JPH1134320A - Ink jet head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform further multi-nozzle, densification and miniaturization of an ink-jet head without problem of a crosstalk by continuously forming piezoelectric films in size to cover two or more pressurizing chambers. SOLUTION: In the ink-jet head 1, piezoelectric films 12 continuously formed in a size to cover all pressurizing chambers 10a on a board 10 and upper electrodes 13 separately formed at the respective chambers 10a are sequentially laminated and formed via a diaphragm 11 made conductive to function at an upper surface of the board 10 as a lower electrode on the board 10 in which a plurality of the chambers 10 are arranged. In this case, each film 12 is necessarily formed in a thickness of 30 μm or less, and can be formed by a method for adhering a chip obtained by polishing sintered material of piezoelectric material such as lead zirconate titanate (PZT) in a thin plate state onto the diaphragm 11. An upper limit of the thickness of the film 12 is adapted to 0.5 μm or more.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet head for an ink jet printer.

[0002]

2. Description of the Related Art In a so-called on-demand type ink-jet printer, a conventional ink-jet head 9 used for discharging ink droplets has, for example, a substrate 90 on which a plurality of pressure chambers 90a are arranged as shown in FIG. Immediately above each of the pressurizing chambers 90 a, at least an upper surface thereof is electrically conductive via a vibrating plate 91.
The piezoelectric film 92 and the upper electrode 93 which are independent for each a are laminated in this order.

In the ink jet head 9 described above, the conductive upper surface of the diaphragm 91 is used as a lower electrode, and printing is performed between the lower electrode and an upper electrode 93 at an arbitrary position among a plurality of positions. When an electric field corresponding to the data is applied, the piezoelectric film 92 between both electrodes is bent, and the pressurizing chamber 90 a immediately below is pressed via the diaphragm 91. By the above-described pressurization, a predetermined amount of the ink previously filled in the pressurizing chamber 90a is ejected as ink droplets from the connected nozzle 90b, and printing is performed by repeating this process.

As the piezoelectric film used in the above-described ink jet head, a chip obtained by polishing a sintered body of a piezoelectric material such as lead zirconate titanate (PZT) into a thin plate is usually used. Then, this chip is attached to the diaphragm 91
A piezoelectric film is formed by adhering to a position immediately above each pressurizing chamber 90a. However, the above configuration sufficiently responds to the recent increase in the number of nozzles of the ink jet head due to the increase in the number of colors and the higher image quality of the ink jet printer, and consequently the increase in the number of pressurized chambers on the substrate and its higher density. The current situation is that it is becoming impossible to complete.

That is, the number of chips and the number of steps for attaching the chips increase as the number of pressurizing chambers increases, so that the work time for attaching and the like becomes longer and the productivity decreases, or in particular, higher. When speeding up the work to shorten the work time to maintain productivity, for example, defects such as chip misalignment, cracking, and sticking occur, resulting in a problem of lowering product yield. .

Therefore, recently, a single chip having a size sufficient to cover all the pressure chambers on the substrate is used as the piezoelectric film, and only the upper electrode thereon is separately formed for each pressure chamber. 1 above
An ink jet head has been proposed in which a single chip is bent by applying an electric field at each position where an upper electrode is formed, that is, at each pressurizing chamber (Japanese Patent Laid-Open No. 5-69549).
No.).

[0007] According to this configuration, since only one chip is required regardless of the number and density of the nozzles, the above-described problem does not occur, the workability is improved, and the number of nozzles of the ink jet head is increased. It is expected that high density, high density, and miniaturization will be possible.

[0008]

However, in the case where the piezoelectric film is formed continuously so as to cover a plurality of pressure chambers as described above, as described in the above-mentioned publication, a conventional chip is used. Has a thickness of about 0.2 to 0.3 mm (200 to
Since the thickness is as small as about 300 μm or less, particularly as the ink jet head becomes denser and the distance between the respective pressurizing chambers becomes smaller, the deflection of the piezoelectric film due to the application of an electric field on one pressurizing chamber becomes larger. The inventors have found that there is a problem that the so-called crosstalk is likely to occur, which affects the bending characteristics of the same piezoelectric film in the surrounding pressure chamber.

An object of the present invention is to provide a piezoelectric film having a size enough to cover two or more pressurizing chambers on a substrate, and to prevent the problem of crosstalk from occurring. An object of the present invention is to provide an ink jet head capable of increasing the number of nozzles, increasing the density, and reducing the size.

