JPS58138057A - Integrated circuit card - Google Patents

Abstract

PURPOSE:To obtain the IC card having high reliability while increasing the stiffness of card base-material itself by changing all electrical elements containing an IC chip, which must be formed into the IC card, and a circuit pattern into a module system. CONSTITUTION:An oversheet with a magnetic recorder 13 is prepared previously to either of oversheets 12 laminated onto the surface and back of a center core 11 through thermal transfer or stripe application, and positioned to a desired pattern, and a magnetic-recorder hard polyvinyl chloride laminate is obtained by the conditions of laminating. The card is acquired by punching the laminate by a trimming die patterned with desired size. The card is obtained, a concave section, plane size thereof is the same as or slightly larger than the IC module 10 and thickness thereof is the same as or deeper than that of the IC module, is cut, and the mounting section of the IC module 10 is formed. The IC module 10 is fixed into the concave section by using two-pack curing type acryl resin adhesives 15 in the low surface and side surface of the concave section. Thereby, the IC card is prepared.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an IC card in which an IC chip is manufactured or incorporated.

recent years! Research is being carried out on cards called microcomputers, cards such as microcomputers, memory cards, microcomputer cards, electronic cards, etc. (hereinafter simply referred to as IC cards) that are equipped with or have built-in IC chips such as memory cards.

Since such IC cards have a larger storage capacity than conventional magnetic stripe cards, banks are considering using them to store the history of deposits and savings in place of passbooks, and wallets are considering storing the history of transactions such as shopping. Such an IC card necessarily has a connection electrode for electrically and mechanically connecting the IC1i path to an external data communication device, etc., and the method for installing this connection electrode is as follows:
Two methods are being considered: one method of providing it on one stroke and the method of providing it on the end face of the card. However, in the latter method, it is necessary to form a circuit pattern inside the card base material, which complicates the manufacturing process unnecessarily. In addition, the electrode contact area with the connection terminal of the external data processing device is not sufficient, making it unreliable. Therefore, as a method for installing connection terminals in an IC card, it is desirable to provide a connection electrode surface on the card surface.

In this way, even in the case of an IC card in which connection terminals are provided on the card surface, if the IC chip is completely submerged in the card base material and a curve is formed around the IC chip, it is easier to connect to the outside. An IC card is being considered in which an electrode and an IC chip are connected. However, the heat and pressure of integral molding with the card base material lowers the reliability of the IC chip and the connection between the IC chip and the circuit pattern, and if integral molding is not performed, the glabella peel strength of the card may decrease. Otherwise, there are problems such as warping of the card, which is not desirable in the manufacture or structure of IC cards.

An object of the present invention is to provide a highly reliable IC card by modularizing all electrical elements including an IC chip and a circuit pattern to be provided in the IC card. In addition, considering the use in which the rigidity of only the IC module part increases and the flexibility of the card is inhibited, and the card is likely to be damaged if the card is deformed, and the KIC module is likely to be damaged or disconnected, the card base material is Another object of the present invention is to provide an IC card whose rigidity and length are increased.

This invention will be explained below.

This invention relates to an IC card, and includes an IC module in which a potting frame is made of hard polyvinyl chloride, an electrode circuit board and an IC chip are attached by bonding, and the inside of one potting frame is integrally processed with epoxy resin molding.
It is attached to a card base made of hard polyvinyl chloride.

That is, Figure 1111 shows a cross section of the IC module according to the present invention, Figure 2 (5) is an upper perspective view thereof, Figure 2 (03) is a lower perspective view thereof, and Figure 2 (1) is a mold processing thereof. The following perspective view is shown. First, a glass epoxy film substrate IK with a thickness of about 0.1 mm is shown.
After etching to obtain a desired pattern using a printed wiring film lined with 35 μm thick copper foil, nickel and gold plating was performed to form electrode pattern 2 for external connection and circuit pattern 3. The CIC chip 5 is punched out to a desired size (W! The continuation electrode pattern 2 and the circuit pattern 3 are electrically connected by the through hole 4 at the required location. Then, at a predetermined position on the circuit pattern 3). Then, the conductor 11i6 on the IC chip 5 and the circuit pattern 3 are bonded with the conductor 7 by a wire bonding method (see FIG. 2). This part can also be implemented in a wire-less Feinponden method, in which case a thinner IC
Can you get Mosier? After making the necessary connections between the IC chip 5 and the circuit pattern 3, a potting frame 8 made of hard polyvinyl chloride is bonded with, for example, epoxy or acrylic adhesive to prevent the flow of poxy resin during potting. It is attached to the glass epoxy film substrate 1, and the epoxy resin 9 is poured in and molded (the second
(see section).

