JPS57188831A - Assembling device for semiconductor - Google Patents

Assembling device for semiconductor

Info

Publication number
JPS57188831A
JPS57188831A JP7339381A JP7339381A JPS57188831A JP S57188831 A JPS57188831 A JP S57188831A JP 7339381 A JP7339381 A JP 7339381A JP 7339381 A JP7339381 A JP 7339381A JP S57188831 A JPS57188831 A JP S57188831A
Authority
JP
Japan
Prior art keywords
chip carrying
carrying means
section
air gap
right angles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7339381A
Other languages
Japanese (ja)
Inventor
Kazuhiro Sugita
Haruhiko Makino
Ryosuke Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP7339381A priority Critical patent/JPS57188831A/en
Publication of JPS57188831A publication Critical patent/JPS57188831A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To enable accurate positioning and rapid transport by moving a bonding section and a chip carrying means by means of linear motors and crossing the reciprocating directions of these linear motors at right angles. CONSTITUTION:The chip carrying means 19 is freely receiprocated in the X direction extending over a section between the sucking position of a semiconductor chip 11 and a work station 15 as a bonding position by means of the linear motor 27 consisting of a primary coil 25 mounted to a supporting arm 18 and a secondary conductor 26 set up to a supporting block 20 oppositely disposed through a predetermined air gap. The work station 15 is freely reciprocated in the direction that crosses at right angles with the reciprocating direction of the chip carrying means 19 by means of the linear motor 31 composed of a primary coil 28 mounted to a base 16 and a secondary conductor 30 set up to the bottom section of a die bonder supporting base 29 oppositely arranged through a prescribed air gap.
JP7339381A 1981-05-18 1981-05-18 Assembling device for semiconductor Pending JPS57188831A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7339381A JPS57188831A (en) 1981-05-18 1981-05-18 Assembling device for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7339381A JPS57188831A (en) 1981-05-18 1981-05-18 Assembling device for semiconductor

Publications (1)

Publication Number Publication Date
JPS57188831A true JPS57188831A (en) 1982-11-19

Family

ID=13516903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7339381A Pending JPS57188831A (en) 1981-05-18 1981-05-18 Assembling device for semiconductor

Country Status (1)

Country Link
JP (1) JPS57188831A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5060841A (en) * 1985-12-25 1991-10-29 Hitachi, Ltd. wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5060841A (en) * 1985-12-25 1991-10-29 Hitachi, Ltd. wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus

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