JPS58151085A - Manufacture of semiconductor laser device - Google Patents

Manufacture of semiconductor laser device

Info

Publication number
JPS58151085A
JPS58151085A JP3231582A JP3231582A JPS58151085A JP S58151085 A JPS58151085 A JP S58151085A JP 3231582 A JP3231582 A JP 3231582A JP 3231582 A JP3231582 A JP 3231582A JP S58151085 A JPS58151085 A JP S58151085A
Authority
JP
Japan
Prior art keywords
substrate
crystal growth
gaas
layer
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3231582A
Other languages
Japanese (ja)
Inventor
Minoru Sagara
相良 実
Hideo Tamura
英男 田村
Seiji Iida
飯田 清次
Haruki Kurihara
栗原 春樹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP3231582A priority Critical patent/JPS58151085A/en
Publication of JPS58151085A publication Critical patent/JPS58151085A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure

Landscapes

  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To obtain a buried type hetero laser with good yield by a method wherein the surface of a crystal growing substrate from a liquid crystal blocking mask is projected in a filament form while performing liquid epitaxial growth. CONSTITUTION:An N-Al0.45Ga0.55As 17 and an N-GaAs 18 are laminated on the N-GaAs substrate 16, and a part of the layer 18 is removed by etching by the aq. soln of NH3+H2O2. The surface of the exposed layer 17 is an oxide film, which becomes the mask 19 for blocking liquid crystal growth, and the remaining stripe shaped N-GaAs layer becomes the substrate surface 20 for crystal growth. An N-Al0.3Ga0.7As clad 21, a non-doped GaAs active layer 22, a P-Al0.3Ga0.7As clad 23 and a P-GaAs ohmic electrode 24 are successively formed epitaxially on this substrate by a normal method. Next, the part except for the main stripe part is covered with an Si3N4 25, and metallic electrodes 26 and 27 are attached. By this constitution, crystals can be easily formed on the stripe shaped window, and accordingly the yield of the buried hetero laser is remarkably improved.

Description

【発明の詳細な説明】 (@明の技愉分1?) 本Q明紘ts@晶成長法也;よる半導体レーザ装置のa
違法じ関する・ (従来技術およびそのRIl1点) フイクメント状の活性領域なりラッド中に麿め込んだい
わゆるBurrisd H@t@ro Las@r(以
下1菖レーザと称丁)は、低駆動電流、等方的な遠a#
像などの優れた性質を有し、光過傷や光情報鶏港の光源
として最適であるが、2度の淑相結蟲戚長工楊を含む畿
道工程か複雑で、a通歩どまりが愚い問題かあった・ このB111点を解決する目的で、1度の箪椙纏晶成長
工程で作られる11構遺として111)・痕a@亀H@
t@rostruatur*工a#er (a下1■レ
ーずと祢丁)が提案されている。IJla乃至第31は
その展進方法を示したものである。即ち、まず第1!1
lL−示すようにeaA−単結晶基板(1)のWk面に
81魯4からなる液相―層成長阻止マスク(2)を設け
る。この基板の上に通常のスライドボート法−二よって
m−44−sG&、、ムークラッド(3)、unlop
s−Gaム−活性領域(4)、p−ムlea Gary
ム−クラッド(53% P−()ILム・オー(ツク電
1k(61t−この*1ニー液相緒晶成長8せることに
よって、第2aに示T断面*aのクエハー會得る。次い
でウェハーのp4M及びn備表11o6二電極加工をし
てからs3図に示すようし半導体レーザーのチップY切
り出丁。なお第3因において、(力に81.IJ。
[Detailed Description of the Invention] (@Akira's Techniques Part 1?) A of the semiconductor laser device according to the book Q Akihirots@Crystal Growth Method
Regarding illegality (prior art and its RI1 point) The so-called Burrisd H@t@ro Las@r (hereinafter referred to as 1-iris laser), which is embedded in a fixed active region or rad, has a low driving current, isotropic far a#
It has excellent properties such as images, and is ideal as a light source for light damage and optical information. There was a problem. In order to solve this B111 point, 111) traces a@KameH@
t@rostruatur* 工 a#er (a 下1■RazutoNecho) has been proposed. IJla to 31st show the method of expansion. In other words, first!
As shown in FIG. 1L, a liquid phase layer growth prevention mask (2) made of 81-4 is provided on the Wk plane of the eaA-single crystal substrate (1). M-44-sG&, MOOCRAD (3), unlop by normal slide boat method on this substrate.
s-Ga mu-active region (4), p-mulea Gary
By growing the crystals of 53% P-()IL MU-O(TSUKU ELECTRONICS 1K(61T)), a wafer with T cross-section *a shown in 2A is obtained.Then, the wafer is p4M and nTable 11o6 After two-electrode processing, cut out the chip Y of the semiconductor laser as shown in figure s3.In addition, in the third factor, (81.IJ in force).