At this time, if you first cover the through hole 4 with a relatively high viscosity (10' CF29 degree) epoxy resin, and after thoroughly curing, pour in a low viscosity (about 10' CP8) epoxy resin. It is possible that the epoxy resin 9 for potting comes out through the through hole 4 to form the connection electrode pattern 2 which becomes the narrow surface.

Is it possible to obtain the IC module 10 for an IC card by the method described above? Each of the methods is compatible with current technology in the relevant industry.

On the other hand, the following method can be used to obtain the desired IC card using the IC module 1O. In other words, regarding the case where hard polyvinyl chloride is used as the card base material, Figure @3 is a plan view of the IC card, and Figure 4 is the top view of the IC card.
It is an AA sectional view of the figure. Card base material is 0.5611I
Center core 1 made of Il thick milky white hard PVC
After printing a desired pattern 14 on the front and back sides of 1 by offset printing or silk screen printing, an oversheet 12 made of transparent hard polyvinyl chloride with a thickness of 0.1 mm is printed on the front and back sides K.
The IA tube is held between two mirror-finished metal plates made of stainless steel, etc., and heated to a temperature of 150"C and a pressure of 25 to 90%.
/cj, heated and pressed under the linate conditions of time addition to form a 0.76-inch thick rigid polyvinyl chloride laminate (
A strong base material) can be obtained.

Moreover, in order to obtain a card base material having a magnetic recording body /3,
On either of the oversheets 12 laminated on the front and back sides of the center core 11 described above, an oversheet with a magnetic recording sickle body 13 is created in advance by thermal transfer or stripe coating, and after alignment with the desired pattern, the same process as described above is performed. A hard polyvinyl chloride laminate with a magnetic sickle body is obtained under the conditions. This laminate is patterned and cut into desired dimensions.
A card is obtained by punching (that is, K). After obtaining the card, the planar dimension is the same or slightly larger than that of the IC module IO, and the thickness is the same as that of the IC module or 0.
．． A deep recess of approximately 0.05B is cut using an end drill or engraving machine to form a mounting portion for the IC module IO.

Next, on the lower and side surfaces of the recess, apply 2 moats of acrylic adhesive, such as Parsa Lock (Sonyke Kencal Co., Ltd. II).
The IC module 10 is fixed in the recess using a screwdriver. In this way, an IC card as shown in FIG. 3 can be created.

On the other hand, FIG. 5 shows another embodiment of the present invention, in which an adhesive (salt vinyl acetate, etc.) 16 is applied in advance to the sides of the center core 11 of the front and back oversheets 12, and the printed center core 1
A punch hole is provided in 1 with the size of the IC module IO. Similarly, the surface oversea) 12 is provided with a size as large as that of the 4IC module 10, and the IC module l
Adhesive 17 similar to that described above is applied to the side surface of O to form a three-layer structure including the back oversheet 12, and the IC module IO is mounted in the punched hole. In this case, the densities are integrated under the conditions of a temperature of 100° C., a pressure of 30 kll/ctA, and an additional time. In addition, after installing the IC module IO, it is necessary to install only the surrounding area or the IC.
The entire structure except Mosiel 1O may be processed by ultrasonic welding.

Furthermore, no adhesive 16.17 was used and the temperature was 150°C.

It is also possible to integrate them by heat fusion under the conditions of pressure 25) C9/cj and time 15 minutes. In addition, the fifth
In the case shown in the figure, the IC module 10 is overseat 1
The thickness should be the same as the sum of one sheet of 2 (cost) and one sheet of core sea) 12.

