JPH11339647A - Manufacture of plasma display panel and panel grinding device used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plasma display panel having excellent operability by precisely grinding the barrier rib top part in working a plane by grinding the barrier rib top part for reliably installing the front face plate side and barrier ribs. SOLUTION: In this manufacturing method, barrier rib pattern gaps of a photosensitive film 414 is formed on a back face plate 406, and the barrier rib pattern gaps and the photosensitive film 414 surface are filled/covered with a barrier rib material 410. After drying this, the back face plate 406 is fixed in a plane state to the back face plate correcting jig 602 surface of a vacuum sucker 600 provided on a horizontal spindle surface grinding machine, and the barrier rib top part is automatically ground by a grinding wheel 502.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a plasma display panel, and more particularly to an improvement in a technique for grinding a partition wall of the plasma display panel.

[0002]

2. Description of the Related Art In recent years, demands for higher performance of televisions, such as high-quality images and large screens, have been increasing, and various displays including displays for high-definition televisions have been developed. Typical types of displays for which research is progressing include CRT displays, liquid crystal displays (LCD), and plasma display panels (P
DP) and the like.

[0003] Among them, PDP is a CRT even for a large screen.
It is excellent in that there are few problems such as increase in the depth dimension and weight as well as in that it can avoid the problem of viewing angle such as LCD. Recently, products with a large screen of 40 inches or more have been developed. Has reached. FIG. 10 is a partial assembly view showing a main configuration of the AC type color PDP. As shown in the figure, the AC type PDP mainly includes a front plate 401 and a back plate 406 arranged in parallel with each other.

The front plate 401 has a plurality of display electrodes 403 arranged in a stripe pattern on the surface of a front plate glass 402, on which a dielectric film 404 and a protective film 405 laminated on the dielectric film 404 are arranged. It is established. Back plate 406
A plurality of address electrodes 408 are arranged on the surface of the back plate glass 407 so as to be orthogonal to the display electrodes 403,
A partition base layer 409 is provided so as to cover the address electrodes 408, and a plurality of partitions 410 are provided thereon in parallel with the address electrodes 408 at intervals of the plurality of address electrodes 408. , The partition underlayer 4 between them
An RGB phosphor layer 411 is applied on the surface of the substrate 09.

The front plate 401 and the back plate 406 are separated from each other by the partition 4
10 is attached so that the top of 10 faces the protective layer 405,
The periphery is sealed, and a mixed rare gas composed of He, Xe, Ne, or the like is sealed as a discharge gas at a pressure of 300 to 500 Torr. Thereby, the partition 410 and the partition base layer 40 are formed.
9 and a space part partitioned by the protective film 405 are discharge cells 412. At the time of sealing, the tip tube 413
After degassing through, the discharge gas is sealed and then sealed. In a PDP having such a configuration,
During operation, in the discharge space 412 forming each pixel, the address electrode 408 and the display electrode 40 opposed thereto are disposed.
3, the phosphor layer 411 emits fluorescent light by ultraviolet light having a short wavelength (wavelength: about 147 nm) generated by the discharge between
An image is displayed.

Here, in order to ensure the display stability of each pixel, the volume of the discharge space 412 must be constant, and the discharge should not leak to the adjacent discharge space 412 (ie, to prevent crosstalk). It is necessary to. Therefore, the partition wall 410 having good uniformity in height is formed on the rear plate 4.
06 is required. Further, the front plate 40
It is desirable that the top of the partition wall facing the first side be formed in a planar shape in order to further improve the attachment between the front plate 401 and the back plate 406 and prevent crosstalk. As a known technique relating to this, for example, a method is known in which after forming the partition 410 by a photolithographic method, the top of the partition is ground with sandpaper or the like to obtain the height uniformity of the partition 410, and the partition top is planarized. (See JP-A-7-192626). This grinding method will be described below.