[0010]

Means for Solving the Problems In order to solve the above problems, the inventors have made various studies on the thickness of the piezoelectric film.
As a result, they found that if the thickness of the piezoelectric film was 30 μm or less, it was possible to reliably prevent the occurrence of crosstalk, and completed the present invention. Therefore, the inkjet head of the present invention is an inkjet head in which a piezoelectric film is formed on each of the pressure chambers of a substrate on which a plurality of pressure chambers are arranged via a vibration plate. It is characterized by being continuously formed to a size that covers at least two or more pressurized chambers and having a thickness of 30 μm or less.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An ink jet head according to the present invention will be described below with reference to FIGS. The inkjet head 1 in the example shown in the figure
On the substrate 10 on which the plurality of pressurizing chambers 10a are arranged, all the pressurizing chambers 10a on the substrate 10 are connected via the vibrating plate 11 at least whose upper surface functions as a lower electrode. Piezoelectric film 12 continuously formed to cover size
And upper electrode 13 formed separately for each pressurizing chamber 10a.
Are stacked in this order. On the lower surface of the substrate 10, nozzles 10b for discharging ink droplets are provided in communication with the pressurizing chambers 10a.

As described above, the thickness of the piezoelectric film 12 is limited to 30 μm or less. The reason is as described above. The thin piezoelectric film 12 is formed by bonding a chip obtained by polishing a sintered body of a piezoelectric material such as PZT into a thin plate to the vibrating plate 11 as in the related art. It is applied to a predetermined position on the diaphragm 11 by a method such as printing so as to have a predetermined shape, dried, temporarily fired, and then sintered to form a thin film of a piezoelectric material. A sol paste formed from an organometallic compound containing each of the following metals is also applied to the diaphragm 11 by a method such as screen printing, dried, temporarily calcined in order to remove organic substances, and then calcined to form a so-called sol paste. A method of forming a thin film of a piezoelectric material by a gel method or a MOD method (a thermal decomposition method of an organometallic compound), a method of forming a thin film of a piezoelectric material on a vibration plate 11 by a vapor phase growth method, and the like. Formed by

In the method using a chip, a chip serving as a piezoelectric film is replaced with a substrate 10 as shown in FIG.
When formed to have a size that covers all the upper pressurizing chambers 10a, there are advantages such as improved workability as described above, but the thickness is as thin as 30 μm or less, and as described above, Chips are easily broken or chipped during operations such as polishing and pasting, and are not easy to handle.

In this method, instead of using a large chip as described above, at least two
A plurality of chips having a size to cover more than one pressurizing chamber 10a may be used. In this case, even if the thickness is 30 μm or less, cracks and the like are less likely to occur as compared with a large chip, handling is easy, and 1
Workability is better than when attaching chips one by one. Note that the thickness, size, and number of chips may be appropriately set in consideration of the balance between the strength of the chips and workability.

As the piezoelectric material constituting the chip, in addition to the above-mentioned PZT-based material containing PZT as a main component, for example, lead magnesium niobate (PMN), lead nickel niobate (PNN), lead zinc niobate, manganese Examples of such materials include lead niobate, lead antimony stannate, lead titanate, and barium titanate. Also, a composite material containing two or more of these components can be used. Also,
As the PZT-based piezoelectric material, in addition to PZT itself,
One obtained by adding one or more kinds of oxides such as lanthanum, barium, niobium, zinc, nickel, and manganese to PZT, such as PLZT, may be mentioned.

The chip is formed by polishing a sintered body obtained by sintering the powder of the piezoelectric material at, for example, a temperature of about 1000 to 1200 ° C. in an oxygen atmosphere into a thin plate as in the conventional case. The thickness of the piezoelectric film 12 formed by the above method may be in the range of 30 μm or less, particularly 10 μm, in consideration of the ease of handling the chip described above.
It is preferably at least 20 μm, more preferably at least 20 μm.

Next, as the piezoelectric material powder used in the above-mentioned method, the powders of the various piezoelectric materials exemplified above are used. The particle size of the powder is not particularly limited,
In order to form a uniform and excellent piezoelectric characteristic piezoelectric film, the average particle diameter of the powder is preferably about 0.2 to 5 μm. In order to obtain a paste, a resin as a film forming agent and a solvent capable of dissolving the resin may be mixed together with the powder of the piezoelectric material. The mixing ratio of each of the above components, the viscosity of the paste, etc., such as the screen printing method described above,
Depending on the method for applying the paste on the diaphragm 11,
Is set.

