JPS55129341A - Photosensitive covering composition - Google Patents

Photosensitive covering composition

Info

Publication number
JPS55129341A
JPS55129341A JP3809279A JP3809279A JPS55129341A JP S55129341 A JPS55129341 A JP S55129341A JP 3809279 A JP3809279 A JP 3809279A JP 3809279 A JP3809279 A JP 3809279A JP S55129341 A JPS55129341 A JP S55129341A
Authority
JP
Japan
Prior art keywords
resin
phenol
photosensitizer
alkali
enhance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3809279A
Other languages
Japanese (ja)
Inventor
Keiji Kubo
Tetsuo Ishihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Corp
Original Assignee
Daicel Corp
Daicel Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp, Daicel Chemical Industries Ltd filed Critical Daicel Corp
Priority to JP3809279A priority Critical patent/JPS55129341A/en
Publication of JPS55129341A publication Critical patent/JPS55129341A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To enhance the coating properties of a photosensitive composition prepared by blending an alkali-soluble phenol-formaldehyde resin with a photosensitizer and enhance the coat characteristics of the resulting film by adding a specified resin such as epoxy resin.
CONSTITUTION: To a photosensitive composition prepared by mixing a photosensitizer such as 4,4'-diazidophenylamine and an alkali-soluble phenol-formaldehyde resin such as phenol-novolak resin in a ratio of about 1:0.5W6 by wt. is added 5W40wt%, preferably 7W30wt% of one or more kinds of resins selected from epoxy resin preferably having a MW of about 500 or less, butyral resin preferably having a butyral conversion degree of about 60W70mol% and obtained from polyvinyl alcohol having an average polymerization degree of about 250W2,000, acrylic resin, preferably acrylic acid-acrylic acid ester copolymer, and butyl-etherified phenol resin, preferably butyl-etherified resol type phenol resin.
COPYRIGHT: (C)1980,JPO&Japio
JP3809279A 1979-03-29 1979-03-29 Photosensitive covering composition Pending JPS55129341A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3809279A JPS55129341A (en) 1979-03-29 1979-03-29 Photosensitive covering composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3809279A JPS55129341A (en) 1979-03-29 1979-03-29 Photosensitive covering composition

Publications (1)

Publication Number Publication Date
JPS55129341A true JPS55129341A (en) 1980-10-07

Family

ID=12515821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3809279A Pending JPS55129341A (en) 1979-03-29 1979-03-29 Photosensitive covering composition

Country Status (1)

Country Link
JP (1) JPS55129341A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59187340A (en) * 1983-08-01 1984-10-24 Kimoto & Co Ltd Photosensitive composition
JPS6024545A (en) * 1983-07-21 1985-02-07 Japan Synthetic Rubber Co Ltd Positive type photosensitive resin composition
JPS62123444A (en) * 1985-08-07 1987-06-04 Japan Synthetic Rubber Co Ltd Radiation sensitive resinous composition
JPH01145649A (en) * 1988-10-18 1989-06-07 Japan Synthetic Rubber Co Ltd Negative type radiation-sensitive resin composition
JPH0267A (en) * 1989-03-13 1990-01-05 Kimoto & Co Ltd Photosensitive composition and method for developing same
US5206116A (en) * 1991-03-04 1993-04-27 Shipley Company Inc. Light-sensitive composition for use as a soldermask and process
US5300380A (en) * 1986-08-06 1994-04-05 Ciba-Geigy Corporation Process for the production of relief structures using a negative photoresist based on polyphenols and epoxy compounds or vinyl ethers
US5397685A (en) * 1992-02-03 1995-03-14 Shipley Company Inc. Light-sensitive composition and process
WO2001025853A1 (en) * 1999-10-07 2001-04-12 Clariant International Ltd. Photosensitive composition
JP2001235859A (en) * 2000-02-24 2001-08-31 Clariant (Japan) Kk Photosensitive resin composition
WO2002048793A1 (en) * 2000-12-14 2002-06-20 Clariant International Ltd. High-resolution photosensitive resin composition usable with i-line and method of forming pattern
US7195858B2 (en) 2003-02-06 2007-03-27 Rohm And Haas Electronic Materials Llc Negative type photosensitive resin composition containing a phenol-biphenylene resin
US7195855B2 (en) 2003-01-30 2007-03-27 Rohm And Haas Electronic Materials Llc Negative-type photosensitive resin composition containing epoxy compound
JP2015179166A (en) * 2014-03-19 2015-10-08 ナガセケムテックス株式会社 positive photosensitive resin composition