First, as shown in a partial sectional view of the back plate (FIG. 4), a photocurable (negative type) photosensitive film 414 is laminated on the partition base layer 409. This photosensitive film 414
Is exposed and light-cured while being masked into a partition pattern gap shape. And by developing,
As shown in FIG. 5, a partition pattern of the photosensitive film 414 is obtained. Next, as shown in FIG. 6, the partition wall material 410 is filled in the partition wall pattern gap, applied so as to completely cover the surface of the photosensitive film 414, and dried (for example, heated and dried at 160 ° C. for 45 minutes). When the partition wall member 410 is dried and the temperature is lowered, the surface of the partition wall member 410 is subsequently ground in a horizontal direction by hand using wet sandpaper until the surface of the photosensitive film 414 is exposed.

Next, as shown in FIG. 7, the photosensitive film 414 of the partition pattern is peeled and removed with a predetermined peeling solution or an alkaline aqueous solution (for example, a 3 to 5% sodium hydroxide aqueous solution).
Wash with water. Thereafter, when the partition wall material 410 is fired, the partition wall 41 with the partition wall top 4101 formed in a plane with a certain degree of accuracy.
0 is obtained.

[0009]

However, the glass plate used for the back plate glass may still have some distortion, and the address electrode 408, the partition base layer 409, and the partition 410 are formed as described above. In many cases, distortion occurs in the step of performing the process. If there is distortion, placing the back glass on a flat surface and pressing it from above will deflect, so in conventional manual grinding, the height of the partition wall should be uniform or the top of the partition wall should be accurately ground to a flat surface However, it was difficult to deny that the grinding accuracy was also different due to individual differences. Further, it is difficult to adjust the grinding work by hand, and as shown in FIG. 7, if the partition wall top 4101 is wavy or the force is excessively applied, the partition wall 410 may be damaged, and this may cause color mixing of the phosphor ink during the formation of the phosphor layer. Was the cause.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to form a partition having high uniformity in height and high planarity in a short time as compared with the prior art, and to provide good operability. An object of the present invention is to provide a method for manufacturing a plasma display panel capable of manufacturing a plasma display panel.

[0011]

In order to solve the above problems, the present invention provides a method in which a plurality of partitions are arranged on a first substrate, the tops of the partitions are ground, and the second substrate is mounted and fixed on the tops of the ground partitions. A method for manufacturing a plasma display panel, wherein a surface grinder is used in the step of grinding the partition wall top, and the first substrate is adhered and fixed to a grinding table of the surface grinder, and the partition wall top is ground. did. Alternatively, in the step of grinding the top of the partition wall of the first substrate, the first substrate is adhered and fixed on a grinding table, and the grinding wheel is supported at a fixed distance from the surface of the grinding table, while the grinding wheel of the grinding wheel is The top of the partition on the first substrate is ground by moving the grind table relatively and slidingly driving the grindstone grinding surface of the grindstone.
In this case, the method of performing the surface grinding can be set by setting the control unit of the surface grinding machine to select whether to finish by one grinding or to finish while grinding in several steps. Good.

[0012] By performing the grinding in this manner, it is possible to obtain an excellent uniformity of the partition wall height and the horizontal accuracy of the top of the partition wall as compared with the manual grinding, and to rely on the visual inspection so much. Thus, consistent grinding can be performed smoothly, and a plasma display panel can be manufactured more quickly than in the past. Also, the first
Form a photosensitive resin partition pattern gap on the substrate,
After filling and drying the partition wall material, the photosensitive resin is removed and a partition is formed using a photolithography method.Before removing the photosensitive resin, a step of grinding the top of the partition wall may be performed. it can. According to this method, the partition walls are supported by the adjacent photosensitive resin during the grinding process, and in addition to the above-described effects, the occurrence of defects can be suppressed and stable grinding can be performed.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the method for manufacturing a plasma display panel of the present invention will be described below. (Embodiment 1) The overall configuration of the PDP of the present embodiment is almost the same as that of the above-described PDP of FIG. Less than,
The method of manufacturing the PDP according to the present embodiment will be described with reference to the drawings. First, the front plate 401 is manufactured.

