JPH11282997A - Ic card manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To quickly compression-bond and fix many ICs and to improve productivity in the case of electrically compression bonding and connecting the IC to a card base material. SOLUTION: This device is provided with a carrying device 2 for carrying a card assembly in which many card elements are arranged in a matrix shape, a multi-type anisotropic conductive film sticking device 11 for simultaneously transferring the anisotropic conductive film (4a) of a transfer unit carrier tape 4 to many card elements, plural independently driven type temporary compression bonding devices 16 for temporarily compression bonding and fixing the IC on the transferred anisotropic conductive film (4a) and a multi-type normal compression bonding device 21 for simultaneously and normally compression bonding many temporarily compression bonded ICs to the card elements. Then temporary compression bonding and fixing time is constituted so as to be remarkably shorter than normal compression and fixing time and the number of normal compression bonding machines 18 is arranged so as to be remarkably larger than the number of the devices 16.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing an IC card in which an anisotropic conductive film is transferred onto a base material, and then an IC is preliminarily pressure-bonded to the upper surface of the anisotropic conductive film, followed by final pressure bonding.

[0002]

2. Description of the Related Art In recent years, IC cards having a storage function, a payment function, an identity verification function (ID function), and the like have been widely used in various fields. IC cards are based on ICs (Integrated Ci
rcuit; a card on which a semiconductor integrated circuit (chip) chip is mounted, and is classified into a contact type and a non-contact type according to an interface (coupling) method with an external device. In the contact type, the card terminal connected to the IC terminal is exposed on the surface, and the IC terminal
By inserting the card into the insertion slot of the external device, information is transmitted between the IC chip and the external device through the card terminal. In the non-contact type, an antenna unit connected to an IC terminal is buried under the surface layer (laminate layer) of the card. When the IC card is inserted into an insertion slot of an external device, an IC chip and an external device are passed through the antenna unit. Information transmission between the devices is performed.

In both the contact type and the non-contact type, it is necessary to make an electrical connection between the IC terminal and the terminal on the base side. FIG. 8 is a plan view showing an example of a non-contact type IC card that makes such a connection by using an anisotropic conductive film.
FIG. 9 is a schematic sectional view illustrating the connection method.
In these figures, the base 54 of the IC card 1b is made of, for example, a hard polyester film having a thickness of about 125 μm, on which a loop-shaped antenna part 55 with a part cut off is formed by printing or the like. An anisotropic conductive film 4a is applied to the end portion by thermocompression bonding. Then, an IC 15 having a thickness of about 0.1 mm is fixed on the anisotropic conductive film 4a by thermocompression bonding, and the terminals of the IC 15 and the antenna unit 55 are connected to each other via the anisotropic conductive film 4a.
Further, a cover film 56 such as a soft polyester film having a thickness of about 0.1 mm is laminated from above the IC 15.

[0004] The anisotropic conductive film 4a is generally used to mount ultra-small electronic components on a base electric circuit (for example, power supply wiring and input / output wiring) at a high density for electrical connection. For example, it is configured by embedding and dispersing a large number of conductive particles such as metal in an extremely thin resin layer so as to penetrate vertically. Therefore, it shows conductivity in the thickness direction, but shows electrical insulation in the plane direction. When the anisotropic conductive film 4a is placed on the electric circuit of the base material and transferred by thermocompression bonding, the resin layer in the thermocompression bonded portion is melted and adhered to the base material, and the base electric circuit and the conductive particles are transferred. Is connected. Since the conductive particles in such a state only function as a kind of through-hole at the crimped portion, when the IC 15 is further placed thereon and thermocompression-bonded, the electric circuit of the base material and the terminal of the IC 15 are electrically connected. Is done. Generally, the anisotropic conductive film 4a is laminated on a support layer in consideration of handleability and supplied as an elongated composite tape, and the anisotropic conductive film 4a is cut into transfer units before or together with thermocompression bonding. Such a tape-shaped composite layer is commercially available, for example, from Hitachi Chemical Co., Ltd. under the registered trademark Anisorm, types AC-5052 (thermoplastic type) and AC-7072, 6013 (thermosetting type).

[0005]

Conventionally, an anisotropic conductive film is applied on a card-based electric circuit, an IC is mounted on the conductive film, and temporary and final press bonding is performed on the base 1 by using a base 1. I went every sheet. Therefore, it takes a lot of time to crimp and fix ICs to a large number of card bases, and there is a problem that productivity is extremely low. Therefore, an object of the present invention is to provide a new IC card manufacturing apparatus that solves such a conventional problem.

