JPS58143516A - Method and device for obliquely soldering lc composite part - Google Patents

Method and device for obliquely soldering lc composite part

Info

Publication number
JPS58143516A
JPS58143516A JP57026931A JP2693182A JPS58143516A JP S58143516 A JPS58143516 A JP S58143516A JP 57026931 A JP57026931 A JP 57026931A JP 2693182 A JP2693182 A JP 2693182A JP S58143516 A JPS58143516 A JP S58143516A
Authority
JP
Japan
Prior art keywords
coil
soldering
coil bobbin
chip
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57026931A
Other languages
Japanese (ja)
Other versions
JPH0213809B2 (en
Inventor
博 桃井
山村 正己
豊典 金高
大谷 聖史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57026931A priority Critical patent/JPS58143516A/en
Publication of JPS58143516A publication Critical patent/JPS58143516A/en
Publication of JPH0213809B2 publication Critical patent/JPH0213809B2/ja
Granted legal-status Critical Current

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  • Molten Solder (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 不始明μインダクタンスー品とコンダンT ds di
rと虻1つのユニットとしたLO4M合蟲品の巷婦に壷
俊のfイツトンルダリング処り方砿およびそO半田付け
***に関する4oで、七の白φ)とするとこつμ半田
付けdA!!tの異なる恥部り半田付は住粟におiて、
部品の18積性【低Fざぜることなく哨#に処理できる
もの會提供することにt心。
[Detailed Description of the Invention] Unprecedented μ inductance product and condenser T ds di
r and LO4M combined into one unit, Tsubo Shun's f Itton Rudering method and SoO soldering *** 4o, 7 white φ) and the trick μ soldering Attached dA! ! The soldering of the pubic area with different t is done at Sumawa i,
We are committed to providing a company that can process parts quickly and efficiently without causing any turbulence.

本発明の肘板とな4)LO個台龜酷μ第2区(a)(切
のように襖成されている。(1)ば畳叡帥にポリウレタ
ン銅像(2)が巷鰻されコンダンプ擲部にチップコンテ
ンプ(3)が轡人されるコイル本ビン、(4m)(4b
)aコイルボビン(υの嗣子である。なお、Mj記コシ
ゾンデ為部は伸入嘔れたチップコンテンプ(3)の電[
(baX5b)か電子(4a)(4b) IIC椹pb
T 6 x ウll&され1^る41た、ポリウレタン
銅線(2)0畳貼り&1ひ*kD v配tb*(1−子
<4N)(4b) yt−b 称a /L。
The elbow board of the present invention and the second section (a) of the L.O.P. Coil main bottle, (4m) (4b) where chip content (3) is placed in the handle.
) a coil bobbin (heir of υ. In addition, Mj Koshisonde Tamebe is the electric [
(baX5b) or electron (4a) (4b) IIC sawa pb
T 6 x Ull & 1^ 41 ta, polyurethane copper wire (2) 0 tatami pasted & 1 hi * kD v distribution tb * (1-child < 4N) (4b) yt-b name a /L.

khJ &jチツフ”コンダンt La) O@ k 
(baバ5b)ト、eに鳴子(44バ4FI)に干出I
f rj 411 テvs o 。
khJ
(ba 5b) g, e to Naruko (44ba 4FI) to Hide I
f rj 411 te vs o.

半田Ifけ秒置の羞本檎成は絽1図にボアように、夫印
エカ+mJvc回転するチー1ル(6)に妙着されたチ
ャック(υeこ″、ステージ■ンムでs1組コイルボビ
ン(lJ虻牛半田は部(8)が′F方となるよう挿入し
、次−でスデーシ日ンBで半田付は匍(榎に7フツクス
伽41Jk行い、スアーシ日ン0でデイツトンルダリン
ク(D俊、ステージーンDでaチャック(1)からコイ
ルホビンtit 1セ@収って次工性に供給する構成と
゛なつでいる。
As shown in Fig. 1, the solder is attached to the chuck (υeko), which is attached to the rotating wheel (6), and the coil bobbin (s1 set) is mounted on the stage. Insert the lJ bull solder so that part (8) is on the 'F side, then solder with Sudeshi day B and solder with 41 Jk on Enoki, and with Suashi day 0 and Dateton Ruda link ( D-shun, stage D has a structure in which a coil hobbin tit 1 is collected from a chuck (1) and supplied to the next machining.

