JPS55128835A - Molding method and mold used therefor - Google Patents

Molding method and mold used therefor

Info

Publication number
JPS55128835A
JPS55128835A JP3547479A JP3547479A JPS55128835A JP S55128835 A JPS55128835 A JP S55128835A JP 3547479 A JP3547479 A JP 3547479A JP 3547479 A JP3547479 A JP 3547479A JP S55128835 A JPS55128835 A JP S55128835A
Authority
JP
Japan
Prior art keywords
header
resin
recess
molds
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3547479A
Other languages
Japanese (ja)
Inventor
Keizo Otsuki
Hidetoshi Mochizuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3547479A priority Critical patent/JPS55128835A/en
Publication of JPS55128835A publication Critical patent/JPS55128835A/en
Pending legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE: To readily separate resin lump on the back surface of a header pulled out of upper and lower molds by forming a recess on the lower surface side of the header of the lower mold to stop flowing of the resin when molding a header carrying a circuit element with resin using the upper and lower molds.
CONSTITUTION: In using upper and lower molds 3 and 4 having a molding space 6 when molding a header 10 carrying a circuit element 9 with resin 7, a small recess 14 having a size slightly smaller than the header 10 is formed at the lower side of the header 10 on the lower mold 4. Thus, the upper and lower molds 3 and 4 are formed, the header 10 carrying the element 9 is placed on the recess 14, and the element 9 is connected to a lead wire 8 using a gold wire 11. When resin 7 is charged into a cavity 2 and the space 6 formed between the upper die 3 and the lower die 4, there occurs a relieving space 15 in the recess 9 with a result that almost no resin 7 is introduced into the recess 14. Accordingly, the resin lump on the back surface of the header 10 pulled out of the molds can be simply separated therefrom.
COPYRIGHT: (C)1980,JPO&Japio
JP3547479A 1979-03-28 1979-03-28 Molding method and mold used therefor Pending JPS55128835A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3547479A JPS55128835A (en) 1979-03-28 1979-03-28 Molding method and mold used therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3547479A JPS55128835A (en) 1979-03-28 1979-03-28 Molding method and mold used therefor

Publications (1)

Publication Number Publication Date
JPS55128835A true JPS55128835A (en) 1980-10-06

Family

ID=12442765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3547479A Pending JPS55128835A (en) 1979-03-28 1979-03-28 Molding method and mold used therefor

Country Status (1)

Country Link
JP (1) JPS55128835A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5316463A (en) * 1992-11-24 1994-05-31 Neu Dynamics Corporation Encapsulating molding equipment
US5409362A (en) * 1992-11-24 1995-04-25 Neu Dynamics Corp. Encapsulation molding equipment
US5429488A (en) * 1992-11-24 1995-07-04 Neu Dynamics Corporation Encapsulating molding equipment and method
US5959349A (en) * 1997-02-25 1999-09-28 Micron Technology, Inc. Transfer molding encapsulation of a semiconductor die with attached heat sink
US6117797A (en) * 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant
US6297960B1 (en) 1998-06-30 2001-10-02 Micron Technology, Inc. Heat sink with alignment and retaining features
US6297548B1 (en) 1998-06-30 2001-10-02 Micron Technology, Inc. Stackable ceramic FBGA for high thermal applications
US6444501B1 (en) 2001-06-12 2002-09-03 Micron Technology, Inc. Two stage transfer molding method to encapsulate MMC module
JP2009140951A (en) * 2007-12-03 2009-06-25 Denso Corp Method of manufacturing electronic apparatus
CN109285787A (en) * 2017-07-19 2019-01-29 丰田自动车株式会社 The manufacturing method of semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5397370A (en) * 1977-02-07 1978-08-25 Toshiba Corp Trasfer mold device for semiconductor device
JPS5480079A (en) * 1978-08-07 1979-06-26 Dai Ichi Seiko Co Ltd Method of forming semiconductor seal

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5397370A (en) * 1977-02-07 1978-08-25 Toshiba Corp Trasfer mold device for semiconductor device
JPS5480079A (en) * 1978-08-07 1979-06-26 Dai Ichi Seiko Co Ltd Method of forming semiconductor seal

