JPS5614088A - Production of multilayer clad plate - Google Patents

Production of multilayer clad plate

Info

Publication number
JPS5614088A
JPS5614088A JP9068879A JP9068879A JPS5614088A JP S5614088 A JPS5614088 A JP S5614088A JP 9068879 A JP9068879 A JP 9068879A JP 9068879 A JP9068879 A JP 9068879A JP S5614088 A JPS5614088 A JP S5614088A
Authority
JP
Japan
Prior art keywords
copper
plates
steel plate
iron
stainless steel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9068879A
Other languages
Japanese (ja)
Other versions
JPS5722675B2 (en
Inventor
Iwao Kono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TAKEFU TOKUSHU KOZAI KK
Original Assignee
TAKEFU TOKUSHU KOZAI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TAKEFU TOKUSHU KOZAI KK filed Critical TAKEFU TOKUSHU KOZAI KK
Priority to JP9068879A priority Critical patent/JPS5614088A/en
Publication of JPS5614088A publication Critical patent/JPS5614088A/en
Publication of JPS5722675B2 publication Critical patent/JPS5722675B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/04—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a rolling mill

Abstract

PURPOSE:To prevent the occurrence of cracking at the simultaneous joining and forming of iron or steel plates, stainless steel plates and copper plates by interposing a thin copper layer between the iron or steel plate and the stainless steel plate at the time of superposing a stainless steel plate on one surface of the iron or steel plate and a copper plate on the other surface and metallurgically joining these. CONSTITUTION:At the time of superposing an iron or steel plate 1, a stainless steel plate 2 and a copper plate 3, the respective superposed surfaces are washed, and the plates are superposed in order of 2, 1, 3 from above; in addition, a thin copper layer 4 is interposed between the plates 2 and 1. The layer 4 may be formed by uniform scattering of copper powder, besides a copper foil, and its material may be a copper alloy comprising essentially copper, besides pure copper. Its thickness is so set as to remain as the thickness that can guarantee the prevention of diffusion of carbon component to the stainless steel layer, that is, as the thickness of about 3mu in the final product. These blank materials 1-4 are rolled at 850-1,000 deg.C copper forge welding temperatures, at which time these are enveloped by iron-made auxiliary plates 6 by way of a release agent 5 such as alumina and their joints are heremetically sealed 7 by welding to prevent the entry of the atmospheric air into the superposed surfaces.
JP9068879A 1979-07-16 1979-07-16 Production of multilayer clad plate Granted JPS5614088A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9068879A JPS5614088A (en) 1979-07-16 1979-07-16 Production of multilayer clad plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9068879A JPS5614088A (en) 1979-07-16 1979-07-16 Production of multilayer clad plate

Publications (2)

Publication Number Publication Date
JPS5614088A true JPS5614088A (en) 1981-02-10
JPS5722675B2 JPS5722675B2 (en) 1982-05-14

Family

ID=14005464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9068879A Granted JPS5614088A (en) 1979-07-16 1979-07-16 Production of multilayer clad plate

Country Status (1)

Country Link
JP (1) JPS5614088A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101947571A (en) * 2010-09-06 2011-01-19 杨自芬 Manufacturing method of compound steel
CN110756985A (en) * 2019-11-14 2020-02-07 中国航空制造技术研究院 Assembly positioning device and method for diffusion connection structure
CN113634597A (en) * 2021-08-19 2021-11-12 安徽工程大学 Micro-nano layered copper/copper alloy composite board and preparation method thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653763U (en) * 1992-12-21 1994-07-22 株式会社ゼクセル Camshaftless type fuel injection pump
CN106312454B (en) * 2016-08-29 2018-11-13 辽宁北祥重工机械制造有限公司 The method of the folded forging production main shaft forging of multiple-unit homogenous metal
CN106271482B (en) * 2016-08-29 2018-11-13 辽宁北祥重工机械制造有限公司 The method of the folded forging production mould steel moald-cavity of multiple-unit homogenous metal

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4928559A (en) * 1972-07-12 1974-03-14

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4928559A (en) * 1972-07-12 1974-03-14

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101947571A (en) * 2010-09-06 2011-01-19 杨自芬 Manufacturing method of compound steel
CN110756985A (en) * 2019-11-14 2020-02-07 中国航空制造技术研究院 Assembly positioning device and method for diffusion connection structure
CN113634597A (en) * 2021-08-19 2021-11-12 安徽工程大学 Micro-nano layered copper/copper alloy composite board and preparation method thereof

Also Published As

Publication number Publication date
JPS5722675B2 (en) 1982-05-14

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