JPH11345865A - Semiconductor manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device that has a chip illumination method improved by a relatively simple method and a chip recognition rate improved by satisfactory identification of streets between chips. SOLUTION: In a semiconductor manufacturing device that has a separation stage for individually separating semiconductor chips 1 and 6 from a wafer sheet 9, on which the semiconductor chips 1 and 6 are mounted and held, a means for illuminating the semiconductor chip 1 on the separation stage, a CCD camera 10 for exposing the illuminated semiconductor chip 1 and an image processor 11 for image recognizing the exposed semiconductor chip 1 to identify the shape and position thereof, the wafer sheet 9 is constituted by a transparent or semitransparent light-transmitting sheet and a illumination means 8 illuminates the semiconductor chip 1 on the wafer sheet 9 from a side opposite to the CCD camera 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a semiconductor manufacturing apparatus having an improved die bonding process.

[0002]

2. Description of the Related Art In a manufacturing process between a dicing process and a die bonding process of a semiconductor device, a diced chip is stuck on an adhesive wafer sheet as a transfer film and transferred, and then the transferred chip is transferred. Mount on lead frame. At the time of mounting, individual chips are picked up and picked up from the wafer sheet by a suction holder such as a collet, and at this time, a needle is used to improve the position reading work to read the chip position and to separate the chip from the wafer sheet. An operation of pushing up a chip from a lower surface of a sheet with a needle-shaped tool using a pushing device and separating the chip is often performed.

FIG. 3 shows a schematic configuration diagram of a chip separation stage of a semiconductor manufacturing apparatus in a conventional wafer pickup process. FIG. 4 shows an example of a display image on the monitor TV screen in this case. 3 and 4, 1 is a chip to be processed, 2 is oblique illumination, 3 is coaxial epi-illumination, 4 is a street between chips, 5 is a sheet, 6 is an adjacent chip,
Reference numeral 7 denotes a suction stage, 10 denotes a CCD camera, 11 denotes an image processing device, 12 denotes a monitor TV, and 13 denotes a pickup head.

The diced chip 1 is held on a sheet 5 made of an adhesive resin tape and transported to a suction stage 7, where the sheet 5 is sucked from the back surface by the suction stage 7 and is pushed up by a chip push-up pin. The chip 1 is pushed up from the back surface and separated. At this time, the position and the shape of the chip 1 carried on the suction stage 7 are image-recognized by the CCD camera 10. Based on this recognized position, the pickup head 13 of the die pickup device
Captures the chips 1 and picks up the chips 1 one by one and mounts them on a lead frame or a package.

In recognizing the image of the chip 1, in the prior art, a light source is provided off-axis with respect to the optical axis of the CCD camera 10, and an oblique illumination 2 for irradiating the chip 1 as a sample obliquely, and a half mirror. CCD camera 1 using a prism and
An illumination method such as coaxial epi-illumination 3, which illuminates the chip 1 as a sample from above by matching the optical axis of 0 with the illumination axis, has been adopted. In this case, in the monitor image, the outer shape of the chip 1 is recognized by the reflected light of the oblique illumination 2 and the coaxial epi-illumination 3 as a white mass reflecting light, which is distinguished from the black of the street 4 between the chips 1 and 6.

However, in this case: 1) When there is a pattern or unevenness on the surface of the chip 1 and it is difficult to reflect, the external shape may be difficult to recognize as a white mass, and the threshold value for recognition as white is a problem. 2) If the amount of stretching of the sheet 5 is small, the street 4 becomes narrow and the black portion cannot be recognized, and the boundary between the chip 1 and the adjacent chip 6 cannot be identified. Due to such problems, the chip recognition rate may be reduced.

[0007]

As described above, in the chip pick-up process of the conventional semiconductor manufacturing apparatus, there is a problem in the recognition of chips or streets in the image recognition by the conventional illumination method, and the chip recognition rate is reduced. was there.

According to the present invention, there is provided a semiconductor manufacturing apparatus which solves this problem, improves the method of illuminating a chip by a relatively simple method, improves the identification of the street between chips, and improves the chip recognition rate. The task is to achieve it.

