JPS54112164A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS54112164A JPS54112164A JP2017178A JP2017178A JPS54112164A JP S54112164 A JPS54112164 A JP S54112164A JP 2017178 A JP2017178 A JP 2017178A JP 2017178 A JP2017178 A JP 2017178A JP S54112164 A JPS54112164 A JP S54112164A
- Authority
- JP
- Japan
- Prior art keywords
- thin plate
- support stand
- wafer
- fixed angle
- notch lines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
Abstract
PURPOSE: To simplify the breakaway of an element with the contact strength between the element and a thin plate weakened by sticking a semiconductor wafer with notch lines among many formed semiconductor elements to a flexible thin plate and by turning this thin plate supported on a support stand in a curved shape by a fixed angle.
CONSTITUTION: Semiconductor wafer 1 with several semiconductor elements 2 formed is provided with notch lines 4 and 5 and then stuck to flexible thin plate 3. Next, this thin plate 3 is held on spherical support stand 9 provided with ring- shaped concave grooves 10 at adequate positions and shifted fixed angle by fixed angle to cause wafer 1 to generate bending force, so that wafer 1 will be divided at notch lines 4 and 5. Next, thin plate 3 is pushed against the spherical surface of support stand 9 and fixed to concave grooves 10 by using wedges 11. In this way the contact strength of each element 2 to thin plate 3 is weakened and each element 2 is broken away by collet 12. Consequently, the automatic mounting of each element is simplified.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017178A JPS54112164A (en) | 1978-02-22 | 1978-02-22 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017178A JPS54112164A (en) | 1978-02-22 | 1978-02-22 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54112164A true JPS54112164A (en) | 1979-09-01 |
Family
ID=12019717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017178A Pending JPS54112164A (en) | 1978-02-22 | 1978-02-22 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54112164A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10361097B2 (en) | 2012-12-31 | 2019-07-23 | Globalwafers Co., Ltd. | Apparatus for stressing semiconductor substrates |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49108978A (en) * | 1973-02-19 | 1974-10-16 |
-
1978
- 1978-02-22 JP JP2017178A patent/JPS54112164A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49108978A (en) * | 1973-02-19 | 1974-10-16 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10361097B2 (en) | 2012-12-31 | 2019-07-23 | Globalwafers Co., Ltd. | Apparatus for stressing semiconductor substrates |
| US11276583B2 (en) | 2012-12-31 | 2022-03-15 | Globalwafers Co., Ltd. | Apparatus for stressing semiconductor substrates |
| US11276582B2 (en) | 2012-12-31 | 2022-03-15 | Globalwafers Co., Ltd. | Apparatus for stressing semiconductor substrates |
| US11282715B2 (en) | 2012-12-31 | 2022-03-22 | Globalwafers Co., Ltd. | Apparatus for stressing semiconductor substrates |
| US11764071B2 (en) | 2012-12-31 | 2023-09-19 | Globalwafers Co., Ltd. | Apparatus for stressing semiconductor substrates |
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