JPH11288750A - Joint structure of flexible wiring board - Google Patents
Joint structure of flexible wiring boardInfo
- Publication number
- JPH11288750A JPH11288750A JP10101927A JP10192798A JPH11288750A JP H11288750 A JPH11288750 A JP H11288750A JP 10101927 A JP10101927 A JP 10101927A JP 10192798 A JP10192798 A JP 10192798A JP H11288750 A JPH11288750 A JP H11288750A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- flexible wiring
- connection terminal
- cover film
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Liquid Crystal (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明はフレキシブル配線
基板の接合構造に関する。[0001] 1. Field of the Invention [0002] The present invention relates to a joint structure of a flexible wiring board.
【０００２】[0002]
【従来の技術】例えば液晶表示装置においては、液晶表
示パネルと回路基板とを導電接続するためにフレキシブ
ル配線基板が使用されている。2. Description of the Related Art For example, in a liquid crystal display device, a flexible wiring board is used for conductively connecting a liquid crystal display panel and a circuit board.
【０００３】図５は従来のこのような液晶表示装置の一
例の一部の平面図を示したものである。この液晶表示装
置は液晶表示パネル１を備えている。液晶表示パネル１
はガラス等からなる２枚の透明な基板２、３間に液晶
（図示せず）が封入された構造となっている。この場
合、下側基板２の図５における下辺部及び右辺部は上側
基板３から突出され、これら突出部２ａ、２ｂの上面の
各所定の箇所にはＬＳＩ等からなる半導体チップ４、５
が異方導電性接着剤（接合剤）６、７を介して搭載され
ている。また、下側基板２の上面の図５における右辺部
の下辺側にはフレキシブル配線基板８の一端部が異方導
電性接着剤（接合剤）９を介して接合されている。フレ
キシブル配線基板８の他端部は図示しない回路基板に図
示しない異方導電性接着剤（接合剤）を介して接合され
ている。FIG. 5 shows a partial plan view of an example of such a conventional liquid crystal display device. This liquid crystal display device includes a liquid crystal display panel 1. Liquid crystal display panel 1
Has a structure in which a liquid crystal (not shown) is sealed between two transparent substrates 2 and 3 made of glass or the like. In this case, the lower side and the right side in FIG. 5 of the lower substrate 2 protrude from the upper substrate 3, and semiconductor chips 4 and 5 made of LSI or the like are provided at predetermined positions on the upper surfaces of the protruding portions 2a and 2b.
Are mounted via anisotropic conductive adhesives (bonding agents) 6 and 7. Further, one end of a flexible wiring board 8 is joined to the lower side of the upper side of the upper surface of the lower substrate 2 in FIG. 5 via an anisotropic conductive adhesive (joining agent) 9. The other end of the flexible wiring board 8 is joined to a circuit board (not shown) via an anisotropic conductive adhesive (not shown).
【０００４】次に、図６は図５のＸ−Ｘ線に沿う断面
図、図７はその一部を拡大した断面図を示したものであ
る。フレキシブル配線基板８はベース基板１１を備えて
いる。ベース基板１１の下面には接着剤層１２を介して
銅箔からなる複数の配線１３が設けられている。配線１
３は、ベース基板１１の一端部に設けられた接続端子１
３ａと、他端部に設けられた接続端子（図示せず）と、
その間に設けられた引き回し線１３ｂとからなってい
る。ベース基板１１の引き回し線１３ｂの部分の下面に
は接着剤層１４を介してカバーフィルム１５が設けられ
ている。接続端子１３ａの下面には金メッキ層１６が設
けられている。そして、フレキシブル配線基板８の一端
部の接続端子１３ａの部分は、液晶表示パネル１の下側
基板２の突出部２ｂの上面に設けられた接続端子１７の
部分に異方導電性接着剤９を介して熱圧着により接合さ
れている。異方導電性接着剤９は熱硬化性の樹脂からな
る絶縁性接着剤９ａ中にニッケル等からなる導電性粒子
９ｂが混入されたものからなっている。なお、下側基板
２とカバーフィルム１５との間は離間されている。ま
た、異方導電性接着剤９の外周部は、熱圧着時の圧力に
より、周囲にはみ出され、特に、接続端子１３ａの下面
における下側基板２の外側にはみ出され、このはみ出さ
れた部分によってはみ出し部１０が形成されている。FIG. 6 is a sectional view taken along the line XX of FIG. 5, and FIG. The flexible wiring board 8 includes a base substrate 11. A plurality of wirings 13 made of copper foil are provided on the lower surface of the base substrate 11 via an adhesive layer 12. Wiring 1
3 is a connection terminal 1 provided at one end of the base substrate 11.
3a, a connection terminal (not shown) provided at the other end,
It is composed of a leading line 13b provided therebetween. A cover film 15 is provided on the lower surface of the base substrate 11 at the portion of the wiring line 13b via an adhesive layer 14. A gold plating layer 16 is provided on the lower surface of the connection terminal 13a. The connection terminal 13a at one end of the flexible wiring board 8 is coated with the anisotropic conductive adhesive 9 on the connection terminal 17 provided on the upper surface of the projection 2b of the lower substrate 2 of the liquid crystal display panel 1. And joined by thermocompression bonding. The anisotropic conductive adhesive 9 is formed by mixing conductive particles 9b made of nickel or the like into an insulating adhesive 9a made of a thermosetting resin. The lower substrate 2 and the cover film 15 are separated from each other. In addition, the outer peripheral portion of the anisotropic conductive adhesive 9 protrudes to the periphery due to the pressure at the time of thermocompression bonding, and in particular, protrudes to the outside of the lower substrate 2 on the lower surface of the connection terminal 13a. A protruding portion 10 is formed.
