JPS53110371A - Ceramic package type semiconductor device - Google Patents

Ceramic package type semiconductor device

Info

Publication number
JPS53110371A
JPS53110371A JP2477377A JP2477377A JPS53110371A JP S53110371 A JPS53110371 A JP S53110371A JP 2477377 A JP2477377 A JP 2477377A JP 2477377 A JP2477377 A JP 2477377A JP S53110371 A JPS53110371 A JP S53110371A
Authority
JP
Japan
Prior art keywords
semiconductor device
type semiconductor
ceramic package
package type
surrounding equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2477377A
Other languages
Japanese (ja)
Inventor
Kanji Otsuka
Hiroshi Hososaka
Mitsuo Miyamoto
Tamotsu Usami
Kenryo Kawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2477377A priority Critical patent/JPS53110371A/en
Publication of JPS53110371A publication Critical patent/JPS53110371A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain an LSI package suited for the automatic wire bonding with a small size and low cost, by using the first surrounding equipment formed by the insulating plate containing a concavity at the center part on the upper surface opposing to the print wiring substrate and the second surrounding equipment featuring a thermal expansion coefficient approximate to the circuit element.
JP2477377A 1977-03-09 1977-03-09 Ceramic package type semiconductor device Pending JPS53110371A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2477377A JPS53110371A (en) 1977-03-09 1977-03-09 Ceramic package type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2477377A JPS53110371A (en) 1977-03-09 1977-03-09 Ceramic package type semiconductor device

Related Child Applications (7)

Application Number Title Priority Date Filing Date
JP58226841A Division JPS59139659A (en) 1983-12-02 1983-12-02 Method for formation of lead for electronic circuit device
JP58226837A Division JPS59139652A (en) 1983-12-02 1983-12-02 Mounting structure of electronic circuit device
JP22684283A Division JPS59139653A (en) 1983-12-02 1983-12-02 Mounting method of electronic part
JP58226838A Division JPS59139657A (en) 1983-12-02 1983-12-02 Lead frame for electronic element
JP58226839A Division JPS59139650A (en) 1983-12-02 1983-12-02 Sealing method of electronic element
JP58226840A Division JPS59139658A (en) 1983-12-02 1983-12-02 Electronic circuit device
JP60026201A Division JPS60258944A (en) 1985-02-15 1985-02-15 Ic device

Publications (1)

Publication Number Publication Date
JPS53110371A true JPS53110371A (en) 1978-09-27

Family

ID=12147480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2477377A Pending JPS53110371A (en) 1977-03-09 1977-03-09 Ceramic package type semiconductor device

Country Status (1)

Country Link
JP (1) JPS53110371A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5860187U (en) * 1981-10-20 1983-04-22 シャープ株式会社 refrigerator
JPS59214288A (en) * 1983-05-20 1984-12-04 松下電器産業株式会社 Printed board device
JPH036052A (en) * 1989-06-02 1991-01-11 Fujitsu Ltd Semiconductor package
US6924514B2 (en) 2002-02-19 2005-08-02 Nichia Corporation Light-emitting device and process for producing thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5860187U (en) * 1981-10-20 1983-04-22 シャープ株式会社 refrigerator
JPS59214288A (en) * 1983-05-20 1984-12-04 松下電器産業株式会社 Printed board device
JPH036052A (en) * 1989-06-02 1991-01-11 Fujitsu Ltd Semiconductor package
US6924514B2 (en) 2002-02-19 2005-08-02 Nichia Corporation Light-emitting device and process for producing thereof

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