Examples of the resin as a film forming agent include ethyl cellulose, hydroxypropyl cellulose, polyvinyl alcohol and the like. As a method of applying the paste on the vibration plate 11, a printing method such as a screen printing method is suitably employed as described above. The thickness of the coating film, the thickness of the piezoelectric film 12 after sintering is 30 μm or less,
The thickness is appropriately set so as to have a predetermined thickness. In order to adjust the thickness of the coating film, there is a method of adjusting the number of times of application.

After the above-mentioned coating film is dried and calcined in order to remove organic substances such as a film forming agent and then sintered, for example, in an oxygen atmosphere, the piezoelectric film 12 is formed. The sintering temperature is
It is about 1000-1200 ° C. The thickness of the piezoelectric film 12 formed by the above method is within the range of 30 μm or less, especially 20 μm or less, in consideration of preventing cracks due to sintering and forming a uniform piezoelectric film 12. Preferably, the thickness is 10 μm or less.

Although the lower limit of the thickness of the piezoelectric film 12 is not particularly limited, it is possible to prevent a short circuit between the upper and lower electrodes sandwiching the piezoelectric film 12 and sufficiently deform the piezoelectric film 12 by applying an electric field. In order to be able to do so, its thickness is preferably 0.5 μm or more. This preferred range of the lower limit of the thickness is common to the piezoelectric films formed by the method described below.

Next, in the so-called sol-gel method, one or more kinds of organometallic compounds, such as alkoxides, containing each metal as the base of the piezoelectric material as described above are used. You. For example, in the case of PZT, one or two or more, preferably three kinds of organometallic compounds containing zirconium, titanium and lead are used.

In order to form a sol paste, the organometallic compound is hydrolyzed in a suitable solvent in the presence of a stabilizer or the like, and a water-soluble resin or the like as a thickener is added. What is necessary is just to mix. The mixing ratio of each component, the viscosity of the sol paste, and the like are appropriately set according to the method of applying the sol paste on the vibration plate 11, such as the screen printing method described above.

Examples of the water-soluble resin as a thickener include ethyl cellulose, hydroxypropyl cellulose and the like. As a method of applying the sol paste on the vibration plate 11, a printing method such as a screen printing method is also suitably adopted. The thickness of the coating film is appropriately set so that the piezoelectric film 12 after sintering has a predetermined thickness of 30 μm or less. In order to adjust the thickness of the coating film, there is also a method of adjusting the number of times of application.

In the sol paste, the condensation reaction of the metal hydroxide generated by the hydrolysis of the organometallic compound is progressing, and the coating film applied on the vibration plate 11 is subjected to the metal oxidation by the progress of the condensation reaction. As the material grows (polymerizes), the state changes from a fluid sol state to a non-flowable gel state. In order to promote this reaction, water generated by condensation may be sequentially removed.

The coating film in which the condensation has progressed to a gel state is dried, and calcined to remove organic substances as described above, and then calcined in an oxygen atmosphere, for example, to complete the condensation reaction and to form a piezoelectric material. The functioning composite metal oxide such as PZT described above is generated, and the piezoelectric film 12 is formed.
The firing temperature is about 400 to 900 ° C.

The piezoelectric film 1 formed by the above method
In consideration of forming a uniform piezoelectric film 12 while also preventing the occurrence of cracks, the thickness of
Within the range of μm or less, it is particularly preferably 20 μm or less, and more preferably 10 μm or less. As the next vapor phase growth method, for example, (a) the above-described piezoelectric material is heated and evaporated in an oxygen atmosphere,
Vacuum evaporation method of forming a thin film of piezoelectric material on it, or (b) heating and evaporating the above-mentioned piezoelectric material, or each metal or its individual oxide, etc. in oxygen plasma A reactive ion plating method in which a thin film of a piezoelectric material is formed on the vibration plate 11, or (c) a target made of the above piezoelectric material, or a metal as a source thereof, or an individual oxide of each metal. A reactive sputtering method in which a thin film of a piezoelectric material is formed on the vibration plate 11 by sputtering in contact with oxygen plasma.

