JPS5546579A - Method of fabricating semiconductor device - Google Patents

Method of fabricating semiconductor device

Info

Publication number
JPS5546579A
JPS5546579A JP12077578A JP12077578A JPS5546579A JP S5546579 A JPS5546579 A JP S5546579A JP 12077578 A JP12077578 A JP 12077578A JP 12077578 A JP12077578 A JP 12077578A JP S5546579 A JPS5546579 A JP S5546579A
Authority
JP
Japan
Prior art keywords
pellets
scriber
ink
semiconductor device
automate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12077578A
Other languages
Japanese (ja)
Inventor
Kenji Katagiri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12077578A priority Critical patent/JPS5546579A/en
Publication of JPS5546579A publication Critical patent/JPS5546579A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE: To automate a method of fabricating a semiconductor device by using a dicing saw capable of cutting sufficient depth of semiconductor wafer when dicing the wafer and photosetting ink at its inking time for marking the result of the test.
CONSTITUTION: A semiconductor wafer diffused with impurities is cut with shallow cutout by a daimond scriber or laser scriber to be separated as pellets, which are inspected and marked with photosetting ink. Then, the pellets are cut in sufficient depth by a dicing saw or blade scriber capable of cooling with coolant. Then, only good pellets are selected by optical measn, and fed to next step. Then the pellets are mounted, bonded with wires, and molded. Thus, the marked ink is not erased to thereby automate the integral work.
COPYRIGHT: (C)1980,JPO&Japio
JP12077578A 1978-09-30 1978-09-30 Method of fabricating semiconductor device Pending JPS5546579A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12077578A JPS5546579A (en) 1978-09-30 1978-09-30 Method of fabricating semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12077578A JPS5546579A (en) 1978-09-30 1978-09-30 Method of fabricating semiconductor device

Publications (1)

Publication Number Publication Date
JPS5546579A true JPS5546579A (en) 1980-04-01

Family

ID=14794688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12077578A Pending JPS5546579A (en) 1978-09-30 1978-09-30 Method of fabricating semiconductor device

Country Status (1)

Country Link
JP (1) JPS5546579A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3304280A1 (en) * 1982-02-16 1983-08-25 Sony/Tektronix Corp., Tokyo METHOD FOR PRESENTING A LOGICAL SIGNAL
JPS6128818A (en) * 1984-07-19 1986-02-08 Toyota Motor Corp Signal recording apparatus and signal recording/ generating apparatus
US6770544B2 (en) * 2001-02-21 2004-08-03 Nec Machinery Corporation Substrate cutting method
US7772090B2 (en) * 2003-09-30 2010-08-10 Intel Corporation Methods for laser scribing wafers
KR101140164B1 (en) * 2005-10-28 2012-04-24 미쓰보시 다이야몬도 고교 가부시키가이샤 Method?of?forming?scribe?line?on?substrate?of?brittle?material?and?scribe?line?forming?apparatus

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3304280A1 (en) * 1982-02-16 1983-08-25 Sony/Tektronix Corp., Tokyo METHOD FOR PRESENTING A LOGICAL SIGNAL
JPS6128818A (en) * 1984-07-19 1986-02-08 Toyota Motor Corp Signal recording apparatus and signal recording/ generating apparatus
US6770544B2 (en) * 2001-02-21 2004-08-03 Nec Machinery Corporation Substrate cutting method
US7772090B2 (en) * 2003-09-30 2010-08-10 Intel Corporation Methods for laser scribing wafers
US8364304B2 (en) 2003-09-30 2013-01-29 Intel Corporation Methods and apparatus for laser scribing wafers
KR101140164B1 (en) * 2005-10-28 2012-04-24 미쓰보시 다이야몬도 고교 가부시키가이샤 Method?of?forming?scribe?line?on?substrate?of?brittle?material?and?scribe?line?forming?apparatus
TWI413622B (en) * 2005-10-28 2013-11-01 Mitsuboshi Diamond Ind Co Ltd And a scribing device for forming a brittle material substrate

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