JPH1199462A - Wire saw - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wire saw favourable in dimensional precision and in a working yield and capable of easily carrying out cutting work. SOLUTION: It has a first wire bobbin 1 to rewind a wire 2 for cutting, a second wire bobbin 3 to wind up the wire 2 for cutting, a driving mechanism 6 existing between both of the wire bobbins 1, 3, rollers 4a, 4b, 4c with a pair of grooves existing between both of the wire bobbins 1, 3, to suspend the wire 2 for cutting in parallel while guiding it and to travel it in a specified direction, a driving mechanism 6 to rotationally drive the guide rollers 4a, 4b, 4c, a working body support mechanism 7 to pressurisingly support a cutting material 8 against the wire 2 to travel, pretreatment means 9a, 9b arranged in front of the guide roller 4c on the side of a working region with which the wire 2 for cutting and the cutting material 8 make contact and to roughen a surface of the wire 2 for cutting and working slurry supplying mechanisms 10a, 10b to supply slurry for working to the region with which the pretreated wire 2 for cutting and the cutting material 8 make contact.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire saw for cutting a so-called brittle material, such as a semiconductor material or a magnetic material, with a wire. The present invention relates to a wire-type cutting device for cutting by supplying a processing liquid containing abrasive grains to a pressed portion.

[0002]

2. Description of the Related Art In general, a wire-type cutting device called a wire saw is used to cut a member to be cut (a material to be cut), for example, a semiconductor block (a silicon single crystal ingot) or a magnetic material, into a cutting wire running at a high speed. (A quartz glass molding block for a photomask) or the like is pressed or pressed to simultaneously cut a large number of wafers. Then, a cutting wire is stretched in parallel at an arbitrary set interval between the pair of guide rollers, and while the cutting wire row is pressed against the material (block) to be cut, abrasive grains are applied to the pressed portion. By supplying a processing slurry containing, a lapping action is performed to cut and separate.

[0003] As the above-mentioned wire saw, a method in which the cutting wire is rewound (extended) and wound up in a fixed direction while the cutting wire is reciprocated (Japanese Patent Publication No. 52-129).
No. 54 publication. JP-A-52-98291, etc.) and a method in which a cutting wire is run at a high speed in a certain direction (JP-A-61-11706).
No. 0). In particular, a wire saw that allows a cutting wire to travel at a high speed in a certain direction is superior to a reciprocating traveling wire saw in cutting ability and roughness / accuracy of a cut surface.

[0004] Regardless of the reciprocating traveling type or the constant direction high speed traveling type, the wire saw supplies a working fluid containing abrasive grains in the cutting process, so that the abrasive grains adhere to the surface of the cutting wire together with the cutting powder, There is a problem that the cutting accuracy is impaired. For this reason, it has been proposed that, after contributing to the cutting process, the deposits on the surface of the cutting wire coming out of the processing area be removed using a cleaning liquid such as kerosene (Japanese Utility Model Application Laid-Open No. 61-92528). No.).

[0005]

By the way, the wire surface of the new wire has a very small and uniform surface roughness due to the drawing and plating at the time of manufacture. In addition, the amount of slurry attached to the wire saw is important because the wire saw attaches a slurry (a mixture of machining fluid and abrasive grains) to the wire that travels at high speed. In order to use the slurry, the amount of slurry attached was short. In particular, in the case of a water-soluble slurry, the adhesion of the slurry becomes difficult due to the residual oil used in the production of the wire.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a wire saw capable of easily performing cutting with good dimensional accuracy and processing yield.

[0007]

According to a first aspect of the present invention, there is provided a first wire bobbin for rewinding a cutting wire, a second wire bobbin for winding the cutting wire, and a cutting wire between the two wire bobbins. A guide roller with a groove stretched in parallel while guiding the wire for guiding, and running in parallel in a certain direction, a driving mechanism for rotating the guide roller, and pressing against the cutting wire for running. A workpiece support mechanism that supports the material to be cut, and a pre-processing means that is disposed on the near side of the guide roller on the side of the processing region where the cutting wire and the material to be cut are in contact, and roughens the surface of the cutting wire; A processing slurry supply mechanism for supplying a processing slurry to a region where the pretreated cutting wire and the material to be cut come into contact with each other. Is Yaso.

According to a second aspect of the present invention, in the wire saw according to the first aspect, the pretreatment means is means for spraying abrasive grains having a particle size of 0.05 to 100 μm with a high-pressure air. That is, the present invention allows the cutting wire stretched between the grooved guide rollers to travel in parallel in a certain direction,
In a device that cuts a material to be cut (a member or a block) by pressing it against the traveling cutting wire and performs a lapping operation, a groove is provided to allow the cutting wire to travel in a certain direction. The main point is that a pretreatment means for roughening the surface of the cutting wire is arranged before the guide roller. Here, the pre-treatment means generally sprays abrasive grains having a particle diameter of 0.05 to 100 μm with, for example, high-pressure air, and makes the surface of the cutting wire substantially uniform and has a fine rough surface by the frictional action of the abrasive grains. It is something to make.

