JPH1130631A - Probe card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the spacing of probes high in density by extending probe tip parts from a plurality of probe joint end parts to bring them into contact with an electrode pad, and providing a flexible insulating support member along a plurality of probes to fix the probes. SOLUTION: A plurality of probe joint end parts 32 support a plurality of probes 25 probing an electrode pad 27 on the surface of a semiconductor wafer 29 and sending and receiving electric signals, and these probe joint end parts 32 are connected to an electric signal input terminal provided at an upper support plate. A flexible insulating support member 33 is provided along the probes 25 so as to fix the probes 25. The probe joint end parts 32 are inserted or held in connecting holes of a probe card and electrically connected to printed circuit board. Probe tip parts 28 are fixed to the support member 33 so as to be able to probe the electrode of a movable mold, so that guide holes of a lower support plate can be omitted. With this structure, the layout pitch of the probe tip parts 28 can be made high in density.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card for conducting an electrical test of an individual semiconductor device, an integrated circuit, or the like by using a probe on an electrode pad formed on a surface of a semiconductor wafer. In particular, it relates to a probe card that moves vertically with respect to a semiconductor wafer.

[0002]

2. Description of the Related Art Conventionally, an increase in the number of electrode pads and a reduction in an electrode pad interval of a semiconductor device have been promoted, and a semiconductor device has been tested using a vertically movable probe card for a probe.

FIG. 4 is a sectional view of a conventional probe card 5. In the figure, a probe card 5 includes a movable mold 10 that moves up and down, an upper support plate 12 provided adjacent to the movable mold 10, a lower support plate 16 provided side by side with the upper support plate 12 and a spacer 14, These movable molds 1
0, upper and lower support plates 12, 16 and a connecting portion 18 for connecting the spacer 14, the upper support plate 12 fixes a probe 25 for a probe with a coupling hole 24, and the lower support plate 26 detects a probe with a guide hole 26. The printed board 20 inserted in the board insertion section 22 by slidingly supporting the probe tip 28 of the probe 25
Supplied an electric signal including a power supply through the coupling hole 24.

[0004]

However, the spacing between the probe probes to be integrated in the vertically moving probe card is formed in the lower support plate 16 which supports the tip portion 28 of the probe probe. Since it depends on the dimensional accuracy of the guide hole 26, it is difficult to narrow the probe interval even if the diameter of the probe 25 is reduced.

When the vertically moving probe 25 probes the surface of the semiconductor wafer, the probe 25 bends,
There is a disadvantage that an accident of contact with the adjacent probe 25 occurs and the reliability of the probe card is impaired.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned drawbacks, and an object of the present invention is to provide an insulating support for holding a plurality of probe probes collectively, thereby reducing the arrangement intervals of the probe probes. It is in.

Another object of the present invention is to fix a plurality of probe probes so that they do not short-circuit when moving up and down.

[0008]

According to the present invention, in order to solve the above-mentioned problems, a plurality of probe probes which probe an electrode pad on the surface of a semiconductor wafer and transmit and receive an electric signal are supported and supported on an upper portion. A probe connected to an electric signal input / output terminal provided on a plate and having a plurality of probe joint ends for transmitting and receiving electric signals, and a probe tip extending from the probe joint end and in contact with an electrode pad on a semiconductor wafer surface And a flexible insulating support member arranged side by side along the probe and fixing the plurality of probe.

[0009]

In the present invention having the above structure, the probe probe is fixed to the insulating support member, so that the interval between the probes can be reduced.

When the probe moves up and down to probe the surface of the semiconductor wafer, the probe is fixed to the insulating support member, so that the deformation direction of the probe is constant, so that the probe comes into contact with an adjacent probe. Nothing.

[0011]

Preferred embodiments of the present invention will be described below with reference to the drawings. Although this device is not particularly limited, it is configured for a probe test device of a semiconductor device.

FIG. 1 is a sectional view of a probe unit 30 for a probe according to an embodiment of the present invention. In the figure, a probe unit 30 supports a plurality of probe probes 25 that probe electrode pads 27 on the surface of a semiconductor wafer 29 and transmit and receive electrical signals, and an electrical signal provided on an upper support plate 12. A plurality of probe connection ends 32 connected to the input / output terminals for transmitting and receiving electric signals; a probe for probe 25 having a probe end portion 28 that contacts the electrode pad 27 on the surface of the semiconductor wafer 29 from the probe connection end 32 , A flexible and insulating support member 33 for fixing the plurality of probe probes 25, which are arranged side by side along the probe probes 25, And is electrically connected to the printed circuit board 20. Since the probe tip 28 is fixed to the support member 33, the probe pad 28 can probe the electrode pad 27 as the movable mold 10 moves up and down, and the guide hole 26 provided in the lower support plate 16 can be omitted. it can. In addition, since each probe 25 can bend together with the support member 33 while probing the electrode pad 27, the probes 25 are displaced in the same direction, and an accident of contact with each other can be prevented. The supporting member 33 of the present embodiment may be a resin such as a plastic plate or an elastic rubber plate as long as it is flexible and insulating. Further, the probe 25 can be fixed by applying an adhesive between the probe 25 and the support member 33. The probe 25 is disposed on the support member 33, and the polyimide film is coated on the entire surface. After coating, curing treatment can be performed. That is, any other means for fixing the probe 25 may be used between the support member 33 and the surface protection film.
May be configured to be sandwiched. Further, although the illustrated probe for probe 25 is arranged on the front surface of the support member 33, it can be arranged on the back surface of the support member 33. Can be transmitted to the support member 33 side, so that the needle probe 25 can be effectively prevented from detaching from the support member 33 even if the adhesive force between the probe 25 and the support member 33 is small. .

