JPS57159078A - Manufacture of semiconductor light-emitting device - Google Patents

Manufacture of semiconductor light-emitting device

Info

Publication number
JPS57159078A
JPS57159078A JP56043700A JP4370081A JPS57159078A JP S57159078 A JPS57159078 A JP S57159078A JP 56043700 A JP56043700 A JP 56043700A JP 4370081 A JP4370081 A JP 4370081A JP S57159078 A JPS57159078 A JP S57159078A
Authority
JP
Japan
Prior art keywords
laser element
mount
heat sink
lead
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56043700A
Other languages
Japanese (ja)
Inventor
Seiji Iida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56043700A priority Critical patent/JPS57159078A/en
Publication of JPS57159078A publication Critical patent/JPS57159078A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball

Abstract

PURPOSE:To solidify the mount as well as to extend the life of the subject light- emitting device by a method wherein an element is supported at the point of a capillary tube using the tension of the lead which was bonded at the upper electrode of a semiconductor laser element, and the element is slidingly positioned and adhered on a heat sink. CONSTITUTION:An electrode lead 6 is bonded on the upper electrode of the semiconductor laser element 2, and the laser element is retained at the point of the capillary tube utilizing the tension of the lead. Then, the element is slidingly moved in the state wherein the lower electrode of the laser element is contacted to the heat sink 3 in which a eutectic metal is fused in the heated A which was heated in advance. The laser element is positioned and stopped at the prescribed position, the heat sink is cooled, and the eutectic metal 4 is solidified. Accordingly, the positional deviation of the laser element is prevented, and the mount is solidified, thereby enabling to contrive improvement of the yield rate and the long life of the mount.
JP56043700A 1981-03-25 1981-03-25 Manufacture of semiconductor light-emitting device Pending JPS57159078A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56043700A JPS57159078A (en) 1981-03-25 1981-03-25 Manufacture of semiconductor light-emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56043700A JPS57159078A (en) 1981-03-25 1981-03-25 Manufacture of semiconductor light-emitting device

Publications (1)

Publication Number Publication Date
JPS57159078A true JPS57159078A (en) 1982-10-01

Family

ID=12671088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56043700A Pending JPS57159078A (en) 1981-03-25 1981-03-25 Manufacture of semiconductor light-emitting device

Country Status (1)

Country Link
JP (1) JPS57159078A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0589524A2 (en) * 1992-09-25 1994-03-30 Koninklijke Philips Electronics N.V. Method of manufacturing an optoelectronic semiconductor device and optoelectronic semiconductor element suitable for use in such a method
JP2006294821A (en) * 2005-04-08 2006-10-26 Nichia Chem Ind Ltd Light emitting device excellent in heat resistance and light resistance

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0589524A2 (en) * 1992-09-25 1994-03-30 Koninklijke Philips Electronics N.V. Method of manufacturing an optoelectronic semiconductor device and optoelectronic semiconductor element suitable for use in such a method
EP0589524A3 (en) * 1992-09-25 1994-04-20 Koninklijke Philips Electronics N.V. Method of manufacturing an optoelectronic semiconductor device and optoelectronic semiconductor element suitable for use in such a method
JP2006294821A (en) * 2005-04-08 2006-10-26 Nichia Chem Ind Ltd Light emitting device excellent in heat resistance and light resistance

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