JPS57188855A - Radiator for semiconductor element - Google Patents

Radiator for semiconductor element

Info

Publication number
JPS57188855A
JPS57188855A JP5919981A JP5919981A JPS57188855A JP S57188855 A JPS57188855 A JP S57188855A JP 5919981 A JP5919981 A JP 5919981A JP 5919981 A JP5919981 A JP 5919981A JP S57188855 A JPS57188855 A JP S57188855A
Authority
JP
Japan
Prior art keywords
end edges
radiator
large amount
disposed
parallel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5919981A
Other languages
Japanese (ja)
Inventor
Norihiko Kono
Shotaro Takahashi
Hideyuki Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP5919981A priority Critical patent/JPS57188855A/en
Publication of JPS57188855A publication Critical patent/JPS57188855A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain compact-sized radiator having a large amount of radiant heat by a construction that a plurality of fin members each having bent end edges on both sides thereof are disposed in parallel, and base plates are connected to faces defined by the respective end edges. CONSTITUTION:A plurality of fin members 1 each having bent end edges 1a on both sides thereof and a spacer pawl 1b in the intermediate part are disposed in parallel. Base plates 2 are brought into abutment with faces defined by the respective end edges 1a, and then both plates are bonded integrally. By so doing, it becomes possible to manufacture compact-sized radiator having a large amount of radiant heat with high productivity.
JP5919981A 1981-04-21 1981-04-21 Radiator for semiconductor element Pending JPS57188855A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5919981A JPS57188855A (en) 1981-04-21 1981-04-21 Radiator for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5919981A JPS57188855A (en) 1981-04-21 1981-04-21 Radiator for semiconductor element

Publications (1)

Publication Number Publication Date
JPS57188855A true JPS57188855A (en) 1982-11-19

Family

ID=13106510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5919981A Pending JPS57188855A (en) 1981-04-21 1981-04-21 Radiator for semiconductor element

Country Status (1)

Country Link
JP (1) JPS57188855A (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59146959U (en) * 1983-03-23 1984-10-01 東京ラヂエ−タ−製造株式会社 air cooled radiator
EP0554689A2 (en) * 1992-02-03 1993-08-11 International Business Machines Corporation Structure for dissipation of heat having slidably engaged fins for conformal disposition against a heat generating surface
US5371665A (en) * 1994-03-14 1994-12-06 Quisenberry; Tony M. Power control circuit for improved power application and temperature control of thermoelectric coolers and method for controlling thereof
US5381859A (en) * 1990-11-09 1995-01-17 Kabushiki Kaisha Toshiba Heat sink and the producing method thereof
US5528485A (en) * 1994-03-14 1996-06-18 Devilbiss; Roger S. Power control circuit for improved power application and control
US5529120A (en) * 1994-02-01 1996-06-25 Hubbell Incorporated Heat exchanger for electrical cabinet or the like
US5558155A (en) * 1993-08-06 1996-09-24 Mitsubishi Denki Kabushiki Kaisha Cooling apparatus and assembling method thereof
US5561981A (en) * 1993-10-05 1996-10-08 Quisenberry; Tony M. Heat exchanger for thermoelectric cooling device
US5689957A (en) * 1996-07-12 1997-11-25 Thermotek, Inc. Temperature controller for low voltage thermoelectric cooling or warming boxes and method therefor
US5690849A (en) * 1996-02-27 1997-11-25 Thermotek, Inc. Current control circuit for improved power application and control of thermoelectric devices
US5890371A (en) * 1996-07-12 1999-04-06 Thermotek, Inc. Hybrid air conditioning system and a method therefor
JP2002141446A (en) * 2000-11-06 2002-05-17 Sumitomo Precision Prod Co Ltd Heat radiator
EP1507290A3 (en) * 2003-08-12 2005-06-01 Coolit Systems Inc. Heat Sink
US7954332B2 (en) 2007-01-19 2011-06-07 Alkhorayef Petroleum Company Temperature control systems and methods
EP2422387A1 (en) * 2009-04-24 2012-02-29 Akasol Engineering GmbH Cooling module
US8443613B2 (en) 2008-08-27 2013-05-21 Thermotek, Inc. Vehicle air comfort system and method
US9435553B2 (en) 2009-08-27 2016-09-06 Thermotek, Inc. Method and system for maximizing thermal properties of a thermoelectric cooler and use therewith in association with hybrid cooling

