JPH11298189A - Preparatory plan changing method and equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable setting a preparatory plan without arranging information reading equipment in a pre-stage, when the kind of an object is changed, by changing a preparatory plan of processing a second object to be treated next, on the basis of a read information of kind, after a first object which is carried-in last is processed. SOLUTION: Feature parameters (reference) of inspecting regions of the respective components 21S on a reference board 20S and a board 20T to be inspected are imaged, and the imaged data are processed. The processed data are compared with the feature parameters (inspection) of inspection regions of the respective components 21S, and whether the respective components 21S are rightly mounted is judged on the basis of judging reference. An XY table part 23 moves and positions a stage 26 retaining boards 20T, 20S in the X direction and the Y direction by the driving of an X axis motor and a Y axis motor which are controlled by controlling signals given from an XY table controller 31 of processing equipment 27. A board kind discriminating part 42 outputs a board kind information from an image sensing part 25 installed on the board 20T to be inspected. Board kind is judged by pattern matching with reference image data.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a setup change method and apparatus for processing in an inspection apparatus, a mounting apparatus, a printing apparatus, various manufacturing apparatuses, and the like.

[0002]

2. Description of the Related Art An apparatus for inspecting the mounting state of components on a printed wiring board will be described as an example. Inspection of the mounting of electronic components on a printed wiring board (hereinafter simply referred to as “substrate”) includes inspection of the presence and posture of electronic components before soldering, and inspection of soldering quality after soldering. It is. Here, all states where components are present on the board before and after soldering are referred to as “mounting”. Therefore, the components on the board are mounted components. The presence or absence and posture of electronic components before soldering and the quality of soldering after soldering are collectively referred to as the quality of the mounted state (or the quality of mounting).

[0003] In the inspection of the mounting quality by visual inspection, occurrence of an inspection error is inevitable, and the inspection result tends to vary depending on the inspector. In addition, the inspection processing capacity is limited.

Therefore, an inspection apparatus has been put to practical use for automatically inspecting the mounting quality of a board on which a number of components are mounted by using an image processing technique. This inspection device has a teaching mode and an inspection mode. In the teaching mode, inspection data (information) for mounting state inspection is set.
In the inspection mode, an actual board inspection is performed with reference to the inspection data.

Inspection data (information) set in the teaching mode is set for each type of substrate to be inspected. The inspection data includes information on an image required for an automatic inspection and its criterion, in addition to the size of the substrate to be inspected and the position and type of components mounted on the substrate to be inspected.
This image and the information about its criteria include the land on the board to which each part is to be soldered, information about the part, information about the window set as the inspection area (shape, size, etc.), the soldering state on the land There are information on characteristic parameters (reference parameters) representing the parameters and the like, and judgment criteria for judging the quality of the characteristic parameters and the like.

FIG. 5 shows a schematic configuration of a conventional inspection apparatus.

When inspecting various types of substrates to be inspected, generally, the same type of substrates are inspected collectively. After the inspection of one type of substrate to be inspected is completed, the inspection proceeds to another type of substrate to be inspected. In FIG. 5, a plurality of substrates to be inspected 73 and 74 are conveyed at regular intervals by a conveyor 75. It is assumed that the types of the substrates to be inspected 73 and 74 are different. After the inspection of all the substrates to be inspected 73 is completed, the inspection of the substrate to be inspected 74 is started.

A board type discriminating / reading device 71 and a mounted component inspection device 72 are arranged in the middle of the conveying path of the conveyor 55. The boards 73 and 74 to be inspected pass through the board type discrimination reading device 71 and the mounted component inspection device 72 in this order. Of a plurality of component mounting boards of the same type, information (for example, barcode information) 73a, 74a for specifying the type of the board is preliminarily stored in the component mounting board to be conveyed at the head (first inspected). The board type identification information is read by the board type identification reading device 71 prior to the inspection by the mounted component inspection device 72. The read board type determination information is sent from the board type determination reading device 71 to the mounted component inspection device 72. Based on the board type identification information, the mounted component inspection apparatus 72 performs preparations for the inspection of the component mounted board to be inspected next (for example, adjustment of the guide width according to the board type, specification of the determination criteria). . This is called setup change.

As described above, the conventional inspection device, mounting device,
In order to automatically and continuously process a large number of types of substrates and printed materials (collectively, target objects) in printing devices, various manufacturing devices, etc. (collectively, processing devices), the following must be performed in advance. It is necessary to determine the type of the object to be processed in advance. Since the information for determining the object is provided in the first object to be carried into the processing device among a large number of objects to be carried in in series, a reading device for the information is provided at the front stage of the processing device. Had to be placed.

