JPS52123873A - Sealing method of semiconductor elements - Google Patents

Sealing method of semiconductor elements

Info

Publication number
JPS52123873A
JPS52123873A JP4029876A JP4029876A JPS52123873A JP S52123873 A JPS52123873 A JP S52123873A JP 4029876 A JP4029876 A JP 4029876A JP 4029876 A JP4029876 A JP 4029876A JP S52123873 A JPS52123873 A JP S52123873A
Authority
JP
Japan
Prior art keywords
semiconductor elements
sealing method
polyimide
base resin
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4029876A
Other languages
Japanese (ja)
Inventor
Takashi Yokoyama
Yasuo Miyadera
Hiroshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4029876A priority Critical patent/JPS52123873A/en
Publication of JPS52123873A publication Critical patent/JPS52123873A/en
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To improve reliability under high temperature and high humidity by subjecting releace-treatment to the surface of polyimide-base resins in order to weaken the adhesion between polyimide-base resin film and epoxy-base resin layer.
COPYRIGHT: (C)1977,JPO&Japio
JP4029876A 1976-04-12 1976-04-12 Sealing method of semiconductor elements Pending JPS52123873A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4029876A JPS52123873A (en) 1976-04-12 1976-04-12 Sealing method of semiconductor elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4029876A JPS52123873A (en) 1976-04-12 1976-04-12 Sealing method of semiconductor elements

Publications (1)

Publication Number Publication Date
JPS52123873A true JPS52123873A (en) 1977-10-18

Family

ID=12576694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4029876A Pending JPS52123873A (en) 1976-04-12 1976-04-12 Sealing method of semiconductor elements

Country Status (1)

Country Link
JP (1) JPS52123873A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54144873A (en) * 1978-05-04 1979-11-12 Nippon Telegr & Teleph Corp <Ntt> Manufacture for resin sealing semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54144873A (en) * 1978-05-04 1979-11-12 Nippon Telegr & Teleph Corp <Ntt> Manufacture for resin sealing semiconductor device
JPS5633860B2 (en) * 1978-05-04 1981-08-06

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