【０００５】次に、下側基板２とカバーフィルム１５と
の間を離間させている理由について説明する。フレキシ
ブル配線基板８を形成する場合には、図示していない
が、まず、長尺のベース基板を用意し、また一の面の幅
方向中央部に長尺の接着剤層が接着された長尺のカバー
フィルムを用意する。そして、長尺のベース基板の幅方
向両側にパンチングによりスプロケットホールを形成
し、またその一の面に複数の配線１３を形成する。ま
た、長尺のカバーフィルムの幅方向両側にパンチングに
よりスプロケットホールを形成するとともに、このカバ
ーフィルム及びこれに接着された接着剤層の接続端子１
３ａに対応する部分にパンチングにより開口部を形成す
る。次に、長尺のベース基板と長尺のカバーフィルムと
を、その各スプロケットホールを同一のスプロケットホ
イールに係合させて位置合わせして、接着剤層を介して
貼り合わせる。次に、所定の長さ及び幅に切断すると、
図６及び図７に示すフレキシブル配線基板８が得られ
る。ところで、各スプロケットホールはスプロケットホ
イールの歯が係合できる大きさよりも多少大きめに形成
されている。このため、長尺のベース基板と長尺のカバ
ーフィルムとを貼り合わせる際の位置合わせに比較的大
きなばらつきが生じる。したがって、図６及び図７に示
すフレキシブル配線基板８の状態において、ベース基板
１１とカバーフィルム１５との貼り合わせ位置のばらつ
きも大きくなってしまう。この結果、フレキシブル配線
基板８を液晶表示パネル１に位置合わせして熱圧着する
場合、下側基板２の図６及び図７における右端面とカバ
ーフィルム１５の図６及び図７における左端面とをぴっ
たり合わせるのが極めて困難である関係から、上記貼り
合わせ位置のばらつきを考慮して、下側基板２とカバー
フィルム１５との間を離間させている。Next, the reason why the lower substrate 2 is separated from the cover film 15 will be described. In the case of forming the flexible wiring board 8, although not shown, first, a long base substrate is prepared, and a long adhesive layer is adhered to the center of one surface in the width direction. Prepare a cover film. Then, sprocket holes are formed by punching on both sides in the width direction of the long base substrate, and a plurality of wirings 13 are formed on one surface thereof. Further, sprocket holes are formed by punching on both sides in the width direction of the long cover film, and connection terminals 1 of the cover film and the adhesive layer adhered thereto are formed.
An opening is formed in a portion corresponding to 3a by punching. Next, the long base substrate and the long cover film are aligned with each other by engaging the respective sprocket holes with the same sprocket wheel, and are bonded via an adhesive layer. Next, when cutting to a predetermined length and width,
The flexible wiring board 8 shown in FIGS. 6 and 7 is obtained. By the way, each sprocket hole is formed slightly larger than the size that the teeth of the sprocket wheel can engage. For this reason, a relatively large variation occurs in the alignment at the time of bonding the long base substrate and the long cover film. Therefore, in the state of the flexible wiring board 8 shown in FIGS. 6 and 7, the variation in the bonding position between the base substrate 11 and the cover film 15 also increases. As a result, when the flexible wiring board 8 is aligned with the liquid crystal display panel 1 and thermocompression-bonded, the right end face of the lower substrate 2 in FIGS. 6 and 7 and the left end face of the cover film 15 in FIGS. Since it is extremely difficult to make a close fit, the lower substrate 2 and the cover film 15 are separated from each other in consideration of the variation in the bonding position.
【０００６】[0006]
【発明が解決しようとする課題】このように、従来のフ
レキシブル配線基板８の接合構造では、下側基板２とカ
バーフィルム１５との間を離間させている。しかしなが
ら、下側基板２とカバーフィルム１５との間において接
続端子１３ａの一部が露出されることになるので、フレ
キシブル配線基板８を折り曲げた場合、異方導電性接着
剤９のはみ出し部１０の先端部における接続端子１３ａ
の部分につまり図７において矢印Ａで示す部分に応力が
集中し、特に折り曲げが繰り返されると接続端子１３ａ
が図７において矢印Ａで示す部分で断線することがある
という問題があった。この発明の課題は、フレキシブル
配線基板の折り曲げの耐久性を向上させることである。As described above, in the conventional joint structure of the flexible wiring board 8, the lower substrate 2 and the cover film 15 are separated from each other. However, since a part of the connection terminal 13 a is exposed between the lower substrate 2 and the cover film 15, when the flexible wiring board 8 is bent, the protruding portion 10 of the anisotropic conductive adhesive 9 is formed. Connection terminal 13a at the tip
7, that is, the stress is concentrated on the portion indicated by arrow A in FIG.
However, there is a problem that the wire may be disconnected at a portion indicated by an arrow A in FIG. An object of the present invention is to improve the bending durability of a flexible wiring board.
【０００７】[0007]
【課題を解決するための手段】請求項１記載の発明は、
一端部にカバーフィルムにより被われずに露出された接
続端子を有するフレキシブル配線基板の前記接続端子の
当該一端部側の部分と電子部品の所定の箇所に設けられ
た接続端子の部分とが接合剤を介して接合され、且つ前
記接合剤の一部が前記電子部品の外側において前記フレ
キシブル配線基板の前記接続端子の残りの部分及びその
近傍のカバーフィルムを被って前記フレキシブル配線基
板に接着されているものである。この請求項１記載の発
明によれば、接合剤の一部を電子部品の外側においてフ
レキシブル配線基板の接続端子の部分及びその近傍のカ
バーフィルムを被ってフレキシブル配線基板に接着して
いるので、接合剤の一部によって電子部品とカバーフィ
ルムとの間における接続端子の部分を補強することがで
き、したがってフレキシブル配線基板の折り曲げの耐久
性を向上させることができる。請求項２記載の発明は、
一端部において該一端部の先端部と該先端部から所定の
距離だけ離間した位置との間にカバーフィルムにより被
われずに露出された接続端子を有するフレキシブル配線
基板の前記接続端子の露出された部分及びその両側の前
記カバーフィルムと電子部品の所定の箇所に設けられた
接続端子の部分とが接合剤を介して接合されているもの
である。この請求項２記載の発明によれば、フレキシブ
ル配線基板の接続端子の露出された部分及びその両側の
カバーフィルムと電子部品の接続端子の部分とを接合剤
を介して接合しているので、フレキシブル配線基板のう
ち強度的に弱い部分つまり接続端子の露出された部分が
すべて電子部品の接続端子の部分に接合されることにな
り、したがってフレキシブル配線基板の折り曲げの耐久
性を向上させることができる。請求項３記載の発明は、
一端部にカバーフィルムにより被われずに露出された接
続端子を有するフレキシブル配線基板の前記接続端子の
部分及びその近傍の前記カバーフィルムと電子部品の所
定の箇所に設けられた接続端子の部分とが接合剤を介し
て接合されているものである。この請求項３記載の発明
によれば、フレキシブル配線基板の接続端子の部分及び
その近傍のカバーフィルムと電子部品の接続端子の部分
とが接合剤を介して接合しているので、フレキシブル配
線基板のうち強度的に弱い部分つまり接続端子の露出さ
れた部分がすべて電子部品の接続端子の部分に接合され
ることになり、したがってフレキシブル配線基板の折り
曲げの耐久性を向上させることができる。According to the first aspect of the present invention,
One end of the connection terminal of the flexible wiring board having the connection terminal exposed without being covered with the cover film at one end thereof and the connection terminal portion provided at a predetermined position of the electronic component are formed of a bonding agent. And a part of the bonding agent is adhered to the flexible wiring board by covering a remaining part of the connection terminal of the flexible wiring board and a cover film near the outside on the outside of the electronic component. Things. According to the first aspect of the present invention, a part of the bonding agent is adhered to the flexible wiring board by covering the connection terminal portion of the flexible wiring board and the cover film in the vicinity thereof outside the electronic component. Part of the agent can reinforce the connection terminal portion between the electronic component and the cover film, so that the bending durability of the flexible wiring board can be improved. The invention according to claim 2 is
The connection terminal of the flexible wiring board having the connection terminal exposed at one end without being covered by the cover film between the tip of the one end and a position separated by a predetermined distance from the tip is exposed. The part and the cover film on both sides thereof and the part of the connection terminal provided at a predetermined position of the electronic component are joined via a joining agent. According to the second aspect of the present invention, since the exposed portions of the connection terminals of the flexible wiring board and the cover films on both sides thereof and the connection terminal portions of the electronic component are joined via the joining agent, the flexible portion is flexible. The part of the wiring board that is weak in strength, that is, the exposed part of the connection terminal is all joined to the connection terminal part of the electronic component, and therefore, the bending durability of the flexible wiring board can be improved. The invention according to claim 3 is
The connection terminal portion of the flexible wiring board having the connection terminal exposed at one end without being covered by the cover film, and the cover film in the vicinity thereof and the connection terminal portion provided at a predetermined position of the electronic component are included. They are joined via a joining agent. According to the third aspect of the present invention, since the connection terminal portion of the flexible wiring board and the cover film in the vicinity thereof and the connection terminal portion of the electronic component are joined via the bonding agent, Of these, all of the weak portions, that is, the exposed portions of the connection terminals are joined to the connection terminals of the electronic component, and therefore, the bending durability of the flexible wiring board can be improved.
