JPS57121265A - Pressure welding method of strip for lead frame - Google Patents

Pressure welding method of strip for lead frame

Info

Publication number
JPS57121265A
JPS57121265A JP598581A JP598581A JPS57121265A JP S57121265 A JPS57121265 A JP S57121265A JP 598581 A JP598581 A JP 598581A JP 598581 A JP598581 A JP 598581A JP S57121265 A JPS57121265 A JP S57121265A
Authority
JP
Japan
Prior art keywords
strip
pressing
laminate
pressed
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP598581A
Other languages
Japanese (ja)
Other versions
JPH0134717B2 (en
Inventor
Teruo Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daido Steel Co Ltd
Original Assignee
Daido Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daido Steel Co Ltd filed Critical Daido Steel Co Ltd
Priority to JP598581A priority Critical patent/JPS57121265A/en
Publication of JPS57121265A publication Critical patent/JPS57121265A/en
Publication of JPH0134717B2 publication Critical patent/JPH0134717B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4821Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842Mechanical treatment, e.g. punching, cutting, deforming, cold welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To obtain a lead frame of high quality by polishing the surface to be pressed of a sealing strip with a wire brush of the prescribed diameter, superposing an aluminum foil of the prescribed thickness on the strip, applying an adequate pressure thereto, rolling and pressing the laminate, and annealing it. CONSTITUTION:42%-Ni steel of sealing strip 1 and an aluminum strip 2 of 30-6mum thick are drawn from reels 3, 4. The surface to be pressed of the strip 1 is polished with a wire brush 5 made of strands of 0.08-0.21mm in diameter, is then cleaned, and the surfaces are superposed, and passed through pressing rollers 6. The pressing rate at this time is 10-35% in the rolling and pressing of the laminate. The laminate strip 7 is then annealed for its production. In this manner, the pressing property of the aluminum is improved, only the strip can be polished with the wire brush, and can be pressed and rolled as cold work.
JP598581A 1981-01-20 1981-01-20 Pressure welding method of strip for lead frame Granted JPS57121265A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP598581A JPS57121265A (en) 1981-01-20 1981-01-20 Pressure welding method of strip for lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP598581A JPS57121265A (en) 1981-01-20 1981-01-20 Pressure welding method of strip for lead frame

Publications (2)

Publication Number Publication Date
JPS57121265A true JPS57121265A (en) 1982-07-28
JPH0134717B2 JPH0134717B2 (en) 1989-07-20

Family

ID=11626094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP598581A Granted JPS57121265A (en) 1981-01-20 1981-01-20 Pressure welding method of strip for lead frame

Country Status (1)

Country Link
JP (1) JPS57121265A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59193256A (en) * 1983-04-18 1984-11-01 Daido Steel Co Ltd Reduction of residual strain of aluminum clad metal strip piece
JPS60120544A (en) * 1983-12-02 1985-06-28 Sumitomo Electric Ind Ltd Lead frame for semiconductor device
JPH02109357A (en) * 1988-10-18 1990-04-23 Sumitomo Special Metals Co Ltd Manufacture of clad plate for plastic molding
CN102249022A (en) * 2011-07-08 2011-11-23 浙江中烟工业有限责任公司 Aluminum foil indentation pattern rolling device used in cigarette packing machine

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5075554A (en) * 1973-11-08 1975-06-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5075554A (en) * 1973-11-08 1975-06-20

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59193256A (en) * 1983-04-18 1984-11-01 Daido Steel Co Ltd Reduction of residual strain of aluminum clad metal strip piece
JPS62224B2 (en) * 1983-04-18 1987-01-06 Daido Steel Co Ltd
JPS60120544A (en) * 1983-12-02 1985-06-28 Sumitomo Electric Ind Ltd Lead frame for semiconductor device
JPH02109357A (en) * 1988-10-18 1990-04-23 Sumitomo Special Metals Co Ltd Manufacture of clad plate for plastic molding
CN102249022A (en) * 2011-07-08 2011-11-23 浙江中烟工业有限责任公司 Aluminum foil indentation pattern rolling device used in cigarette packing machine

Also Published As

Publication number Publication date
JPH0134717B2 (en) 1989-07-20

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