JPS57138575A - Grinding machine - Google Patents

Grinding machine

Info

Publication number
JPS57138575A
JPS57138575A JP56020201A JP2020181A JPS57138575A JP S57138575 A JPS57138575 A JP S57138575A JP 56020201 A JP56020201 A JP 56020201A JP 2020181 A JP2020181 A JP 2020181A JP S57138575 A JPS57138575 A JP S57138575A
Authority
JP
Japan
Prior art keywords
work
grinding
machine
light
photo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56020201A
Other languages
Japanese (ja)
Other versions
JPS6211986B2 (en
Inventor
Kazuhiro Ogawa
Tsuneo Kawai
Koichi Noto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56020201A priority Critical patent/JPS57138575A/en
Publication of JPS57138575A publication Critical patent/JPS57138575A/en
Publication of JPS6211986B2 publication Critical patent/JPS6211986B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To make it possible to work continuously without stopping machine from starting to finish of the work in a grinding machine that laps a transparent work by shooting light to the position of working of a work and receiving the light reflected from the work to detect the amount of working of the work. CONSTITUTION:A motor 5 is operated and a lapping machine 9 is rotated to grind the lower face of a work 16 that is set in the piercing hole 15 of a work holder 14 with lapping agent supplied to a polishing cloth 10. During the grinding laser light from a laser stimulating device 27 is directed to the grinding face of the work 16 through an objective lens of a weight 17 that is provided on the piercing hole 15, and the laser light reflected from the grinding face is received by a photo-sensor 28 and the light is converted into electricity. The output signal from the photo-sensor 28 is input to a control device 29. In this control device 29 the input is compared with a beforehand set reference value. If the output signal coincides with the reference value, the motor 5 is stopped, and the rotation of the lapping machine is stopped, and the work is machined to a specified dimension.
JP56020201A 1981-02-16 1981-02-16 Grinding machine Granted JPS57138575A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56020201A JPS57138575A (en) 1981-02-16 1981-02-16 Grinding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56020201A JPS57138575A (en) 1981-02-16 1981-02-16 Grinding machine

Publications (2)

Publication Number Publication Date
JPS57138575A true JPS57138575A (en) 1982-08-26
JPS6211986B2 JPS6211986B2 (en) 1987-03-16

Family

ID=12020545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56020201A Granted JPS57138575A (en) 1981-02-16 1981-02-16 Grinding machine

Country Status (1)

Country Link
JP (1) JPS57138575A (en)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6133857A (en) * 1984-07-27 1986-02-17 Matsushita Electric Ind Co Ltd Accurate polishing device
US5433651A (en) * 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
US5964643A (en) * 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
US6077452A (en) * 1992-09-17 2000-06-20 Luxtron Corporation Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment
US6342166B1 (en) 1998-12-10 2002-01-29 Nikon Corporation Method of detecting end point of polishing of wafer and apparatus for detecting end point of polishing
US6537133B1 (en) 1995-03-28 2003-03-25 Applied Materials, Inc. Method for in-situ endpoint detection for chemical mechanical polishing operations
US6676717B1 (en) 1995-03-28 2004-01-13 Applied Materials Inc Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6719818B1 (en) 1995-03-28 2004-04-13 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6849152B2 (en) 1992-12-28 2005-02-01 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US6876454B1 (en) 1995-03-28 2005-04-05 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6994607B2 (en) 2001-12-28 2006-02-07 Applied Materials, Inc. Polishing pad with window
US7001242B2 (en) 2002-02-06 2006-02-21 Applied Materials, Inc. Method and apparatus of eddy current monitoring for chemical mechanical polishing
US7011565B2 (en) 1995-03-28 2006-03-14 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US7037403B1 (en) 1992-12-28 2006-05-02 Applied Materials Inc. In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization
US7118457B2 (en) 2000-05-19 2006-10-10 Applied Materials, Inc. Method of forming a polishing pad for endpoint detection
US7677959B2 (en) 1999-09-14 2010-03-16 Applied Materials, Inc. Multilayer polishing pad and method of making
US7731566B2 (en) 1995-03-28 2010-06-08 Applied Materials, Inc. Substrate polishing metrology using interference signals
CN110752169A (en) * 2019-10-21 2020-02-04 西安奕斯伟硅片技术有限公司 Wafer processing device and loading and unloading method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5190095A (en) * 1975-02-05 1976-08-06