【０００８】[0008]
【発明の実施の形態】図１（Ａ）はこの発明の第１実施
形態を適用した液晶表示装置の接合前の状態の断面図を
示し、図１（Ｂ）は接合後の状態の断面図を示し、図２
は図１（Ｂ）の一部を拡大した断面図を示したものであ
る。これらの図において、図６及び図７と同一名称部分
には同一の符号を付し、その説明を適宜省略する。FIG. 1A is a cross-sectional view of a liquid crystal display device according to a first embodiment of the present invention before bonding, and FIG. 1B is a cross-sectional view of the liquid crystal display device after bonding. FIG. 2
Is a cross-sectional view in which a part of FIG. 1B is enlarged. In these figures, the same reference numerals are given to the same parts as those in FIGS. 6 and 7, and the description thereof will be omitted as appropriate.
【０００９】さて、液晶表示パネル１にフレキシブル配
線基板８を接合する場合には、まず図１（Ａ）に示すよ
うに、フレキシブル配線基板８の接続端子１３ａの部分
の下面及びその近傍のカバーフィルム１５の下面にシー
ト状の熱硬化性の異方導電性接着剤（接合剤）９を仮接
着する。この場合、フレキシブル配線基板８の一端部下
面の所定の箇所に設けられた図示しないアライメントマ
ークの部分には異方導電性接着剤９を設けない。次に、
フレキシブル配線基板８の接続端子１３ａの一端部側の
部分を下側基板２の接続端子１７の部分上に位置合わせ
して配置する。この場合の位置合わせは、フレキシブル
配線基板８のアライメントマークを下側基板２の上面の
所定の箇所に設けられた図示しないアライメントマーク
に合わせて行なう。そして、この状態では、フレキシブ
ル配線基板８のカバーフィルム１５と下側基板２との間
は、従来の場合と同様の理由から、離間されている。次
に、熱圧着ヘッド２１を用いて熱圧着するとともに、下
側基板２の外側における異方導電性接着剤９の下面に熱
風を吹き付ける。すると、図１（Ｂ）及び図２に示すよ
うに、熱圧着時の圧力により、フレキシブル配線基板８
と下側基板２との間に介在された異方導電性接着剤９の
外周部が周囲にはみ出される。この結果、特に、下側基
板２とカバーフィルム１５との間における異方導電性接
着剤９の厚みが厚くなる。そして、フレキシブル配線基
板８の接続端子１３ａの一端部側の部分と下側基板２の
接続端子１７の部分とが硬化した異方導電性接着剤９を
介して接合される。また、特に、下側基板２の外側にお
ける異方導電性接着剤９が接続端子１３ａの部分の下面
及びその近傍のカバーフィルム１５の下面に接着された
状態で硬化する。さらに、下側基板２の外側における異
方導電性接着剤９が下側基板２の端面に接着される。When the flexible wiring board 8 is joined to the liquid crystal display panel 1, first, as shown in FIG. 1A, the lower surface of the connection terminals 13a of the flexible wiring board 8 and a cover film near the lower surface. A sheet-like thermosetting anisotropic conductive adhesive (bonding agent) 9 is temporarily adhered to the lower surface of 15. In this case, the anisotropic conductive adhesive 9 is not provided on a portion of an alignment mark (not shown) provided at a predetermined location on the lower surface of one end of the flexible wiring board 8. next,
One end of the connection terminal 13 a of the flexible wiring board 8 is aligned with and disposed on the connection terminal 17 of the lower substrate 2. In this case, the alignment is performed by aligning the alignment mark of the flexible wiring board 8 with an alignment mark (not shown) provided at a predetermined position on the upper surface of the lower substrate 2. In this state, the cover film 15 of the flexible wiring board 8 and the lower substrate 2 are separated from each other for the same reason as in the conventional case. Next, thermocompression bonding is performed using the thermocompression bonding head 21, and hot air is blown to the lower surface of the anisotropic conductive adhesive 9 outside the lower substrate 2. Then, as shown in FIG. 1 (B) and FIG.
The outer peripheral portion of the anisotropic conductive adhesive 9 interposed between the lower substrate 2 and the lower substrate 2 protrudes to the periphery. As a result, particularly, the thickness of the anisotropic conductive adhesive 9 between the lower substrate 2 and the cover film 15 increases. Then, a portion on one end side of the connection terminal 13 a of the flexible wiring board 8 and a portion of the connection terminal 17 on the lower substrate 2 are joined via the cured anisotropic conductive adhesive 9. In particular, the anisotropic conductive adhesive 9 outside the lower substrate 2 is cured while being adhered to the lower surface of the connection terminal 13a and the lower surface of the cover film 15 in the vicinity thereof. Further, an anisotropic conductive adhesive 9 outside the lower substrate 2 is bonded to an end surface of the lower substrate 2.