結縁績、(81、t91はそれぞれP備、N側電極盆^
である。レーザーの発光部分は第1図の−8のストライ
プ状窓(「王ストライブ状慝」と呼ぶことζ:する)の
上の結晶hi、★で得られるフィラメント状のmgm城
(4〆である。また暢8′のストライプ状窓はダミー領
域とも呼ばれ、液相結晶成長時に液相から析田する結晶
の多くを吸収すること(二よって帖蟲戚長速wLY抑制
するために設けられている。
Connection results, (81 and t91 are P-side and N-side electrode trays, respectively)
It is. The light emitting part of the laser is a filament-like mgm castle (4〆) obtained by the crystal hi, ★ above the striped window (called ``king stripe'') shown at -8 in Figure 1. In addition, the striped window 8' is also called a dummy region, and is provided to absorb most of the crystals precipitated from the liquid phase during liquid phase crystal growth (therefore, it is provided to suppress the long velocity wLY of the crystals). There is.

ダミー領域を設けない場合は結晶成長速度が迷子ぎて、
を古注温域の厚さく0.1〜0.3μm)を制御するこ
とは冥際上不−Jkである。
If you do not provide a dummy region, the crystal growth rate will be unstable,
It is extremely important to control the thickness of the ancient temperature range (0.1 to 0.3 μm).

しかしながらこのような方法で作られるIllレーザの
製造歩どまりは低い。それは$2図に示した#L相結晶
成員工楊において、王ストライブ状窓における結晶成長
が全く行われないか、打われても特定の軸蟲鵬が欠落す
ることが憂いからである。
However, the production yield of Ill lasers made by this method is low. This is because in the #L phase crystal member shown in the $2 diagram, crystal growth in the striped window may not occur at all, or certain axes may be missing even if the window is struck.

これが兄麓レーザが^性能かつ島脚道歩どまりのレーザ
として期待されていながら、実用化されていない原因と
なっている技術上の問題点である。
This is the technical problem that has caused the Eneroku laser to not be put into practical use, although it is expected to be a laser with high performance and a similar level of performance.

(発明の目的) この発明の目的はICHレーザの歩どまりの良いJll
l道IPを提供すること1二ある。
(Object of the invention) The object of the invention is to improve the production quality of ICH lasers.
There are 12 ways to provide IP.

(発明の概1り 第1図乃至第3図示の従来の方法で主ストライプ状態6
二おける結晶成長が困難な原因は、主スト阻止マスクよ
り低い為−二、結晶成長tせしむる溶液に箇れない事で
あると推論され、実験的にも確かめられた。この推#i
Vs溝lきった基板上の溶液についてのモデルを用いて
説明する・第4囮において、a(1は暢2ω(=−)、
深さdの篩をきった基板で、この上に表面張力Cの溶i
[uが曲率半径ρで接している。この時 ρ3−(−一41)を十ω1から ρ;(♂+♂)/2
dである。
(Summary of the invention 1) The main stripe state 6 is
It was inferred that the reason why the crystal growth in the second stage was difficult was that the crystal growth temperature was lower than that of the main strike prevention mask, so that the crystal growth t could not penetrate into the solution, and this was confirmed experimentally. This recommendation #i
This will be explained using a model for a solution on a substrate with a Vs groove cut out. ・In the fourth decoy, a
A substrate with a sieve of depth d is placed on top of the molten metal with a surface tension of C.
[U is in contact with the radius of curvature ρ. At this time, ρ3-(-141) is calculated from 10ω1 ρ; (♂+♂)/2
It is d.

