsu Chemicals, Incorporated | Polyimides and heat-resistant adhesives comprising the same |
JPS6248782A (en) * | 1985-08-27 | 1987-03-03 | Mitsui Toatsu Chem Inc | Heat-resistant adhesive |
EP0729995A1 (en) * | 1985-08-27 | 1996-09-04 | MITSUI TOATSU CHEMICALS, Inc. | Polyimide and high-temperature adhesive of polyimide |
JPS6284124A (en) * | 1985-08-30 | 1987-04-17 | ゼネラル・エレクトリツク・カンパニイ | Crystalline polyimide containing cumulative phenylenesulfideunit |
US4797466A (en) * | 1985-09-03 | 1989-01-10 | Mitsui Toatsu Chemicals, Inc. | High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy)pyridine |
JPS6286021A (en) * | 1985-10-11 | 1987-04-20 | Mitsui Toatsu Chem Inc | Polyimide and heat-resistant adhesive comprising same |
JPS62185715A (en) * | 1986-02-13 | 1987-08-14 | Mitsui Toatsu Chem Inc | Colorless polyimide film |
US4795798A (en) * | 1986-02-25 | 1989-01-03 | Mitsui Toatsu Chemicals, Inc. | High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phenoxy)phenyl]1,1,1,3,3,3-hexafluoro propane |
EP0234882A2 (en) * | 1986-02-25 | 1987-09-02 | MITSUI TOATSU CHEMICALS, Inc. | High-temperature adhesive of polyimide |
JPS63170421A (en) * | 1986-11-19 | 1988-07-14 | ゼネラル・エレクトリック・カンパニイ | Crystalline polyimide containing built-up phenylensulfide unit |
EP0269319A2 (en) * | 1986-11-19 | 1988-06-01 | MITSUI TOATSU CHEMICALS, Inc. | Polyimide |
JPS63130633A (en) * | 1986-11-20 | 1988-06-02 | Kanegafuchi Chem Ind Co Ltd | Novel polyamic acid and production of polyimide |
JPS63170420A (en) * | 1987-01-08 | 1988-07-14 | Nitto Electric Ind Co Ltd | Molded article of colorless transparent polyimide and production thereof |
JPS64121A (en) * | 1987-02-13 | 1989-01-05 | New Japan Chem Co Ltd | Polyimide resin composition and its production |
JPH0195155A (en) * | 1987-10-05 | 1989-04-13 | Mitsubishi Kasei Corp | Polyimide resin composition |
JPH01131239A (en) * | 1987-11-16 | 1989-05-24 | Mitsui Toatsu Chem Inc | Production of polyimide of good processability |
JPH01268778A (en) * | 1988-04-20 | 1989-10-26 | Hitachi Chem Co Ltd | Hot-melt adhesive, polyimide film with said adhesive layer and printed circuit board therefrom |
JPH01282283A (en) * | 1988-05-10 | 1989-11-14 | Hitachi Chem Co Ltd | Hot-melt adhesive, polyimide film with hot-melt adhesive layer and board for printed circuit |
JPH0260934A (en) * | 1988-06-28 | 1990-03-01 | Amoco Corp | Polyimide and copolyimide which have low dielectric constant and low moisture absorptivity and are used for both interlayer insulator and base plate coating film |
JPH02253551A (en) * | 1989-03-27 | 1990-10-12 | Nippon Telegr & Teleph Corp <Ntt> | Conditioning method for electron microscope specimen and apparatus therefor |
JPH036226A (en) * | 1989-05-31 | 1991-01-11 | Shin Etsu Chem Co Ltd | Polyimide resin solution composition |
JPH0364355A (en) * | 1989-08-02 | 1991-03-19 | Shin Etsu Chem Co Ltd | Composition for protection of semiconductor element |
JPH03166227A (en) * | 1989-11-24 | 1991-07-18 | Ube Ind Ltd | Thermoplastic aromatic polyimide |
JPH06106678A (en) * | 1991-10-07 | 1994-04-19 | Internatl Business Mach Corp <Ibm> | Multilayer product, its production process, and process for minimizing generation of metallic particle |
JPH05117596A (en) * | 1991-10-29 | 1993-05-14 | Sumitomo Bakelite Co Ltd | Film adhesive having high thermal conductivity and bondable by hot melt bonding |
JPH05125332A (en) * | 1991-11-01 | 1993-05-21 | Sumitomo Bakelite Co Ltd | Hot melt bonding electrically conductive filmy adhesive |
JPH05331424A (en) * | 1992-06-04 | 1993-12-14 | Sumitomo Bakelite Co Ltd | Film adhesive |
JPH07292249A (en) * | 1995-03-20 | 1995-11-07 | Mitsui Toatsu Chem Inc | Polyimide resin composition |
JPH07292247A (en) * | 1995-03-20 | 1995-11-07 | Mitsui Toatsu Chem Inc | New polyimide resin composition |
JPH07292246A (en) * | 1995-03-20 | 1995-11-07 | Mitsui Toatsu Chem Inc | Polyimide resin composition |
JPH0841338A (en) * | 1995-03-20 | 1996-02-13 | Mitsui Toatsu Chem Inc | Composition for polyimide resin |
JPH07278393A (en) * | 1995-04-17 | 1995-10-24 | Mitsui Toatsu Chem Inc | Polyimide resin composition |
JPH08225645A (en) * | 1995-12-18 | 1996-09-03 | Nitto Denko Corp | Colorless clear polyimide molding and production thereof |
JPH08231714A (en) * | 1996-01-24 | 1996-09-10 | Mitsui Toatsu Chem Inc | Polyimide excellent in thermal stability |
JPH08231715A (en) * | 1996-03-08 | 1996-09-10 | Mitsui Toatsu Chem Inc | Polyimide excellent in thermal stability |
US6468664B1 (en) | 1999-10-19 | 2002-10-22 | Samsung Electronics Co., Ltd. | Poly(imide-siloxane) compound for tapeless LOC packaging |
Also Published As
Publication number | Publication date |
---|---|
JPH0231516B2 (en) | 1990-07-13 |
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