Therefore, it is necessary to arrange the pre-processing means at least in front of the guide roller on the side of the area to be cut. The high-pressure air may be blown not only by air but also by containing an appropriate processing liquid.

When the particle size of the abrasive grains is less than 0.05 μm,
The surface of the cutting wire tends to be insufficiently roughened, and if it exceeds 100 μm, the cutting wire tends to locally form a thin portion. 30 μm).

Further, the wire bobbin for rewinding the cutting wire (first wire bobbin) and the wire bobbin for winding up (second wire bobbin) can be used for both purposes. That is, the cutting wire may be rewound from the wound second wire bobbin and wound on the first wire bobbin.

In consideration of this mode of use, pre-processing means are respectively arranged in front of the grooved guide rollers on the side of the area to be cut, and the second wire bobbin to be unwound is functioned as pre-processing means, and What is necessary is just to make the wire bobbin side of 1 function for cleaning only by blowing high-pressure air. Further, the grooved guide roller sets grooves parallel to a plurality of rows at equal intervals.

According to the present invention, the surface of the cutting wire is moved to the cutting region in a finely roughened state with a substantially uniform surface. Cut and separated. In other words, the cutting wire always has a substantially constant surface state, and a processing slurry containing a certain amount of abrasive grains is adhered to the cutting wire and pressed (pressed) against the cut portion of the cut material. A steady cutting process is performed.

Here, the fact that the cutting wire always presents a substantially constant surface state and that a predetermined amount of a working slurry (working liquid) containing abrasive grains is adhered to and contributes to the cutting process has good dimensional accuracy. In addition to enabling wafer processing (or good yield), wear and abrasion of guide rollers and wire bobbins are reduced or avoided, and durability is improved.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment will be described below with reference to FIGS.

FIG. 1 is an exploded perspective view schematically showing the structure of a wire saw according to an embodiment. In FIG. 1, 1 is a diameter.
A first wire bobbin for rewinding a cutting wire 2 composed of a piano wire of about 0.18 mm;
A second wire bobbin 4a, 4b, 4c is provided between the two wire bobbins 1 and 3, and is stretched in parallel while guiding the cutting wire 1, and has a groove for running in parallel in a certain direction. Guide rollers.

Here, the grooved guide rollers 4a, 4b, 4c
Is made of urethane resin having a diameter of about 150 mm and a length of about 400 mm, for example, and has a plurality of grooves formed on the peripheral surface thereof at equal intervals. Then, the cutting wire 2 to be rewound and wound between the wire bobbins 1 and 3 is guided by the guide roller 4.
Run while stretching in parallel between a, 4b and 4c.

The cutting wire 2 to be rewound or wound on the wire bobbins 1 and 3 passes between the grooved guide rollers 4a, 4b and 4c via a general guide roller 5. To run.

Reference numeral 6 denotes a driving mechanism (motor) for rotating the guide rollers 4a, 4b, 4c, and 7 supports a material (for example, a semiconductor block) 8 to be pressed against the traveling cutting wire 2. This is the work piece support mechanism to be performed. Here, the workpiece support mechanism 7 includes the guide roller
For cutting wire 2 stretched in parallel between 4a and 4b,
This is an elevating device that can support the material to be cut 8 in a pressable manner.

More specifically, for example, it comprises a support 7a for supporting the material 8 to be cut substantially horizontally, a holder 7b for holding the support 7a, and a drive mechanism 7c for vertically moving the holder 7b. I have.

Further, 9a (9b) is arranged in front of the guide roller 4C on the processing region side where the cutting wire 2 and the material 8 to be cut come into contact with, and sprays a pretreatment agent to roughen the surface of the cutting wire 2. Pretreatment means to be surfaced, 10a (10b)
Is a processing slurry supply mechanism for supplying a processing slurry to a region where the pre-processed cutting wire 2 and the material to be cut 8 come into contact with each other.

Here, the pre-processing means 9a (9b) is configured to show a schematic configuration example in perspective in FIG. 2 and a schematic configuration example in cross section in FIG. That is, a slurry supply path composed of a processing liquid and abrasive grains arranged concentrically in a high-pressure carrier gas (for example, high-pressure air) supply path 11a.
A pretreatment agent injection member 11 having a pretreatment agent supply path in which 11b is disposed, and a recovery path 12b opposed to the pretreatment agent injection port 11c and connected to the injected pretreatment agent receiving port 12a and the recovery tank side. And a recovery section 12 for the pretreatment agent.

In this configuration, a surface roughening process is performed while the cutting wire 2 passes between the facing surfaces of the pretreatment agent injection port 11c and the receiving port 12a.

The processing liquid constituting the pre-slurry processing agent is, for example, a water-soluble processing liquid mainly containing mineral oil, and the abrasive grains are SiC powder or GC powder having a particle size of 0.05 to 100 μm. Further, when the cutting wire 2 is rewound onto the wire bobbin 1, the pretreatment means 9a (9b) only needs to spray high-pressure gas.