[0010]

DISCLOSURE OF THE INVENTION The present invention relates to a processing apparatus for processing a plurality of types of objects, when the type of the object changes,
It is an object of the present invention to provide a method and an apparatus capable of performing a setup change without disposing an information reading device or the like in a preceding stage.

According to a first aspect of the present invention, there is provided a setup change method for sequentially processing objects to be sequentially carried into a processing position, and performing processing on a new type of object when the type of the object changes. This is a method of performing setup change. When there are a plurality of first objects of the same type to be processed sequentially,
Next, type information about a second object of another type to be processed is provided in one of the first objects, and the first object provided with this type information is stored in the first object. At the end of the object, the object is loaded into the processing position, the type information provided for the first object that is finally loaded at the processing position is read, and the first type loaded at the last is read based on the read type information.
After the processing for the object, the setup change for the processing for the second object to be processed next is performed.

A setup change device according to a first aspect of the present invention is used for realizing the above-described setup change method, and stores storage information for setting up information corresponding to the type of an object, and is carried into the processing position. Means for reading the type information provided for the object provided, and, based on the read type information, after processing the object provided with the type information, based on the information relating to the setup stored in the storage means. There is provided a means for performing setup change for processing of an object to be processed next.

A setup change method and apparatus according to the present invention include an inspection apparatus for inspecting the mounting state of components on a board, a mounting apparatus for mounting components on a board, a printing apparatus for printing on an object, and a manufacturing apparatus for industrial products. Etc. can be applied.

According to the present invention, for a plurality of objects (first objects) to be sequentially processed, another object to be processed next (the second object to be processed next) 2) is provided. Therefore, the type information can be read by the processing device, and preparation for processing the next type of object (preparation for setup change) can be performed. There is no need to arrange a reading device in front of the processing device for reading the type information, and a reading device (including an imaging device) provided in the processing device
Can be utilized. After the processing of the first object that has been carried in last, the setup is changed. When sequentially processing a plurality of types of objects, the setup change can be performed unmannedly and smoothly.

If there is only one first object, the object may be provided with type information on another type of second object to be processed next.

However, if there is no change in the setup even when the type of the object changes, the setup change is not necessarily required (this case is also included in "performing the setup change"). The process for the second object is performed in the same setup.

The information relating to the setup stored in the storage means may be stored in the form of a table or may be incorporated in a program.

The setup change method according to the second aspect of the present invention sequentially processes the processing objects which are sequentially carried into the processing position, and performs processing for a new type of object when the type of the object changes. This is a method of performing setup change. After processing for all objects of the same type is completed,
Next, the dedicated setup change instruction provided with the type information of the object to be processed is carried into the processing position, the type information provided in the setup change instruction dedicated carried into the processing position is read, and the read type is read. On the basis of the information, a setup change for the processing of the object of the type to be processed next is performed.

The setup change device according to the second invention is suitably used for realizing the above-described setup change method, and includes storage means for storing setup-related information corresponding to the type of an object, and the processing position. Means for reading the type information provided in the dedicated setup change instruction carried into the apparatus, and, based on the read type information and the information on the setup stored in the storage means, information on the type of object to be processed next. It is provided with means for performing setup change for processing.

Prior to the processing of the object to be processed next, a dedicated changeover instruction is carried into the processing apparatus, and the type information provided in the dedicated changeover instruction is read to perform the changeover. Also in the second invention, it is not necessary to provide a type information reading device in the preceding stage of the processing device, and it is possible to read the type information by utilizing the reading device provided in the processing device and to proceed to setup change. is there.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to an apparatus for inspecting the mounting status of components mounted on a substrate will be described below.

FIG. 1 shows the configuration of a mounted component inspection apparatus.

The inspection apparatus captures an image of the reference substrate 20S and processes the imaged data to obtain a characteristic parameter (reference parameter) of an inspection area of each component 21S on the reference substrate 20S and a substrate 20T to be inspected. Characteristic parameters (inspection parameters) of the inspection area of each component 21T on the inspection target substrate 20T obtained by imaging and processing the imaging data.
And each of these parts 21T based on the criterion.
This is for determining whether or not is mounted correctly, and includes an XY table section 23, a light projecting section 24, an imaging section 25, and a processing device 27.

