JPS5727015A - Manufacture of silicon thin film - Google Patents
Manufacture of silicon thin filmInfo
- Publication number
- JPS5727015A JPS5727015A JP10111580A JP10111580A JPS5727015A JP S5727015 A JPS5727015 A JP S5727015A JP 10111580 A JP10111580 A JP 10111580A JP 10111580 A JP10111580 A JP 10111580A JP S5727015 A JPS5727015 A JP S5727015A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- silicon thin
- plasmatic
- silicon
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Photovoltaic Devices (AREA)
Abstract
PURPOSE:To eliminate the mixture of impurities as well as to increase electric conductivity for the subject silicon thin film by a method wherein the mixture gas of tetrafluorosilane and silane is used when a silicon film, containing fluorine and hydrogen in a plasmatic atmosphere, is formed. CONSTITUTION:The silicon film is formed on an optional substrate in a plasmatic atmosphere and, in the process wherein a semiconductor element is formed, the mixed gas of tetrafluorosilane and silane is used as raw gas to be used for induction of fluorine and hydrogen on the silicon thin film. Then, when the plasmatic discharge power is reduced relatively in the prescrived mixed gas compression, a silicon thin film having no residual effect of impurities is formed and when the discharge power is increased, a silicon thin film having a high electric conductivity is formed. Through these procedures, the photoelectric converter element and the image element having excellent photoelectic characteristics and the photoelectric converter element having excellent ohmic characteristics can be formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10111580A JPS5727015A (en) | 1980-07-25 | 1980-07-25 | Manufacture of silicon thin film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10111580A JPS5727015A (en) | 1980-07-25 | 1980-07-25 | Manufacture of silicon thin film |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12356187A Division JPS63126214A (en) | 1987-05-20 | 1987-05-20 | Manufacture of silicon thin film |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5727015A true JPS5727015A (en) | 1982-02-13 |
JPS6329821B2 JPS6329821B2 (en) | 1988-06-15 |
Family
ID=14292068
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10111580A Granted JPS5727015A (en) | 1980-07-25 | 1980-07-25 | Manufacture of silicon thin film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5727015A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6070480A (en) * | 1983-08-26 | 1985-04-22 | トムソン−セ−エスエフ | Manufacture of substrate for electronically controlled equipment and display screen made thereof |
JPS60218829A (en) * | 1984-04-16 | 1985-11-01 | Canon Inc | Formation of deposited film |
JPS60218828A (en) * | 1984-04-16 | 1985-11-01 | Canon Inc | Formation of deposited film |
JPS6185818A (en) * | 1984-10-04 | 1986-05-01 | Canon Inc | Deposition film forming method |
JPS6187320A (en) * | 1984-10-05 | 1986-05-02 | Canon Inc | Formation of deposition film |
JPS6188520A (en) * | 1984-10-08 | 1986-05-06 | Canon Inc | Formation of deposited film |
JPS6189624A (en) * | 1984-10-09 | 1986-05-07 | Canon Inc | Formation of deposited film |
JPS61185919A (en) * | 1985-02-13 | 1986-08-19 | Canon Inc | Formation of deposited film |
JPS61191020A (en) * | 1985-02-20 | 1986-08-25 | Canon Inc | Formation of deposited film |
JPS61190922A (en) * | 1985-02-19 | 1986-08-25 | Canon Inc | Formation of deposited film |
JPS6411322A (en) * | 1987-07-06 | 1989-01-13 | Mitsui Toatsu Chemicals | Manufacture of semiconductor device |
-
1980
- 1980-07-25 JP JP10111580A patent/JPS5727015A/en active Granted
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0562746B2 (en) * | 1983-08-26 | 1993-09-09 | Thomson Csf | |
JPS6070480A (en) * | 1983-08-26 | 1985-04-22 | トムソン−セ−エスエフ | Manufacture of substrate for electronically controlled equipment and display screen made thereof |
JPS60218829A (en) * | 1984-04-16 | 1985-11-01 | Canon Inc | Formation of deposited film |
JPS60218828A (en) * | 1984-04-16 | 1985-11-01 | Canon Inc | Formation of deposited film |
JPS6185818A (en) * | 1984-10-04 | 1986-05-01 | Canon Inc | Deposition film forming method |
JPS6187320A (en) * | 1984-10-05 | 1986-05-02 | Canon Inc | Formation of deposition film |
JPS6188520A (en) * | 1984-10-08 | 1986-05-06 | Canon Inc | Formation of deposited film |
JPS6189624A (en) * | 1984-10-09 | 1986-05-07 | Canon Inc | Formation of deposited film |
JPS61185919A (en) * | 1985-02-13 | 1986-08-19 | Canon Inc | Formation of deposited film |
JPS61190922A (en) * | 1985-02-19 | 1986-08-25 | Canon Inc | Formation of deposited film |
JPH0834181B2 (en) * | 1985-02-19 | 1996-03-29 | キヤノン株式会社 | Deposited film formation method |
JPS61191020A (en) * | 1985-02-20 | 1986-08-25 | Canon Inc | Formation of deposited film |
JPS6411322A (en) * | 1987-07-06 | 1989-01-13 | Mitsui Toatsu Chemicals | Manufacture of semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS6329821B2 (en) | 1988-06-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE27186T1 (en) | PROCESSES FOR THE PRODUCTION OF AMORPHOUS SEMICONDUCTING ALLOYS AND ARRANGEMENTS BY MICROWAVE ENERGY. | |
JPS5727015A (en) | Manufacture of silicon thin film | |
JPS5530846A (en) | Method for manufacturing fixed memory | |
JPS5550664A (en) | Semiconductor device and method of fabricating the same | |
JPS57166310A (en) | Formation of amorphous silicon | |
JPS54104770A (en) | Heat treatment method for 3-5 group compound semiconductor | |
JPS56107551A (en) | Amorphous semiconductor having chemical modification | |
JPS5717145A (en) | Semiconductor device and manufacture therefor | |
JPS572519A (en) | Manufacture of semiconductor device | |
JPS5539631A (en) | Semiconductor device | |
JPS5683036A (en) | Glass passivation of mesa type semiconductor device | |
JPS5415669A (en) | Manufacture of mesa-type semiconductor device | |
JPS5582451A (en) | Manufacture of semiconductor device | |
JPS56114368A (en) | Manufacture of semiconductor ic device | |
JPS575364A (en) | Mos integrated circuit device | |
SE339057B (en) | ||
JPS5227354A (en) | Impurity diffusion method for iii-v group compound semiconductor region | |
JPS5723216A (en) | Manufacture of plasma reactor and semiconductor element | |
JPS55164077A (en) | Method for etching by gas plasma | |
JPS56142649A (en) | Semiconductor device | |
JPS53105171A (en) | Manufacture of semiconductor device | |
JPS5726171A (en) | Dry etching method for molybdenum | |
JPS57134936A (en) | Forming method of insulation film on compound semiconductor | |
JPS57139971A (en) | Semiconductor device with high withstand voltage | |
JPS57111043A (en) | Semiconductor integrated circuit and manufacture thereof |