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5036209A (en) * 1973-06-20 1975-04-05
JPS50108919A (en) * 1974-01-24 1975-08-27
JPS50125806A (en) * 1974-03-25 1975-10-03
JPS549619A (en) * 1977-06-23 1979-01-24 Oji Paper Co Photosensitive composition

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5036209A (en) * 1973-06-20 1975-04-05
JPS50108919A (en) * 1974-01-24 1975-08-27
JPS50125806A (en) * 1974-03-25 1975-10-03
JPS549619A (en) * 1977-06-23 1979-01-24 Oji Paper Co Photosensitive composition

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6024545A (en) * 1983-07-21 1985-02-07 Japan Synthetic Rubber Co Ltd Positive type photosensitive resin composition
JPH0322618B2 (en) * 1983-07-21 1991-03-27 Japan Synthetic Rubber Co Ltd
JPH0253778B2 (en) * 1983-08-01 1990-11-19 Kimoto Kk
JPS59187340A (en) * 1983-08-01 1984-10-24 Kimoto & Co Ltd Photosensitive composition
US5494784A (en) * 1985-08-07 1996-02-27 Japan Synthetic Rubber Co., Ltd. Method of pattern formation utilizing radiation-sensitive resin composition containing monooxymonocarboxylic acid ester solvent
US5405720A (en) * 1985-08-07 1995-04-11 Japan Synthetic Rubber Co., Ltd. Radiation-sensitive composition containing 1,2 quinonediazide compound, alkali-soluble resin and monooxymonocarboxylic acid ester solvent
JPH0322619B2 (en) * 1985-08-07 1991-03-27 Japan Synthetic Rubber Co Ltd
US6270939B1 (en) 1985-08-07 2001-08-07 Jsr Corporation Radiation-sensitive resin composition
US6228554B1 (en) 1985-08-07 2001-05-08 Jsr Corporation Radiation-sensitive resin composition
US5925492A (en) * 1985-08-07 1999-07-20 Jsr Corporation Radiation-sensitive resin composition utilizing monooxymonocarboxylic acid ester solvent
JPS62123444A (en) * 1985-08-07 1987-06-04 Japan Synthetic Rubber Co Ltd Radiation sensitive resinous composition
US5300380A (en) * 1986-08-06 1994-04-05 Ciba-Geigy Corporation Process for the production of relief structures using a negative photoresist based on polyphenols and epoxy compounds or vinyl ethers
JPH01145649A (en) * 1988-10-18 1989-06-07 Japan Synthetic Rubber Co Ltd Negative type radiation-sensitive resin composition
JPH0267A (en) * 1989-03-13 1990-01-05 Kimoto & Co Ltd Photosensitive composition and method for developing same
US5206116A (en) * 1991-03-04 1993-04-27 Shipley Company Inc. Light-sensitive composition for use as a soldermask and process
US5397685A (en) * 1992-02-03 1995-03-14 Shipley Company Inc. Light-sensitive composition and process
WO2001025853A1 (en) * 1999-10-07 2001-04-12 Clariant International Ltd. Photosensitive composition
JP2001235859A (en) * 2000-02-24 2001-08-31 Clariant (Japan) Kk Photosensitive resin composition
WO2002048793A1 (en) * 2000-12-14 2002-06-20 Clariant International Ltd. High-resolution photosensitive resin composition usable with i-line and method of forming pattern
US6806019B2 (en) 2000-12-14 2004-10-19 Clariant Finance (Bvi) Limited High-resolution photosensitive resin composition usable with i-line and method of forming pattern
KR100857042B1 (en) * 2000-12-14 2008-09-05 에이제토 엘렉토로닉 마티리알즈 가부시키가이샤 High-resolution photosensitive resin composition usable with i-line and method of forming pattern
US7195855B2 (en) 2003-01-30 2007-03-27 Rohm And Haas Electronic Materials Llc Negative-type photosensitive resin composition containing epoxy compound
US7195858B2 (en) 2003-02-06 2007-03-27 Rohm And Haas Electronic Materials Llc Negative type photosensitive resin composition containing a phenol-biphenylene resin
JP2015179166A (en) * 2014-03-19 2015-10-08 ナガセケムテックス株式会社 positive photosensitive resin composition

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