JPS55151377A - Photo semiconductor device - Google Patents

Photo semiconductor device

Info

Publication number
JPS55151377A
JPS55151377A JP5996779A JP5996779A JPS55151377A JP S55151377 A JPS55151377 A JP S55151377A JP 5996779 A JP5996779 A JP 5996779A JP 5996779 A JP5996779 A JP 5996779A JP S55151377 A JPS55151377 A JP S55151377A
Authority
JP
Japan
Prior art keywords
substrate
secured
hole
optical fibers
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5996779A
Other languages
Japanese (ja)
Inventor
Masaru Ihara
Takao Kaneda
Shuzo Kagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5996779A priority Critical patent/JPS55151377A/en
Publication of JPS55151377A publication Critical patent/JPS55151377A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

PURPOSE:To easily couple optical fibers in a photo semiconductor device by employing a transparent insulator layer and an active semiconductor layer laminated on a substrate and forming a hole for inserting the optical fibers reaching the insulator layer from the back surface of the substrate at the opposed position with the element region in the active layer. CONSTITUTION:A photo semiconductor element 2 is secured with solder 11 to the bottom surface in the body of a container 1 at the substrate 21 side, and so installed as to communicate with an optical fiber inserting hole 12 perforated at the bottom of the body with a hole 25 for inserting the optical fiber formed on the back of the element 2 at its secured position. The optical fibers 3 inserted into the holes 12, 25 are secured to the bottom of the container with adhesive resin 31.
JP5996779A 1979-05-16 1979-05-16 Photo semiconductor device Pending JPS55151377A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5996779A JPS55151377A (en) 1979-05-16 1979-05-16 Photo semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5996779A JPS55151377A (en) 1979-05-16 1979-05-16 Photo semiconductor device

Publications (1)

Publication Number Publication Date
JPS55151377A true JPS55151377A (en) 1980-11-25

Family

ID=13128442

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5996779A Pending JPS55151377A (en) 1979-05-16 1979-05-16 Photo semiconductor device

Country Status (1)

Country Link
JP (1) JPS55151377A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60134485A (en) * 1983-12-23 1985-07-17 Agency Of Ind Science & Technol Optical and electrical integrated circuit
JPS6337307A (en) * 1986-08-01 1988-02-18 Derufuai:Kk Constitution of optical fiber connector
JPS6461969A (en) * 1987-09-02 1989-03-08 Kyocera Corp Light-emitting element
US4845052A (en) * 1986-02-07 1989-07-04 Harris Corporation Method of packaging a non-contact I/O signal transmission integrated circuit
US4862231A (en) * 1983-11-18 1989-08-29 Harris Corporation Non-contact I/O signal transmission in integrated circuit packaging
US4916497A (en) * 1988-05-18 1990-04-10 Harris Corporation Integrated circuits including photo-optical devices and pressure transducers and method of fabrication
EP0442312A2 (en) * 1990-02-10 1991-08-21 Alcatel SEL Aktiengesellschaft Integrated optical transmitter and/or receiver
US5070596A (en) * 1988-05-18 1991-12-10 Harris Corporation Integrated circuits including photo-optical devices and pressure transducers and method of fabrication
JPH04127578A (en) * 1990-09-19 1992-04-28 Nec Corp Package of optical semiconductor element
US5359208A (en) * 1993-02-26 1994-10-25 Nippon Sheet Glass Co., Ltd. Chip package with microlens array
US5497465A (en) * 1992-03-25 1996-03-05 Nippon Sheet Glass Co., Ltd. Parallel digital processing system using optical interconnection between control sections and data processing sections
JP2006039046A (en) * 2004-07-23 2006-02-09 Shinko Electric Ind Co Ltd Optical waveguide mounting member, substrate, semiconductor device, manufacturing method of optical waveguide mounting member, and manufacturing method of substrate
JP2009175274A (en) * 2008-01-22 2009-08-06 Nitto Denko Corp Manufacturing method of optical waveguide device
WO2014109158A1 (en) * 2013-01-11 2014-07-17 株式会社ブイ・テクノロジー Optical interconnection device

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862231A (en) * 1983-11-18 1989-08-29 Harris Corporation Non-contact I/O signal transmission in integrated circuit packaging
JPS60134485A (en) * 1983-12-23 1985-07-17 Agency Of Ind Science & Technol Optical and electrical integrated circuit
US4845052A (en) * 1986-02-07 1989-07-04 Harris Corporation Method of packaging a non-contact I/O signal transmission integrated circuit
JPS6337307A (en) * 1986-08-01 1988-02-18 Derufuai:Kk Constitution of optical fiber connector
JPS6461969A (en) * 1987-09-02 1989-03-08 Kyocera Corp Light-emitting element
US5070596A (en) * 1988-05-18 1991-12-10 Harris Corporation Integrated circuits including photo-optical devices and pressure transducers and method of fabrication
US4916497A (en) * 1988-05-18 1990-04-10 Harris Corporation Integrated circuits including photo-optical devices and pressure transducers and method of fabrication
EP0442312A3 (en) * 1990-02-10 1992-02-26 Standard Elektrik Lorenz Aktiengesellschaft Integrated optical transmitter and/or receiver
EP0442312A2 (en) * 1990-02-10 1991-08-21 Alcatel SEL Aktiengesellschaft Integrated optical transmitter and/or receiver
JPH04127578A (en) * 1990-09-19 1992-04-28 Nec Corp Package of optical semiconductor element
US5497465A (en) * 1992-03-25 1996-03-05 Nippon Sheet Glass Co., Ltd. Parallel digital processing system using optical interconnection between control sections and data processing sections
US5359208A (en) * 1993-02-26 1994-10-25 Nippon Sheet Glass Co., Ltd. Chip package with microlens array
JP2006039046A (en) * 2004-07-23 2006-02-09 Shinko Electric Ind Co Ltd Optical waveguide mounting member, substrate, semiconductor device, manufacturing method of optical waveguide mounting member, and manufacturing method of substrate
JP4558400B2 (en) * 2004-07-23 2010-10-06 新光電気工業株式会社 Semiconductor device
JP2009175274A (en) * 2008-01-22 2009-08-06 Nitto Denko Corp Manufacturing method of optical waveguide device
WO2014109158A1 (en) * 2013-01-11 2014-07-17 株式会社ブイ・テクノロジー Optical interconnection device
CN104919731A (en) * 2013-01-11 2015-09-16 株式会社V技术 Optical interconnection device

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