The piezoelectric film 1 formed by the above method
In consideration of forming a uniform piezoelectric film 12 and preventing the occurrence of cracks, and also considering the productivity of the ink jet head, the thickness of 2 is preferably not more than 10 μm in the range of 30 μm or less. Preferably, it is 5 μm or less. In the present invention, the sol-gel method among the methods described above is preferably employed. This is (1) According to the sol-gel method,
As described above, it is possible to form the piezoelectric film 12 having a desired size and shape without using a chip which is easily broken or chipped and which is not easy to handle, and (2) complex and large-scale equipment such as a vacuum evaporation apparatus. It is not necessary and can be implemented by a simple device such as a screen printer. (3) The sintering temperature of the sol-gel method is 4
Since the sintering temperature is about 00 to 900 ° C., which is lower than the sintering temperature in the same sintering method, the substrate 10 and the diaphragm 1
As a material such as 1, it is not necessary to use a special material that has high heat resistance, such as ceramics, but has low workability and is easily broken or chipped. This is because there is an advantage that a metal material having excellent properties can be used.

As the substrate 10, the vibration plate 11, and the upper electrode 13 constituting the ink jet head 1 together with the above-mentioned piezoelectric film 12, the same ones as those in the related art can be used. That is, as described above, the plate body made of metal or ceramic is used as the substrate 10. The size and shape of the pressurizing chamber 10a and the nozzle 10b formed on the substrate 10 may be appropriately changed according to the specifications of the ink jet head.
In the case of an ink jet printer of about dpi, the size of the pressure chamber 10a is 1 to 3 mm in length and 0.05 to 1 m in width.
m, depth about 0.05 to 0.3 mm, adjacent pressure chamber 1
The width of the rib 10c between 0a is about 0.05 to 0.3 mm,
The diameter of the nozzle 10b is about 30 to 70 μm,
The gap b is formed to be about 0.07 to 1.3 mm.

In order to form the above parts on the substrate 10, etching using a so-called photolithographic method or the like is adopted in consideration of the dimensional accuracy and the like. Diaphragm 1
As 1, a thin plate having a thickness of about 0.01 to 0.2 mm, which is also made of metal or ceramic as described above, is used. As described above, the diaphragm 11 is made conductive so that at least its upper surface functions as a lower electrode. Specifically, for example, the entire diaphragm 11 is
At least the upper surface of the diaphragm 11 is formed by forming a metal material having excellent conductivity or by laminating a thin film or thin plate of a metal material having excellent conductivity on the surface of the diaphragm 11 made of metal or ceramic. Are made conductive.

Further, as the upper electrode 13, a thin film or a thin plate of a metal material having excellent conductivity is used.
In the case of the drawing, the upper electrode 13 is formed separately for each pressurizing chamber 10a, but the lower electrode formed on the surface of the diaphragm 11 is formed separately for each pressurizing chamber 10a. , The upper electrode 13 may be formed continuously to a size that covers all the pressurizing chambers 10a. In addition, both upper and lower electrodes are
It may be formed separately for each 0a. In the latter two cases, in order to insulate between the lower electrodes, non-conductive ceramics are used as the diaphragm 11 or an insulating layer is formed between the diaphragm 11 and the lower electrode. Good.

[0031]

The present invention will be described below based on examples and comparative examples. Example 1 <Preparation of Chip> The following metal oxide powders were mixed,
Sintered at 1100 ° C. for 10 hours.

(Ingredient) (parts by weight) Lead zirconate powder 52 Lead titanate powder 48 Next, this sintered body is polished to a length of 50 mm and a width of 40 m.
A sintered chip of piezoelectric material having a thickness of 30 μm and a thickness of 30 μm was prepared.

<Manufacture of inkjet head> FIG. 1 (a)
It has the shape shown in (b), 1.3 mm long and 0.65 m wide
m, a pressure chamber 10a having a depth of 200 μm is arranged in a total of 520 places of 20 rows × 26 digits, and its own dimension is 80 m in length.
A 30 μm-thick titanium-made diaphragm 11, which also serves as a lower electrode, was laminated on a stainless steel substrate having a width of 20 mm, a width of 20 mm, and a thickness of 0.2 mm, and was fixed with an adhesive.