[0006]

According to an embodiment of the present invention, there is provided an IC card manufacturing apparatus, wherein a plurality of card elements 1a are arranged in a matrix in a column Y and a row X. The transfer device 2 has a transfer unit 2 on which both sides of the transfer unit carrier tape 4 are intermittently conveyed by a fixed distance in the row X direction, and a supply reel 5 of a transfer unit carrier tape 4 and a winding unit. The take-up reel 6, the head has a pressure heating device 7 attached thereto, and has a large number of unit bodies 8, and the base attachment body 9 has the large number of unit bodies 8 arranged in the column Y direction. A multi-type anisotropic conductive film which is attached to the first three-dimensional drive device 10 and simultaneously transfers the anisotropic conductive film 4a of the transfer unit carrier tape 4 to the plurality of card elements 1a in the column Y And a pressure heating device 12 is provided at the head at the end of each device, and a second three-dimensional driving device 14 is provided independently of each other. A plurality of independent drive type temporary crimping devices 16 for holding the IC 15 and temporarily fixing it on the transferred anisotropic conductive film 4a, and the temporary crimping device
It is arranged downstream in the transport direction of 16, has a number of final presses 18 provided with a pressurizing heat device 17 at the head of each tip,
The large number of final crimping machines 18 are attached to the
The main crimping device main body 19 is attached to a third three-dimensional driving device 20 and the multiple ICs 15 in the tandem Y which are preliminarily crimped are simultaneously fixed to the card element 1a. Device 21, and the temporary crimping fixing time is configured to be significantly shorter than the main crimping fixing time, and the number of the main crimping machines 18 is reduced to the number of the independently driven temporary crimping devices 16. It is arranged so as to be significantly larger than that.

According to the above IC card manufacturing apparatus, a large number of ICs 15 are attached to a card assembly 1 having a large number of card elements 1a.
Each IC 15 is independently used by a plurality of independently driven temporary crimping devices 16 to fix the anisotropic conductive film 4.
Temporarily press-fitting on a allows each one to be temporarily fixed at a predetermined position accurately. Then, a large number of the ICs 15 temporarily fixed are simultaneously fixed by the multi-type main bonding apparatus 21. The main crimping fixing time is configured to be significantly longer than the temporary crimping fixing time, and is arranged such that the number of the main crimping machines 18 is significantly larger than the number of the independently driven temporary crimping apparatuses 16. As a result, as a result, the overall operation time of the card assembly 1 in the temporary pressure bonding step and the overall operation time in the main pressure bonding step can be approximated. As a result, unnecessary waiting time is eliminated and a large number of I
C cards can be produced accurately and efficiently.

[0008] According to a second aspect of the present invention, there is provided an IC card manufacturing apparatus.
2. The apparatus according to claim 1, wherein there are at least two independent driving type temporary crimping devices 16, and the ICs 15 are respectively temporarily crimped and fixed to the card elements 1a in the column Y separated from each other by a plurality of rows in the row X direction. . The IC card manufacturing apparatus according to the second aspect is configured such that at least two independently driven temporary crimping apparatuses 16 alternately and temporarily crimp the ICs 15 to the card elements 1a in the column Y which are separated from each other by a plurality of rows in the row X direction. Therefore, the independently driven temporary crimping devices 16 that are independently driven can be arranged without interference with each other. Thus, the IC 15 can be quickly and accurately positioned and fixed to each card element 1a.

[0009]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an explanatory plan view of an IC card manufacturing apparatus, and FIG. 2 is an elevation explanatory view thereof. FIG. 3 is a view taken along the line III-III in FIG. 2, and FIG.
FIG. 5 is a view taken in the direction of arrows V-V in FIG. 2, and FIG.
It is a VI view. The IC card manufacturing apparatus of the present invention is not an individual card base constituting the IC card 1b, but a large number of card elements 1a as shown in FIG.
Are arranged in a matrix in columns and rows (in this example, six rows and seven columns). Then, as shown in FIG. 10 (b), the anisotropic conductive film 4a is simultaneously transferred to each card element 1a of the card assembly 1 by thermocompression bonding in each column, and is sequentially moved by one pitch in the row direction. After transferring the anisotropic conductive film 4a to the card element 1a, the IC 15 is thermocompression-bonded thereon as shown in FIG. 10C, and finally the card assembly is cut by a cutting device as shown in FIG. 1 is cut and separated into an IC card 1b.