The XY table section 23 includes an X-axis motor and a Y-axis motor (both not shown) controlled by a control signal given from an XY table controller 31 of the processing device 27. Substrate 20
The stage 26 supporting S or 20T is moved and positioned in the X and Y directions.

The substrate supported by the XY table 23
20S and 20T are illuminated by the light emitting unit 24 and the imaging unit
Imaged by 25.

The light projecting unit 24 generates a red light, a green light, and a blue light based on a control signal from the imaging controller 29 of the processing device 27, and emits a ring-shaped light for irradiating the inspection object with different incident angles. Has a body. The substrate 20S or 20T is illuminated by the three colors of light emitted from these light emitters. The reflected light image is converted by the imaging unit 25 into an electric signal.

The imaging unit 25 includes a color television camera located above the light projecting unit 24, and includes a substrate 20S or 20S.
The reflected light from T is converted into three primary color signals R, G, and B by the color television camera and processed by the processing device 27.
Supplied to The imaging unit 25 has an auto focus function, a zoom function, and the like.

The processing device 27 includes an image input unit 28, an imaging controller 29, an image processing unit 30, an XY table controller
31, inspection area extraction unit 32, determination unit 33, teaching table 34, board type determination unit 42, memory 35, keyboard 36, C
It comprises an RT display device 37, a printer 38, a communication device 39, a floppy disk device 40, and a control unit 41. Some or all of these units 28 to 34, 41, 42, etc. are realized by a programmed computer. In FIG. 1, functions performed by the computer are represented as respective units.

When the color signals R, G, and B are supplied from the image pickup unit 25, the image input unit 28 converts the color signals into digital signals and performs other processing to convert the digital signals into image data, and converts the signals into image data.
Give to. The memory 35 includes a RAM and is used as a work area of the control unit 41.

The inspection area extracting section 32 cuts out an image in a range where the inspection target (parts or the like) exists from the image data given via the control section 41, and further extracts the inspection area (image data in the window) from the cut out image. Is extracted.

The image processing section 30 performs image processing on the image data extracted by the inspection area extraction section 32 to create feature parameters (reference parameters and inspection parameters), and then determines these parameters by the determination section 33, the teaching table 34 or the control section. 41
To supply. The teaching table 34 stores various data set in the teaching mode, characteristic parameters obtained by the image processing unit 30, and other inspection data.

In the teaching mode or the inspection mode, the judging section 33 compares the reference parameters read from the teaching table 34 with the inspection parameters transferred from the image processing section 30 and, based on the judgment criteria, determines the target parameters. The quality of the mounting state (soldering state or the like) of the inspection board 20T is determined, and the determination result is output to the control unit 41.

The board type discriminating section 42 is outputted from the image pickup section 25 which picks up the board type information provided on the board 20T to be inspected,
The pattern matching is performed between the board type information image data provided through the image input unit 28 and the control unit 41 for specifying the type of the board and the reference image data prepared in advance. The type (substrate type) of the inspection substrate 20T is determined, and the details will be described later.

The imaging controller 29 includes a control unit 41 and a light emitting unit.
It has an interface for connecting the imaging unit 25 and the imaging unit 25, and adjusts the amount of light of the light emitter of the light emitting unit 24 and controls the color television camera of the imaging unit 25 according to a command from the control unit 41. .

The XY table controller 31 includes a control unit 41
And an interface for connecting the XY table section 23 to the XY table section 23. The XY table section 23 is controlled based on the output of the control section 41 to perform positioning of the substrate 20S or 20T thereon.

The CRT display device 37 includes a cathode ray tube (CRT), and when image data, a determination result, key input data, and the like are supplied from the control unit 41, these are displayed on a screen.
When the inspection result and the like are supplied from the control unit 41, the printer 38 prints out the inspection result and the like in a predetermined format. The keyboard 36 has various keys necessary for inputting operation information, data relating to the reference substrate 20S and the substrate to be inspected 20T, and the like, information and data input from the keyboard 36 are supplied to the control unit 41. . The floppy disk device 40 stores inspection result data and the like provided from the control unit 41 on a floppy disk. Communication device
Reference numeral 39 performs data communication between the inspection device and a server or information analysis terminal device connected online to the inspection device.

The control unit 41 includes a CPU, controls the entire operation in the teaching mode and the entire operation in the inspection mode through the control of each unit described above, and exchanges data with the server and the terminal device through the communication device 39. I do.