As shown in FIG. 10, one surface of a front glass plate 402 (thickness: 3.0 mm) made of soda lime glass is
A plurality of display electrodes 403 are formed at regular intervals. The display electrode 403 can be formed by printing a paste containing silver and a low-melting glass, firing the paste, and forming a silver film on the surface of the front plate glass 402. Next, a low-melting glass is applied over the formed display electrode 403 and baked, whereby a dielectric layer 404 (film thickness: 20 μm) is uniformly formed over the entire surface of the front plate glass 402.

Further, a protective layer 4 made of magnesium oxide is formed on the dielectric layer 404 by EB (electron beam) evaporation.
05 (film thickness 1.0 μm) is formed uniformly. Next, the back plate 406 is manufactured. As shown in FIG. 10, a plurality of address electrodes 408 made of silver are formed at regular intervals on one surface of a back plate glass 407 (thickness: 3.0 mm) made of soda lime glass. The address electrode 408 can be formed by preparing a paste containing, for example, silver, applying the paste by screen printing, and then firing the paste. Further, similarly to the display electrode 403, it can be formed by a sputtering method.

Subsequently, a low-melting-point glass is applied while covering the address electrode 408 formed above, and baked to form a partition base layer 409 over the surface of the back plate glass 407.
(Film thickness 20 μm) is formed uniformly. Next, a partition wall 410 is formed. In the present embodiment, the fine cell structure P
It was decided to use a photolithography method suitable for producing DP.

As shown in FIG. 4, a 70 μm-thick photocurable (negative) photosensitive film 414 (for example, Tokyo Ohka Kogyo Co., Ltd.)
(Product number α-450T) is laminated in a light-shielded state, the film surface is masked with a light-shielding mask (not shown) having an opening of a partition pattern gap, and ultraviolet rays are irradiated at a predetermined exposure amount (for example, 25 mJ / cm ² ). I do. Since the thickness of the photosensitive film 414 corresponds to the height of the partition to be formed, a film having an appropriate thickness is actually used according to the height of the partition to be formed. As a result, as shown in the partial cross-sectional view of the back plate in FIG. 4, only the portion of the photosensitive film 414 irradiated with ultraviolet rays from the opening of the partition pattern gap of the light shielding mask is photo-cured. 0.5w after UV irradiation
The photosensitive film 414 is developed with a developing solution such as a t% aqueous solution of sodium carbonate, and the photo-decomposition component is washed away to form a gap of the partition pattern on the photosensitive film 414 as shown in FIG.

Next, as a partition wall material, a glass paste mainly composed of a mixture of a low-melting glass and a metal oxide such as alumina (for example, product number 310 manufactured by ESL Co., Ltd.)
0) is prepared. As shown in FIG. 6, this is filled in the gap of the partition pattern of the photosensitive film 414. In order to ensure the filling and to facilitate the subsequent grinding process, the gap material is filled in the gap. Apply over the entire surface of the photosensitive film 414 using a larger amount than necessary. Specifically, when the thickness of the photosensitive film is about 70 μm as in this embodiment, the height from the bottom of the partition pattern gap to the surface of the partition material is 100 to 2 μm.
The photosensitive film 414 is coated so as to have a thickness of about 00 μm so as to uniformly cover the partition wall material 410. However, in this method, since a relatively large amount of the partition material 410 is used, if the partition material 410 can be reliably filled in the gap, the coating of the photosensitive film 414 with the partition material 410 is partially or completely omitted. Cost can also be reduced.

When the application of the partition material 410 is completed, it is heated (at 160 ° C. for 45 minutes) and dried to some extent. Then, in this state, the process proceeds to the grinding of the partition wall material 410. In the present embodiment, at the time of the grinding, mechanical grinding is performed using a panel grinding device described below.

