JPS5487183A - Package for semiconductor device - Google Patents
Package for semiconductor deviceInfo
- Publication number
- JPS5487183A JPS5487183A JP15444877A JP15444877A JPS5487183A JP S5487183 A JPS5487183 A JP S5487183A JP 15444877 A JP15444877 A JP 15444877A JP 15444877 A JP15444877 A JP 15444877A JP S5487183 A JPS5487183 A JP S5487183A
- Authority
- JP
- Japan
- Prior art keywords
- cap
- seal
- package
- hole
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Abstract
PURPOSE: To reinforce the seal strength, by providing concave and convex or hole at ridge of the seal scheduled part of the package cap.
CONSTITUTION: The hole 2A or concave and convexe part 2B is formed at the seal acheduled part of the cap 2. Next, the cap is bonded with the bonding agent 3 such as glass flit on the opposing surface. Thus, the miniscas region of the adhesives 3 is remarkably increased and the bonding strength can effectively be increased.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52154448A JPS6040704B2 (en) | 1977-12-23 | 1977-12-23 | Semiconductor device package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52154448A JPS6040704B2 (en) | 1977-12-23 | 1977-12-23 | Semiconductor device package |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5487183A true JPS5487183A (en) | 1979-07-11 |
JPS6040704B2 JPS6040704B2 (en) | 1985-09-12 |
Family
ID=15584423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52154448A Expired JPS6040704B2 (en) | 1977-12-23 | 1977-12-23 | Semiconductor device package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6040704B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60133640U (en) * | 1984-02-13 | 1985-09-06 | 三菱電機株式会社 | Hollow package for semiconductor devices |
JPS6129155A (en) * | 1984-07-19 | 1986-02-10 | Fujitsu Ltd | Semiconductor device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06221005A (en) * | 1993-01-27 | 1994-08-09 | Seiko Sangyo Kk | Household toilet space unit |
-
1977
- 1977-12-23 JP JP52154448A patent/JPS6040704B2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60133640U (en) * | 1984-02-13 | 1985-09-06 | 三菱電機株式会社 | Hollow package for semiconductor devices |
JPS6129155A (en) * | 1984-07-19 | 1986-02-10 | Fujitsu Ltd | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS6040704B2 (en) | 1985-09-12 |
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