JPS54109828A - Heat resistant photoresist composition - Google Patents
Heat resistant photoresist compositionInfo
- Publication number
- JPS54109828A JPS54109828A JP1661178A JP1661178A JPS54109828A JP S54109828 A JPS54109828 A JP S54109828A JP 1661178 A JP1661178 A JP 1661178A JP 1661178 A JP1661178 A JP 1661178A JP S54109828 A JPS54109828 A JP S54109828A
- Authority
- JP
- Japan
- Prior art keywords
- heat resistant
- photoresist composition
- resistant photoresist
- composition
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polymerisation Methods In General (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1661178A JPS54109828A (en) | 1978-02-17 | 1978-02-17 | Heat resistant photoresist composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1661178A JPS54109828A (en) | 1978-02-17 | 1978-02-17 | Heat resistant photoresist composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54109828A true JPS54109828A (en) | 1979-08-28 |
Family
ID=11921106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1661178A Pending JPS54109828A (en) | 1978-02-17 | 1978-02-17 | Heat resistant photoresist composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54109828A (en) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5920304A (en) * | 1982-07-27 | 1984-02-02 | Nippon Oil & Fats Co Ltd | Photopolymerization initiator composition |
JPS59160139A (en) * | 1983-03-04 | 1984-09-10 | Hitachi Ltd | Photosensitive polymer composition |
JPS63206740A (en) * | 1987-02-24 | 1988-08-26 | Mitsubishi Gas Chem Co Inc | Photosensitive polymer composition |
JPS63206741A (en) * | 1987-02-24 | 1988-08-26 | Mitsubishi Gas Chem Co Inc | Photosensitive polymer composition |
JPS63221109A (en) * | 1987-03-10 | 1988-09-14 | Mitsubishi Gas Chem Co Inc | Photosensitive polyamide acid composition |
JPH0418450A (en) * | 1990-04-16 | 1992-01-22 | Fujitsu Ltd | Photosensitive heat-resistant resin composition and method for forming pattern using the same |
US6342333B1 (en) | 1999-09-23 | 2002-01-29 | Hitachi Chemical Dupont Microsystems, L.L.C. | Photosensitive resin composition, patterning method, and electronic components |
US6960420B2 (en) | 2002-11-06 | 2005-11-01 | Hitachi Chemical Dupont Microsystems Ltd | Photosensitive resin composition, process for forming relief pattern, and electronic component |
US7476476B2 (en) | 2003-06-02 | 2009-01-13 | Toray Industries, Inc. | Photosensitive resin composition, electronic component using the same, and display unit using the same |
US7932012B2 (en) | 2004-03-31 | 2011-04-26 | Hitachi Chemical Dupont Microsystems Ltd. | Heat-resistant photosensitive resin composition, method for forming pattern using the composition, and electronic part |
US7977400B2 (en) | 2005-03-15 | 2011-07-12 | Toray Industries, Inc. | Photosensitive resin composition |
US8097386B2 (en) | 2006-08-14 | 2012-01-17 | Hitachi Chemical Dupont Microsystems, Ltd. | Positive-type photosensitive resin composition, method for producing patterns, and electronic parts |
US8765868B2 (en) | 2009-07-31 | 2014-07-01 | Hitachi Chemical Dupont Microsystems, Ltd. | Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components |
KR20210134696A (en) | 2019-04-02 | 2021-11-10 | 닛뽄 가야쿠 가부시키가이샤 | Bismaleimide compound, photosensitive resin composition using same, cured product thereof and semiconductor device |
-
1978
- 1978-02-17 JP JP1661178A patent/JPS54109828A/en active Pending
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5920304A (en) * | 1982-07-27 | 1984-02-02 | Nippon Oil & Fats Co Ltd | Photopolymerization initiator composition |
JPH0463882B2 (en) * | 1982-07-27 | 1992-10-13 | Nippon Oils & Fats Co Ltd | |
JPS59160139A (en) * | 1983-03-04 | 1984-09-10 | Hitachi Ltd | Photosensitive polymer composition |
JPH0318703B2 (en) * | 1983-03-04 | 1991-03-13 | Hitachi Seisakusho Kk | |
JPS63206740A (en) * | 1987-02-24 | 1988-08-26 | Mitsubishi Gas Chem Co Inc | Photosensitive polymer composition |
JPS63206741A (en) * | 1987-02-24 | 1988-08-26 | Mitsubishi Gas Chem Co Inc | Photosensitive polymer composition |
JPS63221109A (en) * | 1987-03-10 | 1988-09-14 | Mitsubishi Gas Chem Co Inc | Photosensitive polyamide acid composition |
JPH0418450A (en) * | 1990-04-16 | 1992-01-22 | Fujitsu Ltd | Photosensitive heat-resistant resin composition and method for forming pattern using the same |
US6342333B1 (en) | 1999-09-23 | 2002-01-29 | Hitachi Chemical Dupont Microsystems, L.L.C. | Photosensitive resin composition, patterning method, and electronic components |
US6773866B2 (en) | 1999-09-23 | 2004-08-10 | Hitachi Chemical Dupont Microsystems L.L.C. | Photosensitive resin composition, patterning method, and electronic components |
US6960420B2 (en) | 2002-11-06 | 2005-11-01 | Hitachi Chemical Dupont Microsystems Ltd | Photosensitive resin composition, process for forming relief pattern, and electronic component |
US7476476B2 (en) | 2003-06-02 | 2009-01-13 | Toray Industries, Inc. | Photosensitive resin composition, electronic component using the same, and display unit using the same |
US7932012B2 (en) | 2004-03-31 | 2011-04-26 | Hitachi Chemical Dupont Microsystems Ltd. | Heat-resistant photosensitive resin composition, method for forming pattern using the composition, and electronic part |
US7977400B2 (en) | 2005-03-15 | 2011-07-12 | Toray Industries, Inc. | Photosensitive resin composition |
US8097386B2 (en) | 2006-08-14 | 2012-01-17 | Hitachi Chemical Dupont Microsystems, Ltd. | Positive-type photosensitive resin composition, method for producing patterns, and electronic parts |
US8765868B2 (en) | 2009-07-31 | 2014-07-01 | Hitachi Chemical Dupont Microsystems, Ltd. | Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components |
KR20210134696A (en) | 2019-04-02 | 2021-11-10 | 닛뽄 가야쿠 가부시키가이샤 | Bismaleimide compound, photosensitive resin composition using same, cured product thereof and semiconductor device |
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