[0009]

In order to achieve the above object, the present invention provides a separation stage for individually separating semiconductor chips from a wafer sheet on which semiconductor chips are mounted and held, and a semiconductor device separated by the separation stage. Suction holding means for sucking, holding and transferring the chip, illumination means for illuminating the semiconductor chip on the separation stage, imaging means for imaging the semiconductor chip illuminated by the illumination means, and imaging by the imaging means An image recognizing means for recognizing an image of the obtained semiconductor chip by image recognition to identify a shape and a position thereof and to use the suction holding means for a suction holding operation. Consisting of a translucent sheet, the illuminating means from the opposite side of the wafer sheet to the imaging means Serial characterized by configured to perform illumination of the semiconductor chip on the separation stage.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a semiconductor manufacturing apparatus according to the present invention will be described in detail with reference to the accompanying drawings. FIG.
FIG. 2 is a layout view showing a configuration of an embodiment of a chip separation stage in the semiconductor manufacturing apparatus of the present invention. FIG. 2 shows an example of a display image on the monitor TV screen. 1 and 2
1, 1 is a chip to be processed, 4 is a street between chips, 6 is an adjacent chip, 7 is a suction stage, 8 is a ring-shaped fiber illuminating means, 9 is a translucent sheet, 10 is a CCD camera, and 11 is image processing. Device, 12 is monitor T
V and 13 are pickup heads.

The diced chip 1 is held on a translucent sheet 9 made of an adhesive and translucent resin tape, and is conveyed to a suction stage 7. The position and shape of the chips 1 carried on the suction stage 7 are image-recognized by the CCD camera 10, and the chips 1 are picked up one by one by the pickup head 13 of the die pick-up device based on the recognized positions. Attached to.

In recognizing the image of the chip 1, in the present invention, the chip 1, which is a sample, is illuminated with a backlight from the opposite side of the translucent sheet 9 with respect to the CCD camera 10 to recognize the chip 1 in silhouette. I decided to take the method to make it. That is, in the present embodiment shown in FIG. 1, light is guided from a light source to an illuminating unit 8 made of a ring-shaped fiber by an optical fiber or the like, and scattered light from the inside of the illuminating unit 8 passes through a translucent sheet 9. In addition to illuminating the chip 1 with a backlight, at least the upper part of the suction stage 7 is made of a translucent material, and light is guided to this part. The backlight of the chip 1 is illuminated via. As the translucent material, a methacrylic resin such as a polycarbonate resin and PMMA, and other translucent materials can be used.

In this manner, the image captured by the CCD camera 10 and processed by the image processing device 11 is such that, as shown in FIG. It is recognized as a white line and displayed on the monitor TV12. With this method, the chips 1 and 6 are completely independent of the surface condition.
Is displayed as a black lump irrespective of the threshold value, and the street 4 is a white line. Therefore, recognition errors are almost eliminated and the chip recognition rate can be greatly improved.

In the above description, a ring-shaped fiber is used for the illuminating means 8 to illuminate with its own scattered light and the scattered light illuminating the translucent portion of the suction stage 7. However, the present invention is not necessarily limited to this, and any device can be used as long as it illuminates the chip 1 with a backlight via the translucent sheet 9 suitable for the purpose of the present invention. For example, a light emitting unit such as an LED may be arranged around the suction stage 7 or may be embedded in the translucent portion of the suction stage 7 to emit light.

As described above, in the present invention, 1) the chip is illuminated with backlight and the chip portion is shaded;
Since the street portion between the chips is represented by a bright portion, the identification can be performed stably irrespective of the pattern or unevenness on the chip surface. 2) Even if the street becomes narrower, the chip boundary can be reliably recognized as long as a light beam leaks from below. 3) Expensive illumination such as oblique illumination and coaxial illumination, which has been conventionally used, is not required, and can be realized by a simple illumination method. Further, since the light source can be provided below the sheet, the light source can be provided within the movable range of the pickup head. And the danger of interference with the operation of the pickup head is eliminated. There are advantages such as.

