JPS58114500A - High density mounting substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a circuit board having a highly efficient structure for heat transfer cooling using a refrigerant liquid for electronic devices such as semiconductor devices that generate heat. The present invention relates to a circuit board having a structure in which a signal propagation distance between elements is shortened for electrical elements required between the elements.

The present invention also relates to a cooling method and a high-density experimental method using this substrate.

Conventional circuit boards are made up of individual boards, and the boards on which elements are mounted are arranged in a fence-like manner. When using a board with such a structure and mounting method, if you try to cool them with a refrigerant liquid, you will have a problem with heat transfer.杢 1 hawk J.Also, if you do 11jM[;6fiT without making it into a shelf shape, you will get 11jM[;6fiT.On the other hand,■If you stack one board in a shelf shape and mount it vertically Although the convection of the refrigerant is not hindered, the signal propagation distance between the elements on the board is long, even when placed horizontally, and even if the performance of the elements is improved, the processing capacity of the equipment will be affected due to delays, etc. There are drawbacks such as the lack of improvement.

The present invention has been made in view of the above points, and a substrate for mounting an electronic element such as a semiconductor element that generates heat is formed into a cam-like structure with a continuous polygonal cross section and an element inside the substrate. By implementing this, the purpose is to increase the efficiency when heat transfer cooling is performed using a refrigerant liquid. Furthermore, by forming the substrate into a honeycomb-like structure, the signal propagation path between elements is shortened, thereby providing a device capable of high-speed signal processing.

The present invention provides heat transfer cooling using a refrigerant wave body.
The most common value of 2 when the board is mounted vertically, and 5II
When the substrate is closely mounted and the elements are placed close to each other and face each other, the bubbles generated by boiling will interfere with each other and reduce the dissipation efficiency. Being able to solve this problem while maintaining r&&1FI4 on a constant income;
■In order to process signals at high speed, it is necessary to shorten the wiring length on the board by connecting as many elements as possible as short as possible. In order to satisfy these points, the substrate has a honeycomb-like structure in which the wh plane is a polygonal continuous circular structure. ,
This will be explained in detail. FIG. 1181 is a perspective view of a unit i and a temporary unit constituting a high-density mounting board.

The unit board is constructed by electrically connecting a unit board 2 on which an element 1 is mounted with an even number of leads 8.

FIG. 2 is a perspective view of a high-density packaging substrate B in which jil:lFi unit substrates are assembled to form a honeycomb structure with a square cross section.

For the electrical connection of the unit board 1 and 1, connect the lead 8 at the *11 part 4, or bond a film-like wiring material (not shown) to the position 5.The mechanical strength is determined by the support. It is maintained by the tool 6.

There are solder bumps 5 on the lead ends as shown in Figure 6 (Hata).
2 are formed on the unit substrate 50, and the unit substrate 50.2 is formed on the unit substrate 50.
The connection is made by mending the film-like wiring material 6B between the 50' and 50'.

The film-like wiring material (1), as shown by the turtle 61, has a conductor 66 and a bonding pad 156 formed in the form of a printed cape on a polyester film 54.

The holding structure for supporting the honeycomb structure as a substrate for high-density mounting can be achieved by a method such as fixing the unit substrate with frames from above and below.

Although the cross section in FIG. 2 is square, it is of course possible to use a hexagonal polygon.

Figure 8 shows a method of mounting elements. If a large number of elements 1 are mounted in one square, the efficiency of cooling with liquid will decrease, so they should be distributed as much as possible.

In these devices, the wiring length is +1% shorter because the high-density mounting substrate has eight-dimensional connections by assembling the single substrates on which the devices are mounted in a fly cam shape. Note that 7ti wiring is shown.

FIG. 4 shows this substrate B immersed in a coolant 8 to be cooled.

When element 1 generates heat, cold III & 8 #'i convection, boiling,
The steam is narrowed by ml to form droplets 10 in the container 90, and heat is transferred to the outside.In this case, since the base ljB has a honeycomb structure, the flow of bubbles 11, the convection 12 The cooling occurs unhindered, the cooling efficiency is very good, and the elements 1 are mounted with 4 high-density KWs with appropriate spacing.

In the example of 1114v1, semiconductor elements are cooled using gK fluorocarbon refrigerant, and 100 to 160 elements can be mounted on a d-luxury basis.

Elements can be mounted with high density, and cooling using liquid can be performed efficiently. Furthermore, since the signal transmission path between elements is short, high-speed signal processing is also possible.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a single board constituting a high-density mounting board, FIG. 92 is a perspective view of the configuration of a high-density mounting board, and FIG.
What is the top view of the high-density mounting board, Figure 4? t4vIj degree Cross-sectional view when the mounting board is not cooled with liquid, Figure 5 is a perspective view when connecting single boards using film-shaped wiring material, Figure 6 is O perspective view when film-shaped wiring material is used to connect single boards. Plan view e) and cross-sectional view (b
). tFi element, 2 is a unit board, 8 is a connector terminal or lead, 4 is a connector, 6 is a support 9 is a cooling container, s
Fi refrigerant liquid, 12 is liquid convection. 1O is condensed [, 11 is a bubble ◇ Tsubo 1 Diagram 2 Figure 83 Diagram 4 Mouth 0

Claims (1)

[Claims] It is characterized by having a unit board on which a semiconductor device is mounted, a connector that electrically connects the unit board, and a support that supports the unit board and the connector in a /1 nicum structure having a polygonal cross section. A high-density experimental substrate.