JPS56151757A - Polyimide resin molded article - Google Patents

Polyimide resin molded article

Info

Publication number
JPS56151757A
JPS56151757A JP5538680A JP5538680A JPS56151757A JP S56151757 A JPS56151757 A JP S56151757A JP 5538680 A JP5538680 A JP 5538680A JP 5538680 A JP5538680 A JP 5538680A JP S56151757 A JPS56151757 A JP S56151757A
Authority
JP
Japan
Prior art keywords
maximum diameter
molded article
pref
thickness
aromatic group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5538680A
Other languages
Japanese (ja)
Other versions
JPS6358186B2 (en
Inventor
Katsuhiko Maeda
Mitsuhiko Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Carbide Industries Co Inc
Original Assignee
Nippon Carbide Industries Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Carbide Industries Co Inc filed Critical Nippon Carbide Industries Co Inc
Priority to JP5538680A priority Critical patent/JPS56151757A/en
Publication of JPS56151757A publication Critical patent/JPS56151757A/en
Publication of JPS6358186B2 publication Critical patent/JPS6358186B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To prepare the titled molded article having high dielectric strength and suitable as a coating film, a printed circuit board, etc., without lowering the tensile strength, etc., by compounding a flaky inorganic insulator in a polyimide polymer.
CONSTITUTION: 100pts.wt. Of a polyimide polymer having a recurring unit of formula (R1 is 4-valent aromatic group; R2 is bivalent aromatic group; n is a positive integer of pref. ≥10) is mixed and kneaded with 5W40pts.wt. of a flaky inorganic insulator (esp. mica or glass) having a thickness of 0.005W0.05mm, the maximum diameter of ≤1.2mm, and the ratio of the maximum diameter to the thickness of ≥5, especially, having the above ratio of ≥10 and the maximum diameter of ≤1.0mm, and the mixture is formed, pref. by solvent-casting method.
COPYRIGHT: (C)1981,JPO&Japio
JP5538680A 1980-04-28 1980-04-28 Polyimide resin molded article Granted JPS56151757A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5538680A JPS56151757A (en) 1980-04-28 1980-04-28 Polyimide resin molded article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5538680A JPS56151757A (en) 1980-04-28 1980-04-28 Polyimide resin molded article

Publications (2)

Publication Number Publication Date
JPS56151757A true JPS56151757A (en) 1981-11-24
JPS6358186B2 JPS6358186B2 (en) 1988-11-15

Family

ID=12997057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5538680A Granted JPS56151757A (en) 1980-04-28 1980-04-28 Polyimide resin molded article

Country Status (1)

Country Link
JP (1) JPS56151757A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59176362A (en) * 1983-03-25 1984-10-05 Hitachi Cable Ltd Enameled wire having resistance to heat and overload
JPS59176363A (en) * 1983-03-25 1984-10-05 Hitachi Cable Ltd Enameled wire having resistance to corona and overload
JPS59186204A (en) * 1983-04-05 1984-10-23 株式会社日立製作所 Method of forming wiring structure
JPS60228557A (en) * 1984-04-27 1985-11-13 Sumitomo Bakelite Co Ltd Polyarylene polyether polyimide film
JPS60253105A (en) * 1984-05-29 1985-12-13 宇部興産株式会社 Insulated conductor
JPH02103804A (en) * 1988-10-08 1990-04-16 Hitachi Cable Ltd Radiation resistant electric wire and cable
WO1997027244A1 (en) * 1996-01-29 1997-07-31 E.I. Du Pont De Nemours And Company Polyimide composite material powder and the manufacturing method thereof
JP2015118194A (en) * 2013-12-18 2015-06-25 東レ株式会社 Photosensitive resin composition, photosensitive resin film comprising the same, insulating film formed from the photosensitive resin film, and multilayer wiring board including the insulating film

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50112442A (en) * 1974-02-18 1975-09-03
JPS5210343A (en) * 1975-07-14 1977-01-26 Matsushita Electric Ind Co Ltd Polymer film

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50112442A (en) * 1974-02-18 1975-09-03
JPS5210343A (en) * 1975-07-14 1977-01-26 Matsushita Electric Ind Co Ltd Polymer film

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59176362A (en) * 1983-03-25 1984-10-05 Hitachi Cable Ltd Enameled wire having resistance to heat and overload
JPS59176363A (en) * 1983-03-25 1984-10-05 Hitachi Cable Ltd Enameled wire having resistance to corona and overload
JPH0216940B2 (en) * 1983-03-25 1990-04-18 Hitachi Cable
JPS59186204A (en) * 1983-04-05 1984-10-23 株式会社日立製作所 Method of forming wiring structure
JPH0125162B2 (en) * 1983-04-05 1989-05-16 Hitachi Ltd
JPS60228557A (en) * 1984-04-27 1985-11-13 Sumitomo Bakelite Co Ltd Polyarylene polyether polyimide film
JPS60253105A (en) * 1984-05-29 1985-12-13 宇部興産株式会社 Insulated conductor
JPH02103804A (en) * 1988-10-08 1990-04-16 Hitachi Cable Ltd Radiation resistant electric wire and cable
WO1997027244A1 (en) * 1996-01-29 1997-07-31 E.I. Du Pont De Nemours And Company Polyimide composite material powder and the manufacturing method thereof
JP2015118194A (en) * 2013-12-18 2015-06-25 東レ株式会社 Photosensitive resin composition, photosensitive resin film comprising the same, insulating film formed from the photosensitive resin film, and multilayer wiring board including the insulating film

Also Published As

Publication number Publication date
JPS6358186B2 (en) 1988-11-15

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