溶液&部での圧力tP1溶液の曲率の中心から基板の溝
の上辺へ引いた直線が鉛直方図となす角を0とする時、
Is敵が鉤の底に接する条件はF−2’>2#*#=+
zg、−である。前出の式とまとめるρ と、この条件は、結Mjg<p、”−±ら−となる。具
体d 的に通常の’% ”、’lの値(′#相結晶成葺時の溶
液とおもしの圧力の和P二2XIO” dyn/dω=
1.5.am、 Axlllll)1代入すると1. 
、 (61,±” z o、3256 y n/a+w
とd なる。この憾は、通常の液体金属の表向張力の厘lO〜
l(l dyn/mに比べ非常に小さく、溶液が溝底部
−二触れない事がわかる。逆媚二’= l O” +l
 y n/amとして、 Pm2XlO” dyn/a
Lω=1.5μmの場合、溶液が溝底部に接する為の溝
深さaV計算すると)d〜2ツム程度となり、実質的に
は、溝の深さが0にならないとS*かIII#底面口接
しない事がわかる。
Pressure at solution & part tP1 When the angle between the vertical plane and the straight line drawn from the center of curvature of the solution to the top of the substrate groove is 0,
Is The condition for the enemy to touch the bottom of the hook is F-2'>2#*#=+
zg, -. This condition is summarized as ρ and the above equation, and the crystallization Mjg<p, ``-±ra-.Specifically, the normal ``%'', the value of ``l'' (the solution at the time of ``# phase crystal formation''). The sum of the pressures P22XIO” dyn/dω=
1.5. am, Axllllll) 1 and 1.
, (61,±”z o, 3256 y n/a+w
And d becomes. This problem is equal to the surface tension of ordinary liquid metal.
l(l It is very small compared to dyn/m, and it can be seen that the solution does not touch the bottom of the groove.
As y n/am, Pm2XlO” dyn/a
When Lω = 1.5 μm, the groove depth (aV) for which the solution comes into contact with the groove bottom is calculated to be about d ~ 2 mm, and in reality, unless the groove depth becomes 0, the S* or III# bottom surface I understand that there is no oral contact.

本発明では第5因に示すようにフィラメント状の結晶成
長基板面α邊が、液相結晶成長阻止マスク03より突出
した基板(141’t−液相結晶成長に用いる事によっ
て、従来技術の困JImを克服した。結晶成員基数面は
結晶成長阻止マスクより突出しているので結晶成長をセ
しむる溶液と必ず接触する。また、この様に突出した部
分は界面二不ルギーの作用により、メルトバックをうけ
易く、メルトバックによって表面近傍の結晶性の悪い部
分が除れるなどの利点も生じる。
In the present invention, as shown in the fifth factor, the filament-shaped crystal growth substrate surface α protrudes from the liquid phase crystal growth blocking mask 03 (141't-) by using the substrate for liquid phase crystal growth. JIm has been overcome.Since the crystal member radix plane protrudes from the crystal growth inhibition mask, it always comes into contact with the solution that inhibits crystal growth.In addition, such protruding parts are prevented from melting back due to the action of interfacial birurgy. It also has the advantage that poor crystallinity near the surface can be removed by meltback.

(発明の実施例) ムjX Gal −1A s/G !LムーIH1m−
・rにおける本発明の一実施例t’*6図乃至第8囮を
参照して説明する。第6内は結晶成長前の基板で、以下
の方法で作製した。連続液相結晶成長によって、n−G
aム―基板叫上にn−ムー、ea−、ム一層α’ItS
n−Gaム一層a[株]ヲツく・ハフy%ニア+過酸化
水素水のエツ?yグ液でn−GaAsPm(181の一
部を選択エツチングする・露出したムtGaム一層Q7
)の表向は酸化層となっており、液相結晶成長阻止マス
クa場となり、エツチングされずに残ったストライプ状
のn−Gal−履の部分が結晶成長基板1iIGlll
となる。なお、結晶成長基板1ilG!1jは$3μm
、廖さ0.5syn、またその両側に位置する結晶成長
阻止マスクam、asはそれぞれ犠lOμmとした。
(Embodiment of the invention) MujX Gal-1A s/G! Lmu IH1m-
- An embodiment of the present invention in r will be described with reference to t'*6 figures to the eighth decoy. The sixth substrate is a substrate before crystal growth, which was manufactured by the following method. By continuous liquid phase crystal growth, n-G
n-mu, ea-, mu more α'ItS on amu- board shout
n-Gamuichilayera [stock] wotsuku・huffy%near+hydrogen peroxide solution? Selective etching of a part of n-GaAsPm (181) with YG solution・Exposed MutGa layer Q7
) is an oxide layer, which serves as a liquid-phase crystal growth blocking mask a field, and the striped n-Gal layer that remains unetched serves as a crystal growth substrate 1iIGllll.
becomes. In addition, the crystal growth substrate 1ilG! 1j is $3μm
, the height was 0.5 syn, and the crystal growth blocking masks am and as located on both sides were each sacrificial 10 μm.