【００１０】このように、この液晶表示装置では、異方
導電性接着剤９の一部を下側基板２の外側においてフレ
キシブル配線基板８の接続端子１３ａの部分及びその近
傍のカバーフィルム１５を被ってフレキシブル配線基板
８に接着しているので、異方導電性接着剤９の一部によ
って下側基板２とカバーフィルム１５との間における接
続端子１３ａの部分を補強することができ、したがって
フレキシブル配線基板８の折り曲げの耐久性を向上させ
ることができる。この結果、製造工程中において液晶表
示装置を取り扱う際に、フレキシブル配線基板８に不要
な力が加わっても、フレキシブル配線基板８の接続端子
１３ａが断線しないようにすることができる。また、液
晶表示装置をケース等に組み込んで製品にする際に、フ
レキシブル配線基板８に不要な力が加わっても、フレキ
シブル配線基板８の接続端子１３ａが断線しないように
することができる。さらに、下側基板２の外側における
異方導電性接着剤９を下側基板２の端面に接着している
ので、フレキシブル配線基板８の下側基板２に対する接
合強度をより強くすることができる。As described above, in this liquid crystal display device, a part of the anisotropic conductive adhesive 9 is covered on the outside of the lower substrate 2 with the connection terminal 13a of the flexible wiring board 8 and the cover film 15 in the vicinity thereof. And the connection terminal 13a between the lower substrate 2 and the cover film 15 can be reinforced by a part of the anisotropic conductive adhesive 9, so that the flexible wiring board 8 can be reinforced. The durability of the bending of the substrate 8 can be improved. As a result, even when an unnecessary force is applied to the flexible wiring board 8 when handling the liquid crystal display device during the manufacturing process, the connection terminals 13a of the flexible wiring board 8 can be prevented from being disconnected. Further, when the liquid crystal display device is incorporated into a case or the like to produce a product, even if an unnecessary force is applied to the flexible wiring board 8, the connection terminals 13a of the flexible wiring board 8 can be prevented from being disconnected. Furthermore, since the anisotropic conductive adhesive 9 outside the lower substrate 2 is bonded to the end surface of the lower substrate 2, the bonding strength of the flexible wiring substrate 8 to the lower substrate 2 can be further increased.
【００１１】ここで、フレキシブル配線基板８の折り曲
げ実験について説明する。まず、図１（Ｂ）に示すこの
実施形態における液晶表示装置を２つ用意し、また比較
のために図６に示す従来の液晶表示装置を２つ用意し
た。そして、フレキシブル配線基板８を１００ｇで引っ
張った状態で上下方向に９０°ずつ折り曲げ、この折り
曲げを接続端子１３ａが切れるまで行なった。そして、
上下方向の折り曲げを１回として計算し、接続端子１３
ａが切れるまでの各折り曲げ回数を調べたところ、この
実施形態における２つの液晶表示装置の場合には１９回
と２８回であり、従来の２つの液晶表示装置の場合には
共に７回であった。これから明らかなように、この実施
形態における液晶表示装置の折り曲げ回数は従来の液晶
表示装置の折り曲げ回数の２倍以上であり、この実施形
態における液晶表示装置の折り曲げの耐久性が従来の液
晶表示装置の折り曲げの耐久性の２倍以上に向上されて
いることが理解される。Here, an experiment on bending the flexible wiring board 8 will be described. First, two liquid crystal display devices in this embodiment shown in FIG. 1B were prepared, and two conventional liquid crystal display devices shown in FIG. 6 were prepared for comparison. Then, the flexible wiring board 8 was bent vertically by 90 ° while being pulled by 100 g, and this bending was performed until the connection terminal 13a was cut. And
Calculate the bending in the vertical direction as one time, and
When the number of times of bending until a was cut was examined, the number was 19 and 28 in the case of the two liquid crystal display devices in this embodiment, and was 7 in the case of the two conventional liquid crystal display devices. Was. As is clear from this, the number of times of bending of the liquid crystal display device in this embodiment is twice or more the number of times of bending of the conventional liquid crystal display device. It can be understood that the durability of the bending is more than doubled.
【００１２】また、別の折り曲げ実験も行なった。この
折り曲げ実験では、基本的には上記折り曲げ実験と同様
であるが、フレキシブル配線基板８を多少捩って折り曲
げ、フレキシブル配線基板８の片側に応力が集中するよ
うにした。すると、この実施形態における液晶表示装置
の場合の折り曲げ回数は１１回であった。これから明ら
かなように、この実施形態における液晶表示装置の場合
には、フレキシブル配線基板８を多少捩って折り曲げて
も、上記折り曲げ実験における従来の液晶表示装置の折
り曲げ回数よりも多く、これによっても折り曲げの耐久
性が向上されていることが理解される。Further, another bending experiment was performed. This bending experiment is basically the same as the above-mentioned bending experiment, except that the flexible wiring board 8 is slightly twisted and bent so that stress is concentrated on one side of the flexible wiring board 8. Then, the number of times of bending in the case of the liquid crystal display device in this embodiment was 11 times. As is apparent from the above description, in the case of the liquid crystal display device according to this embodiment, even if the flexible wiring board 8 is slightly twisted and bent, the number of bending times of the conventional liquid crystal display device in the bending experiment is larger than that of the conventional liquid crystal display device. It is understood that the durability of bending is improved.
【００１３】次に、図３（Ａ）はこの発明の第２実施形
態を適用した液晶表示装置の接合前の状態の断面図を示
し、図３（Ｂ）は接合後の状態の断面図を示し、図４は
図３（Ｂ）の一部を拡大した断面図を示したものであ
る。これらの図において、図６及び図７と同一名称部分
には同一の符号を付し、その説明を適宜省略する。この
場合のフレキシブル配線基板８では、ベース基板１１の
一端部における先端部の接続端子１３ａの部分の下面に
も接着剤層１４ａを介してカバーフィルム１５ａが設け
られている。また、カバーフィルム１５、１５ａにより
被われずに露出された接続端子１３ａの左右方向の長さ
は熱圧着ヘッド２１の左右方向の長さよりも大きくなっ
ている。FIG. 3A is a cross-sectional view of a liquid crystal display device according to a second embodiment of the present invention before bonding, and FIG. 3B is a cross-sectional view of the liquid crystal display device after bonding. FIG. 4 is an enlarged sectional view of a part of FIG. In these figures, the same reference numerals are given to the same parts as those in FIGS. 6 and 7, and the description thereof will be omitted as appropriate. In this case, in the flexible wiring board 8, a cover film 15 a is also provided via an adhesive layer 14 a on the lower surface of the connection terminal 13 a at one end of the base substrate 11. In addition, the length in the left-right direction of the connection terminal 13a exposed without being covered by the cover films 15, 15a is larger than the length in the left-right direction of the thermocompression bonding head 21.
