JPS5740952A - Taking-out of semiconductor chip - Google Patents

Taking-out of semiconductor chip

Info

Publication number
JPS5740952A
JPS5740952A JP11664280A JP11664280A JPS5740952A JP S5740952 A JPS5740952 A JP S5740952A JP 11664280 A JP11664280 A JP 11664280A JP 11664280 A JP11664280 A JP 11664280A JP S5740952 A JPS5740952 A JP S5740952A
Authority
JP
Japan
Prior art keywords
chip
sucking
collet
tray
small chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11664280A
Other languages
Japanese (ja)
Inventor
Toshio Komuro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11664280A priority Critical patent/JPS5740952A/en
Publication of JPS5740952A publication Critical patent/JPS5740952A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To commonly, easily and surely suck chips having different thicknesses and to take out the chips from a tray uniformly unifying the depth of a chip accommodation chamber by improving the shape of a collet. CONSTITUTION:A chip tray 31 having a plurality of chip accommodation small chambers 33 divided by partition walls 32 has an air flow hole 34 at the bottom section of each small chamber 33. In a collet 36 sucking a chip 35 and fetching the chip 35 from the chip tray 31, the sucking surface 37 of the collet 36 is of a sucking plane configuration having larger area than that of the divided small chamber of the chip tray 31. With the sucking surface 37 pressed to the upper surface of each small chamber 33 divided wall of the chip tray 31 and with vacuum suction applied to the chip 35 from a vacuum suction hole 38 provided at the collet 36, the chip 35 is surely sucked to the chip sucking surface 37 by the sucking force of the collet 36 and by the force action of air flow inflowing to each small chamber 33 through the air flow hole 34 and it becomes possible to take out the chip 35.
JP11664280A 1980-08-25 1980-08-25 Taking-out of semiconductor chip Pending JPS5740952A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11664280A JPS5740952A (en) 1980-08-25 1980-08-25 Taking-out of semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11664280A JPS5740952A (en) 1980-08-25 1980-08-25 Taking-out of semiconductor chip

Publications (1)

Publication Number Publication Date
JPS5740952A true JPS5740952A (en) 1982-03-06

Family

ID=14692254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11664280A Pending JPS5740952A (en) 1980-08-25 1980-08-25 Taking-out of semiconductor chip

Country Status (1)

Country Link
JP (1) JPS5740952A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4549843A (en) * 1983-03-15 1985-10-29 Micronix Partners Mask loading apparatus, method and cassette
US4758127A (en) * 1983-06-24 1988-07-19 Canon Kabushiki Kaisha Original feeding apparatus and a cassette for containing the original
JPH03106746U (en) * 1990-02-19 1991-11-05
CN103086318A (en) * 2013-01-11 2013-05-08 烟台睿创微纳技术有限公司 Micro-electromechanical system (MEMS) silicon wafer scribing and cutting and structure releasing method
CN103491717A (en) * 2012-06-13 2014-01-01 信泰光学(深圳)有限公司 Jig for assembling chip
JP2015008170A (en) * 2013-06-24 2015-01-15 Ｔｏｗａ株式会社 Housing jig for electronic component, manufacturing method therefor and individualization device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4549843A (en) * 1983-03-15 1985-10-29 Micronix Partners Mask loading apparatus, method and cassette
US4758127A (en) * 1983-06-24 1988-07-19 Canon Kabushiki Kaisha Original feeding apparatus and a cassette for containing the original
JPH03106746U (en) * 1990-02-19 1991-11-05
CN103491717A (en) * 2012-06-13 2014-01-01 信泰光学(深圳)有限公司 Jig for assembling chip
CN103086318A (en) * 2013-01-11 2013-05-08 烟台睿创微纳技术有限公司 Micro-electromechanical system (MEMS) silicon wafer scribing and cutting and structure releasing method
JP2015008170A (en) * 2013-06-24 2015-01-15 Ｔｏｗａ株式会社 Housing jig for electronic component, manufacturing method therefor and individualization device

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