j85図(a)(切はステージ曹ンCの構成を示し、(
旬VX牛田情、LiJぼ矢1:lJ川のように斜降して
半田軸(IJ)から給鯨牛田四【汲み上げる半田パケッ
トで、チャック(7)によって保持されたコイルホビン
(1) (D +山1fけ部(&I)か帛6図色)のよ
うに俗−半田CIIJ中に浸され、全ての端子(4m)
(4b)へのチップコンゾンデ(JJcD11t樵(5
JL)(5b) トtri !J ? V 71 ン銅
轍(Jt IJ時に半田付けする。
Figure j85 (a) (cut indicates the configuration of stage C, (
Shun VX Ushida Jo, LiJ Boya 1: lJ It descends like a river and feeds whale Ushida 4 from the solder shaft (IJ) [pumping up the solder packet, the coil hobbin (1) held by the chuck (7) (D + Immerse all the terminals (4m) in common-solder CIIJ as shown in Fig.
(4b) Chip consonde (JJcD11t woodcutter (5
JL) (5b) Totri! J? V 71 copper track (soldered during Jt IJ).

しかし、cvlうな従来Oデイツ1Φソルダリング処坂
力沃Vζすると、チツ1コンデンttaJ崗aの調子L
4&)(4’klJへυ半田付けが低部でm−てめるに
もかかわらず、チップコンデン? (37r[、f、リ
ウレタンIN * (り E)−子(45L)(4k)
へO牛ktH7け0ために七の鰍噛以上O^偏にさら畜
れて、チップコンゾンデ(3)に許容@度以上oiB亀
がかかることWCl2、チツ1コンデンt ta) K
サーマルクラック、電掘の食われが軸住して% LO蓄
合−品0Δ−注り土の原因となつてiや。
However, if the cvl conventional O date 1Φ soldering is done, the condition of the chitsu 1 condenser is
4&) (4'klJ to υ soldering is m-terminated at the lower part, but the chip capacitor?
To O cow ktH7 ke 0, it is exposed to O^ bias for more than seven snail bites, and chip consonde (3) is subjected to more than permissible @ degree oiB turtle WCl2, chitu 1 condent ta) K
Thermal cracks and erosion from the electric excavation are the cause of %LO accumulation and soil pouring.

そ仁で本発明は、チツ1コンデンtの電植とコイル01
461部とt−瞳にコイルボビンO−すにデイツトソル
ダリングす4KML、I#ff暴己コイkt%ビンt 
*Jlidチツ1コンデン1011c櫨屹叡°万1匈に
鎮斜葛ゼて味付し、次いて半…佃と一1j紀コイルボビ
ンとを相対的に近づけて前記チツ1コンデン1tl)一
方の電極とコイルの配線部とコイルボビンの端子を牛田
浸し6て、牛田象向とチップコンゾンデとoh触圓St
t賦少畜ぜてチップコンゾンデへのト、 伝熱型を低威し、−w4性O低下を幼正丁ΦtOでと、
#Jd2本V絋ンO鉱なくとも一万τてり−6lわりに
回にIJさゼゐ駆動手段と、牛…液圓と11記2本りビ
ンとt相対沁ノに沙近艦聞6せる牛田浸し+戊と【故’
ff4ことによって、上記斜め半田付は方法會効牟よく
簀軸することができる。
The present invention is based on the electroplating of 1 condenser and the coil 01.
461 parts and t-pupil to coil bobbin O-soldering to date 4KML, I#ff violent carp kt% bin t
*Jlid Chitsu 1 Condens 1011c 柨屹叡° 1011c 柨屹叡°11匈 was seasoned with diluted kudzu, and then the half... and the 11th century coil bobbin were brought relatively close to each other, and the said Chitsu 1 Condens 1tl) was connected to one electrode. Immerse the wiring part of the coil and the terminal of the coil bobbin in Ushida 6, and connect it with Ushida Zoukou, chip consonde, and oh touch ring St.
To reduce the amount of t and to the chip consonde, to lower the heat transfer type, and to reduce the -w4 property O with Yoseicho ΦtO,
# Jd 2 bottles V line O ore at least 10,000 tau - 6 liters per turn IJ size drive means, cow liquid round and 11th 2 bottles and t relative 沁ノ and sakin ship 6 Ushida dipping + 戊 and [late'
By using ff4, the above-mentioned diagonal soldering can be carried out effectively.

先j“、木発萌の斜め半田付は力泳の原連【脱明する。The diagonal soldering of Kibo Moe is the first step of the original training.

御飯K11iils+&j(It体陶の伝#m1.LH
Gohan K11iils+&j (Itai Ceramics Legend #m1.LH
.

Q−acts−%t)B  (K”い]で表わされる。It is expressed as Q-acts-%t)B (K''i).