【００１４】そして、液晶表示パネル１にフレキシブル
配線基板８を接合する場合には、まず図３（Ａ）に示す
ように、フレキシブル配線基板８の接続端子１３ａの露
出された部分の下面及びその両側のカバーフィルム１
５、１５ａの下面にシート状の熱硬化性の異方導電性接
着剤（接合剤）９を仮接着する。この場合も、フレキシ
ブル配線基板８の一端部下面の所定の箇所に設けられた
図示しないアライメントマークの部分には異方導電性接
着剤９を設けない。次に、フレキシブル配線基板８の接
続端子１３ａの露出された部分及びその両側のカバーフ
ィルム１５、１５ａを下側基板２の接続端子１７の部分
上に位置合わせして配置する。次に、熱圧着ヘッド２１
を用いて熱圧着する。すると、図３（Ｂ）及び図４に示
すように、熱圧着時の圧力により、カバーフィルム１
５、１５ａにより被われずに露出された接続端子１３ａ
の両端部及びこの両端部に対応するベース基板１１及び
接着剤層１２の部分が内側に折れ曲がるとともに、カバ
ーフィルム１５、１５ａが内側に傾き、異方導電性接着
剤９の外周部が周囲にはみ出される。そして、フレキシ
ブル配線基板８の接続端子１３ａの露出された部分及び
その両側のカバーフィルム１５、１５ａと下側基板２の
接続端子１７の部分とが硬化した異方導電性接着剤９を
介して接合される。また、下側基板２の外側における異
方導電性接着剤９が下側基板２の端面に接着される。When the flexible wiring board 8 is joined to the liquid crystal display panel 1, first, as shown in FIG. 3A, the lower surface of the exposed portion of the connection terminal 13a of the flexible wiring board 8 and both sides thereof. Cover film 1
A sheet-like thermosetting anisotropic conductive adhesive (bonding agent) 9 is temporarily adhered to the lower surfaces of 5, 5a. Also in this case, the anisotropic conductive adhesive 9 is not provided on a portion of an alignment mark (not shown) provided at a predetermined location on the lower surface of one end of the flexible wiring board 8. Next, the exposed portions of the connection terminals 13 a of the flexible wiring board 8 and the cover films 15, 15 a on both sides thereof are aligned and arranged on the connection terminals 17 of the lower substrate 2. Next, the thermocompression bonding head 21
Thermocompression bonding. Then, as shown in FIG. 3 (B) and FIG.
Connection terminals 13a exposed without being covered by 5, 15a
Of the base substrate 11 and the adhesive layer 12 corresponding to both ends are bent inward, the cover films 15 and 15a are inclined inward, and the outer peripheral portion of the anisotropic conductive adhesive 9 protrudes to the periphery. Is done. Then, the exposed portions of the connection terminals 13 a of the flexible wiring board 8 and the cover films 15, 15 a on both sides thereof and the connection terminals 17 of the lower substrate 2 are joined via the cured anisotropic conductive adhesive 9. Is done. Further, an anisotropic conductive adhesive 9 outside the lower substrate 2 is bonded to the end surface of the lower substrate 2.
【００１５】このように、この液晶表示装置では、フレ
キシブル配線基板８の接続端子１３ａの露出された部分
及びその両側のカバーフィルム１５、１５ａと下側基板
２の接続端子１７の部分とを異方導電性接着剤９を介し
て接合しているので、フレキシブル配線基板８のうち強
度的に弱い部分つまり接続端子１３ａの露出された部分
がすべて下側基板２の接続端子１７の部分に接合される
ことになり、したがってフレキシブル配線基板８の折り
曲げの耐久性を向上させることができる。また、フレキ
シブル配線基板８のうち強度的に強い部分つまりカバー
フィルム１５で被われた部分が下側基板２の図３（Ｂ）
における右端部の部分から外側に位置することになるの
で、下側基板２の近傍に位置するフレキシブル配線基板
８の折り曲げ強度を図６に示す従来のフレキシブル配線
基板８の折り曲げ強度の１０倍以上とすることができ
る。さらに、下側基板２の外側における異方導電性接着
剤９を下側基板２の端面に接着しているので、フレキシ
ブル配線基板８の下側基板２に対する接合強度をより強
くすることができる。As described above, in this liquid crystal display device, the exposed portions of the connection terminals 13a of the flexible wiring board 8 and the cover films 15, 15a on both sides thereof and the connection terminals 17 of the lower substrate 2 are anisotropic. Since the bonding is performed via the conductive adhesive 9, the portion of the flexible wiring board 8 that is weak in strength, that is, the exposed portion of the connection terminal 13 a is all bonded to the connection terminal 17 of the lower substrate 2. Therefore, the bending durability of the flexible wiring board 8 can be improved. In addition, a portion of the flexible wiring board 8 that is strong in strength, that is, a portion covered with the cover film 15 is a portion of the lower substrate 2 shown in FIG.
Of the flexible wiring board 8 located in the vicinity of the lower substrate 2 is at least 10 times the bending strength of the conventional flexible wiring board 8 shown in FIG. can do. Furthermore, since the anisotropic conductive adhesive 9 outside the lower substrate 2 is bonded to the end surface of the lower substrate 2, the bonding strength of the flexible wiring substrate 8 to the lower substrate 2 can be further increased.