FIG. 1 is a partial perspective view of the panel grinding apparatus. The panel grinding apparatus has the same overall configuration as a horizontal axis type surface grinding machine known as a machine tool, and includes a main body (not shown) and a disk type grinding wheel 502 mounted on a main shaft 501 provided horizontally. A slide head 500 supported by the main body so as to be movable in the Z direction (vertical direction) in the figure, and disposed below the slide head 500 and movable along the XY plane (horizontal direction) in the figure A grinding table 800 supported by the main body in such a state, a driving mechanism for driving them, and a control unit (not shown) for automatically controlling these driving. The slide head 500 is provided with a drive mechanism (not shown) for driving the grinding wheel 502 to rotate. A known electromagnetic chuck 700 is arranged on the grinding table 800, and a vacuum suction device 600 for fixing the back plate 406 is installed on the electromagnetic chuck 700.

The movement of the slide head 500 and the grinding table in the X, Y, and Z axes can be performed either manually or automatically by the control unit by energizing a stepping motor having excellent braking performance.

In the electromagnetic chuck 700, separators are arranged at intervals of the arrangement of the electromagnetic coils on an upper part of a magnet case 701 of a rectangular parallelepiped container in which a plurality of electromagnetic coils (not shown) are arranged with the iron core in a vertical direction. Face plate 70
2 is mounted, and is directly fixed on the grinding table 800 with fixing screws 801. The electromagnetic coil is energized by manual operation or automatic operation, and the magnetic material (ie, the vacuum adsorber 600 in this case) on the face plate 702 is attracted and fixed to the surface of the face plate 702 by the magnetic force generated by the energization. You.

The vacuum suction device 600 has a flat suction plate (back plate correction jig 602) mounted on a deaeration case 601 which is a rectangular parallelepiped container. Back plate straightening jig 602
Is a plate body having substantially the same size as the back plate 406, and a suction groove 6022 is provided in a multiple annular shape over the entire surface thereof. Inside the groove, a degassing case 60 is provided at regular intervals.
1 is provided with a perforation 6021 communicating with the inside. On the other hand, an intake pipe 603 is connected to the degassing case 601, and the intake pipe 603 is connected to a vacuum pump (not shown). In FIG. 1, the suction groove 6022 is formed in a multiple ring shape, but the shape of the groove may be a stripe shape, a spiral shape, or the like, and may be provided over the entire surface of the back plate correction jig 602. .

According to the configuration of the vacuum suction device 600, when the back plate 406 is placed on the back plate correcting jig 602 and the vacuum pump is operated, the back plate 406 is instantaneously viewed from the back plate (FIG. 8). From this state, as shown in FIG. 9, it is fixed on the surface of the back plate jig 602 by vacuum suction without any gap. Therefore, even if the back plate 406 is warped, the back plate 406 can be extremely easily flattened along the surface of the back plate correcting jig 602. Here, the method of fixing the back plate 406 is not limited to the above-described method. For example, the vacuum suction device 600 may be directly fixed to the grinding table. Also,
In addition to the method using the vacuum adsorber 600, the back plate 406
(For example, back plate 40)
6 can be fixed on the grinding table 800 by a clamp to fix the back plate 406 in close contact.

The grinding wheel 502 has a predetermined thickness (for example, 25
mm) and generally used vitrified (alumina) grindstone or GC
Green (Green Carborundum; green silicon carbide) whetstones can also be used, but such whetstones are relatively soft and may cause some of the abrasive grains to fall off during dressing, resulting in scratches on the ground surface and missing partition walls. There is. For this reason, the grinding of the partition wall material 410 is performed using a diamond grindstone or C
A hard grindstone such as a BN (cubic boron nitride) grindstone is desirable.

