JPS54153590A - Surface acoustoc wave device - Google Patents

Surface acoustoc wave device

Info

Publication number
JPS54153590A
JPS54153590A JP6266678A JP6266678A JPS54153590A JP S54153590 A JPS54153590 A JP S54153590A JP 6266678 A JP6266678 A JP 6266678A JP 6266678 A JP6266678 A JP 6266678A JP S54153590 A JPS54153590 A JP S54153590A
Authority
JP
Japan
Prior art keywords
sealed
insulation film
film
wave device
acoustic wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6266678A
Other languages
Japanese (ja)
Inventor
Katsuaki Yanagisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6266678A priority Critical patent/JPS54153590A/en
Publication of JPS54153590A publication Critical patent/JPS54153590A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

PURPOSE:To establish the sealing unit for surface acoustic wave devices, which is low in cost and excellent in sealed condition. CONSTITUTION:The crossing comb type electrode 22 of Al or the like is formed on the piezoelectric substrate 21, and after forming the insulation film 23 on it, the conductor layer 24 is formed on the film 23 (Figs. a, b). Next, the holes 25 to perform wire bonding to the input and output terminals and the ground terminal of the transducer is formed. (Fig. c) After that, wire bonding is made with Al or the like, and the entire unit is sealed with molding resin. Further, in this case, the Al film 24 is connected to ground. Thus, the insulation film layer is formed on the suface of the surface acoustic wave device providing electrodes on the piezoelectric substrate, and further, the insulation film forming the conductive layer on it is sealed with molding resin.
JP6266678A 1978-05-24 1978-05-24 Surface acoustoc wave device Pending JPS54153590A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6266678A JPS54153590A (en) 1978-05-24 1978-05-24 Surface acoustoc wave device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6266678A JPS54153590A (en) 1978-05-24 1978-05-24 Surface acoustoc wave device

Publications (1)

Publication Number Publication Date
JPS54153590A true JPS54153590A (en) 1979-12-03

Family

ID=13206838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6266678A Pending JPS54153590A (en) 1978-05-24 1978-05-24 Surface acoustoc wave device

Country Status (1)

Country Link
JP (1) JPS54153590A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5592730A (en) * 1994-07-29 1997-01-14 Hewlett-Packard Company Method for fabricating a Z-axis conductive backing layer for acoustic transducers using etched leadframes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5592730A (en) * 1994-07-29 1997-01-14 Hewlett-Packard Company Method for fabricating a Z-axis conductive backing layer for acoustic transducers using etched leadframes

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