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5190095A (en) * 1975-02-05 1976-08-06

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6133857A (en) * 1984-07-27 1986-02-17 Matsushita Electric Ind Co Ltd Accurate polishing device
US6077452A (en) * 1992-09-17 2000-06-20 Luxtron Corporation Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment
US6110752A (en) * 1992-09-17 2000-08-29 Luxtron Corporation Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment
US6849152B2 (en) 1992-12-28 2005-02-01 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US7582183B2 (en) 1992-12-28 2009-09-01 Applied Materials, Inc. Apparatus for detection of thin films during chemical/mechanical polishing planarization
US7569119B2 (en) 1992-12-28 2009-08-04 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization
US7037403B1 (en) 1992-12-28 2006-05-02 Applied Materials Inc. In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization
US7024063B2 (en) 1992-12-28 2006-04-04 Applied Materials Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US5433651A (en) * 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
US6875078B2 (en) 1995-03-28 2005-04-05 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US8092274B2 (en) 1995-03-28 2012-01-10 Applied Materials, Inc. Substrate polishing metrology using interference signals
US6876454B1 (en) 1995-03-28 2005-04-05 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6719818B1 (en) 1995-03-28 2004-04-13 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US8556679B2 (en) 1995-03-28 2013-10-15 Applied Materials, Inc. Substrate polishing metrology using interference signals
US8506356B2 (en) 1995-03-28 2013-08-13 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US7011565B2 (en) 1995-03-28 2006-03-14 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6676717B1 (en) 1995-03-28 2004-01-13 Applied Materials Inc Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6537133B1 (en) 1995-03-28 2003-03-25 Applied Materials, Inc. Method for in-situ endpoint detection for chemical mechanical polishing operations
US6860791B2 (en) 1995-03-28 2005-03-01 Applied Materials, Inc. Polishing pad for in-situ endpoint detection
US7118450B2 (en) 1995-03-28 2006-10-10 Applied Materials, Inc. Polishing pad with window and method of fabricating a window in a polishing pad
US7841926B2 (en) 1995-03-28 2010-11-30 Applied Materials, Inc. Substrate polishing metrology using interference signals
US7255629B2 (en) 1995-03-28 2007-08-14 Applied Materials, Inc. Polishing assembly with a window
US7775852B2 (en) 1995-03-28 2010-08-17 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US7731566B2 (en) 1995-03-28 2010-06-08 Applied Materials, Inc. Substrate polishing metrology using interference signals
US5964643A (en) * 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
US6342166B1 (en) 1998-12-10 2002-01-29 Nikon Corporation Method of detecting end point of polishing of wafer and apparatus for detecting end point of polishing
US7677959B2 (en) 1999-09-14 2010-03-16 Applied Materials, Inc. Multilayer polishing pad and method of making
US7429207B2 (en) 2000-05-19 2008-09-30 Applied Materials, Inc. System for endpoint detection with polishing pad
US7118457B2 (en) 2000-05-19 2006-10-10 Applied Materials, Inc. Method of forming a polishing pad for endpoint detection
US8485862B2 (en) 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US9333621B2 (en) 2000-05-19 2016-05-10 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US7198544B2 (en) 2001-12-28 2007-04-03 Applied Materials, Inc. Polishing pad with window
US6994607B2 (en) 2001-12-28 2006-02-07 Applied Materials, Inc. Polishing pad with window
US7591708B2 (en) 2002-02-06 2009-09-22 Applied Materials, Inc. Method and apparatus of eddy current monitoring for chemical mechanical polishing
US7374477B2 (en) 2002-02-06 2008-05-20 Applied Materials, Inc. Polishing pads useful for endpoint detection in chemical mechanical polishing
US7001242B2 (en) 2002-02-06 2006-02-21 Applied Materials, Inc. Method and apparatus of eddy current monitoring for chemical mechanical polishing
US8858298B2 (en) 2002-07-24 2014-10-14 Applied Materials, Inc. Polishing pad with two-section window having recess
CN110752169A (en) * 2019-10-21 2020-02-04 西安奕斯伟硅片技术有限公司 Wafer processing device and loading and unloading method

Also Published As

Publication number Publication date
JPS6211986B2 (en) 1987-03-16

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