JPH11220262A - Circuit part built-in module and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit part built-in module, which is high in reliability and where circuit components can be mounted high in density by a method in which an insulating board formed of a mixture containing inorganic filler and thermosetting resin is used. SOLUTION: A circuit part built-in module comprises an electrically insulating laminated board 401 composed of insulating boards 401a, 401b, and 401c, wiring patterns 402a, 402b, 402c, and 402d formed on the surface and inside of the board 401, a circuit part 403 arranged inside the board 401 and connected to the wiring pattern, and inner vias 404 which electrically connect the wiring patterns 402a, 402b, 402c, and 402d. The insulating boards 401a, 401b, and 401c are formed of a mixture which contains inorganic filler and thermosetting resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a module with a built-in circuit component, and more particularly to, for example, a module with a built-in circuit component in which circuit components are arranged inside an electrically insulating substrate.

[0002]

2. Description of the Related Art In recent years, with the demand for higher performance and smaller size of electronic equipment, higher density and higher function of circuit parts have been further called out. Therefore, there is a demand for a circuit board that is compatible with high density and high functionality of circuit components.

As a method of increasing the density of circuit components, a method of forming a multilayer circuit is conceivable. However, in a conventional glass-epoxy substrate, it is necessary to use a through-hole structure using a drill. Is difficult to deal with. For this reason, development of an inner via hole connection method capable of connecting wiring patterns between LSIs and components in the shortest distance has been advanced in various fields as a method for achieving the highest circuit density.

In the inner via hole connection method, only necessary layers can be connected, and the mountability of circuit components is excellent (JP-A-63-47991, JP-A-6-268).
345).

[0005]

However, conventionally,
The substrate used in the inner via hole connection method has a problem of low thermal conductivity because it is made of a resin-based material. In a module with built-in circuit components, the higher the mounting density of the circuit components, the higher the need to dissipate the heat generated by the components.However, conventional boards cannot sufficiently dissipate heat, and There is a problem that the reliability of the device decreases.

SUMMARY OF THE INVENTION An object of the present invention is to provide a highly reliable circuit component built-in module capable of mounting circuit components at high density and a method of manufacturing the same, in order to solve the above-mentioned conventional problems.

[0007]

In order to achieve the above object, a circuit component built-in module according to the present invention comprises a mixture containing 70% to 95% by weight (based on the mixture) of an inorganic filler and a thermosetting resin. An electrical insulating substrate comprising: a plurality of wiring patterns (one wiring pattern is formed of a group of electrical wirings formed on the same plane) formed on at least a main surface of the electrical insulating substrate; A circuit component disposed inside the conductive substrate and electrically connected to the wiring pattern; and an inner via formed in the electrically insulating substrate so as to electrically connect the plurality of wiring patterns.

In the above-mentioned module with a built-in circuit component, since the inner via hole connection is made by the inner via formed in the electrically insulating substrate, the circuit component can be mounted at a high density. Further, since the heat generated from the circuit components is quickly radiated by the inorganic filler, a highly reliable circuit component built-in module can be obtained. Further, by selecting the inorganic filler, the thermal conductivity, the coefficient of linear expansion, the dielectric constant, the withstand voltage, and the like of the electrically insulating substrate can be changed in accordance with the built-in circuit components. In a circuit component built-in module including a semiconductor element and a chip capacitor, noise of an electric signal can be reduced by shortening the distance between the semiconductor element and the chip capacitor.

In the above-mentioned module with a built-in circuit component, the wiring pattern is preferably formed on the main surface and inside of the electrically insulating substrate. When the wiring pattern has a multilayer structure, circuit components can be mounted at a higher density.

In the above-mentioned module with a built-in circuit component, the circuit component preferably includes an active component, and the inner via is preferably formed of a conductive resin composition. By including the active component in the circuit component, a circuit component having a desired function can be formed. Further, when the inner via is made of a conductive resin composition, the production becomes easy.

In the circuit component built-in module, it is preferable that the circuit component is shielded from the outside air by the electrically insulating substrate. By blocking the circuit components from the outside air, it is possible to prevent a decrease in the reliability of the circuit components due to humidity.

In the above-mentioned module with a built-in circuit component, the thermosetting resin preferably contains at least one thermosetting resin selected from an epoxy resin, a phenol resin and a cyanate resin. This is because these resins are excellent in heat resistance and electrical insulation.

In the circuit component built-in module, the inorganic filler is composed of Al ₂ O ₃ , MgO, BN, AlN and Si.
It preferably contains at least one inorganic filler selected from O ₂ . By using these inorganic fillers, an electrically insulating substrate having excellent heat dissipation properties can be obtained. When MgO is used as the inorganic filler, the coefficient of linear expansion of the electrically insulating substrate can be increased. Moreover, SiO ₂ (especially amorphous SiO ₂ ) is used as the inorganic filler.
When is used, the dielectric constant of the electrically insulating substrate can be reduced. When BN is used as the inorganic filler, the coefficient of linear expansion can be reduced.