上式η為らチップコンゾンデへ6t)1リヒー) K 
L 4tte)上昇および僧!IH1讃aの低減を図れ
ば伝5hqt低賊できることがわかる。しかし、1す1
−)については製品w造上、Il脂製。
From the above formula η to chip consonde 6t) 1lihy) K
L 4tte) Rise and Monk! It can be seen that if you try to reduce IH1 Sana, you can become a 5hqt low-ranking thief. However, 1s1
-) are manufactured by Il fat due to product construction.

ボビンか使Ft1されるなどによや、その1リヒ一トI
M度1cは限界がめ珈、その幼縦框非常に少なく、*触
l槓S虻瓢ら丁以外に伝勲jrQk低離することa″′
c11なi。
If the bobbin is used Ft1, part 1
M degree 1c has a limit, its young vertical frame is very small, and apart from touching S, Qk is low, it is a'''
c11 i.

松下本殆明<t)具捧内な一簀抛六虻路4凶〜塾8Ig
AVC着づいて侃明丁ゐ嗜な身、嶋2区と娼6圓と一様
の作用を成すtのKはm−符号を付1Tてその説明r漬
く。
Matsushita Honmaki <t) Gusho na Ichisan Rokufuro 4 Kyou ~ Juku 8 Ig
Since I arrived at AVC, I've become a fan of K, which has the same effect as Shima 2 and 6, so I'll add an m- sign to the K of t, and give an explanation of it.

u岑μパレットで、コイルボビン(IJが午…If灯婦
(8)【上にして11g4図のように1かれる。1ル体
佇手段で、輪心方IQIがコイルボビン(υのに手カ同
でkA部、#てパレットリ禅上のコイル本ビン(17t
−灰佇する2本りチャックビン(14m)(14b)と
、−カのチャックビン(14a)fr他Boチャックビ
ン(14b) fJjJX矢印臘方IQI)K付勢する
ばね0@とから域る・U−はIII記他方のチャックビ
ン(14b) tその一心Iわ9に1j11I11させ
る駆動手段で、チャックビン(14b)に数付けられた
ピニオンOηと、このヒニオンIIηに係合するラック
as r aする。
On the u 岑μ pallet, place the coil bobbin (IJ on the side...If Tofu (8) [on top of the In the kA department, the coil book bin (17 tons)
- Two chuck bins (14m) (14b) standing in gray, - chuck bins (14a) fr and other bo chuck bins (14b)・U- is the driving means for driving the other chuck bin (14b) 9 to 1j11I11, and the pinion Oη numbered on the chuck bin (14b) and the rack as r engaged with this hinion IIη. a.

なお、itr紀チャックビン(14a)ば先−が内銀杉
に水成されておル、この先端がコイルホビンtit 。
In addition, the tip of the Itrian chuck bin (14a) is water-grown in the inner silver cedar, and this tip is the coil hobbin tit.

センタ一孔−に471A合し、チャックビン(14b)
の先部ul161gIk)(2)υ1うにコイルボビン
(IJ l/Jセンタ一孔−に係合する円−一一とコイ
ルネにン−1)の−圓のW欠薯埠圓と突出−一に七れで
n休診する凸116T:#、@を脅し、コイルボビン(
lハよこoナヤッタビン(14b)Kよって位置(角度
)規制される。
Fit 471A into the center hole, chuck bottle (14b)
Tip part ul161gIk) (2) υ1 of the coil bobbin (IJ l/J center one hole - circle that engages with -11 and coil neck ring -1) - W missing the W missing part of the coil bobbin and protruding -1 to 7 Convex 116T: #, threatening @, coil bobbin (
The position (angle) is regulated by K (14b).

