JPS52123873A - Sealing method of semiconductor elements - Google Patents
Sealing method of semiconductor elementsInfo
- Publication number
- JPS52123873A JPS52123873A JP4029876A JP4029876A JPS52123873A JP S52123873 A JPS52123873 A JP S52123873A JP 4029876 A JP4029876 A JP 4029876A JP 4029876 A JP4029876 A JP 4029876A JP S52123873 A JPS52123873 A JP S52123873A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor elements
- sealing method
- polyimide
- base resin
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To improve reliability under high temperature and high humidity by subjecting releace-treatment to the surface of polyimide-base resins in order to weaken the adhesion between polyimide-base resin film and epoxy-base resin layer.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4029876A JPS52123873A (en) | 1976-04-12 | 1976-04-12 | Sealing method of semiconductor elements |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4029876A JPS52123873A (en) | 1976-04-12 | 1976-04-12 | Sealing method of semiconductor elements |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52123873A true JPS52123873A (en) | 1977-10-18 |
Family
ID=12576694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4029876A Pending JPS52123873A (en) | 1976-04-12 | 1976-04-12 | Sealing method of semiconductor elements |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52123873A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54144873A (en) * | 1978-05-04 | 1979-11-12 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture for resin sealing semiconductor device |
-
1976
- 1976-04-12 JP JP4029876A patent/JPS52123873A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54144873A (en) * | 1978-05-04 | 1979-11-12 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture for resin sealing semiconductor device |
JPS5633860B2 (en) * | 1978-05-04 | 1981-08-06 |
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