Next, on the vibrating plate 11, the above-mentioned chip formed so as to cover all the pressure chambers on the substrate was bonded with an adhesive to form a piezoelectric film 12 having a thickness of 30 μm. Next, an upper electrode 13 made of gold was formed separately on each of the pressure chambers 10a on the piezoelectric film 12 by a screen printing method to manufacture an ink jet head.

Comparative Examples 1 and 2 Chips having the same vertical and horizontal dimensions and thicknesses of 100 μm (Comparative Example 1) and 50 μm (Comparative Example 2) were manufactured by polishing the same sintered body as described above. An ink jet head was manufactured in the same manner as in Example 1 except that the ink jet head was used. Conventional Example 1 The same sintered body as described above was polished to produce a vertical length of 1.3 m.
An ink jet head was manufactured in the same manner as in Example 1, except that 520 chips each having a size of m, a width of 0.65 mm, and a thickness of 50 μm were affixed one by one to a position immediately above each of the pressure chambers on the diaphragm. did.

Example 2 <Preparation of sintering paste> The following components were mixed with water to prepare a sintering paste. The mixing ratio of each component and water is such that the viscosity of the paste is 3000 to 100000c.
P (20 ° C.) was adjusted.

(Ingredient) (parts by weight) Lead zirconate powder 52 Lead titanate powder 48 Polyvinyl alcohol 5 <Production of inkjet head> A thin film made of zirconia ceramics having a thickness of 30 μm and having a lower electrode on its surface to serve as a lower electrode The paste was printed by screen printing on the vibrating plate on which was formed in such a size as to cover all the pressure chambers on the substrate, and then baked to remove organic substances. After repeating this process four times,
Sintering was performed at 0 ° C. for 10 hours to form a piezoelectric film having a thickness of 20 μm.

Next, the same gold upper electrode was formed separately on each of the pressure chambers in the same manner as in Example 1 on this piezoelectric film. Then, the laminated body of the diaphragm, the piezoelectric film, and the upper electrode is fixed on the same stainless steel substrate having the same dimensions and shape as that used in Example 1 with an adhesive to manufacture an ink jet head. did.

Example 3 <Preparation of sol paste for sol-gel method>
To 3 were individually prepared and mixed to obtain a solution 4. (Solution 1) Ti (O-nBu) ₄ acetylacetone 2-methoxyethanol (Solution 2) Zr (O-nBu) ₄ acetylacetone 2-methoxyethanol (Solution 3) Lead acetate trihydrate monoethanolamine 2-methoxyethanol The contents of the above components in the solution 4 were as follows.

(Component) (parts by weight) Ti (O-nBu) ₄ 12 Zr (O-nBu) ₄ 15 Lead acetate trihydrate 31 acetylacetone 5 2-methoxyethanol 29 monoethanolamine 5 4 was mixed with 25 parts by weight of ethylcellulose as a thickener to 100 parts by weight to prepare a sol paste. <Manufacture of inkjet head> On a diaphragm made of titanium having a thickness of 30 μm and having a platinum thin film serving as a lower electrode formed on the surface thereof, by a screen printing method,
The above-mentioned sol paste was printed in a size to cover all the pressure chambers on the substrate, dried, and baked temporarily. This step is 1
After repeating 0 times, the resultant was fired at 600 ° C. for 10 hours to form a 4 μm-thick piezoelectric film.

Next, the same gold upper electrode was formed separately on each of the pressure chambers in the same manner as in Example 1 on this piezoelectric film. Then, the laminated body of the diaphragm, the piezoelectric film, and the upper electrode is fixed on the same stainless steel substrate having the same dimensions and shape as that used in Example 1 with an adhesive to manufacture an ink jet head. did.

A DC electric field of 25 V was applied between the lower electrode of each ink jet head and the upper electrode corresponding to one pressurizing chamber in each of the above-mentioned examples, comparative examples, and conventional examples, and a piezoelectric film was formed. The amount of vertical deflection when the portion sandwiched between the two electrodes was bent was measured using a laser Doppler meter. Then, when the amount of deflection at the center position of the pressurizing chamber was 1, the deflection amount ratio A at a position d (μm) away from the center position was determined, and the deflection amount distribution was examined.

The results are shown in Table 1 and FIG.

