JPS55500049A - - Google Patents

Info

Publication number
JPS55500049A
JPS55500049A JP50034379A JP50034379A JPS55500049A JP S55500049 A JPS55500049 A JP S55500049A JP 50034379 A JP50034379 A JP 50034379A JP 50034379 A JP50034379 A JP 50034379A JP S55500049 A JPS55500049 A JP S55500049A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50034379A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/869,523 external-priority patent/US4184188A/en
Application filed filed Critical
Publication of JPS55500049A publication Critical patent/JPS55500049A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
JP50034379A 1978-01-16 1979-01-05 Pending JPS55500049A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US05/869,523 US4184188A (en) 1978-01-16 1978-01-16 Substrate clamping technique in IC fabrication processes
US88481278A 1978-03-09 1978-03-09

Publications (1)

Publication Number Publication Date
JPS55500049A true JPS55500049A (en) 1980-01-31

Family

ID=27128118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50034379A Pending JPS55500049A (en) 1978-01-16 1979-01-05

Country Status (4)

Country Link
EP (1) EP0007918A1 (en)
JP (1) JPS55500049A (en)
IL (1) IL56224A (en)
WO (1) WO1979000510A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358193A (en) * 2000-06-13 2001-12-26 Ulvac Japan Ltd Electrostatic chucking system, substrate-conveying device, vacuum processing device and substrate-holding method
WO2015114896A1 (en) * 2014-01-28 2015-08-06 東京エレクトロン株式会社 Film-forming apparatus and substrate holder used therein

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4282924A (en) * 1979-03-16 1981-08-11 Varian Associates, Inc. Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface
DE3028536C2 (en) * 1980-07-28 1983-01-05 Siemens AG, 1000 Berlin und 8000 München Device for holding circular substrate disks and their use
GB2106325A (en) * 1981-09-14 1983-04-07 Philips Electronic Associated Electrostatic chuck
US4412133A (en) * 1982-01-05 1983-10-25 The Perkin-Elmer Corp. Electrostatic cassette
JPS6059104B2 (en) * 1982-02-03 1985-12-23 株式会社東芝 electrostatic chuck board
GB2147459A (en) * 1983-09-30 1985-05-09 Philips Electronic Associated Electrostatic chuck for semiconductor wafers
EP0138254B1 (en) * 1983-09-30 1988-06-01 Philips Electronics Uk Limited Electrostatic chuck and loading method
US4938992A (en) * 1988-01-07 1990-07-03 Varian Associates, Inc. Methods for thermal transfer with a semiconductor
US4997606A (en) * 1988-01-07 1991-03-05 Varian Associates, Inc. Methods and apparatus for fabricating a high purity thermally-conductive polymer layer
US4962441A (en) * 1989-04-10 1990-10-09 Applied Materials, Inc. Isolated electrostatic wafer blade clamp
US5001594A (en) * 1989-09-06 1991-03-19 Mcnc Electrostatic handling device
DE69103915T2 (en) * 1990-01-25 1995-05-11 Applied Materials Inc Electrostatic clamp and method.
EP0460955A1 (en) * 1990-06-08 1991-12-11 Varian Associates, Inc. Clamping a workpiece utilizing polyphase clamping voltage
US5452177A (en) 1990-06-08 1995-09-19 Varian Associates, Inc. Electrostatic wafer clamp
JP3238925B2 (en) * 1990-11-17 2001-12-17 株式会社東芝 Electrostatic chuck
US5155652A (en) * 1991-05-02 1992-10-13 International Business Machines Corporation Temperature cycling ceramic electrostatic chuck
FI941079A0 (en) * 1993-03-08 1994-03-08 Wolfowitz Steven Alan Limloest ecological rent electricity supply for the production and supply of materials
US6864570B2 (en) 1993-12-17 2005-03-08 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US6375549B1 (en) * 2000-03-17 2002-04-23 Motorola, Inc. Polishing head for wafer, and method for polishing
US20040066601A1 (en) * 2002-10-04 2004-04-08 Varian Semiconductor Equipment Associates, Inc. Electrode configuration for retaining cooling gas on electrostatic wafer clamp
EP1737564B1 (en) 2004-03-12 2019-09-11 SRI International Mechanical meta-materials
US7595972B2 (en) 2004-04-09 2009-09-29 Varian Semiconductor Equipment Associates, Inc. Clamp for use in processing semiconductor workpieces
TW200715464A (en) * 2005-06-30 2007-04-16 Varian Semiconductor Equipment Clamp for use in processing semiconductor workpieces
US7554787B2 (en) 2006-06-05 2009-06-30 Sri International Wall crawling devices
US7551419B2 (en) * 2006-06-05 2009-06-23 Sri International Electroadhesion
DE102007023970A1 (en) * 2007-05-23 2008-12-04 Aixtron Ag Apparatus for coating a plurality of densely packed substrates on a susceptor
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD778247S1 (en) 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3634740A (en) * 1970-04-20 1972-01-11 Addressograph Multigraph Electrostatic holddown
US3916270A (en) * 1974-05-02 1975-10-28 Tektronix Inc Electrostatic holddown apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2897424A (en) * 1953-11-10 1959-07-28 Robert W Waring Electrostatic apparatus
US3197682A (en) * 1961-04-13 1965-07-27 Pure Oil Co Safet electro-responsive-fluid chuck
US3401628A (en) * 1964-07-02 1968-09-17 American Can Co Method of electrostatically coating recessed surfaces
US3897324A (en) * 1973-06-25 1975-07-29 Honeywell Inc Material deposition masking for microcircuit structures
US3955163A (en) * 1974-06-24 1976-05-04 The Computervision Corporation Method of positioning a semiconductor wafer for contact printing

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3634740A (en) * 1970-04-20 1972-01-11 Addressograph Multigraph Electrostatic holddown
US3916270A (en) * 1974-05-02 1975-10-28 Tektronix Inc Electrostatic holddown apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358193A (en) * 2000-06-13 2001-12-26 Ulvac Japan Ltd Electrostatic chucking system, substrate-conveying device, vacuum processing device and substrate-holding method
JP4640876B2 (en) * 2000-06-13 2011-03-02 株式会社アルバック Substrate transfer device
WO2015114896A1 (en) * 2014-01-28 2015-08-06 東京エレクトロン株式会社 Film-forming apparatus and substrate holder used therein

Also Published As

Publication number Publication date
EP0007918A1 (en) 1980-02-06
IL56224A0 (en) 1979-03-12
IL56224A (en) 1982-08-31
WO1979000510A1 (en) 1979-08-09

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