FIG. 7 is a plan view schematically showing an IC card manufacturing apparatus according to the present invention. In this IC card manufacturing apparatus, a card assembly 1 (not shown in the drawing) is supplied to a card assembly supply device 22 one by one from a base material loader 57, and the card assembly 1 is placed on the card assembly supply device 22. 1 is positioned and fed to the upstream end of the transport device 2. The transporting device 2 grips both sides of the card assembly 1 in the column Y direction and transports it intermittently in the horizontal direction X by a fixed distance. Then, the card assembly 1 is conveyed to the conveying device 2 and sequentially passes through the multi-type anisotropic conductive film sticking device 11, the independently driven temporary crimping device 16, and the multi-type main crimping device 21. A number of ICs are crimped and fixed to the card element. The IC is held at the tip of an independently driven temporary crimping device 16 via an IC delivery device 45 from an IC supply device (not shown).

As shown in FIGS. 1 and 2, a card assembly supply device 22 includes an adjustment table for mounting the card assembly 1 supplied from a substrate loader (not shown), Two-dimensional drive device for adjusting the posture of the card assembly 1 obtained by a measuring device such as a television camera to adjust the posture to a normal posture, an adjustment device for adjusting the rotation angle θ, and a card assembly mounted on an adjustment table An X-direction drive motor 36 for transporting the body 1 to the multi-type anisotropic conductive film sticking apparatus 11 is provided. In FIG. 1, the multi-type anisotropic conductive film sticking device 11, the independently driven temporary crimping device 16, the multi-type main crimping device 21
Are indicated by chain lines. Further, the card assembly 1 is also indicated by a chain line in a substantially central portion of FIG.

The transport device 2 holds both ends in the Y direction of the card assembly 1 which is a flexible sheet material with a chuck 24. Referring to FIG. 6, the edge of the card assembly 1 is located between the upper surface of the column-shaped receiving member 53 raised at both ends of the connecting plate 28 and the chuck 24 provided vertically movable by the cylinder. The chuck 24 is lowered by the cylinder, and both edges of the card assembly 1 are sandwiched between the chuck 24 and the upper surface of the receiving member 53. Then, in this state, the chuck 24 and the receiving member 53 move in a direction orthogonal to the direction Y. In the movement, the connecting plate 28 integral with the chuck 24 and the like is moved by the transport motor 25, the timing belt 27, the screw shaft 35, the nut unit 26 in FIG.
Is performed by reciprocating in the X direction a predetermined distance through. When the connecting plate 28 moves downstream (to the right) in the X direction, the chuck 24 holds both edges of the card assembly 1. Next, when the connecting plate 28 moves to the upstream side (left side) in the X direction, the chuck 24 is opened, and the card assembly 1 is held there by being sucked by the air inlet / outlet hole 29 on the backup 13. Is done.

In this manner, the transport device 2 intermittently moves the card assembly 1 to the right in the X direction by a predetermined distance. An elevating table 30 is provided at the center of the transport path, and is provided by an elevating cylinder 52 so as to be vertically movable. When the card assembly 1 moves, the elevating table 30 moves down, and when the card assembly 1 stops, it rises and holds the central part thereof horizontally.

Next, a multi-type anisotropic conductive film sticking device 11
As shown in FIG. 2, the unit base 3 has a supply reel 5 for the transfer unit carrier tape 4, a take-up reel 6, and a number of unit bodies 8 with a pressure heating device 7 attached to the head. 9 are arranged in parallel in the column Y direction as shown in FIGS. And its base mounting body 9
Are attached to the first three-dimensional driving device 10. This first
The three-dimensional drive device 10 is moved in a three-dimensional XYZ-axis direction by an X-direction drive motor 36, a Y-direction drive motor 37, a Z-direction drive air cylinder 39, and a θ-direction drive motor 40,
The movement of the angle θ in the plane can be adjusted. In addition, the independent three-dimensional driving device 14 and the third three-dimensional driving device 14 in the independent driving type temporary crimping device 16 and the multi-type main crimping device 21 which are arranged on the downstream side of the multi-type anisotropic conductive film sticking device 11. 20 also moves in the three-dimensional XYZ axis directions,
It is configured such that the movement of the angle θ in the plane can be adjusted.

The multi-type anisotropic conductive film sticking device 11 applies the anisotropic conductive film 4a of the transfer unit carrier tape 4 to all of the many card elements 1a in the column Y of the card assembly 1.
Are simultaneously transferred under pressure. Prior to the transfer, the head of the unit body 8 is moved onto the anisotropic conductive film cutter 42 in the previous stage, and only the anisotropic conductive film 4a covering the surface of each transfer unit carrier tape 4 is anisotropically. The conductive film cutter 42 is cut. As a result, it is possible to transfer only the anisotropic conductive film 4a of a necessary length to the card element 1a of the card assembly 1 on the backup 13. When the anisotropic conductive film 4a is sequentially transferred to the card elements 1a in each row of the card assembly 1, the card assembly 1
Moves to the independently driven temporary crimping device 16. In this example, two independently driven temporary crimping apparatuses 16 are arranged apart from each other in the X direction. As shown in FIG. 5, each of the independently driven temporary crimping devices 16 sucks the IC on the IC delivery device 45 and sequentially and accurately positions it at a predetermined position of each card element 1a in the column direction of the card assembly 1. , And IC are temporarily fixed by pressure bonding.