FIG. 2 shows an example of the teaching table. The teaching table is the board name (board I
D). Teaching of each board name
The table contains the board size, data specifying the components mounted on the board (component data; component type, group, variation, etc.), and the mounting position of the component on the board (coordinates based on a predetermined point on the board). Data), taught inspection data (data relating to the above-described window, reference parameters, determination criteria, etc.) and the like are stored. This teaching table is created by the operation in the teaching mode.

FIG. 3 shows an outline of the procedure of the inspection processing in the inspection mode of the inspection apparatus.

A substrate type information area is provided on the inspection target substrate 20T. This area is the XY table of the inspection device
The front end, the rear end, and the like are determined in advance based on the posture of the inspection target substrate 20T loaded on the reference numeral 23. If there are a plurality of substrates of the same type to be sequentially inspected, the substrate type information is displayed in the substrate type information area only for the last one of the inspected substrates that is carried into the inspection apparatus. You. The board type information specifies the type of board to be inspected by the inspection apparatus next, and is represented by, for example, a bar code. A sticker on which a barcode is printed is attached to the board type information area. If there is only one type of substrate to be inspected, substrate type information is displayed on that substrate.

The operator inputs the name of the substrate to be inspected from the keyboard 36 (step 51), and inputs the start of inspection from the keyboard 36 (step 52).

The substrate to be inspected 20T conveyed by the conveyor is automatically or automatically loaded by the operator onto the XY table 23 and positioned (steps 53 and 54).

The substrate type information area of the substrate to be inspected 20T is an imaging unit.
The XY table 23 is controlled so as to reach the 25 imaging positions. A region including the substrate type information region is imaged by the imaging unit 25, and an image of the substrate type information region is extracted by the region extraction unit 32 from the image data obtained by the imaging.

The image of the extracted board type information area or the pattern or parameter extracted from the image is stored in the board type determining section 42 in the form of reference image data for board type determination stored in the board type determining section 42 in advance. (Or a reference pattern or parameter) (e.g., pattern matched). By this comparison processing, it is determined whether or not there is substrate type information in the substrate type information area on the substrate to be inspected, and if so, what type of substrate is indicated by the substrate type information. When it is determined that there is no substrate type information, the substrate is not the last substrate of the same type of inspected substrate, and when it is determined that the substrate is present, it is the last substrate (step 55).

If it is not the last substrate, the process proceeds to the inspection of the substrate to be inspected (step 62).

In the board inspection, an area to be inspected is extracted from an image captured by the imaging section 25 by the area extracting section 32, and feature parameters (inspection parameters) are created by the image processing section 30 based on the extracted image data. Is done. The created inspection parameters are compared with reference parameters stored in the teaching table 34, and the quality of the mounted component is determined according to the determination criteria (step 63). The above processing is repeated for all the mounted components 21T on the board to be inspected 20T.

As a result of the inspection, for a board including a component having a defective mounting, the inspection result and the image of the defective portion are displayed on the CRT.
It is displayed on the display device 37 (step 64). The data indicating the inspection result includes information such as the coordinates (position), the component name, and the details of the defective component (eg, defective solder, no component), and the measurement data information (fillet length, etc.) of the defective component. The inspection result is output to the outside. For example, it is stored by the floppy disk device 40 or transferred to the server by the communication device 39. Part or all of the displayed content is printed by the printer 38 as necessary.

Thereafter, the inspection target substrate 20T is moved to the XY table 23.
It is carried out from above (step 65).

The next substrate to be inspected 20T is similarly loaded onto the XY table 23 (steps 53 and 54), and it is determined whether it is the last substrate (step 55).

If it is determined that there is substrate type information in the substrate type information area of the inspected substrate 20T (YES in step 55), the type of the inspected substrate to be carried in next is specified based on the substrate type information. (Step 56). Data indicating the specified substrate type is stored in the memory.

The inspection of the board to be inspected 20T already loaded on the XY table 23 is performed for each component as described above (step 57), and for those containing defective components, their display and output are performed. (Step 59). The inspected substrate is unloaded from the XY table 23 (step 6).
0).

After that, based on the data indicating the type of the next substrate stored beforehand, a setup change is performed in the inspection apparatus for a new type of substrate to be inspected which will be carried next. This setup change is performed based on data prepared in advance for each board type (step 6).
1). For example, based on the board size stored in the teaching table 34,
The guide width on the XY table 23 is adjusted so as to match the substrate size of T. In addition, inspection data for a new type of board is pointed out. The pointed inspection data is used for the inspection of the substrate to be carried in next. Thereafter, when a new type of substrate is carried into the XY table (steps 53 and 54), the inspection of the substrate is similarly performed.