半田付Yj作業は、チャックビン(14a)(14b)
テコイルホビンtlJ ′に灰佇して島5図のようにパ
レットttxpbコイルボビン山を抜き歇ル、次にラッ
クO岑に回動してチャックビン(14b)’を所定角度
だけ回動させ、コイルホビン(1) l第7凶−)の姿
勢η1ら帛7凶(匈(/Jj5に矢印y方岡に回動ざゼ
て、コイルホビン(1)kテラ1:Iンデンナ(dJ 
Oill樵配設方1岨矢印・□V力E* 3に川原−だ
け一針嘔ゼて味佇する。そしてこり状io1!チャック
とン(14□)(14b)ell助させて半田付は婦t
87[7ラツクス【−布し、半田パケット四て汲み上げ
た#−牛田tillに第8図のように一方の半田付け5
(8)のみt先ず浸して端子(4,)側の半田付け【行
い、パケット四を一旦下蜂妊ぜ、引さd%Aてラツクリ
匈によってチャックビン(14b) ir回I妾ゼて他
方の半田付は部(8)の端子(4b)$にりφてもコイ
ルホビン(IJ t−鏑針もぜて崗悼にディツトンルタ
リングtb−>た彼、コイル本ビン山を路7凶−)υ輪
費九傷層皇ゼてパレットII冑に開式nる9 (toように半田付は状自は、チップコンデンt(1)
 Oml 41部のみ牛…献圓と振触しており、従来に
比べて大lth&に伝熱量がおさえられ、チップコンデ
ンf (3) K fi 、i!!管かけることなくチ
ップコンゾンデ(3)の電極とポリウレタン−練(27
11i51時に端子(4a)またに<4.)K半田付け
することができる。
For soldering Yj work, use chuck bins (14a) (14b)
Standing on the coil hobbin tlJ', pull out the pallet ttxpb coil bobbin stack as shown in Figure 5, then rotate it to the rack O, rotate the chuck bin (14b)' by a predetermined angle, and remove the coil bobbin (1 ) The posture of η 1 and the 7th arrow (/Jj5, the arrow y rotates in the direction of the y direction, and the coil hobbin (1) k Terra 1: I Indenna (dJ
Oil Woodcutter Arrangement Method 1 岨arrow □V Force E* 3 Kawahara - only one needle vomits and stands still. And stiff io1! Chuckton (14□) (14b) Let me help you with the soldering.
87 [7 Lacs [- cloth and pumped up 4 solder packets #- Ushida till one side solder 5 as shown in Figure 8
(8) First dip the terminal (4,) side and solder the terminal (4,) side, then lower the packet 4, pull it out, and then use the chuck bottle (14b) with a rake. The soldering was done with the terminal (4b) of part (8). ) υWin cost 9 scratches on the pallet II helmet 9 (as in the case of soldering, the chip condenser t(1)
Only 41 copies of Oml are shaken as if it were a cow...and the amount of heat transfer is greatly suppressed compared to the conventional method. ! The electrode of chip consonde (3) and polyurethane kneading (27
At 11i51, terminal (4a) also <4. )K can be soldered.

以上説明のように本発明にすると、半田付は編I!to
異なるチップコンデンtとコイルの配置線とtPiiI
J龜に弱vhITT釦チップコンデンナに無廊會かける
ことなく四階にディップ・ンルダリングする仁とかでl
、チップコンデンtにす二マルクラック中亀Jikの食
われの売主もなく、半田付けり隊のLO複合部品4D4
1!幀性の低下の問題を回射できる。箇た、本発明の半
田付は装置によると、−成藺率にし工斜め半田付は処理
を簀行できるも・のでるる。
With the present invention as explained above, soldering is part I! to
Different chip capacitors and coil arrangement lines and tPiii
Jin who dips and undulates the fourth floor without having a meeting with the weak vhITT button chip condenser on the J-shape.
, chip condenser T, two-maru crack Nakagame Jik's prey seller, soldering team's LO composite parts 4D4
1! The problem of reduced affordability can be resolved. In addition, the soldering device of the present invention has a low production rate, and the diagonal soldering process can be carried out in a single manner.

【図面の簡単な説明】[Brief explanation of drawings]

蒙1mIQ早出付けfjIj−〇基本−成凶、躬2 m
 (a)((9)9工L Oa 4!r f&、& g
D w m mと1M11m1a、帛6凶−)(b)に
従来の半田付は藝−の止1図と賛躯陶叩凶、帛4−〜I
n−は本尭明〇−蓑纏例を示し、躬4凶會よチャック*
*@UO本ビンの状−図、第5区区チャックOボビン律
カ状m図、第6凶(1)(鴫区チャックビンO針伐凶と
チャックビンとボビンとの保合状芯祝明凶、第7凶(龜
)(榊框ボビンの一斜状急説明凶、1Ii88図は半田
付は状m睨明凶でめる・(17−コイルボビン、(2)
−ポリウレタン銅轍、(3)−・チップコンゾンデ、 
(4m)(4b) ・一端子、(8)−半田付は卸、閣
−牛出情、tt;i−憚佇手klx 、(14aX14
b)・−チャックビン、tn−m一手段、1177−に
:”ニオン・す4・−ラツy、v−チツ1コンfンナの
電極配設方1川 代理人   森  本  銭  弘 第1図 第2図
Meng 1m IQ early departurefjIj-〇Basic-Success, 萬2m
(a) ((9) 9th L Oa 4!r f&, &g
D w m m and 1M11m1a, Plate 6 -) (b) Conventional soldering is art-stop 1 figure and support ceramics, Plate 4-I
n- indicates the example of the book, Ming 〇- Ming, and the 4th misfortune, Chuck *
*@UO main bottle shape diagram, 5th ward chuck O bobbin regular shape m diagram, 6th (1) (Shigu ku chuck bottle O needle cutting pattern and the convergence of the chuck bottle and bobbin) (17-coil bobbin, (2)
- Polyurethane copper track, (3) - Chip consonde,
(4m) (4b) ・One terminal, (8) - soldering is wholesale, cabinet - Ushidejo, tt;
b)・-Chuckbin, tn-m one means, 1177-: ``Nion Su4・-Ratsuy, v-chitsu 1confna's electrode placement method 1 River agent Zenihiro Morimoto Figure 1 Figure 2