The IC delivery device 45 has a pair of IC alignment devices 46, and is provided between a movable gripping piece 48 and a fixed gripping piece 49 of the IC alignment device 46 via an IC supply device not shown in FIG. The IC is positioned and held,
Then, it is sucked and held at the tip of the independently driven temporary crimping device 16. At this time, the IC transfer device 45 is intermittently reciprocated in the X direction via the X direction drive motor 36 and the screw shaft 35. Then, the right-hand independent driving type temporary crimping device 16 and the left independent driving type temporary crimping device 16 are moved on the axis of each head, and the IC is alternately supplied to both independent driving type temporary crimping devices 16. That is, when supplying to the left independently driven temporary crimping device 16, the IC located on the left side of the IC alignment device 46 in the state of FIG. When the IC is sucked, the table of the IC transfer device 45 moves to the right, and the IC on the right IC alignment device 46 is sucked to the IC.

Each of the independent driving type temporary crimping devices 16 moves in the Y direction via a Y direction driving motor 37 and a screw shaft 35. Then, the IC is sequentially supplied to the card elements 1a from the front end to the rear end of the first column of the card assembly 1 by the right side independently driven temporary crimping device 16 by way of the right side independently driven temporary crimping device. ICs are supplied to the card elements 1a from the front end to the rear end of the fourth column from 16 in order. When the temporary crimping and fixing of the ICs in both rows are completed, the card assembly moves by one row in the X direction, and the card elements 1a in the second row and the fifth row.
Are supplied in order. Next, the card assembly is further moved by one row in the X direction, and ICs are sequentially supplied to the card elements 1a in the third and sixth rows, and all card elements 1a are provided with I cards.
C is supplied.

ICs by respective independent drive type temporary crimping devices 16
Is about 1/7 of the crimping time of the main crimping described later. As an example, the time required for temporarily bonding one IC is about 3 seconds. Note that the positioning of the IC in this temporary crimping needs to be performed extremely accurately. Therefore, in the present invention, the two independent driving type temporary crimping devices 16 have independent second three-dimensional driving devices 14, respectively.
One IC is accurately positioned and temporarily fixed by pressure bonding.

Next, when the ICs are temporarily crimped and fixed to the card elements 1a in all rows, the card assembly 1 moves to the multi-type final crimping apparatus 21. The multi-type final crimping machine
Numeral 21 is provided downstream of the independent drive type temporary crimping device 16 in the transport direction, and has a large number of full crimping machines 18 each having a pressure heating device 17 provided at the head at each end, as shown in FIG. That is, a large number of the final crimping machines 18 are arranged in parallel with the main crimping device main body 19 in the column Y direction, and the main crimping device main body 19 is attached to the third three-dimensional driving device 20. Then, all the ICs 15 in each column, which are temporarily crimped to each card element 1 a of the card assembly 1, are fixed by full-pressing simultaneously with each row by the pressurizing and heating devices 17 of each of the final crimping machines 18. The time for the final pressure bonding is, for example, about 20 seconds. It should be noted that the time required for attaching the anisotropic conductive film by the multi-type anisotropic conductive film attaching device 11 is shorter than the time for the final pressure bonding.

[0020]

The operation and effect of the present invention are as follows.
A plurality of ICs 15 are crimped and fixed to a card assembly 1 having a large number of card elements 1a, and each IC 15 is individually temporarily crimped on the anisotropic conductive film 4a by a plurality of independently driven temporary crimping devices 16. By doing so, it is possible to temporarily fix those ICs accurately at predetermined positions. Then, a large number of the ICs 15 temporarily fixed are permanently fixed by the multi-type permanent bonding apparatus 21 for each row at the same time. The time for the final crimping fixation is configured to be significantly longer than the time for the temporary crimping fixation, and the number of the final crimping machines 18 is independently driven.
Since the arrangement is made so as to be significantly larger than the number of 16, the overall operation time of the card assembly 1 in the temporary compression bonding step and the overall operation time in the final compression bonding step can be made close to each other. As a result, a large number of IC cards can be efficiently and accurately produced without wasteful waiting time.

