JPS5546579A - Method of fabricating semiconductor device - Google Patents
Method of fabricating semiconductor deviceInfo
- Publication number
- JPS5546579A JPS5546579A JP12077578A JP12077578A JPS5546579A JP S5546579 A JPS5546579 A JP S5546579A JP 12077578 A JP12077578 A JP 12077578A JP 12077578 A JP12077578 A JP 12077578A JP S5546579 A JPS5546579 A JP S5546579A
- Authority
- JP
- Japan
- Prior art keywords
- pellets
- scriber
- ink
- semiconductor device
- automate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE: To automate a method of fabricating a semiconductor device by using a dicing saw capable of cutting sufficient depth of semiconductor wafer when dicing the wafer and photosetting ink at its inking time for marking the result of the test.
CONSTITUTION: A semiconductor wafer diffused with impurities is cut with shallow cutout by a daimond scriber or laser scriber to be separated as pellets, which are inspected and marked with photosetting ink. Then, the pellets are cut in sufficient depth by a dicing saw or blade scriber capable of cooling with coolant. Then, only good pellets are selected by optical measn, and fed to next step. Then the pellets are mounted, bonded with wires, and molded. Thus, the marked ink is not erased to thereby automate the integral work.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12077578A JPS5546579A (en) | 1978-09-30 | 1978-09-30 | Method of fabricating semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12077578A JPS5546579A (en) | 1978-09-30 | 1978-09-30 | Method of fabricating semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5546579A true JPS5546579A (en) | 1980-04-01 |
Family
ID=14794688
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12077578A Pending JPS5546579A (en) | 1978-09-30 | 1978-09-30 | Method of fabricating semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5546579A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3304280A1 (en) * | 1982-02-16 | 1983-08-25 | Sony/Tektronix Corp., Tokyo | METHOD FOR PRESENTING A LOGICAL SIGNAL |
JPS6128818A (en) * | 1984-07-19 | 1986-02-08 | Toyota Motor Corp | Signal recording apparatus and signal recording/ generating apparatus |
US6770544B2 (en) * | 2001-02-21 | 2004-08-03 | Nec Machinery Corporation | Substrate cutting method |
US7772090B2 (en) * | 2003-09-30 | 2010-08-10 | Intel Corporation | Methods for laser scribing wafers |
KR101140164B1 (en) * | 2005-10-28 | 2012-04-24 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Method?of?forming?scribe?line?on?substrate?of?brittle?material?and?scribe?line?forming?apparatus |
-
1978
- 1978-09-30 JP JP12077578A patent/JPS5546579A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3304280A1 (en) * | 1982-02-16 | 1983-08-25 | Sony/Tektronix Corp., Tokyo | METHOD FOR PRESENTING A LOGICAL SIGNAL |
JPS6128818A (en) * | 1984-07-19 | 1986-02-08 | Toyota Motor Corp | Signal recording apparatus and signal recording/ generating apparatus |
US6770544B2 (en) * | 2001-02-21 | 2004-08-03 | Nec Machinery Corporation | Substrate cutting method |
US7772090B2 (en) * | 2003-09-30 | 2010-08-10 | Intel Corporation | Methods for laser scribing wafers |
US8364304B2 (en) | 2003-09-30 | 2013-01-29 | Intel Corporation | Methods and apparatus for laser scribing wafers |
KR101140164B1 (en) * | 2005-10-28 | 2012-04-24 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Method?of?forming?scribe?line?on?substrate?of?brittle?material?and?scribe?line?forming?apparatus |
TWI413622B (en) * | 2005-10-28 | 2013-11-01 | Mitsuboshi Diamond Ind Co Ltd | And a scribing device for forming a brittle material substrate |
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