Claims (1)

【特許請求の範囲】 1、チップコンテンプの篭樵とコイlしり配轍部とに同
時にコイルボビン0喝子にダイットンルダリングするに
除し、80記コイルボビンtIu記チツ1コンデン10
−樵配メ力同に鵠針妊ぜてに拉し、〆いで牛田惜と@1
J記コイルボビンと【相刈ゆJに近゛づけて一11紀チ
ツ7°コンデンtの−bの亀柩とコイルのに婦都とコイ
ルボビンの嗣子倉牛田攪しするLO411合部品におけ
る斜め千印付けha−9 g、  :x 4 ルd ビンに一心力lOUがコイル
ボビン長参h1句v2本のビンの一部間で挟佇する株佇
手奴ξ、d+Itd2本りとlり少tくとも一力tヤ0
帽心t t)p 14回III#6ぜる躯−生成と、牛
山敏面とuIJ札2本Vヒンと(ビン的に汝肛−1−さ
ぞ6千田浸し十にとt′叙fj友LCν台部doQ針め
半田付ff装置・
[Scope of Claims] 1. In addition to the fact that the gutter and coil rut distribution part of the chip contemplature are simultaneously dialed into 0 coil bobbins, 80 coil bobbins 1 condenser 10 are added.
- Kidnapped by a woodcutter and pregnant by a woodcutter, and finally with Kei Ushida @1
Diagonal 1000 stamp on LO411 combined parts of coil bobbin and coil bobbin of 111th century 7° condensed near Aigari Yu J. Attachment ha-9 g, :x 4 L d The coil bobbin length LOU is sandwiched between part of the two bottles. Ichiriki tya 0
Hatshin t t)p 14th III #6 Zel body - generation, Ushiyama Toshimen and uIJ bill 2 V Hin (Bin-wise you anus-1-sazo 6 Senda soaked 10 and t' friend) LCν base doQ needle soldering ff device/
JP57026931A 1982-02-19 1982-02-19 Method and device for obliquely soldering lc composite part Granted JPS58143516A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57026931A JPS58143516A (en) 1982-02-19 1982-02-19 Method and device for obliquely soldering lc composite part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57026931A JPS58143516A (en) 1982-02-19 1982-02-19 Method and device for obliquely soldering lc composite part

Publications (2)

Publication Number Publication Date
JPS58143516A true JPS58143516A (en) 1983-08-26
JPH0213809B2 JPH0213809B2 (en) 1990-04-05

Family

ID=12206900

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57026931A Granted JPS58143516A (en) 1982-02-19 1982-02-19 Method and device for obliquely soldering lc composite part

Country Status (1)

Country Link
JP (1) JPS58143516A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6163357A (en) * 1984-09-04 1986-04-01 Tamura Seisakusho Co Ltd Soldering method and its device
US4841318A (en) * 1984-11-14 1989-06-20 Minolta Camera Kabushiki Kaisha Camera system with mode selecting device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7431614B2 (en) 2020-02-21 2024-02-15 三菱重工コンプレッサ株式会社 rotating machinery

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6163357A (en) * 1984-09-04 1986-04-01 Tamura Seisakusho Co Ltd Soldering method and its device
JPH0224625B2 (en) * 1984-09-04 1990-05-30 Tamura Seisakusho Kk
US4841318A (en) * 1984-11-14 1989-06-20 Minolta Camera Kabushiki Kaisha Camera system with mode selecting device
US4849779A (en) * 1984-11-14 1989-07-18 Minolta Camera Kabushiki Kaisha Moving driving device of camera

Also Published As

Publication number Publication date
JPH0213809B2 (en) 1990-04-05

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