JPS55127553A - Photosensitive composition - Google Patents

Photosensitive composition

Info

Publication number
JPS55127553A
JPS55127553A JP3637079A JP3637079A JPS55127553A JP S55127553 A JPS55127553 A JP S55127553A JP 3637079 A JP3637079 A JP 3637079A JP 3637079 A JP3637079 A JP 3637079A JP S55127553 A JPS55127553 A JP S55127553A
Authority
JP
Japan
Prior art keywords
photosensitive composition
mixture
phenol
alkylphenol
soluble
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3637079A
Other languages
Japanese (ja)
Inventor
Keiji Kubo
Tetsuo Ishihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Corp
Original Assignee
Daicel Corp
Daicel Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp, Daicel Chemical Industries Ltd filed Critical Daicel Corp
Priority to JP3637079A priority Critical patent/JPS55127553A/en
Priority to DE19803009873 priority patent/DE3009873A1/en
Priority to US06/130,372 priority patent/US4308368A/en
Publication of JPS55127553A publication Critical patent/JPS55127553A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To enhance the sensitization property of an o-quinone diazide type photodecomposable photosensitive composition by mixing alkali-soluble cocondensed novolak resin of a mixture of alkylphenol with a high MW and (methyl-substituted) phenol in a specified molar ratio into the composition.
CONSTITUTION: 50W100mol% of formaldehyde is added to a mixture of one or more kinds of alkylphenols represented by formula I (where R is 3W12C alkyl or phenyl) and (methyl-substituted) phenol or a mixture thereof in an alkylphenol to other phenol molar ratio of 1:9W9:1, and they are condensed in the presence of acid catalyst. One or more kinds of the resulting alkali-soluble cocondensed novolak resins are added to a photodecomposable photosensitive composition containing an o-quinone diazide compound represented by formula II or III, and an Al plate or the like is covered with a photosensitive layer formed, thus obtaining a photosensitive composition having high resistance to an aqueous alkali solution at its unexposed portion, superior sensitization property and high long-term shelf stability and suitable for use as a printing material such as a PS plate, a photomask, etc.
COPYRIGHT: (C)1980,JPO&Japio
JP3637079A 1979-03-16 1979-03-27 Photosensitive composition Pending JPS55127553A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP3637079A JPS55127553A (en) 1979-03-27 1979-03-27 Photosensitive composition
DE19803009873 DE3009873A1 (en) 1979-03-16 1980-03-14 PHOTO SENSITIVE DIMENSIONS
US06/130,372 US4308368A (en) 1979-03-16 1980-03-14 Photosensitive compositions with reaction product of novolak co-condensate with o-quinone diazide

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3637079A JPS55127553A (en) 1979-03-27 1979-03-27 Photosensitive composition

Publications (1)

Publication Number Publication Date
JPS55127553A true JPS55127553A (en) 1980-10-02

Family

ID=12467942

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3637079A Pending JPS55127553A (en) 1979-03-16 1979-03-27 Photosensitive composition

Country Status (1)

Country Link
JP (1) JPS55127553A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61130947A (en) * 1984-11-30 1986-06-18 Japan Synthetic Rubber Co Ltd Positive type resist composition
JPH0296164A (en) * 1988-10-03 1990-04-06 Konica Corp Photosensitive composition
US5407780A (en) * 1989-12-27 1995-04-18 Sumitomo Chemical Company, Limited Radiation-sensitive positive resist composition comprising an alkali-soluble resin made from m-cresol, 2-tert-butl-5-methyl phenol and formaldehyde
US7112397B2 (en) 2003-01-07 2006-09-26 Okamoto Chemical Industry Co., Ltd. Image forming composition and photosensitive lithographic plate using same
JP2017090486A (en) * 2015-11-02 2017-05-25 旭化成株式会社 Photosensitive resin composition and method for manufacturing cured relief pattern

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4924361A (en) * 1972-06-27 1974-03-04
GB1367830A (en) * 1972-05-23 1974-09-25 Hunt Chem Corp Philip A Processes and materials for making photoresists
JPS54116218A (en) * 1978-03-02 1979-09-10 Oji Paper Co Photosensitive composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1367830A (en) * 1972-05-23 1974-09-25 Hunt Chem Corp Philip A Processes and materials for making photoresists
JPS4924361A (en) * 1972-06-27 1974-03-04
JPS54116218A (en) * 1978-03-02 1979-09-10 Oji Paper Co Photosensitive composition

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61130947A (en) * 1984-11-30 1986-06-18 Japan Synthetic Rubber Co Ltd Positive type resist composition
JPH04260B2 (en) * 1984-11-30 1992-01-06 Japan Synthetic Rubber Co Ltd
JPH0296164A (en) * 1988-10-03 1990-04-06 Konica Corp Photosensitive composition
US5407780A (en) * 1989-12-27 1995-04-18 Sumitomo Chemical Company, Limited Radiation-sensitive positive resist composition comprising an alkali-soluble resin made from m-cresol, 2-tert-butl-5-methyl phenol and formaldehyde
US7112397B2 (en) 2003-01-07 2006-09-26 Okamoto Chemical Industry Co., Ltd. Image forming composition and photosensitive lithographic plate using same
JP2017090486A (en) * 2015-11-02 2017-05-25 旭化成株式会社 Photosensitive resin composition and method for manufacturing cured relief pattern

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