【００１６】なお、上記第２実施形態では、ベース基板
１１の一端部における先端部にカバーフィルム１５ａを
設けた場合について説明したが、これに限らず、ベース
基板１１の一端部における先端部にカバーフィルム１５
ａを設けないようにしてもよい。また、上記第１及び第
２実施形態では、ベース基板１１に接着剤層１４を介し
てカバーフィルム１５を接着した場合について説明した
が、これに限定されるものではない。例えば、感光性の
樹脂を用いたフォトリソグラフィ法や印刷法によりカバ
ーフィルム１５を設けるようにしてもよい。さらに、上
記第１及び第２実施形態では、接合剤として異方導電性
接着剤９を用いた場合について説明したが、これに限ら
ず、例えば接合剤として絶縁性の接着剤を用いるように
してもよい。この場合、熱圧着時の圧力により、フレキ
シブル配線基板８の接続端子１３ａと下側基板２の接続
端子１７との間に介在された絶縁性の接着剤が逃げて、
両接続端子１３ａ、１７が直接接続される。In the second embodiment, the case where the cover film 15a is provided at the end of the base substrate 11 is described. However, the present invention is not limited to this. Film 15
a may not be provided. In the first and second embodiments, the case where the cover film 15 is bonded to the base substrate 11 via the adhesive layer 14 has been described, but the present invention is not limited to this. For example, the cover film 15 may be provided by a photolithography method or a printing method using a photosensitive resin. Furthermore, in the first and second embodiments, the case where the anisotropic conductive adhesive 9 is used as the bonding agent has been described. However, the present invention is not limited to this. For example, an insulating adhesive is used as the bonding agent. Is also good. In this case, due to the pressure at the time of thermocompression bonding, the insulating adhesive interposed between the connection terminal 13a of the flexible wiring board 8 and the connection terminal 17 of the lower substrate 2 escapes,
Both connection terminals 13a and 17 are directly connected.
【００１７】[0017]
【発明の効果】以上説明したように、請求項１記載の発
明によれば、異方導電性接着剤の一部を電子部品の外側
においてフレキシブル配線基板の接続端子の部分及びそ
の近傍のカバーフィルムを被ってフレキシブル配線基板
に接着しているので、異方導電性接着剤の一部によって
電子部品とカバーフィルムとの間における接続端子の部
分を補強することができ、したがってフレキシブル配線
基板の折り曲げの耐久性を向上させることができる。請
求項２記載の発明によれば、フレキシブル配線基板の接
続端子の露出された部分及びその両側のカバーフィルム
と電子部品の接続端子の部分とを異方導電性接着剤を介
して接合しているので、フレキシブル配線基板のうち強
度的に弱い部分つまり接続端子の露出された部分がすべ
て電子部品の接続端子の部分に接合されることになり、
したがってフレキシブル配線基板の折り曲げの耐久性を
向上させることができる。請求項３記載の発明によれ
ば、フレキシブル配線基板の接続端子の部分及びその近
傍のカバーフィルムと電子部品の接続端子の部分とが異
方導電性接着剤を介して接合しているので、フレキシブ
ル配線基板のうち強度的に弱い部分つまり接続端子の露
出された部分がすべて電子部品の接続端子の部分に接合
されることになり、したがってフレキシブル配線基板の
折り曲げの耐久性を向上させることができる。As described above, according to the first aspect of the present invention, a part of the anisotropic conductive adhesive is applied outside the electronic component to the connection terminal portion of the flexible wiring board and the cover film in the vicinity thereof. The connection terminal between the electronic component and the cover film can be reinforced by a part of the anisotropic conductive adhesive. Durability can be improved. According to the second aspect of the present invention, the exposed portions of the connection terminals of the flexible wiring board and the cover films on both sides thereof and the connection terminal portions of the electronic component are joined via the anisotropic conductive adhesive. Therefore, the weak portion of the flexible wiring board, that is, the exposed portion of the connection terminal is all joined to the connection terminal portion of the electronic component,
Therefore, the bending durability of the flexible wiring board can be improved. According to the third aspect of the present invention, since the connection terminal portion of the flexible wiring board and the cover film near the connection terminal portion and the connection terminal portion of the electronic component are joined via the anisotropic conductive adhesive, the flexible wiring board is flexible. The part of the wiring board that is weak in strength, that is, the exposed part of the connection terminal is all joined to the connection terminal part of the electronic component, and therefore, the bending durability of the flexible wiring board can be improved.
【図１】（Ａ）はこの発明の第１実施形態を適用した液
晶表示装置の接合前の状態の断面図、（Ｂ）は接合後の
状態の断面図。FIG. 1A is a cross-sectional view of a liquid crystal display device to which a first embodiment of the present invention is applied before joining, and FIG. 1B is a cross-sectional view after joining.
【図２】図１（Ｂ）の一部を拡大した断面図。FIG. 2 is an enlarged cross-sectional view of a part of FIG.
【図３】（Ａ）はこの発明の第２実施形態を適用した液
晶表示装置の接合前の状態の断面図、（Ｂ）は接合後の
状態の断面図。FIG. 3A is a cross-sectional view of a liquid crystal display device to which a second embodiment of the present invention is applied before joining, and FIG. 3B is a cross-sectional view after joining.
【図４】図３（Ｂ）の一部を拡大した断面図。FIG. 4 is an enlarged cross-sectional view of a part of FIG.
【図５】従来の液晶表示装置の一例の一部の平面図。FIG. 5 is a plan view of a part of an example of a conventional liquid crystal display device.
【図６】図５のＸ−Ｘ線に沿う断面図。FIG. 6 is a sectional view taken along the line XX of FIG. 5;
【図７】図６の一部を拡大した断面図。FIG. 7 is an enlarged sectional view of a part of FIG. 6;
１ 液晶表示パネル ８ フレキシブル配線基板 ９ 異方導電性接着剤 １３ａ 接続端子 １５ カバーフィルム １７ 接続端子 DESCRIPTION OF SYMBOLS 1 Liquid crystal display panel 8 Flexible wiring board 9 Anisotropic conductive adhesive 13a Connection terminal 15 Cover film 17 Connection terminal
Claims (5)
に露出された接続端子を有するフレキシブル配線基板の
前記接続端子の当該一端側の部分と電子部品の所定の箇
所に設けられた接続端子の部分とが接合剤を介して接合
され、且つ前記接合剤の一部が前記電子部品の外側にお
いて前記フレキシブル配線基板の前記接続端子の残りの
部分及びその近傍のカバーフィルムを被って前記フレキ
シブル配線基板に接着されていることを特徴とするフレ
キシブル配線基板の接合構造。1. A portion of a flexible wiring board having a connection terminal exposed at one end without being covered with a cover film, the connection terminal being provided at a predetermined portion of the electronic component and the connection terminal provided at a predetermined location of an electronic component. Are bonded via a bonding agent, and a part of the bonding agent covers the remaining part of the connection terminal of the flexible wiring board and a cover film near the outside on the flexible wiring board outside the electronic component. A bonded structure of a flexible wiring board, which is bonded.
端部から所定の距離だけ離間した位置との間にカバーフ
ィルムにより被われずに露出された接続端子を有するフ
レキシブル配線基板の前記接続端子の露出された部分及
びその両側の前記カバーフィルムと電子部品の所定の箇
所に設けられた接続端子の部分とが接合剤を介して接合
されていることを特徴とするフレキシブル配線基板の接
合構造。2. The connection of a flexible wiring board having connection terminals exposed at one end between a tip end of the one end and a position separated by a predetermined distance from the tip end without being covered by a cover film. A joint structure of a flexible wiring board, wherein an exposed portion of a terminal and the cover film on both sides thereof and a portion of a connection terminal provided at a predetermined position of an electronic component are joined via a bonding agent. .