In order to quickly remove the ground chips from the ground surface, it is desirable to use a grindstone whose abrasive grains are not very dense (that is, the number of pores into which the chips can enter is relatively large). For vitrified and GC grindstones, SDC # 300-400, diamond grindstone and CB
In the case of N grindstones, a slightly coarser grindstone seems appropriate. Hereinafter, a process of grinding a partition wall using the panel grinding device will be described, including a preparation operation of the panel grinding device.

First, a grinding wheel 502 according to a predetermined method is used.
Is attached to the tip of the main shaft 501 of the slide head 500 to perform truing (reshaping) and dressing (centering) of the grinding wheel 502. After the preparation of the grinding wheel 502 by dressing, the surface of the face plate 702 of the electromagnetic chuck 600 is ground to ensure the horizontal accuracy. Next, the vacuum suction device 600 is placed on the face plate 702, and the electromagnetic coil is excited to fix the vacuum suction device 600. Then, the surface of the back plate correction jig 602 is also subjected to surface grinding to ensure the horizontal accuracy of the front surface, that is, the reference surface on which the back plate 406 is placed. It is considered that the grinding of the face plate 702 and the back plate correcting jig 602 is sufficient only at the time of the first use. Further, the grinding wheel at this time is not limited to a diamond wheel or a CBN wheel, but may be an ordinary wheel.

Thereafter, the back plate 406 is placed on the back plate correction jig 602, and the vacuum pump is operated to operate the deaeration case 60.
The inside of 1 is evacuated, and the back plate 406 is fixed by suction to the surface of the back plate correction jig 602 as shown in FIG. By the suction fixing, even if the back plate 406 before fixing is bent as shown in FIG. 8, this is reliably corrected and held in a flat state. In this way, while maintaining the state in which the back plate 406 is fixed horizontally, the top of the partition on the back plate 406 and the photosensitive film 41 are driven while rotating the disk-type grindstone 502.
4 is ground. That is, the slide head 500 is adjusted to Z in accordance with the height of the partition wall set in advance.
The grinding table 800 in the X direction (vertical direction).
By moving along the Y plane, the grinding table 80
The surface portion of the material fixed to the 0 side is ground by the grinding wheel grinding surface of the disk type grinding wheel 502 sliding.

According to this method, the grinding is performed with the distance between the grinding surface of the grinding wheel 502 and the surface of the back plate correcting jig 602 (that is, the back surface of the back plate 406) accurately and constantly maintained. Therefore, the height from the back surface of the back plate 406 to the ground surface is always constant. Therefore, as shown in the partial cross-sectional view of the back plate of FIG. 2, the grinding surface of the grinding wheel 502 is ground so that the ground surface is parallel to the back plate 406, so that the height uniformity and the flatness of the flat top 4012 can be improved. As a result, a partition 410 having excellent properties is formed. In FIG. 2, for convenience of explanation, the diameter of the grinding wheel 502 is smaller than the actual diameter.

When the above-mentioned grinding is completed, the back plate 406
Is removed from the back plate correction jig 602, and then added to a 3 to 5% aqueous sodium hydroxide solution or a predetermined photosensitive film stripping solution (for example, stripping solution B manufactured by Tokyo Ohka Kogyo Co., Ltd.).
After immersion for 20 minutes, the photosensitive film 414 is removed. Thereafter, the substrate is sufficiently washed with water, dried and fired (for example, at 545 ° C.), whereby a rear plate 406 having a partition wall 410 formed thereon as shown in the partial cross-sectional view of the rear plate in FIG. 3 can be obtained.

Subsequently, the partition wall 410 and the partition wall base between the partition walls
The phosphor layer 411 is formed on the layer. As phosphor of each color
Is a red phosphor (Y) generally used in PDPs._x
Gd _1-x) BO₃: Eu³⁺, Green phosphor (Zn₂Si
O₄: Mn), blue phosphor (BaMgAl)₁₀O₁₇:
Eu²⁺) Is used. Vine to this phosphor
To prepare a phosphor ink,
Apply body paste by screen printing method and dry
Dry. And baked at about 500 ° C for 10 minutes, and after slow cooling
The phosphor layer 411 is obtained.