On the other hand, a slurry supply mechanism for processing containing abrasive grains
10a (10b) is a processing slurry storage tank provided with a supply nozzle capable of supplying a required processing slurry almost uniformly to the cutting wire 2 stretched in parallel between the guide rollers 4a and 4b. is there. When the cutting wire 2 is rewound to the wire bobbin after the required cutting, the processing slurry supply mechanism 10b (10a) is not operated.

Next, an operation example of the wire saw will be described.

The cutting wire 2 rewound from the first wire bobbin 1 is stretched in parallel between the grooved guide rollers 4a, 4b, 4c, while its tip is connected to the second wire bobbin 3. Attach. A cutting wire 2 stretched in parallel between the grooved guide rollers 4a, 4b, 4c.
In the unwinding side pretreatment means 10a, the pretreatment agent is
The cutting wire 2 is sprayed at a high speed of about 50 m / sec so that the surface of the cutting wire 2 can be roughened.

In this state, the grooved guide rollers 4a, 4a
b, 4c are driven to rotate by a driving mechanism (motor) 6,
The cutting wire 2 is guided at a high speed of, for example, about 0.01 to 20 m / sec while guiding the cutting wire 2 in a predetermined direction.
On the other hand, the workpiece support mechanism 7 is driven against the running surface of the cutting wire 2 to press (press) a supported workpiece (for example, a semiconductor block) 8.
Prior to the pressing of the semiconductor block 8, the processing slurry including abrasive grains is attached to the cutting wire 2 traveling in parallel to the predetermined direction via the processing slurry supply mechanism 10a. You.

The cutting wire 2 unwound from the first wire bobbin 1 under the above-mentioned semiconductor block cutting (wafering) conditions is processed by the pre-processing means 10a to be fine and substantially fine with cleaning of the surface. Uniform surface roughening is performed,
The processing slurry containing abrasive grains prior to the cutting (wafering) of the semiconductor block is also adhered with a sufficient amount and the amount is almost uniform, so that a wafer having a predetermined thickness can be obtained with good yield. That is, the surface of the cutting wire 2 is
As a whole, it has a constant rough surface state,
Since the amount of processing slurry containing required abrasive grains is always secured, cutting with high dimensional accuracy can be mass-produced.

Further, the cleaning of the surface of the cutting wire 2 avoids damage to the wire bobbin and the guide roller, and also eliminates damage to the surface of the cutting wire 2 due to abrasion dust of the guide roller and the like. Also, the durability can be improved.

In the above, the configuration example of the wire saw for simultaneously obtaining a plurality of wafers has been described. However, the present invention is not limited to this embodiment, and various modifications can be made without departing from the spirit of the invention. For example, the groove of the grooved guide roller may be singular, or it may be appropriately selected according to the material and size of the material to be processed such as the material of the cutting wire and the guide roller and their dimensions. .

[0032]

According to the first and second aspects of the present invention, before the cutting wire travels at a high speed, the surface of the cutting wire is pretreated to a substantially uniform and finely roughened surface. Therefore, a sufficient slurry (a mixture of a working fluid and abrasive grains) is always adhered to the cutting wire, and required cutting can be easily performed.

Further, in the case where the slurry (mixture of working fluid and abrasive grains) is water-soluble, even if the oil used at the time of manufacturing the wire remains, the oil is removed by the pretreatment means. The required slurry can be smoothly processed by the easy attachment of the slurry.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a configuration example of a wire saw according to the present invention.

FIG. 2 is a perspective view showing a configuration example of a main part of a pre-processing means provided in the wire saw according to the present invention.

FIG. 3 is a cross-sectional view showing an example of a configuration of a main part of pretreatment means provided in the wire saw according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... 1st wire bobbin 2 ... Cutting wire 3 ... 2nd wire bobbin 4a-4c ... Guide roller with a plurality of grooves 5 ... Guide roller 6 ... Rotation drive mechanism 7 ... Work Body support mechanism 8 Material to be cut 9a, 9b Pretreatment means 10a, 10b Processing slurry supply mechanism 11 Pretreatment agent injection member 11a Pretreatment agent supply path 11b High pressure air supply path 11b …… Injection port 12 …… Pretreatment agent recovery section 12a …… Reception port 12b …… Recovery path

Claims (2)

[Claims] 1. A first wire bobbin for rewinding a cutting wire, a second wire bobbin for winding the cutting wire, and a tension wire extending between the two wire bobbins while guiding the cutting wire in parallel. A grooved guide roller for traveling in parallel with a certain direction, a drive mechanism for rotating the guide roller, and a workpiece support for pressing the workpiece to be pressed against the traveling cutting wire A mechanism, a pretreatment means arranged on the near side of the guide roller on the processing region side where the cutting wire and the material to be cut come in contact, and roughening the surface of the cutting wire; and the pretreated cutting wire and the coating material. A processing slurry supply mechanism for supplying a processing slurry to a region where the cutting material contacts. 2. The wire saw according to claim 1, wherein the pretreatment means is means for spraying abrasive grains having a particle size of 0.05 to 100 μm with a high-pressure air.