に露出された接続端子を有するフレキシブル配線基板の
前記接続端子の部分及びその近傍の前記カバーフィルム
と電子部品の所定の箇所に設けられた接続端子の部分と
が接合剤を介して接合されていることを特徴とするフレ
キシブル配線基板の接合構造。3. A connection provided at a predetermined portion between the connection terminal and the cover film and an electronic component in the vicinity of the connection terminal of a flexible wiring board having a connection terminal exposed at one end without being covered with a cover film. A connection structure for a flexible wiring board, wherein a terminal portion is connected via a bonding agent.
において該電子部品の端面に接着されていることを特徴
とする請求項１〜３のいずれかに記載のフレキシブル配
線基板の接合構造。4. The bonding structure for a flexible wiring board according to claim 1, wherein a part of the bonding agent is adhered to an end surface of the electronic component outside the electronic component. .
特徴とする請求項１〜４のいずれかに記載のフレキシブ
ル配線基板の接合構造。5. The joint structure according to claim 1, wherein the electronic component is a display panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10192798A JP3804269B2 (en) | 1998-03-31 | 1998-03-31 | Flexible wiring board bonding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10192798A JP3804269B2 (en) | 1998-03-31 | 1998-03-31 | Flexible wiring board bonding structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11288750A true JPH11288750A (en) | 1999-10-19 |
| JP3804269B2 JP3804269B2 (en) | 2006-08-02 |
Family
ID=14313555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10192798A Expired - Fee Related JP3804269B2 (en) | 1998-03-31 | 1998-03-31 | Flexible wiring board bonding structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3804269B2 (en) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001331122A (en) * | 2000-05-18 | 2001-11-30 | Toshiba Corp | Plane display device |
| JP2003091015A (en) * | 2001-09-18 | 2003-03-28 | Matsushita Electric Ind Co Ltd | Liquid crystal display device and method for manufacturing the same |
| JP2006171388A (en) * | 2004-12-16 | 2006-06-29 | Seiko Epson Corp | Electro-optical device, and electronic apparatus |
| JP2007172025A (en) * | 2005-12-19 | 2007-07-05 | Matsushita Electric Ind Co Ltd | Touch panel |
| JP2007193275A (en) * | 2006-01-23 | 2007-08-02 | Nec Lcd Technologies Ltd | Liquid crystal display and method for manufacturing the same |
| KR100820631B1 (en) | 2006-10-10 | 2008-04-11 | 엘지전자 주식회사 | Plasma display apparatus |
| US7359215B2 (en) | 2003-10-17 | 2008-04-15 | Hitachi Displays, Ltd. | Flexible display device |
| JP2009258755A (en) * | 2009-07-31 | 2009-11-05 | Seiko Epson Corp | Method of manufacturing substrate connection structure, and mounting device |
| WO2010001448A1 (en) * | 2008-06-30 | 2010-01-07 | パイオニア株式会社 | Flexible circuit board module and its manufacturing method |
| US20100307797A1 (en) * | 2009-06-09 | 2010-12-09 | Fujikura Ltd. | Flexible printed circuit and method of manufacturing same |
| JP2011059149A (en) * | 2009-09-07 | 2011-03-24 | Hitachi Displays Ltd | Electronic device |
| EP2325861A1 (en) * | 2009-11-19 | 2011-05-25 | Lg Electronics Inc. | Plasma display device and multi plasma display device |
| USRE43124E1 (en) | 2001-03-26 | 2012-01-24 | Sharp Kabushiki Kaisha | Display module including a display panel connected to a flexible wire board with an insulating protective layer extended inside the display panel |
| US8132319B2 (en) | 2007-10-30 | 2012-03-13 | Hitachi Chemical Company, Ltd. | Circuit connecting method |
| CN103513452A (en) * | 2012-06-29 | 2014-01-15 | 北京京东方光电科技有限公司 | Method for assembling display device |
| JP2016137622A (en) * | 2015-01-27 | 2016-08-04 | 京セラ株式会社 | Thermal head and thermal printer including the same |
| WO2018123976A1 (en) * | 2016-12-28 | 2018-07-05 | 株式会社フジクラ | Wiring body assembly, wiring substrate, and touch sensor |
| JP2019050347A (en) * | 2017-09-08 | 2019-03-28 | 株式会社タムラ製作所 | Method for manufacturing electronic substrate and anisotropic conductive paste |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6227786A (en) * | 1985-07-29 | 1987-02-05 | 東芝ライテック株式会社 | Liquid crystal display unit |
| JPS6327072U (en) * | 1986-08-07 | 1988-02-22 | ||
| JPH0194922U (en) * | 1987-12-17 | 1989-06-22 | ||
| JPH0466041U (en) * | 1990-10-18 | 1992-06-10 | ||
| JPH06235928A (en) * | 1993-02-10 | 1994-08-23 | Ricoh Co Ltd | Liquid crystal display device |
| JPH07170047A (en) * | 1993-12-16 | 1995-07-04 | Matsushita Electric Ind Co Ltd | Connection body of flexible printed board with wiring board and manufacture thereof |
| JPH08335472A (en) * | 1995-06-08 | 1996-12-17 | Shin Etsu Polymer Co Ltd | Heat seal connector |
| JPH11224976A (en) * | 1998-02-05 | 1999-08-17 | Matsushita Electric Ind Co Ltd | Wiring board |
| JPH11249163A (en) * | 1998-03-06 | 1999-09-17 | Nec Corp | Liquid crystal display device and production thereof |
-
1998
- 1998-03-31 JP JP10192798A patent/JP3804269B2/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6227786A (en) * | 1985-07-29 | 1987-02-05 | 東芝ライテック株式会社 | Liquid crystal display unit |
| JPS6327072U (en) * | 1986-08-07 | 1988-02-22 | ||
| JPH0194922U (en) * | 1987-12-17 | 1989-06-22 | ||
| JPH0466041U (en) * | 1990-10-18 | 1992-06-10 | ||
| JPH06235928A (en) * | 1993-02-10 | 1994-08-23 | Ricoh Co Ltd | Liquid crystal display device |
| JPH07170047A (en) * | 1993-12-16 | 1995-07-04 | Matsushita Electric Ind Co Ltd | Connection body of flexible printed board with wiring board and manufacture thereof |
| JPH08335472A (en) * | 1995-06-08 | 1996-12-17 | Shin Etsu Polymer Co Ltd | Heat seal connector |
| JPH11224976A (en) * | 1998-02-05 | 1999-08-17 | Matsushita Electric Ind Co Ltd | Wiring board |
| JPH11249163A (en) * | 1998-03-06 | 1999-09-17 | Nec Corp | Liquid crystal display device and production thereof |
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001331122A (en) * | 2000-05-18 | 2001-11-30 | Toshiba Corp | Plane display device |
| USRE43124E1 (en) | 2001-03-26 | 2012-01-24 | Sharp Kabushiki Kaisha | Display module including a display panel connected to a flexible wire board with an insulating protective layer extended inside the display panel |
| JP2003091015A (en) * | 2001-09-18 | 2003-03-28 | Matsushita Electric Ind Co Ltd | Liquid crystal display device and method for manufacturing the same |