After forming the phosphor layer 411, the front panel 40
1 and the back plate 406 are laminated so that the partition wall 410 and the protective layer 405 face each other, and the periphery of both are heat-sealed (about 500 ° C.) with low-melting glass (sealing glass) and sealed.
Then, the discharge space is evacuated from a chip tube (not shown) provided on the back plate 406, and a rare gas is filled therein (filling pressure 5).
(00 Torr), the tip tube is sealed.

According to the above method, the AC type P
A DP can be made. In the present embodiment,
It has been found that when the back plate 406 has a size of 13 to 21 inches, it is desirable to replace the grinding wheel 502 with a grinding process of 15 or less. In addition, since the back plate with a fine structure is ground, a wet grinding method using a water-soluble grinding fluid should be adopted as much as possible in order to prevent the effects of shavings generated during the grinding process. desirable.

Further, in this embodiment, since the photosensitive film is removed after the top of the partition is ground and the partition is baked, the partition is supported by the photosensitive film between the partition patterns in the grinding process, so that it is relatively stable. There is an advantage that the grinding process is performed. However, the photosensitive film may be removed, and the partition walls may be baked and the top of the partition walls may be ground. However, in this case, it should be noted that if a partition material is applied on the photosensitive film, it is difficult to remove the film after exposure. In particular, when the grinding process is performed after removing the photosensitive film, the partition walls are more likely to be missing than in the case where the photosensitive film is present, so in order to prevent this, the grinding direction is made to coincide with the longitudinal direction of the partition walls. It is preferable to carry out.

Further, when the partition walls are formed by a method other than the photolithography method as described above (such as a screen printing method or a thermal spraying method), the grinding processing of this embodiment may be applied. In addition to the configuration shown in the present embodiment, for example, the vacuum adsorber 600 omits the perforation 6021 and installs a deaeration flow pipe (tube) directly in the groove on the surface of the back plate correction jig 602. By arranging a plurality of units, the degassing case 601 may be omitted. In this case, a polypropylene tube or the like having a diameter of about several millimeters is suitable for the deaeration flow pipe, and this is buried inside the jig 602 along the main surface direction of the back plate correction jig 602. , Back plate correction jig 60
2 and the like.

The multiple annular grooves 6022 provided on the back plate correcting jig 602 are not always necessary, and the perforations 6021 may be provided directly on the surface of the back plate correcting jig 602. Further, as the panel grinding device, the same type as the horizontal axis type surface grinding machine used in the present embodiment was used, but in addition to this, the same panel type as other types of grinding machines such as the vertical type surface grinding machine was used. A grinding device may be used. Further, in the present embodiment, the surface of the back plate correction jig 602 is a flat surface, but the surface is not necessarily flat, and even a gentle curved surface can be ground by scanning the slide head in parallel with the curved surface. The effect of.

[0037]

As is apparent from the above description, the present invention provides a plasma display in which a plurality of partitions are arranged on a first substrate, the top of the partitions is ground, and the second substrate is mounted and fixed on the ground top of the partitions. A method of manufacturing a panel, comprising: using a surface grinder in a step of grinding the top of the partition wall, and fixing the first substrate in close contact with a grinding table of the surface grinder to perform surface grinding of the top of the partition wall. The flat end of the partition facing the side can be flattened with high accuracy, and the uniformity of the height of the partition and the horizontal accuracy of the top of the partition can be obtained more quickly and reliably than before, and a good plasma display panel can be manufactured. It becomes possible.

[Brief description of the drawings]

FIG. 1 is a partial perspective view of a panel grinding device used in the present embodiment.

FIG. 2 is a partial cross-sectional view of a back plate showing a state of grinding the top of a partition wall in the present embodiment.

FIG. 3 is a partial cross-sectional view of a back plate immediately after completing a partition in the present embodiment.