この基板の上に通常のスライドボート法によってn−ム
4 畠G &p y A mクラッドGin、 una
ops−Gaム一活性領域■、p−ムje−MGa、?
ムークラッド(ハ)、P−G&、ロオーずツク電極−を
IIIL+:液相結晶成長させて、第7i1!Jl二示
す構造の基板を得る。次いで王ストライブとなる部分g
!Iv除いて8 i、 M、の絶縁麟四を設け、史じ基
板のp4ii!I及びn側表th+に電極層を設けてか
ら、118図に示す半導体レーザのテップl切り出丁。
On this substrate, a normal slide boat method was applied to form a clad Gin, una.
ops-Ga module active region ■, p- module je-MGa, ?
Muklad (c), P-G&, Roozuk electrode-IIIL+: Liquid phase crystal growth, 7th i1! A substrate having the structure shown in Jl2 is obtained. Next is the part g that becomes King Strive.
! Except for Iv, 8i, M, insulators are provided, and p4ii of the historical board! After providing an electrode layer on the I and n side surfaces th+, the semiconductor laser is cut out from the top of the semiconductor laser shown in FIG. 118.

m5IQ(=おいて、(至)、(ハ)はそれぞれp側′
磁極  4゜雀^、n側電極金属である。
m5IQ (=, (to), (c) are respectively p side'
Magnetic pole: 4°, n-side electrode metal.

このよう区ニして傅られた半導体レーザのチップでは、
従来技術で間組となったストライブ状窓I:おける結晶
成長の困娘は全く見られなかった。
In semiconductor laser chips that have been specially designed in this way,
No defects in crystal growth were observed at all in the striped window I:, which had become interlocked in the conventional technique.

(発明の効果) 光通信、光情報処理の光源として最適なりHレーザの一
種類であるBHレーザの!11!造歩どまりを格段に向
上させることができた。
(Effect of the invention) A BH laser, which is a type of H laser, is ideal as a light source for optical communication and optical information processing! 11! We were able to significantly improve the production yield.