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5409362A (en) * 1992-11-24 1995-04-25 Neu Dynamics Corp. Encapsulation molding equipment
US5429488A (en) * 1992-11-24 1995-07-04 Neu Dynamics Corporation Encapsulating molding equipment and method
US5484274A (en) * 1992-11-24 1996-01-16 Neu Dynamics Corp. Encapsulation molding equipment
US5316463A (en) * 1992-11-24 1994-05-31 Neu Dynamics Corporation Encapsulating molding equipment
US6373132B2 (en) 1997-02-25 2002-04-16 Micron Technology, Inc. Semiconductor die with attached heat sink and transfer mold
US5959349A (en) * 1997-02-25 1999-09-28 Micron Technology, Inc. Transfer molding encapsulation of a semiconductor die with attached heat sink
US6001672A (en) * 1997-02-25 1999-12-14 Micron Technology, Inc. Method for transfer molding encapsulation of a semiconductor die with attached heat sink
US6869811B2 (en) 1997-02-25 2005-03-22 Micron Technology, Inc. Methods for transfer molding encapsulation of a semiconductor die with attached heat sink
US6583504B2 (en) 1997-02-25 2003-06-24 Micron Technology, Inc. Semiconductor die with attached heat sink and transfer mold
US6249050B1 (en) 1997-02-25 2001-06-19 Micron Technology, Inc. Encapsulated transfer molding of a semiconductor die with attached heat sink
US6403387B1 (en) 1997-02-25 2002-06-11 Micron Technology Method and apparatus for transfer molding encapsulation of a semiconductor die with attached heat sink
US6525943B2 (en) 1998-06-30 2003-02-25 Micron Technology, Inc. Heat sink with alignment and retaining features
US7285442B2 (en) 1998-06-30 2007-10-23 Micron Technology, Inc. Stackable ceramic FBGA for high thermal applications
US6297960B1 (en) 1998-06-30 2001-10-02 Micron Technology, Inc. Heat sink with alignment and retaining features
US6297548B1 (en) 1998-06-30 2001-10-02 Micron Technology, Inc. Stackable ceramic FBGA for high thermal applications
US6650007B2 (en) 1998-06-30 2003-11-18 Micron Technology, Inc. Stackable ceramic fbga for high thermal applications
US6760224B2 (en) 1998-06-30 2004-07-06 Micron Technology, Inc. Heat sink with alignment and retaining features
US6858926B2 (en) 1998-06-30 2005-02-22 Micron Technology, Inc. Stackable ceramic FBGA for high thermal applications
US6806567B2 (en) 1998-09-03 2004-10-19 Micron Technology, Inc. Chip on board with heat sink attachment and assembly
US6432840B1 (en) 1998-09-03 2002-08-13 Micron Technology, Inc. Methodology of removing misplaced encapsulant for attachment of heat sinks in a chip on board package
US6451709B1 (en) 1998-09-03 2002-09-17 Micron Technology, Inc. Methodology of removing misplaced encapsulant for attachment of heat sinks in a chip on board package
US6229204B1 (en) 1998-09-03 2001-05-08 Micron Technology, Inc. Chip on board with heat sink attachment
US6596565B1 (en) 1998-09-03 2003-07-22 Micron Technology, Inc. Chip on board and heat sink attachment methods
US6117797A (en) * 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant
US6538311B2 (en) 2001-06-12 2003-03-25 Micron Technology, Inc. Two-stage transfer molding method to encapsulate MMC module
US6764882B2 (en) 2001-06-12 2004-07-20 Micron Technology, Inc. Two-stage transfer molding method to encapsulate MMC module
US6730995B2 (en) 2001-06-12 2004-05-04 Micron Technology, Inc. Two-stage transfer molding device to encapsulate MMC module
US7279781B2 (en) 2001-06-12 2007-10-09 Micron Technology, Inc. Two-stage transfer molding device to encapsulate MMC module
US6444501B1 (en) 2001-06-12 2002-09-03 Micron Technology, Inc. Two stage transfer molding method to encapsulate MMC module
US7288441B2 (en) 2001-06-12 2007-10-30 Micron Technology, Inc. Method for two-stage transfer molding device to encapsulate MMC module
JP2009140951A (en) * 2007-12-03 2009-06-25 Denso Corp Method of manufacturing electronic apparatus
CN109285787A (en) * 2017-07-19 2019-01-29 丰田自动车株式会社 The manufacturing method of semiconductor device
JP2019021811A (en) * 2017-07-19 2019-02-07 トヨタ自動車株式会社 Semiconductor device manufacturing method
CN109285787B (en) * 2017-07-19 2021-11-16 株式会社电装 Method for manufacturing semiconductor device

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