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6336690Y2 (en) * 1983-03-23 1988-09-28
JPS59146959U (en) * 1983-03-23 1984-10-01 東京ラヂエ−タ−製造株式会社 air cooled radiator
US5381859A (en) * 1990-11-09 1995-01-17 Kabushiki Kaisha Toshiba Heat sink and the producing method thereof
EP0554689A2 (en) * 1992-02-03 1993-08-11 International Business Machines Corporation Structure for dissipation of heat having slidably engaged fins for conformal disposition against a heat generating surface
US5761811A (en) * 1993-08-06 1998-06-09 Mitsubishi Denki Kabushiki Kaisha Assembling method for cooling apparatus
US5558155A (en) * 1993-08-06 1996-09-24 Mitsubishi Denki Kabushiki Kaisha Cooling apparatus and assembling method thereof
US5561981A (en) * 1993-10-05 1996-10-08 Quisenberry; Tony M. Heat exchanger for thermoelectric cooling device
US5529120A (en) * 1994-02-01 1996-06-25 Hubbell Incorporated Heat exchanger for electrical cabinet or the like
US5371665A (en) * 1994-03-14 1994-12-06 Quisenberry; Tony M. Power control circuit for improved power application and temperature control of thermoelectric coolers and method for controlling thereof
US5528485A (en) * 1994-03-14 1996-06-18 Devilbiss; Roger S. Power control circuit for improved power application and control
US5566062A (en) * 1994-03-14 1996-10-15 Quisenberry; Tony M. Power control circuit for improved power application and temperature control of thermoelectric coolers
US5690849A (en) * 1996-02-27 1997-11-25 Thermotek, Inc. Current control circuit for improved power application and control of thermoelectric devices
US6058712A (en) * 1996-07-12 2000-05-09 Thermotek, Inc. Hybrid air conditioning system and a method therefor
US5890371A (en) * 1996-07-12 1999-04-06 Thermotek, Inc. Hybrid air conditioning system and a method therefor
US5689957A (en) * 1996-07-12 1997-11-25 Thermotek, Inc. Temperature controller for low voltage thermoelectric cooling or warming boxes and method therefor
JP2002141446A (en) * 2000-11-06 2002-05-17 Sumitomo Precision Prod Co Ltd Heat radiator
JP4616458B2 (en) * 2000-11-06 2011-01-19 住友精密工業株式会社 Semiconductor element heatsink
EP1507290A3 (en) * 2003-08-12 2005-06-01 Coolit Systems Inc. Heat Sink
US6971243B2 (en) 2003-08-12 2005-12-06 Coolit Systems Inc. Heat sink
US7954332B2 (en) 2007-01-19 2011-06-07 Alkhorayef Petroleum Company Temperature control systems and methods
US8443613B2 (en) 2008-08-27 2013-05-21 Thermotek, Inc. Vehicle air comfort system and method
US8839633B2 (en) 2008-08-27 2014-09-23 Thermotek, Inc. Vehicle air comfort system and method
US9719703B2 (en) 2008-08-27 2017-08-01 Thermotek, Inc. Vehicle air comfort system and method
US10359216B2 (en) 2008-08-27 2019-07-23 Thermotek, Inc. Vehicle air comfort system and method
EP2422387A1 (en) * 2009-04-24 2012-02-29 Akasol Engineering GmbH Cooling module
US9435553B2 (en) 2009-08-27 2016-09-06 Thermotek, Inc. Method and system for maximizing thermal properties of a thermoelectric cooler and use therewith in association with hybrid cooling
US10215454B2 (en) 2009-08-27 2019-02-26 Thermotek, Inc. Method and system for maximizing the thermal properties of a thermoelectric cooler and use therewith in association with hybrid cooling
US10760827B2 (en) 2010-09-30 2020-09-01 Thermotek, Inc. Method and system for maximizing the thermal properties of a thermoelectric cooler and use therewith in association with hybrid cooling

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