On the other hand, FIG. 6(a) shows an example in which the potting frame 8m is larger than the electrode circuit board 2, and the IC card in this case is manufactured as follows. That is, a hole the same size as the potting frame 8m is made in the center core 11 of the card base material, and a hole the same size as the electric circuit board 2 is made in the oversheet ν. Then, as in the case of Figure 5, a three-layer structure was created, 10 IC modules were installed, and heat-pressure lamination was performed (temperature 150°C, pressure 25 hours/cd, time 15 minutes).
Alternatively, an IC card as shown in FIG. 7 is constructed by ultrasonic welding. In addition, oversheet 12K
12 If the adhesive is applied in advance, the heat conditions may be low, such as at a temperature of 100°C and pressure applied for 1 hour and 1 minute.According to this IC card, it is either a front overlay or a part of the IC module. The plan view of the IC card in this case has a structure as shown in No. 8HK.

In addition, the IC card shown in Fig. 9 was created using the IC4 module 10m of the above-mentioned No. 6E, and the IC card was made using the IC-6 module 10m potting frame to fit the thickness and external shape of the 8 people. A recess of the same size as the first recess is formed, and a second recess with a depth equal to the thickness of the oversheet and larger than the first recess is formed to form a two-step recess at the inner corner. is forming. Then, install the kICae Joule IOA in this two-stage recess, overlap the 12 ring-shaped oversheets punched to the size of the electrode circuit board I [2] according to the external size of the second recess, and It is integrated by ultrasonic welding from the back side. The plan view of the IC card in this case is III 10!
l! The structure is as shown in ilK.

As described above, according to the IC card of the present invention, since the potting frame and the card base material are made of the same material, processing is much better, and the adhesion strength is also much higher than that of the conventional card. In addition, ultrasonic welding and thermocompression bonding are possible, which has the advantage of improving adhesive strength and facilitating installation work.

In addition, in the above-mentioned embodiment 4, an IC that is compatible with an IC card is used.
Although the number of chips or IC modules is one, the number of IC modules to be dug is arbitrary.
The shape of the C module is also arbitrary. In addition, the shape of the IC chip or hole installed for the IC module is also rectangular.
It can be drawn in a circular shape or in any other arbitrary shape.

Brief explanation of 1iliir No. 1II is a cross-sectional view of the IC module used in this invention,
FIGS. 2(5) to 0 are an upper perspective view, a lower perspective view, and a lower perspective view after the cage processing, and FIG. 3 is an I of this invention.
A plan view of the C card, Figure 4 is a sectional view of the person, and Figure 5 is a cross-sectional view of the person.
The figure is a sectional view of an IC card according to another embodiment of the present invention.
No. 69 and (b) are upper and lower perspective views showing other examples of the ICi module used in this invention, FIG. 7 is a sectional view of an IC card using this IC module, and FIG. ) ICty-Tonohira mtm, No. 91mm5lIW
Fig. 1(B) is a cross-sectional view of an IC card showing another embodiment of the present invention using the IC module;

DESCRIPTION OF SYMBOLS 1... Glass boxy film board, 2... Connection electrode pattern, 3... Circuit pattern, 4... Through hole, 5... IC chip, 6... Electrode, 7... Conductor, 8.8A... Botting frame, 10.1OA...
・IC module.

Dai Tahara, Yuzo Agata's amendment proceedings (method) Haruki Shimada, Commissioner of the Japanese Patent Office, who succeeded to Japan in May 19801, Narrow indication of the case, Patent Application No. 20917 of 19802, Name of invention IC card 3, Relationship with the case to be amended Applicant (289) Dai Nippon Printing Co., Ltd. 4, Agent Tokyo Shinshin〆Nishina Haku - T No. 18 No. 16 Nomura Building 7 Telephone (348) 77057877 Patent attorney Yuzo Agata 5, date of amendment order, May 7, 1980, engraving in Ming vertical script (no change in content)

Claims (1)

[Claims] The potting frame is made of hard polyvinyl chloride, an electric circuit board KIC chip is attached by bonding, and the inside of the potting frame is integrally molded with epoxy resin.The IC module is then attached to a card base made of hard polyvinyl chloride. An IC card that is characterized by being attached.