JPS55129341A - Photosensitive covering composition - Google Patents
Photosensitive covering compositionInfo
- Publication number
- JPS55129341A JPS55129341A JP3809279A JP3809279A JPS55129341A JP S55129341 A JPS55129341 A JP S55129341A JP 3809279 A JP3809279 A JP 3809279A JP 3809279 A JP3809279 A JP 3809279A JP S55129341 A JPS55129341 A JP S55129341A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- phenol
- photosensitizer
- alkali
- enhance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To enhance the coating properties of a photosensitive composition prepared by blending an alkali-soluble phenol-formaldehyde resin with a photosensitizer and enhance the coat characteristics of the resulting film by adding a specified resin such as epoxy resin.
CONSTITUTION: To a photosensitive composition prepared by mixing a photosensitizer such as 4,4'-diazidophenylamine and an alkali-soluble phenol-formaldehyde resin such as phenol-novolak resin in a ratio of about 1:0.5W6 by wt. is added 5W40wt%, preferably 7W30wt% of one or more kinds of resins selected from epoxy resin preferably having a MW of about 500 or less, butyral resin preferably having a butyral conversion degree of about 60W70mol% and obtained from polyvinyl alcohol having an average polymerization degree of about 250W2,000, acrylic resin, preferably acrylic acid-acrylic acid ester copolymer, and butyl-etherified phenol resin, preferably butyl-etherified resol type phenol resin.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3809279A JPS55129341A (en) | 1979-03-29 | 1979-03-29 | Photosensitive covering composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3809279A JPS55129341A (en) | 1979-03-29 | 1979-03-29 | Photosensitive covering composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55129341A true JPS55129341A (en) | 1980-10-07 |
Family
ID=12515821
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3809279A Pending JPS55129341A (en) | 1979-03-29 | 1979-03-29 | Photosensitive covering composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55129341A (en) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59187340A (en) * | 1983-08-01 | 1984-10-24 | Kimoto & Co Ltd | Photosensitive composition |
JPS6024545A (en) * | 1983-07-21 | 1985-02-07 | Japan Synthetic Rubber Co Ltd | Positive type photosensitive resin composition |
JPS62123444A (en) * | 1985-08-07 | 1987-06-04 | Japan Synthetic Rubber Co Ltd | Radiation sensitive resinous composition |
JPH01145649A (en) * | 1988-10-18 | 1989-06-07 | Japan Synthetic Rubber Co Ltd | Negative type radiation-sensitive resin composition |
JPH0267A (en) * | 1989-03-13 | 1990-01-05 | Kimoto & Co Ltd | Photosensitive composition and method for developing same |
US5206116A (en) * | 1991-03-04 | 1993-04-27 | Shipley Company Inc. | Light-sensitive composition for use as a soldermask and process |
US5300380A (en) * | 1986-08-06 | 1994-04-05 | Ciba-Geigy Corporation | Process for the production of relief structures using a negative photoresist based on polyphenols and epoxy compounds or vinyl ethers |
US5397685A (en) * | 1992-02-03 | 1995-03-14 | Shipley Company Inc. | Light-sensitive composition and process |
WO2001025853A1 (en) * | 1999-10-07 | 2001-04-12 | Clariant International Ltd. | Photosensitive composition |
JP2001235859A (en) * | 2000-02-24 | 2001-08-31 | Clariant (Japan) Kk | Photosensitive resin composition |
WO2002048793A1 (en) * | 2000-12-14 | 2002-06-20 | Clariant International Ltd. | High-resolution photosensitive resin composition usable with i-line and method of forming pattern |
US7195858B2 (en) | 2003-02-06 | 2007-03-27 | Rohm And Haas Electronic Materials Llc | Negative type photosensitive resin composition containing a phenol-biphenylene resin |
US7195855B2 (en) | 2003-01-30 | 2007-03-27 | Rohm And Haas Electronic Materials Llc | Negative-type photosensitive resin composition containing epoxy compound |
JP2015179166A (en) * | 2014-03-19 | 2015-10-08 | ナガセケムテックス株式会社 | positive photosensitive resin composition |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5036209A (en) * | 1973-06-20 | 1975-04-05 | ||