| US7359215B2 (en) | 2003-10-17 | 2008-04-15 | Hitachi Displays, Ltd. | Flexible display device |
| JP2006171388A (en) * | 2004-12-16 | 2006-06-29 | Seiko Epson Corp | Electro-optical device, and electronic apparatus |
| JP2007172025A (en) * | 2005-12-19 | 2007-07-05 | Matsushita Electric Ind Co Ltd | Touch panel |
| JP2007193275A (en) * | 2006-01-23 | 2007-08-02 | Nec Lcd Technologies Ltd | Liquid crystal display and method for manufacturing the same |
| US7714973B2 (en) * | 2006-01-23 | 2010-05-11 | Nec Lcd Technologies, Ltd. | Liquid crystal display device and manufacturing method thereof |
| KR100820631B1 (en) | 2006-10-10 | 2008-04-11 | 엘지전자 주식회사 | Plasma display apparatus |
| US8132319B2 (en) | 2007-10-30 | 2012-03-13 | Hitachi Chemical Company, Ltd. | Circuit connecting method |
| WO2010001448A1 (en) * | 2008-06-30 | 2010-01-07 | パイオニア株式会社 | Flexible circuit board module and its manufacturing method |
| JP2010287595A (en) * | 2009-06-09 | 2010-12-24 | Fujikura Ltd | Flexible printed board, and method of manufacturing the same |
| US9247651B2 (en) | 2009-06-09 | 2016-01-26 | Fujikura Ltd. | Flexible printed circuit and method of manufacturing same |
| US20100307797A1 (en) * | 2009-06-09 | 2010-12-09 | Fujikura Ltd. | Flexible printed circuit and method of manufacturing same |
| CN101925251A (en) * | 2009-06-09 | 2010-12-22 | 株式会社藤仓 | Flexible printed circuit board and manufacture method thereof |
| JP2009258755A (en) * | 2009-07-31 | 2009-11-05 | Seiko Epson Corp | Method of manufacturing substrate connection structure, and mounting device |
| JP2011059149A (en) * | 2009-09-07 | 2011-03-24 | Hitachi Displays Ltd | Electronic device |
| EP2325861A1 (en) * | 2009-11-19 | 2011-05-25 | Lg Electronics Inc. | Plasma display device and multi plasma display device |
| US8193706B2 (en) | 2009-11-19 | 2012-06-05 | Lg Electronics Inc. | Plasma display device and multi plasma display device |
| CN103513452A (en) * | 2012-06-29 | 2014-01-15 | 北京京东方光电科技有限公司 | Method for assembling display device |
| JP2016137622A (en) * | 2015-01-27 | 2016-08-04 | 京セラ株式会社 | Thermal head and thermal printer including the same |
| WO2018123976A1 (en) * | 2016-12-28 | 2018-07-05 | 株式会社フジクラ | Wiring body assembly, wiring substrate, and touch sensor |
| TWI656468B (en) * | 2016-12-28 | 2019-04-11 | 日商藤倉股份有限公司 | Wiring body assembly, wiring substrate, and touch detector |
| CN109804720A (en) * | 2016-12-28 | 2019-05-24 | 株式会社藤仓 | Wiring body component, circuit board and touch sensor |
| JP2019050347A (en) * | 2017-09-08 | 2019-03-28 | 株式会社タムラ製作所 | Method for manufacturing electronic substrate and anisotropic conductive paste |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3804269B2 (en) | 2006-08-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6952250B2 (en) | Pressure-welded structure of flexible circuit boards | |
| JPH11288750A (en) | Joint structure of flexible wiring board | |
| JP3512655B2 (en) | Semiconductor device, method of manufacturing the same, and reinforcing tape used for manufacturing the semiconductor device | |
| TWI301318B (en) | Tab package connecting host device element | |
| KR100399379B1 (en) | Semiconductor device and process for manufacturing the same, liquid crystal module and process for mounting the same | |
| JP3850915B2 (en) | Method for reinforcing formation of flexible substrate and flexible substrate | |
| JP3998878B2 (en) | Semiconductor device, semiconductor device manufacturing method, and package manufacturing method | |
| JP3360669B2 (en) | Semiconductor package element, three-dimensional semiconductor device, and manufacturing method thereof | |
| JP2005129846A (en) | Semiconductor device and its manufacturing method, electronic module and electronic equipment | |
| JP3360445B2 (en) | Flexible wiring board connection structure | |
| JP2000269608A (en) | Flexible wiring board and display device provided therewith | |
| JPH11121682A (en) | Tape carrier package semiconductor device and liquid crystal panel display device using the same | |
| JP2001119116A (en) | Connecting structure for liquid crystal display device | |
| JP3080106B2 (en) | IC module connection method | |
| JPH10261851A (en) | Flexible substrate | |
| JP3545178B2 (en) | Disconnection test method | |
| JPH0612614Y2 (en) | Circuit board unit | |
| JPH06168985A (en) | Packaging structure of semiconductor element | |
| JP2773707B2 (en) | Manufacturing method of hybrid integrated circuit device | |
| JPH09246331A (en) | Manufacture of semiconductor device and wire pattern film using it | |
| JPH10303251A (en) | Semiconductor device | |
| JPH064581Y2 (en) | Semiconductor unit connection structure | |
| JPH01145893A (en) | Flexible printed substrate | |
| JP2816281B2 (en) | Liquid crystal display | |
| JPH07175078A (en) | Packaging structure of panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20050310 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050315 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050502 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050726 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050926 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060110 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20060202 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20060222 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060313 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20060418 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20060501 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090519 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100519 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110519 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110519 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120519 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120519 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130519 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130519 Year of fee payment: 7 |
|
| LAPS | Cancellation because of no payment of annual fees |