FIG. 4 is a partial sectional view of a back plate to which a photosensitive film is adhered.

FIG. 5 is a partial sectional view of a back plate on which a partition pattern of a photosensitive film is formed.

FIG. 6 is a partial cross-sectional view of a back plate to which a partition material is applied.

FIG. 7 is a partial cross-sectional view of a conventional back plate in which the top of a partition wall is manually ground.

FIG. 8 is a front view of the rear plate showing a warp of the rear plate before being adsorbed to the vacuum adsorber.

FIG. 9 is a front view of the back plate showing the back plate sucked by the vacuum suction device.

FIG. 10 is a set diagram showing a main configuration of an AC type PDP.

[Explanation of symbols]

 401 Front plate 406 Back plate 407 Back plate glass 410 Partition (partition material) 411 Phosphor layer 414 Partition material

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Katsuyoshi Yamashita 1006 Kadoma Kadoma, Osaka Pref. Matsushita Electric Industrial Co., Ltd.

Claims (9)

[Claims] 1. A method for manufacturing a plasma display panel, comprising: arranging a plurality of partitions on a first substrate, grinding a top of the partitions, and mounting and fixing a second substrate on the ground tops of the partitions. A method for manufacturing a plasma display panel, wherein a surface grinder is used in a grinding step, and a top surface of a partition wall is ground by fixing a first substrate on a grinding table of the surface grinder. 2. A method for grinding a top of a partition wall of a first substrate on which a plurality of partition walls are provided, a second substrate facing a partition side of the first substrate, and attaching the first substrate and the second substrate. A method for manufacturing a plasma display panel, comprising: a step of grinding a top of a partition wall of the first substrate, wherein the first substrate is adhered and fixed on a grinding table, and the grinding wheel is supported at a fixed distance from the surface of the grinding table. A plasma display panel characterized in that a grinding wheel grinding surface of a grinding wheel is relatively moved with a grinding table, and a grinding wheel grinding surface of the grinding wheel is slidably driven to flatten a partition top on a first substrate. Manufacturing method. 3. The method of manufacturing a plasma display panel according to claim 1, further comprising, before the step of grinding the top of the partition wall, a preliminary grinding step of grinding the surface of the grinding table into a planar shape. . 4. The step of grinding the top of the partition wall comprises the steps of:
The plasma display according to any one of claims 1 to 3, wherein the substrate is placed on the surface of the grinding table, and then is fixed to the surface of the grinding table by vacuum suction. Panel manufacturing method. 5. In the step of grinding the top of the partition wall, at least one of a diamond grindstone, a cubic boron nitride grindstone, a green silicon carbide grindstone, and an alumina grindstone is used as a grinding grindstone. A method for manufacturing a plasma display panel according to claim 1. 6. The partition formed in a plurality of rows on the first substrate is formed by a photolithography method in which a partition pattern gap of a photosensitive resin is formed on the first substrate and the partition material is filled in the gap. A method for manufacturing a plasma display panel according to claim 1. 7. The method for manufacturing a plasma display panel according to claim 6, wherein a partition wall material is filled in the partition wall pattern gap, and the photosensitive resin surface is covered with the partition wall member. 8. A grinding tool for performing grinding while slidingly driving the surface to be ground, a grinding table for mounting a substrate on which a plurality of partition walls are arranged, and closely fixing the substrate on the grinding table. Fixing means, a grinding tool support means for supporting the grinding tool at a predetermined distance from the grinding table, and a grinding tool and a grinding table relatively moved while supporting the grinding means with the grinding tool support means. A panel grinding apparatus comprising: a moving unit. 9. The fixing means comprises a passage opening to the mounting surface of the grinding table, and a deaerator connected to the passage, and mounting and removing the substrate on the mounting surface of the grinding table. 9. The panel grinding apparatus according to claim 8, wherein the substrate is adhered and fixed to the mounting surface by operating the vacuum device.