JPS564241A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS564241A
JPS564241A JP7936179A JP7936179A JPS564241A JP S564241 A JPS564241 A JP S564241A JP 7936179 A JP7936179 A JP 7936179A JP 7936179 A JP7936179 A JP 7936179A JP S564241 A JPS564241 A JP S564241A
Authority
JP
Japan
Prior art keywords
groove
wall surface
heat radiating
radiating plate
reverse side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7936179A
Other languages
Japanese (ja)
Other versions
JPS6016747B2 (en
Inventor
Ikuo Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP7936179A priority Critical patent/JPS6016747B2/en
Publication of JPS564241A publication Critical patent/JPS564241A/en
Publication of JPS6016747B2 publication Critical patent/JPS6016747B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To efficiently prevent flashes from being produced on the reverse side of a heat radiating plate, by providing a groove on the desired peripheral part of the reverse side of the heat radiating plate so that a narrow zone is located between the groove and the periphery of the plate and by positioning the wall surface of the recess of an opposed metal mold toward the groove and sealing up with resin. CONSTITUTION:The wall surface 8a of a metal mold 7 is brought into contact with the narrow zone 3 of the reverse side 1b of a heat radiating plate 1. The wall surface 9b of a recess 9 is located almost in the center of the groove 2 of the heat radiating plate. A lead 4 is pinch-held by metal molds 7, 10. A semiconductor device is set in a cavity. When the cavity is filled with resin 12', a small quantity of the resin flows down into the groove 2 but does not creep up on the wall surface 9b. As a result, salient flashes burrs are hardly produced.
JP7936179A 1979-06-23 1979-06-23 Manufacturing method of semiconductor device Expired JPS6016747B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7936179A JPS6016747B2 (en) 1979-06-23 1979-06-23 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7936179A JPS6016747B2 (en) 1979-06-23 1979-06-23 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS564241A true JPS564241A (en) 1981-01-17
JPS6016747B2 JPS6016747B2 (en) 1985-04-27

Family

ID=13687744

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7936179A Expired JPS6016747B2 (en) 1979-06-23 1979-06-23 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6016747B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63211638A (en) * 1988-01-08 1988-09-02 Nec Home Electronics Ltd Manufacture of resin seal type semiconductor device
US5959349A (en) * 1997-02-25 1999-09-28 Micron Technology, Inc. Transfer molding encapsulation of a semiconductor die with attached heat sink
US6117797A (en) * 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant
US6297960B1 (en) 1998-06-30 2001-10-02 Micron Technology, Inc. Heat sink with alignment and retaining features
US6297548B1 (en) 1998-06-30 2001-10-02 Micron Technology, Inc. Stackable ceramic FBGA for high thermal applications
US6444501B1 (en) 2001-06-12 2002-09-03 Micron Technology, Inc. Two stage transfer molding method to encapsulate MMC module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61155351U (en) * 1985-03-13 1986-09-26

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63211638A (en) * 1988-01-08 1988-09-02 Nec Home Electronics Ltd Manufacture of resin seal type semiconductor device
US6373132B2 (en) 1997-02-25 2002-04-16 Micron Technology, Inc. Semiconductor die with attached heat sink and transfer mold
US5959349A (en) * 1997-02-25 1999-09-28 Micron Technology, Inc. Transfer molding encapsulation of a semiconductor die with attached heat sink
US6869811B2 (en) 1997-02-25 2005-03-22 Micron Technology, Inc. Methods for transfer molding encapsulation of a semiconductor die with attached heat sink
US6583504B2 (en) 1997-02-25 2003-06-24 Micron Technology, Inc. Semiconductor die with attached heat sink and transfer mold
US6249050B1 (en) 1997-02-25 2001-06-19 Micron Technology, Inc. Encapsulated transfer molding of a semiconductor die with attached heat sink
US6403387B1 (en) 1997-02-25 2002-06-11 Micron Technology Method and apparatus for transfer molding encapsulation of a semiconductor die with attached heat sink
US6525943B2 (en) 1998-06-30 2003-02-25 Micron Technology, Inc. Heat sink with alignment and retaining features
US6650007B2 (en) 1998-06-30 2003-11-18 Micron Technology, Inc. Stackable ceramic fbga for high thermal applications
US7285442B2 (en) 1998-06-30 2007-10-23 Micron Technology, Inc. Stackable ceramic FBGA for high thermal applications
US6858926B2 (en) 1998-06-30 2005-02-22 Micron Technology, Inc. Stackable ceramic FBGA for high thermal applications
US6760224B2 (en) 1998-06-30 2004-07-06 Micron Technology, Inc. Heat sink with alignment and retaining features
US6297960B1 (en) 1998-06-30 2001-10-02 Micron Technology, Inc. Heat sink with alignment and retaining features
US6297548B1 (en) 1998-06-30 2001-10-02 Micron Technology, Inc. Stackable ceramic FBGA for high thermal applications
US6229204B1 (en) 1998-09-03 2001-05-08 Micron Technology, Inc. Chip on board with heat sink attachment
US6596565B1 (en) 1998-09-03 2003-07-22 Micron Technology, Inc. Chip on board and heat sink attachment methods
US6451709B1 (en) 1998-09-03 2002-09-17 Micron Technology, Inc. Methodology of removing misplaced encapsulant for attachment of heat sinks in a chip on board package
US6806567B2 (en) 1998-09-03 2004-10-19 Micron Technology, Inc. Chip on board with heat sink attachment and assembly
US6117797A (en) * 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant
US6432840B1 (en) 1998-09-03 2002-08-13 Micron Technology, Inc. Methodology of removing misplaced encapsulant for attachment of heat sinks in a chip on board package
US6538311B2 (en) 2001-06-12 2003-03-25 Micron Technology, Inc. Two-stage transfer molding method to encapsulate MMC module
US6730995B2 (en) 2001-06-12 2004-05-04 Micron Technology, Inc. Two-stage transfer molding device to encapsulate MMC module
US6764882B2 (en) 2001-06-12 2004-07-20 Micron Technology, Inc. Two-stage transfer molding method to encapsulate MMC module
US6444501B1 (en) 2001-06-12 2002-09-03 Micron Technology, Inc. Two stage transfer molding method to encapsulate MMC module
US7279781B2 (en) 2001-06-12 2007-10-09 Micron Technology, Inc. Two-stage transfer molding device to encapsulate MMC module
US7288441B2 (en) 2001-06-12 2007-10-30 Micron Technology, Inc. Method for two-stage transfer molding device to encapsulate MMC module

Also Published As

Publication number Publication date
JPS6016747B2 (en) 1985-04-27

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