JPS50108919A (en) * | 1974-01-24 | 1975-08-27 | ||
JPS50125806A (en) * | 1974-03-25 | 1975-10-03 | ||
JPS549619A (en) * | 1977-06-23 | 1979-01-24 | Oji Paper Co | Photosensitive composition |
-
1979
- 1979-03-29 JP JP3809279A patent/JPS55129341A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5036209A (en) * | 1973-06-20 | 1975-04-05 | ||
JPS50108919A (en) * | 1974-01-24 | 1975-08-27 | ||
JPS50125806A (en) * | 1974-03-25 | 1975-10-03 | ||
JPS549619A (en) * | 1977-06-23 | 1979-01-24 | Oji Paper Co | Photosensitive composition |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6024545A (en) * | 1983-07-21 | 1985-02-07 | Japan Synthetic Rubber Co Ltd | Positive type photosensitive resin composition |
JPH0322618B2 (en) * | 1983-07-21 | 1991-03-27 | Japan Synthetic Rubber Co Ltd | |
JPH0253778B2 (en) * | 1983-08-01 | 1990-11-19 | Kimoto Kk | |
JPS59187340A (en) * | 1983-08-01 | 1984-10-24 | Kimoto & Co Ltd | Photosensitive composition |
US5494784A (en) * | 1985-08-07 | 1996-02-27 | Japan Synthetic Rubber Co., Ltd. | Method of pattern formation utilizing radiation-sensitive resin composition containing monooxymonocarboxylic acid ester solvent |
US5405720A (en) * | 1985-08-07 | 1995-04-11 | Japan Synthetic Rubber Co., Ltd. | Radiation-sensitive composition containing 1,2 quinonediazide compound, alkali-soluble resin and monooxymonocarboxylic acid ester solvent |
JPH0322619B2 (en) * | 1985-08-07 | 1991-03-27 | Japan Synthetic Rubber Co Ltd | |
US6270939B1 (en) | 1985-08-07 | 2001-08-07 | Jsr Corporation | Radiation-sensitive resin composition |
US6228554B1 (en) | 1985-08-07 | 2001-05-08 | Jsr Corporation | Radiation-sensitive resin composition |
US5925492A (en) * | 1985-08-07 | 1999-07-20 | Jsr Corporation | Radiation-sensitive resin composition utilizing monooxymonocarboxylic acid ester solvent |
JPS62123444A (en) * | 1985-08-07 | 1987-06-04 | Japan Synthetic Rubber Co Ltd | Radiation sensitive resinous composition |
US5300380A (en) * | 1986-08-06 | 1994-04-05 | Ciba-Geigy Corporation | Process for the production of relief structures using a negative photoresist based on polyphenols and epoxy compounds or vinyl ethers |
JPH01145649A (en) * | 1988-10-18 | 1989-06-07 | Japan Synthetic Rubber Co Ltd | Negative type radiation-sensitive resin composition |
JPH0267A (en) * | 1989-03-13 | 1990-01-05 | Kimoto & Co Ltd | Photosensitive composition and method for developing same |
US5206116A (en) * | 1991-03-04 | 1993-04-27 | Shipley Company Inc. | Light-sensitive composition for use as a soldermask and process |
US5397685A (en) * | 1992-02-03 | 1995-03-14 | Shipley Company Inc. | Light-sensitive composition and process |
WO2001025853A1 (en) * | 1999-10-07 | 2001-04-12 | Clariant International Ltd. | Photosensitive composition |
JP2001235859A (en) * | 2000-02-24 | 2001-08-31 | Clariant (Japan) Kk | Photosensitive resin composition |
WO2002048793A1 (en) * | 2000-12-14 | 2002-06-20 | Clariant International Ltd. | High-resolution photosensitive resin composition usable with i-line and method of forming pattern |
US6806019B2 (en) | 2000-12-14 | 2004-10-19 | Clariant Finance (Bvi) Limited | High-resolution photosensitive resin composition usable with i-line and method of forming pattern |
KR100857042B1 (en) * | 2000-12-14 | 2008-09-05 | 에이제토 엘렉토로닉 마티리알즈 가부시키가이샤 | High-resolution photosensitive resin composition usable with i-line and method of forming pattern |
US7195855B2 (en) | 2003-01-30 | 2007-03-27 | Rohm And Haas Electronic Materials Llc | Negative-type photosensitive resin composition containing epoxy compound |
US7195858B2 (en) | 2003-02-06 | 2007-03-27 | Rohm And Haas Electronic Materials Llc | Negative type photosensitive resin composition containing a phenol-biphenylene resin |
JP2015179166A (en) * | 2014-03-19 | 2015-10-08 | ナガセケムテックス株式会社 | positive photosensitive resin composition |
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