JPS5577141A - Etching method - Google Patents

Etching method

Info

Publication number
JPS5577141A
JPS5577141A JP15164078A JP15164078A JPS5577141A JP S5577141 A JPS5577141 A JP S5577141A JP 15164078 A JP15164078 A JP 15164078A JP 15164078 A JP15164078 A JP 15164078A JP S5577141 A JPS5577141 A JP S5577141A
Authority
JP
Japan
Prior art keywords
etching
substrate
central portion
tank
etching liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15164078A
Other languages
Japanese (ja)
Other versions
JPS6346572B2 (en
Inventor
Katsuichi Kaminaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP15164078A priority Critical patent/JPS5577141A/en
Publication of JPS5577141A publication Critical patent/JPS5577141A/en
Publication of JPS6346572B2 publication Critical patent/JPS6346572B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Weting (AREA)

Abstract

PURPOSE: To make possible the formation of a precise pattern by means of a shielding body provided close to the substrated for even etching speed when a semiconductor substrate undergoes an etching liquid.
CONSTITUTION: An etching tank 3 filled with an etching liquid is arranged into a water tank 2 having water 2 stored to prevent the rise in the temperature of the etching liquid. A carrier 4 holding a plurality of semiconductor substrates leaving a clearance therebetween is submerged into the tank 3 and a specified etching is performed. In this process, adjusting plates 8 serving as a shielding body are inserted into the clearance between the substrates to uniformize the etching speed between the peripheral and central portion of the substrate. In other words, a hole with a diameter about 1/2 as large as the substrate is punched at the central portion of the adjusting plate so that the amount of the etching liquid 7 is properly increased toward the central portion of the substrate 5 to eliminate uneven etching speed. With such an arrangement, a better etching is possible even to yield any fine pattern.
COPYRIGHT: (C)1980,JPO&Japio
JP15164078A 1978-12-07 1978-12-07 Etching method Granted JPS5577141A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15164078A JPS5577141A (en) 1978-12-07 1978-12-07 Etching method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15164078A JPS5577141A (en) 1978-12-07 1978-12-07 Etching method

Publications (2)

Publication Number Publication Date
JPS5577141A true JPS5577141A (en) 1980-06-10
JPS6346572B2 JPS6346572B2 (en) 1988-09-16

Family

ID=15522967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15164078A Granted JPS5577141A (en) 1978-12-07 1978-12-07 Etching method

Country Status (1)

Country Link
JP (1) JPS5577141A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4501636A (en) * 1983-12-28 1985-02-26 The United States Of America As Represented By The Secretary Of The Air Force Apparatus for etching vertical junction solar cell wafers

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5056148A (en) * 1973-09-14 1975-05-16
JPS5128760A (en) * 1974-09-04 1976-03-11 Hitachi Ltd BANJOBUTSUNOETSUCHINGUSOCHI
JPS5348459A (en) * 1976-10-14 1978-05-01 Mitsubishi Electric Corp Production of semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5056148A (en) * 1973-09-14 1975-05-16
JPS5128760A (en) * 1974-09-04 1976-03-11 Hitachi Ltd BANJOBUTSUNOETSUCHINGUSOCHI
JPS5348459A (en) * 1976-10-14 1978-05-01 Mitsubishi Electric Corp Production of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4501636A (en) * 1983-12-28 1985-02-26 The United States Of America As Represented By The Secretary Of The Air Force Apparatus for etching vertical junction solar cell wafers

Also Published As

Publication number Publication date
JPS6346572B2 (en) 1988-09-16

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