[0016]

As described above, according to the first aspect of the present invention, there is provided a separation stage for individually separating semiconductor chips from a wafer sheet on which semiconductor chips are mounted and held, and a semiconductor device separated by the separation stage. Suction holding means for sucking, holding and transferring the chip, illumination means for illuminating the semiconductor chip on the separation stage, imaging means for imaging the semiconductor chip illuminated by the illumination means, and semiconductor imaged by the imaging means In a semiconductor manufacturing apparatus having image recognition means for image-recognizing an image of a chip to identify its shape and position and utilizing the suction-holding means for suction-holding operation, a wafer sheet is formed of a transparent or translucent sheet transmitting light. The illumination means illuminates the semiconductor chip on the separation stage from the opposite side of the wafer sheet with respect to the imaging means. Uni characterized by configuration. As a result, the chip is illuminated with backlight and the chip part is represented by a shadow, and the street part between the chips is represented by a bright part, so that the chip can be stably identified regardless of the pattern or unevenness on the chip surface, In addition, the streets between the chips can be well identified, and the chip recognition rate can be greatly improved by a relatively simple method.

According to the invention of claim 2 of the present invention, in order to facilitate separation of the semiconductor chip from the wafer sheet, the separation stage includes a sheet suction means for suctioning a back surface of the semiconductor chip mounting surface of the wafer sheet, and a semiconductor chip. Needle-like push-up means for pushing up from the back of the wafer sheet, the sheet suction means is made of a translucent material, and the illuminating means illuminates the semiconductor chip through the wafer sheet from around the sheet suction means, and The semiconductor chip is illuminated by introducing light into the suction means and transmitting the wafer sheet with scattered light inside the sheet suction means. This allows a relatively simple lighting method,
The chip can be illuminated with a backlight to improve the chip recognition rate, and the illumination can be removed from the movable range of the pickup head so as not to interfere with the operation of the pickup.

[Brief description of the drawings]

FIG. 1 is a layout diagram showing a configuration of an embodiment of a chip separation stage in a semiconductor manufacturing apparatus of the present invention.

FIG. 2 is an example of a display image on a monitor TV screen of the image processing apparatus according to the embodiment shown in FIG. 1;

FIG. 3 is a schematic configuration diagram of a chip separation stage of a conventional semiconductor manufacturing apparatus.

FIG. 4 is an example of a display image on a monitor TV screen of an image processing apparatus of a conventional semiconductor manufacturing apparatus.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Chip to be processed, 2 ... Oblique illumination, 3 ... Coaxial incident illumination, 4 ... Street, 5 ... Sheet, 6 ... Adjacent chip, 7
... suction stage, 8 ... ring-shaped fiber illumination means, 9
... Semi-transparent sheet, 10 ... CCD camera, 11 ... Image processing device, 12 ... Monitor TV, 13 ... Pickup head.

Claims (2)

[Claims] A separation stage for individually separating the semiconductor chips from a wafer sheet on which the semiconductor chips are mounted and held; suction holding means for suction-holding and transferring the semiconductor chips separated by the separation stage; Illumination means for illuminating the semiconductor chip on the stage; imaging means for imaging the semiconductor chip illuminated by the illumination means; and image recognition of the image of the semiconductor chip imaged by the imaging means to obtain the shape and A semiconductor manufacturing apparatus having an image recognizing means for identifying a position and assisting the suction holding operation of the suction holding means, wherein the wafer sheet is formed of a transparent or translucent sheet that transmits light, and the illumination means is the imaging means. Illuminating the semiconductor chip on the separation stage from the opposite side of the wafer sheet The semiconductor manufacturing apparatus characterized by constituting urchin. 2. The separation stage according to claim 1, further comprising: a sheet suction unit configured to suction a back surface of the semiconductor chip mounting surface of the wafer sheet to facilitate separation of the semiconductor chip from the wafer sheet. A needle-like push-up means for pushing up from the back surface, wherein the sheet suction means is made of a translucent material, and the illumination means illuminates the semiconductor chip through the wafer sheet from around the sheet suction means. 2. The semiconductor according to claim 1, wherein light is introduced into the sheet suction means, and the semiconductor chip is illuminated by transmitting the wafer sheet with scattered light inside the sheet suction means. 3. Manufacturing equipment.