JPS5438771A - Cooling fin - Google Patents

Cooling fin

Info

Publication number
JPS5438771A
JPS5438771A JP10479077A JP10479077A JPS5438771A JP S5438771 A JPS5438771 A JP S5438771A JP 10479077 A JP10479077 A JP 10479077A JP 10479077 A JP10479077 A JP 10479077A JP S5438771 A JPS5438771 A JP S5438771A
Authority
JP
Japan
Prior art keywords
cooling fin
cooling fins
semiconductor
heat conduction
metal powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10479077A
Other languages
Japanese (ja)
Inventor
Kenji Kijima
Tetsuo Fujiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10479077A priority Critical patent/JPS5438771A/en
Publication of JPS5438771A publication Critical patent/JPS5438771A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To obtain cooling fins of large cooling power by sintering metal powder of good heat conduction having specified particle sizes on the surface of the cooling fins of semiconductor.
COPYRIGHT: (C)1979,JPO&Japio
JP10479077A 1977-09-02 1977-09-02 Cooling fin Pending JPS5438771A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10479077A JPS5438771A (en) 1977-09-02 1977-09-02 Cooling fin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10479077A JPS5438771A (en) 1977-09-02 1977-09-02 Cooling fin

Publications (1)

Publication Number Publication Date
JPS5438771A true JPS5438771A (en) 1979-03-23

Family

ID=14390243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10479077A Pending JPS5438771A (en) 1977-09-02 1977-09-02 Cooling fin

Country Status (1)

Country Link
JP (1) JPS5438771A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4686606A (en) * 1985-03-04 1987-08-11 Hitachi, Ltd. Device for cooling integrated circuit chip
US5006925A (en) * 1989-11-22 1991-04-09 International Business Machines Corporation Three dimensional microelectric packaging
JP2015019076A (en) * 2008-11-18 2015-01-29 日本電気株式会社 Boiling and cooling device
JP2015197245A (en) * 2014-04-01 2015-11-09 昭和電工株式会社 Evaporative cooling device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4686606A (en) * 1985-03-04 1987-08-11 Hitachi, Ltd. Device for cooling integrated circuit chip
US5006925A (en) * 1989-11-22 1991-04-09 International Business Machines Corporation Three dimensional microelectric packaging
JP2015019076A (en) * 2008-11-18 2015-01-29 日本電気株式会社 Boiling and cooling device
US9297589B2 (en) 2008-11-18 2016-03-29 Nec Corporation Boiling heat transfer device
JP2015197245A (en) * 2014-04-01 2015-11-09 昭和電工株式会社 Evaporative cooling device

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