JPS5438771A - Cooling fin - Google Patents
Cooling finInfo
- Publication number
- JPS5438771A JPS5438771A JP10479077A JP10479077A JPS5438771A JP S5438771 A JPS5438771 A JP S5438771A JP 10479077 A JP10479077 A JP 10479077A JP 10479077 A JP10479077 A JP 10479077A JP S5438771 A JPS5438771 A JP S5438771A
- Authority
- JP
- Japan
- Prior art keywords
- cooling fin
- cooling fins
- semiconductor
- heat conduction
- metal powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To obtain cooling fins of large cooling power by sintering metal powder of good heat conduction having specified particle sizes on the surface of the cooling fins of semiconductor.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10479077A JPS5438771A (en) | 1977-09-02 | 1977-09-02 | Cooling fin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10479077A JPS5438771A (en) | 1977-09-02 | 1977-09-02 | Cooling fin |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5438771A true JPS5438771A (en) | 1979-03-23 |
Family
ID=14390243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10479077A Pending JPS5438771A (en) | 1977-09-02 | 1977-09-02 | Cooling fin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5438771A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4686606A (en) * | 1985-03-04 | 1987-08-11 | Hitachi, Ltd. | Device for cooling integrated circuit chip |
US5006925A (en) * | 1989-11-22 | 1991-04-09 | International Business Machines Corporation | Three dimensional microelectric packaging |
JP2015019076A (en) * | 2008-11-18 | 2015-01-29 | 日本電気株式会社 | Boiling and cooling device |
JP2015197245A (en) * | 2014-04-01 | 2015-11-09 | 昭和電工株式会社 | Evaporative cooling device |
-
1977
- 1977-09-02 JP JP10479077A patent/JPS5438771A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4686606A (en) * | 1985-03-04 | 1987-08-11 | Hitachi, Ltd. | Device for cooling integrated circuit chip |
US5006925A (en) * | 1989-11-22 | 1991-04-09 | International Business Machines Corporation | Three dimensional microelectric packaging |
JP2015019076A (en) * | 2008-11-18 | 2015-01-29 | 日本電気株式会社 | Boiling and cooling device |
US9297589B2 (en) | 2008-11-18 | 2016-03-29 | Nec Corporation | Boiling heat transfer device |
JP2015197245A (en) * | 2014-04-01 | 2015-11-09 | 昭和電工株式会社 | Evaporative cooling device |
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