[0044]

[Table 1]

From the results shown in the above tables and figures, all of the ink jet heads of Examples 1 to 3 in which the thickness of the piezoelectric film was 30 μm or less were compared with those of Comparative Examples 1 and 2 in which the thickness was more than 30 μm. The deflection of the film is large on the pressing chamber and small on the rib, and the amount of bending of the piezoelectric film on the rib is the same as that of the conventional example 1 in which the piezoelectric film on each pressing chamber is formed separately. It was found to be comparable or smaller. From this fact, in each of the ink jet heads of the embodiments, although the piezoelectric film is formed to have a size to cover all the pressurizing chambers on the substrate, the cross section is similar to that of the conventional example 1. It was confirmed that there was no possibility of causing a talk problem.

Examples 4 to 8 The thickness of the piezoelectric film was adjusted to 1 μm (Example 4), 3 μm (Example 5), and 5 μm (Example 6) by adjusting the number of times of application of the sol paste on the diaphragm. , 8 μm (Example 7) and 10 μm (Example 8), except that the inkjet head was manufactured in the same manner as in Example 3.

A DC electric field of 25 V is applied between the lower electrode of each of the ink jet heads of Examples 4 to 8 and the ink jet heads of Example 3 and Conventional Example 1 and the upper electrode corresponding to one pressurizing chamber. Then, when the portion sandwiched between the two electrodes of the piezoelectric film is bent, at the position d = 325 μm from the center position of the pressurizing chamber and the peripheral edge, that is, the center position of the pressurizing chamber,
The amount of vertical deflection was measured using a laser Doppler meter.

As a result, in Examples 4 to 8, the amount of deflection at the center position was as large as that of Example 3, and the amount of deflection at the peripheral portion was also almost the same as that of Example 3. This is smaller than the flexure amount of Example 1 (= 0.039 μm). Therefore, in each of Examples 4 to 8, although the piezoelectric film is formed to have a size to cover all the pressure chambers on the substrate. In the same manner as in Example 3 and Conventional Example 1, it was confirmed that there was no possibility of causing a problem of crosstalk.

[0049]

As described in detail above, according to the present invention,
Even though the piezoelectric film is formed in a size to cover two or more pressurized chambers on the substrate, there is no problem of crosstalk. This provides a specific operation and effect that an inkjet head that can be manufactured can be provided.

[Brief description of the drawings]

FIG. 1 is a view showing an example of an embodiment of an ink jet head according to the present invention, wherein FIG. 1 (a) is a cross-sectional view in which main parts are enlarged, and FIG. 1 (b) is an overall perspective view. .

FIG. 2 is a graph showing the distribution of the amount of deflection of a piezoelectric film in an example of the present invention, a comparative example, and a conventional example.

FIG. 3 is an enlarged sectional view of a conventional inkjet head.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Ink jet head 10 Substrate 10a Pressurization chamber 11 Vibration plate 12 Piezoelectric film

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Masayuki Fujishima 1-2-28 Tamazuki, Chuo-ku, Osaka-shi, Osaka Inside Mita Kogyo Co., Ltd. (72) Inventor Seiji Tsuji 1-2-1-2 Tamazo, Chuo-ku, Osaka-shi, Osaka No. 28 Inside Mita Kogyo Co., Ltd. (72) Inventor Masatake Hayashi 1-2-2 Tamatsukuri, Chuo-ku, Osaka, Osaka Prefecture Inside Mita Kogyo Co., Ltd. (72) Junko Yamada 1-2-2 Tamatsukuri, Chuo-ku, Osaka, Osaka No. 28 Inside Mita Kogyo Co., Ltd. (72) Kenichi Satake 1-2-2 Tamazuki, Chuo-ku, Osaka-shi, Osaka 28-28 Inside Mita Kogyo Co., Ltd. Koichi Baba 1-2-2 Takuma-zo, Chuo-ku, Osaka, Osaka No. 28 Mita Industrial Co., Ltd.

Claims (3)

[Claims] 1. An ink jet head having a substrate on which a plurality of pressurizing chambers are arranged, and a piezoelectric film formed on each pressurizing chamber via a vibration plate, wherein the piezoelectric film is provided at two or more locations. An ink jet head, which is formed continuously to have a size to cover the pressure chamber, and has a thickness of 30 μm or less. 2. The ink jet head according to claim 1, wherein the piezoelectric film is formed continuously to a size covering all the pressure chambers on the substrate. 3. The ink jet head according to claim 1, wherein the piezoelectric film is formed by applying a sol paste containing an organometallic compound serving as a base of the piezoelectric material on the vibration plate and firing the sol paste.