JPS5633821A - Photoannealing method for semiconductor layer - Google Patents
Photoannealing method for semiconductor layerInfo
- Publication number
- JPS5633821A JPS5633821A JP10912879A JP10912879A JPS5633821A JP S5633821 A JPS5633821 A JP S5633821A JP 10912879 A JP10912879 A JP 10912879A JP 10912879 A JP10912879 A JP 10912879A JP S5633821 A JPS5633821 A JP S5633821A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- defectless
- silicon
- semiconductor layer
- photoannealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Recrystallisation Techniques (AREA)
Abstract
PURPOSE:To make possible to crystallize a semiconductor layer keeping the state of the entire layer defectless by applying photoannealing treatment two times or more in the thickness direction of the semiconductor layer. CONSTITUTION:On the surface of a sapphire substrate 1, an epitaxial silicon layer 2 is formed. In such construction of an SOS, many crystal defects exist on the sapphire silicon boundary while less crystal defects exist on the silicon surface, therefore an amorphous layer 3 is formed by implanting ions of, for example, Ar to the boundary, and by irradiating laser beams to the layer to anneal it, a defectless monocrystalline layer 4 is formed. Next, Ar ions are implanted to the surface of the silicon layer, and by annealing with laser beams, the surface is made defectless and converted into a defectless monocrystalline layer 6. By so doing, the entire silicon layer can be made completely defectless.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10912879A JPS5633821A (en) | 1979-08-29 | 1979-08-29 | Photoannealing method for semiconductor layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10912879A JPS5633821A (en) | 1979-08-29 | 1979-08-29 | Photoannealing method for semiconductor layer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5633821A true JPS5633821A (en) | 1981-04-04 |
Family
ID=14502277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10912879A Pending JPS5633821A (en) | 1979-08-29 | 1979-08-29 | Photoannealing method for semiconductor layer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5633821A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58135630A (en) * | 1982-02-08 | 1983-08-12 | Fujitsu Ltd | Annealing of semiconductor layer |
US4509990A (en) * | 1982-11-15 | 1985-04-09 | Hughes Aircraft Company | Solid phase epitaxy and regrowth process with controlled defect density profiling for heteroepitaxial semiconductor on insulator composite substrates |
US5021119A (en) * | 1987-11-13 | 1991-06-04 | Kopin Corporation | Zone-melting recrystallization process |
US5298434A (en) * | 1992-02-07 | 1994-03-29 | Harris Corporation | Selective recrystallization to reduce P-channel transistor leakage in silicon-on-sapphire CMOS radiation hardened integrated circuits |
US5453153A (en) * | 1987-11-13 | 1995-09-26 | Kopin Corporation | Zone-melting recrystallization process |
US6383899B1 (en) * | 1996-04-05 | 2002-05-07 | Sharp Laboratories Of America, Inc. | Method of forming polycrystalline semiconductor film from amorphous deposit by modulating crystallization with a combination of pre-annealing and ion implantation |
KR100972605B1 (en) * | 2008-03-19 | 2010-07-28 | 동국대학교 산학협력단 | Method for preparing a silicon on sapphire thin film and the silicon on sapphire thin film prepared by the same |
-
1979
- 1979-08-29 JP JP10912879A patent/JPS5633821A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58135630A (en) * | 1982-02-08 | 1983-08-12 | Fujitsu Ltd | Annealing of semiconductor layer |
US4509990A (en) * | 1982-11-15 | 1985-04-09 | Hughes Aircraft Company | Solid phase epitaxy and regrowth process with controlled defect density profiling for heteroepitaxial semiconductor on insulator composite substrates |
US5021119A (en) * | 1987-11-13 | 1991-06-04 | Kopin Corporation | Zone-melting recrystallization process |
US5453153A (en) * | 1987-11-13 | 1995-09-26 | Kopin Corporation | Zone-melting recrystallization process |
US5298434A (en) * | 1992-02-07 | 1994-03-29 | Harris Corporation | Selective recrystallization to reduce P-channel transistor leakage in silicon-on-sapphire CMOS radiation hardened integrated circuits |
US6383899B1 (en) * | 1996-04-05 | 2002-05-07 | Sharp Laboratories Of America, Inc. | Method of forming polycrystalline semiconductor film from amorphous deposit by modulating crystallization with a combination of pre-annealing and ion implantation |
KR100972605B1 (en) * | 2008-03-19 | 2010-07-28 | 동국대학교 산학협력단 | Method for preparing a silicon on sapphire thin film and the silicon on sapphire thin film prepared by the same |
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