JPS54109828A - Heat resistant photoresist composition - Google Patents

Heat resistant photoresist composition

Info

Publication number
JPS54109828A
JPS54109828A JP1661178A JP1661178A JPS54109828A JP S54109828 A JPS54109828 A JP S54109828A JP 1661178 A JP1661178 A JP 1661178A JP 1661178 A JP1661178 A JP 1661178A JP S54109828 A JPS54109828 A JP S54109828A
Authority
JP
Japan
Prior art keywords
heat resistant
photoresist composition
resistant photoresist
composition
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1661178A
Other languages
Japanese (ja)
Inventor
Kaoru Oomura
Ichirou Shibazaki
Takeo Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP1661178A priority Critical patent/JPS54109828A/en
Publication of JPS54109828A publication Critical patent/JPS54109828A/en
Pending legal-status Critical Current

Links

Landscapes

  • Polymerisation Methods In General (AREA)
JP1661178A 1978-02-17 1978-02-17 Heat resistant photoresist composition Pending JPS54109828A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1661178A JPS54109828A (en) 1978-02-17 1978-02-17 Heat resistant photoresist composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1661178A JPS54109828A (en) 1978-02-17 1978-02-17 Heat resistant photoresist composition

Publications (1)

Publication Number Publication Date
JPS54109828A true JPS54109828A (en) 1979-08-28

Family

ID=11921106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1661178A Pending JPS54109828A (en) 1978-02-17 1978-02-17 Heat resistant photoresist composition

Country Status (1)

Country Link
JP (1) JPS54109828A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5920304A (en) * 1982-07-27 1984-02-02 Nippon Oil & Fats Co Ltd Photopolymerization initiator composition
JPS59160139A (en) * 1983-03-04 1984-09-10 Hitachi Ltd Photosensitive polymer composition
JPS63206740A (en) * 1987-02-24 1988-08-26 Mitsubishi Gas Chem Co Inc Photosensitive polymer composition
JPS63206741A (en) * 1987-02-24 1988-08-26 Mitsubishi Gas Chem Co Inc Photosensitive polymer composition
JPS63221109A (en) * 1987-03-10 1988-09-14 Mitsubishi Gas Chem Co Inc Photosensitive polyamide acid composition
JPH0418450A (en) * 1990-04-16 1992-01-22 Fujitsu Ltd Photosensitive heat-resistant resin composition and method for forming pattern using the same
US6342333B1 (en) 1999-09-23 2002-01-29 Hitachi Chemical Dupont Microsystems, L.L.C. Photosensitive resin composition, patterning method, and electronic components
US6960420B2 (en) 2002-11-06 2005-11-01 Hitachi Chemical Dupont Microsystems Ltd Photosensitive resin composition, process for forming relief pattern, and electronic component
US7476476B2 (en) 2003-06-02 2009-01-13 Toray Industries, Inc. Photosensitive resin composition, electronic component using the same, and display unit using the same
US7932012B2 (en) 2004-03-31 2011-04-26 Hitachi Chemical Dupont Microsystems Ltd. Heat-resistant photosensitive resin composition, method for forming pattern using the composition, and electronic part
US7977400B2 (en) 2005-03-15 2011-07-12 Toray Industries, Inc. Photosensitive resin composition
US8097386B2 (en) 2006-08-14 2012-01-17 Hitachi Chemical Dupont Microsystems, Ltd. Positive-type photosensitive resin composition, method for producing patterns, and electronic parts
US8765868B2 (en) 2009-07-31 2014-07-01 Hitachi Chemical Dupont Microsystems, Ltd. Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components
KR20210134696A (en) 2019-04-02 2021-11-10 닛뽄 가야쿠 가부시키가이샤 Bismaleimide compound, photosensitive resin composition using same, cured product thereof and semiconductor device

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5920304A (en) * 1982-07-27 1984-02-02 Nippon Oil & Fats Co Ltd Photopolymerization initiator composition
JPH0463882B2 (en) * 1982-07-27 1992-10-13 Nippon Oils & Fats Co Ltd
JPS59160139A (en) * 1983-03-04 1984-09-10 Hitachi Ltd Photosensitive polymer composition
JPH0318703B2 (en) * 1983-03-04 1991-03-13 Hitachi Seisakusho Kk
JPS63206740A (en) * 1987-02-24 1988-08-26 Mitsubishi Gas Chem Co Inc Photosensitive polymer composition
JPS63206741A (en) * 1987-02-24 1988-08-26 Mitsubishi Gas Chem Co Inc Photosensitive polymer composition
JPS63221109A (en) * 1987-03-10 1988-09-14 Mitsubishi Gas Chem Co Inc Photosensitive polyamide acid composition
JPH0418450A (en) * 1990-04-16 1992-01-22 Fujitsu Ltd Photosensitive heat-resistant resin composition and method for forming pattern using the same
US6342333B1 (en) 1999-09-23 2002-01-29 Hitachi Chemical Dupont Microsystems, L.L.C. Photosensitive resin composition, patterning method, and electronic components
US6773866B2 (en) 1999-09-23 2004-08-10 Hitachi Chemical Dupont Microsystems L.L.C. Photosensitive resin composition, patterning method, and electronic components
US6960420B2 (en) 2002-11-06 2005-11-01 Hitachi Chemical Dupont Microsystems Ltd Photosensitive resin composition, process for forming relief pattern, and electronic component
US7476476B2 (en) 2003-06-02 2009-01-13 Toray Industries, Inc. Photosensitive resin composition, electronic component using the same, and display unit using the same
US7932012B2 (en) 2004-03-31 2011-04-26 Hitachi Chemical Dupont Microsystems Ltd. Heat-resistant photosensitive resin composition, method for forming pattern using the composition, and electronic part
US7977400B2 (en) 2005-03-15 2011-07-12 Toray Industries, Inc. Photosensitive resin composition
US8097386B2 (en) 2006-08-14 2012-01-17 Hitachi Chemical Dupont Microsystems, Ltd. Positive-type photosensitive resin composition, method for producing patterns, and electronic parts
US8765868B2 (en) 2009-07-31 2014-07-01 Hitachi Chemical Dupont Microsystems, Ltd. Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components
KR20210134696A (en) 2019-04-02 2021-11-10 닛뽄 가야쿠 가부시키가이샤 Bismaleimide compound, photosensitive resin composition using same, cured product thereof and semiconductor device

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