JPS51126062A - Tap short bonding method on wire bonding - Google Patents

Tap short bonding method on wire bonding

Info

Publication number
JPS51126062A
JPS51126062A JP4967875A JP4967875A JPS51126062A JP S51126062 A JPS51126062 A JP S51126062A JP 4967875 A JP4967875 A JP 4967875A JP 4967875 A JP4967875 A JP 4967875A JP S51126062 A JPS51126062 A JP S51126062A
Authority
JP
Japan
Prior art keywords
bonding
tap short
wire bonding
wire
bonding method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4967875A
Other languages
Japanese (ja)
Inventor
Kazunori Nishizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4967875A priority Critical patent/JPS51126062A/en
Publication of JPS51126062A publication Critical patent/JPS51126062A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To positively prevent tap short.
COPYRIGHT: (C)1976,JPO&Japio
JP4967875A 1975-04-25 1975-04-25 Tap short bonding method on wire bonding Pending JPS51126062A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4967875A JPS51126062A (en) 1975-04-25 1975-04-25 Tap short bonding method on wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4967875A JPS51126062A (en) 1975-04-25 1975-04-25 Tap short bonding method on wire bonding

Publications (1)

Publication Number Publication Date
JPS51126062A true JPS51126062A (en) 1976-11-02

Family

ID=12837822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4967875A Pending JPS51126062A (en) 1975-04-25 1975-04-25 Tap short bonding method on wire bonding

Country Status (1)

Country Link
JP (1) JPS51126062A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57180139A (en) * 1981-04-21 1982-11-06 Rockwell International Corp Pneumatic wire lifter
JPS59195835A (en) * 1983-04-20 1984-11-07 Rohm Co Ltd Connection of bonding wire of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57180139A (en) * 1981-04-21 1982-11-06 Rockwell International Corp Pneumatic wire lifter
JPS59195835A (en) * 1983-04-20 1984-11-07 Rohm Co Ltd Connection of bonding wire of semiconductor device

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