By storing the substrate type information of the substrate to be inspected next on the last substrate of the same type of substrate to be inspected, the inspection of one type of substrate and the The transition to the inspection can be performed smoothly. In addition, since the board type information is imaged by utilizing the imaging unit 25 provided in the mounted component inspection apparatus, the board type information for determining the type of the board or the board type information is provided before the mounted component inspection apparatus. There is no need to provide a device for reading. The entire mounted component inspection apparatus (system) can be reduced in size.

The reading of the board type information and the determination processing thereof may be performed after the determination of the quality of all the mounted components on the board to be inspected 20T (the processing of steps 62 and 57) is completed.

The board type information does not necessarily need to be provided on the board to be inspected.
A dummy substrate). Substrate type information is displayed at a specific position on the dummy substrate. FIG. 4 shows an inspection procedure in an inspection mode of the inspection apparatus when a dummy substrate is used. The same processes as those in FIG. 3 are denoted by the same reference numerals, and redundant description will be avoided.

The dummy substrate is placed between the last of the same type of substrate and the first of a new type of substrate to be inspected next. That is, when the type of substrate changes,
Just before the new type of substrate, the dummy substrate is an XY table
It is carried into 23.

When a board is carried into the XY table 23 (steps 53 and 54), the board type information area is imaged, and the presence or absence of the board type information and its contents are determined based on the captured image data. If there is no board type information (step
(NO at 55A), which is a normal substrate to be inspected 20T, and inspection is performed on the substrate to be inspected 20T (step 62). If there is board type information, it is a dummy board (step 55A)
YES). The mounted components are not inspected for the dummy substrate, and the dummy substrate is unloaded from the XY table 23 (step 60A). Preparation for inspection of a new substrate to be inspected next is performed based on the substrate type information read from the dummy substrate (step 61).

[Brief description of the drawings]

FIG. 1 shows a configuration of an inspection apparatus.

FIG. 2 shows an example of the contents of a teaching table.

FIG. 3 is a flowchart showing a processing procedure of the inspection apparatus in an inspection mode.

FIG. 4 is a flowchart illustrating another example of the processing procedure of the inspection apparatus in the inspection mode.

FIG. 5 shows an entire configuration of a conventional inspection apparatus.

[Explanation of symbols]

 25 Imaging unit 27 Processing unit 30 Image processing unit 33 Judgment unit 34 Teaching table 37 CRT display unit 41 Control unit 42 Board type judgment unit

Claims (4)

[Claims] 1. A method of sequentially performing processing of processing objects sequentially loaded into a processing position, and performing setup change for processing of a new type of object when the type of the object changes. When there are a plurality of first objects of the same type to be sequentially processed, type information about a second object of another type to be processed next is provided in one of the first objects. The first object provided with the type information is carried into the processing position at the end of the first object, and the type information provided on the first object finally carried into the processing position. Is read, and, based on the read type information, after the processing for the first object carried in last, the setup change for the processing for the second object to be processed next is performed. How to replace. 2. A method of sequentially performing processing of processing objects sequentially loaded into a processing position, and performing setup change for processing of a new type of object when the type of the object changes. After the processing for all the objects of the same type is completed, a special setup change instruction provided with the type information of the next object to be processed is carried into the processing position,
Reading the type information provided in the dedicated setup change instruction carried into the processing position, and performing a setup change for processing of an object of the next type to be processed based on the read type information; How to replace. 3. An apparatus for sequentially performing processing of processing objects sequentially loaded into a processing position, and performing setup change for processing of a new type of object when the type of the object changes. Storage means for storing information relating to setup corresponding to the type of object; means for reading type information provided for the object carried into the processing position; and providing the type information based on the read type information. And a means for performing a setup change for processing of an object to be processed next based on the setup information stored in the storage unit after the processing of the set object. 4. An apparatus for sequentially performing processing of a processing object sequentially carried into a processing position, and performing setup change for processing of a new type of object when the type of the object changes, Storage means for storing information relating to the setup corresponding to the type of the object, means for reading the type information provided in the dedicated setup change instruction carried into the processing position, and storage of the read type information and the storage means Means for performing a setup change for processing of an object of a type to be processed next, based on the information on the set up performed.