(発明のに形鋼) 実施例の結&材料はムZ x G al−エムー/Ga
ムロであったが、 Gazニー−Xム−1−yPy//
InPなど液相結晶成長法C二よって二車へテロ接合レ
ーザを作ることかできる全ての材料1:ついても本発明
の適用が可能である。また、敵相結晶成J[化マスクと
し11ムLgGζ−エムー鳩表面の酸化層を用いたか、
81.M、属などを用いてもよい。更im、実施例の活
性像域法真直ぐなフィラメント状に填め込まれているが
、これが曲縁、ループ、枝分かれであってもかまわない
(Shaped steel for the invention) The connection and material of the example is MuZ x Gal-M/Ga
Although it was rough, Gaz knee-X mu-1-yPy//
The present invention can be applied to all materials such as InP that can make a two-wheel heterojunction laser by the liquid phase crystal growth method C2. In addition, an oxide layer on the surface of 11 μLgGζ-Emu was used as an enemy phase crystal formation mask,
81. M, genus, etc. may also be used. In addition, although the active image area method of the embodiment is embedded in a straight filament shape, it does not matter if it has curved edges, loops, or branches.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図乃至fsB図はBHレーザの従来の製法とWk造
の説明図、第4因は本発明の詳細な説明する為のSt−
切った基板上の溶液の濡れについてのモデルの図、第5
図は本発明による液相結晶成長阻止マスクをつけた基板
を水丁因、第6因乃至SS図はICHレーザの本発明に
よる製法と構造の説明図である。 ae・・・nGlA−基板、   鰭・・・nムL@、
@ Ga□ム一、餞・・・nGaas 、<11・・・
結晶成長阻止マスク、(2)・・・nGlA−結晶成長
基板面、G11l −nA4−a Ga@11alクラ
ッド1(2)・・・undope Gaムー活性餉域、
Ci3”]>A4すG1・、マムークラツド、(2)・
・・pGaAsオーミック電極1k・・・B i、 M
4、       (至)・・・p@電極金属、gI+
・・・n@電極金属。 (7317)  代塩入 弁理士 則 近 慮 佑(ほ
か1名) 第1図 第2図 第4図 第5図 第6図 第7図 ( 第8図 7
Figures 1 to fsB are explanatory diagrams of the conventional manufacturing method of BH laser and Wk construction, and the fourth factor is St-
Diagram of model for wetting of solution on cut substrate, 5th
The figure shows a substrate equipped with a liquid-phase crystal growth inhibiting mask according to the present invention, and the sixth to SS diagrams are explanatory diagrams of the manufacturing method and structure of an ICH laser according to the present invention. ae...nGlA-substrate, fin...nmuL@,
@Ga□Muichi, 餞...nGaas, <11...
Crystal growth prevention mask, (2)...nGlA-crystal growth substrate surface, G11l-nA4-a Ga@11al cladding 1 (2)...undoped Ga moo active region,
Ci3'']>A4suG1・, Mamoukurad, (2)・
...pGaAs ohmic electrode 1k...B i, M
4. (to)...p@electrode metal, gI+
...n@electrode metal. (7317) Yoshioiri Patent Attorney Nori Yu Chikinaki (and 1 other person) Figure 1 Figure 2 Figure 4 Figure 5 Figure 6 Figure 7 ( Figure 8 7

Claims (1)

【特許請求の範囲】 畝相結晶戚14二用いる半◆体基板上に、ストライプ状
の應を有する箪4@結晶成長阻止!スクを形威し、該基
板上に少なくとも活性領域となるべき半導体結晶と、$
1クラッド及びiJ2クラッドとなるべ#2つの半導体
結晶とを結晶成長する事によって、フイクメント状の活
性領域が2つのクラ層成長阻止マスクよりも突出させる
か、同じ^さにして結晶【せしむる溶液中6二尋人し、
液相結晶成長を打う事を特徴とする半導体レーザ装置の
製造法。
[Scope of Claims] On the semi-solid substrate using the ridge-phase crystal structure 142, there is a striped glaze 4@Crystal growth inhibition! a semiconductor crystal to form at least an active region on the substrate, and a $
By growing the two semiconductor crystals that will become the first cladding and the iJ2 cladding, the ficklement-like active region can be made to protrude beyond the two cladding layer growth prevention masks, or the crystals can be grown at the same level. 62 fathoms in solution,
A method for manufacturing a semiconductor laser device characterized by using liquid phase crystal growth.
JP3231582A 1982-03-03 1982-03-03 Manufacture of semiconductor laser device Pending JPS58151085A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3231582A JPS58151085A (en) 1982-03-03 1982-03-03 Manufacture of semiconductor laser device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3231582A JPS58151085A (en) 1982-03-03 1982-03-03 Manufacture of semiconductor laser device

Publications (1)

Publication Number Publication Date
JPS58151085A true JPS58151085A (en) 1983-09-08

Family

ID=12355500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3231582A Pending JPS58151085A (en) 1982-03-03 1982-03-03 Manufacture of semiconductor laser device

Country Status (1)

Country Link
JP (1) JPS58151085A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104339081A (en) * 2013-08-02 2015-02-11 罗芬-新纳技术公司 Method and device FOR PERFORMING LASER FILAMENTATION WITHIN TRANSPARENT MATERIALS

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104339081A (en) * 2013-08-02 2015-02-11 罗芬-新纳技术公司 Method and device FOR PERFORMING LASER FILAMENTATION WITHIN TRANSPARENT MATERIALS
CN104339081B (en) * 2013-08-02 2016-10-12 罗芬-新纳技术公司 For the method and apparatus performing laser filament in transparent material

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