According to the above embodiment, if the probe tip 28 is fixed to the support member 33, a probe-in test in which the surface protection film of the semiconductor wafer 29 is pierced and comes into contact with the internal conductive layer can be performed. At the time of this probe-in test, one or two probe probes 25 can be appropriately formed.

In the above embodiment, the plate-like support member 33 is used.
However, a mesh-like mesh supporting member 36 can be used as in the probe unit 34 for a probe shown in FIG. The mesh support member 36 is formed of a net such as Kevlar fiber or Dacron fiber having insulation and flexibility, and a plurality of probe probes 25 can be arranged on the surface thereof. Since the guide hole 26 is unnecessary as in the above-described embodiment, the arrangement interval of the probe probes 25 can be made narrower than before, and since the probe probes 25 are fixed to the mesh support member 36, In addition, the positioning accuracy of the probe tip 28 is high, and even if the arrangement density of the electrode pads 27 is high, it can sufficiently cope with the problem. In addition, the probe joint end 3
Numerals 2 are provided so as to correspond to the coupling holes 24 provided in the upper support plate 12, and can be fitted into the coupling holes 24 to transmit and receive electric signals to and from the printed circuit board 20 when incorporated in the probe card 5. Further, the probe joining end 32 may be formed integrally with the probe 25, and the arrangement interval may be the same as or wider than the probe tip 28. In other words, the probe connection end 32 is provided with a sufficient margin while the probe connection end 32 is provided with a large space between the probe connection ends 32 and the probe distal end 28 is provided with a narrow space. Can be inserted.

In the above embodiment, the mesh-like mesh support member 36 is used, but the probe unit 3 for a probe shown in FIG.
As shown in FIG. 8, a skeletal support frame 40 can be used. The support frame 40 is made of synthetic resin and has insulation and flexibility. A plurality of probe probes 25 can be disposed on the surface thereof. Since the guide holes 26 are unnecessary, the interval between the probe probes 25 can be reduced. It can be narrower than before. Further, since the probe 25 is fixed to the support frame 40, the positioning accuracy of the probe tip 28 can be increased. Further, the probe for a probe 25
By insulating coating, it is possible to prevent a contact accident between the bent probe probes beforehand.

Although the embodiment of the present invention has been described above with respect to a probe card using a probe unit in which four probe probes 25 are arranged in parallel, the present invention relates to the above-described four parallel probe units. Needless to say, the present invention can be applied to five or more probe units other than the above.
Further, in addition to the configuration in which the entire probe 25 is fixed to the support member 33, the probe moving distance is corrected by independently bending each probe 25 without fixing the vicinity of the probe tip 28. You can also. Further, a plurality of probe units can be mounted on the upper support plate 12, and in this case, maintenance of the probe card can be exchanged for each probe unit. Of course.

[0017]

As described above, according to the probe card of the present invention, the guide hole of the lower support plate can be dispensed with, and the arrangement pitch of the probe tip can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of a probe card according to an embodiment of the present invention.

FIG. 2 is a perspective view of a probe card according to another embodiment of the present invention.

FIG. 3 is a perspective view of a probe card according to another embodiment of the present invention.

FIG. 4 is a sectional view of a conventional probe card.

[Explanation of symbols]

5 probe card, 12 upper support plate, 25 probe for probe, 27 electrode pad, 28 probe tip,
29 Semiconductor wafer, 32 Probe bonding end, 33
Support members.

Claims (1)

[Claims] 1. A probe card for supporting a plurality of probe probes for transmitting and receiving an electric signal by probing an electrode pad on a surface of a semiconductor wafer, wherein the probe card is connected to an electric signal input / output terminal provided on an upper support plate. A plurality of probe joining ends for transmitting and receiving signals, a probe for a probe having a probe tip extending from the probe joining end and in contact with an electrode pad on the surface of the semiconductor wafer, and juxtaposed along the probe for a probe And a flexible insulating support member for fixing the plurality of probe probes.