Next, in the IC card manufacturing apparatus according to the second aspect, at least two independent driving type temporary crimping devices 16 alternately and temporarily crimp the IC 15 to a plurality of card elements 1a in a row, which are spaced apart from each other in a plurality of rows. With this configuration, the independently driven temporary crimping devices 16 that are independently driven can quickly position and fix the IC 15 to each card element 1a without interfering with each other.

[Brief description of the drawings]

FIG. 1 is an explanatory plan view of an IC card manufacturing apparatus according to the present invention.

FIG. 2 is an explanatory view of the same surface.

FIG. 3 is a view taken in the direction of arrows III-III in FIG. 2;

FIG. 4 is a view taken in the direction of arrows IV-IV in FIG. 2;

FIG. 5 is a view taken in the direction of arrows VV in FIG. 2;

FIG. 6 is a view taken along the line VI-VI in FIG. 2;

FIG. 7 is a schematic plan view of the IC card manufacturing apparatus of the present invention.

FIG. 8 is a plan view of an IC card.

FIG. 9 is an exploded view of the IC card.

FIG. 10 is an explanatory diagram of a manufacturing order of the IC card of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 card assembly 1a card element 1b IC card 2 transfer device 3 unit base 4 transfer unit carrier tape 4a anisotropic conductive film 5 supply reel 6 take-up reel 7 pressure heating device 8 unit body 9 base mount 10 first tertiary Original drive device 11 Multi-type anisotropic conductive film sticking device 12 Pressurizing heat device 13 Backup 14 Second three-dimensional drive device 15 IC 16 Independently driven temporary crimping device 17 Pressurizing heat device 18 Compression device 19 Compression device Main unit 20 Third 3D drive unit 21 Multi-type final crimping unit 22 Card assembly supply unit 24 Chuck 25 Transfer motor 26 Nut unit 27 Timing belt 28 Connecting plate 29 Air inlet / outlet hole 30 Elevating table 31 Elevating shaft 32 Transport guide rail 35 Screw shaft 36 X direction drive motor 37 Y direction drive motor 39 Z direction drive air cylinder 40 θ direction drive motor 41 LM guide 42 Anisotropic conductive film cutter 43 Rotating shaft 44 Arm 45 IC delivery device 46 IC alignment device 47 Arm 48 Movable gripping piece 49 Fixed gripping piece 51 Guide rail 52 Lifting cylinder 53 Receiving member 54 Base 55 Antenna part 56 Cover film 57 Substrate loader

Claims (2)

[Claims] 1. A column Y of a card assembly 1 in which a number of card elements 1a are arranged in a matrix in a column Y and a row X.
Transfer device 2 in which both sides of the card assembly 1 are gripped and the card assembly 1 is intermittently conveyed by a certain distance in the row X direction.
Each unit base 3 has a supply reel 5 of a transfer unit carrier tape 4, a take-up reel 6, and a pressure heating device 7 attached to a head, and has a large number of unit bodies 8. A large number of unit bodies 8 are
The base mounting body 9 is mounted on the first three-dimensional driving device 10 to simultaneously apply the anisotropic conductive film 4a of the transfer unit carrier tape 4 to the plurality of card elements 1a in the column Y. A multi-type anisotropic conductive film sticking device 11 for transferring and a multi-type anisotropic conductive film sticking device 11 are arranged on the downstream side in the transport direction of the multi-type anisotropic conductive film sticking device 11. Then, the transferred anisotropic conductive film 4a is attached to the second three-dimensional driving device 14 to hold the IC 15 and
Multiple independently driven temporary crimping devices to temporarily fix it on top
16 and a plurality of final crimping machines 18 disposed downstream of the temporary crimping device 16 in the transport direction and provided with a pressurizing heat device 17 at the head at the end thereof. Crimping device body
19, the main crimping device main body 19 is arranged in parallel in the column Y direction.
Is attached to the third three-dimensional drive device 20 and is a multi-type final press bonding device 21 that simultaneously press-fits and fixes a large number of the ICs 15 in the column Y which are temporarily pressed to the card element 1a simultaneously. An IC that is configured so that the fixing time is significantly shorter than the main crimping fixing time and that the number of the main crimping machines 18 is significantly larger than the number of the independently driven temporary crimping apparatuses 16. Card manufacturing equipment. 2. The card element 1 in column Y according to claim 1, wherein there are at least two independent driving type temporary crimping devices 16, and a plurality of columns Y are separated from each other in a row X direction.
An IC card manufacturing apparatus configured to temporarily fix an IC 15 to a by pressure bonding.