JPS5615065A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
JPS5615065A
JPS5615065A JP9220679A JP9220679A JPS5615065A JP S5615065 A JPS5615065 A JP S5615065A JP 9220679 A JP9220679 A JP 9220679A JP 9220679 A JP9220679 A JP 9220679A JP S5615065 A JPS5615065 A JP S5615065A
Authority
JP
Japan
Prior art keywords
capacity
integrated circuit
power
semiconductor integrated
noise
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9220679A
Other languages
Japanese (ja)
Inventor
Koichi Hanamura
Takashi Tomizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9220679A priority Critical patent/JPS5615065A/en
Publication of JPS5615065A publication Critical patent/JPS5615065A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE:To remove the noise component generated on a power supply wire by forming a capacity for removing the noise between one power terminal in an integrated circuit and another power terminal except it. CONSTITUTION:A capacity 15 is formed between a polysilicon layer 14 and a silicone substrate 13 isolated from a thin oxide film 12. Since the layer 14 is connected to a power wiring aluminum wiring layer 11, noise components generated on a power wire is shorted and removed to the substrate 13 through the capacity 15.
JP9220679A 1979-07-19 1979-07-19 Semiconductor integrated circuit Pending JPS5615065A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9220679A JPS5615065A (en) 1979-07-19 1979-07-19 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9220679A JPS5615065A (en) 1979-07-19 1979-07-19 Semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS5615065A true JPS5615065A (en) 1981-02-13

Family

ID=14047964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9220679A Pending JPS5615065A (en) 1979-07-19 1979-07-19 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS5615065A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5837886A (en) * 1981-08-28 1983-03-05 Nippon Telegr & Teleph Corp <Ntt> Controlling system of storage space
JPS6022354A (en) * 1983-07-18 1985-02-04 Nec Corp Semiconductor device
US5687109A (en) * 1988-05-31 1997-11-11 Micron Technology, Inc. Integrated circuit module having on-chip surge capacitors
US6114756A (en) * 1998-04-01 2000-09-05 Micron Technology, Inc. Interdigitated capacitor design for integrated circuit leadframes
US6124625A (en) * 1988-05-31 2000-09-26 Micron Technology, Inc. Chip decoupling capacitor
US6414391B1 (en) 1998-06-30 2002-07-02 Micron Technology, Inc. Module assembly for stacked BGA packages with a common bus bar in the assembly

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5837886A (en) * 1981-08-28 1983-03-05 Nippon Telegr & Teleph Corp <Ntt> Controlling system of storage space
JPS6022354A (en) * 1983-07-18 1985-02-04 Nec Corp Semiconductor device
US6448628B2 (en) 1988-05-31 2002-09-10 Micron Technology, Inc. Chip decoupling capacitor
US5687109A (en) * 1988-05-31 1997-11-11 Micron Technology, Inc. Integrated circuit module having on-chip surge capacitors
US6124625A (en) * 1988-05-31 2000-09-26 Micron Technology, Inc. Chip decoupling capacitor
US6184568B1 (en) 1988-05-31 2001-02-06 Micron Technology, Inc. Integrated circuit module having on-chip surge capacitors
US6730994B2 (en) 1998-04-01 2004-05-04 Micron Technology, Inc. Interdigitated capacitor design for integrated circuit lead frames and methods
US6396134B2 (en) 1998-04-01 2002-05-28 Micron Technology, Inc. Interdigitated capacitor design for integrated circuit lead frames
US6265764B1 (en) 1998-04-01 2001-07-24 Micron Technology, Inc. Interdigitated capacitor design for integrated circuit lead frames
US6531765B2 (en) 1998-04-01 2003-03-11 Micron Technology, Inc. Interdigitated capacitor design for integrated circuit lead frames and method
US6114756A (en) * 1998-04-01 2000-09-05 Micron Technology, Inc. Interdigitated capacitor design for integrated circuit leadframes
US6414391B1 (en) 1998-06-30 2002-07-02 Micron Technology, Inc. Module assembly for stacked BGA packages with a common bus bar in the assembly
US6563217B2 (en) 1998-06-30 2003-05-13 Micron Technology, Inc. Module assembly for stacked BGA packages
US6838768B2 (en) 1998-06-30 2005-01-04 Micron Technology Inc Module assembly for stacked BGA packages
US7279797B2 (en) 1998-06-30 2007-10-09 Micron Technology, Inc. Module assembly and method for stacked BGA packages
US7396702B2 (en) 1998-06-30 2008-07-08 Micron Technology, Inc. Module assembly and method for stacked BGA packages
US7400032B2 (en) 1998-06-30 2008-07-15 Micron Technology, Inc. Module assembly for stacked BGA packages
US7408255B2 (en) 1998-06-30 2008-08-05 Micron Technology, Inc. Assembly for stacked BGA packages

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