JPS56151757A - Polyimide resin molded article - Google Patents
Polyimide resin molded articleInfo
- Publication number
- JPS56151757A JPS56151757A JP5538680A JP5538680A JPS56151757A JP S56151757 A JPS56151757 A JP S56151757A JP 5538680 A JP5538680 A JP 5538680A JP 5538680 A JP5538680 A JP 5538680A JP S56151757 A JPS56151757 A JP S56151757A
- Authority
- JP
- Japan
- Prior art keywords
- maximum diameter
- molded article
- pref
- thickness
- aromatic group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To prepare the titled molded article having high dielectric strength and suitable as a coating film, a printed circuit board, etc., without lowering the tensile strength, etc., by compounding a flaky inorganic insulator in a polyimide polymer.
CONSTITUTION: 100pts.wt. Of a polyimide polymer having a recurring unit of formula (R1 is 4-valent aromatic group; R2 is bivalent aromatic group; n is a positive integer of pref. ≥10) is mixed and kneaded with 5W40pts.wt. of a flaky inorganic insulator (esp. mica or glass) having a thickness of 0.005W0.05mm, the maximum diameter of ≤1.2mm, and the ratio of the maximum diameter to the thickness of ≥5, especially, having the above ratio of ≥10 and the maximum diameter of ≤1.0mm, and the mixture is formed, pref. by solvent-casting method.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5538680A JPS56151757A (en) | 1980-04-28 | 1980-04-28 | Polyimide resin molded article |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5538680A JPS56151757A (en) | 1980-04-28 | 1980-04-28 | Polyimide resin molded article |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56151757A true JPS56151757A (en) | 1981-11-24 |
JPS6358186B2 JPS6358186B2 (en) | 1988-11-15 |
Family
ID=12997057
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5538680A Granted JPS56151757A (en) | 1980-04-28 | 1980-04-28 | Polyimide resin molded article |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56151757A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59176362A (en) * | 1983-03-25 | 1984-10-05 | Hitachi Cable Ltd | Enameled wire having resistance to heat and overload |
JPS59176363A (en) * | 1983-03-25 | 1984-10-05 | Hitachi Cable Ltd | Enameled wire having resistance to corona and overload |
JPS59186204A (en) * | 1983-04-05 | 1984-10-23 | 株式会社日立製作所 | Method of forming wiring structure |
JPS60228557A (en) * | 1984-04-27 | 1985-11-13 | Sumitomo Bakelite Co Ltd | Polyarylene polyether polyimide film |
JPS60253105A (en) * | 1984-05-29 | 1985-12-13 | 宇部興産株式会社 | Insulated conductor |
JPH02103804A (en) * | 1988-10-08 | 1990-04-16 | Hitachi Cable Ltd | Radiation resistant electric wire and cable |
WO1997027244A1 (en) * | 1996-01-29 | 1997-07-31 | E.I. Du Pont De Nemours And Company | Polyimide composite material powder and the manufacturing method thereof |
JP2015118194A (en) * | 2013-12-18 | 2015-06-25 | 東レ株式会社 | Photosensitive resin composition, photosensitive resin film comprising the same, insulating film formed from the photosensitive resin film, and multilayer wiring board including the insulating film |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50112442A (en) * | 1974-02-18 | 1975-09-03 | ||
JPS5210343A (en) * | 1975-07-14 | 1977-01-26 | Matsushita Electric Ind Co Ltd | Polymer film |
-
1980
- 1980-04-28 JP JP5538680A patent/JPS56151757A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50112442A (en) * | 1974-02-18 | 1975-09-03 | ||
JPS5210343A (en) * | 1975-07-14 | 1977-01-26 | Matsushita Electric Ind Co Ltd | Polymer film |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59176362A (en) * | 1983-03-25 | 1984-10-05 | Hitachi Cable Ltd | Enameled wire having resistance to heat and overload |
JPS59176363A (en) * | 1983-03-25 | 1984-10-05 | Hitachi Cable Ltd | Enameled wire having resistance to corona and overload |
JPH0216940B2 (en) * | 1983-03-25 | 1990-04-18 | Hitachi Cable | |
JPS59186204A (en) * | 1983-04-05 | 1984-10-23 | 株式会社日立製作所 | Method of forming wiring structure |
JPH0125162B2 (en) * | 1983-04-05 | 1989-05-16 | Hitachi Ltd | |
JPS60228557A (en) * | 1984-04-27 | 1985-11-13 | Sumitomo Bakelite Co Ltd | Polyarylene polyether polyimide film |
JPS60253105A (en) * | 1984-05-29 | 1985-12-13 | 宇部興産株式会社 | Insulated conductor |
JPH02103804A (en) * | 1988-10-08 | 1990-04-16 | Hitachi Cable Ltd | Radiation resistant electric wire and cable |
WO1997027244A1 (en) * | 1996-01-29 | 1997-07-31 | E.I. Du Pont De Nemours And Company | Polyimide composite material powder and the manufacturing method thereof |
JP2015118194A (en) * | 2013-12-18 | 2015-06-25 | 東レ株式会社 | Photosensitive resin composition, photosensitive resin film comprising the same, insulating film formed from the photosensitive resin film, and multilayer wiring board including the insulating film |
Also Published As
Publication number | Publication date |
---|---|
JPS6358186B2 (en) | 1988-11-15 |
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