In the circuit component built-in module, the average particle diameter of the inorganic filler is preferably 0.1 μm to 100 μm. In the circuit component built-in module, the wiring pattern preferably contains copper. Copper has a small electric resistance, so that a fine wiring pattern can be formed.

In the above-described module with a built-in circuit component, the wiring pattern preferably contains a conductive resin composition. By using the conductive resin composition, a wiring pattern can be easily formed.

In the circuit component built-in module, it is preferable that the active component includes a semiconductor bare chip, and the semiconductor bare chip is flip-chip bonded to the wiring pattern.

In the above-mentioned module with a built-in circuit component, the conductive resin composition may include metal particles containing one metal selected from gold, silver, copper and nickel as a conductive component and epoxy resin as a resin component. preferable. This is because the metal has low electric resistance, and the epoxy resin has excellent heat resistance and electric insulation.

In the above-mentioned module with a built-in circuit component, the wiring pattern is preferably formed of a lead frame of a metal plate formed by an etching method or a punching method. This is because a lead frame made of a metal plate has a low electric resistance. By using the etching method, a fine wiring pattern can be formed. By using the punching method, a wiring pattern can be formed with simple equipment.

In the circuit component built-in module, it is preferable that the circuit component includes at least one component selected from a chip-shaped resistor, a chip-shaped capacitor, and a chip-shaped inductor. By using a chip-shaped component, it can be easily embedded in an electrically insulating substrate.

In the above-described module with a built-in circuit component, the mixture desirably further contains at least one additive selected from a dispersant, a colorant, a coupling agent and a release agent. The inorganic filler in the thermosetting resin can be uniformly dispersed by the dispersant. Since the electrically insulating substrate can be colored by the coloring agent, the heat dissipation of the circuit component built-in module can be improved.
With the coupling agent, the adhesive strength between the thermosetting resin and the inorganic filler can be increased, so that the insulating properties of the electrically insulating substrate can be improved. The release agent can improve the mold releasability between the mold and the mixture, so that the productivity can be improved.

In the above-described module with built-in circuit components, the coefficient of linear expansion of the electrically insulating substrate is from 8 × 10 ⁻⁶ / ° C. to 20 × 10 ^−6.
/ ° C and the thermal conductivity of the electrically insulating substrate is 1 w / m
It is preferably from K to 10 w / mK. This is because a thermal conductivity close to that of the ceramic substrate can be obtained, and a substrate having high heat dissipation can be obtained.

According to the first method of manufacturing a module with built-in circuit components of the present invention, a mixture containing 70% to 95% by weight (based on the mixture) of an inorganic filler and a thermosetting resin in an uncured state is passed through a through-hole. Processing the first plate-like body having the following, and filling the through-hole with the thermosetting conductive material to fill the second plate-like body filled with the thermosetting conductive material into the through-hole. Forming, mounting a circuit component on one main surface of the first copper foil, and aligning and overlaying the second plate-shaped body on one main surface of the first copper foil. A step of forming a third plate-like body in which circuit components are buried by overlaying and pressing a second copper foil thereon; and heating the third plate-like body to form a thermosetting resin and A step of curing the conductive material, and forming a wiring pattern by processing the first and second copper foils And a degree. According to the first manufacturing method, the module with built-in circuit components of the present invention can be easily manufactured.

According to a second method for manufacturing a circuit component built-in module of the present invention, a mixture containing 70% to 95% by weight (based on the mixture) of an inorganic filler and an uncured thermosetting resin is passed through a through-hole. Processing the first plate-like body having the following, and filling the through-hole with the thermosetting conductive material to fill the second plate-like body filled with the thermosetting conductive material into the through-hole. Forming, forming a wiring pattern on one main surface of the first release film, mounting a circuit component on the wiring pattern, and forming a wiring pattern on one main surface of the second release film. And pressing the first release film, the second plate-like body, and the second release film in this order so that the wiring pattern faces the second plate-like body, and presses the first release film, the second plate-like body and the second release film. Forming a third plate-like body in which circuit components are embedded by A step of curing the thermosetting resin and the conductive substance by heating the third plate-like body, and a step of peeling the first and second release films from the cured third plate-like body. Including.

According to the second manufacturing method, the circuit component built-in module of the present invention can be easily manufactured.
A third method for manufacturing a circuit component built-in module according to the present invention includes:
A method for manufacturing a circuit component built-in module having a multilayer structure, comprising: mixing a mixture containing 70% by weight to 95% by weight (based on the mixture) of an inorganic filler and a thermosetting resin in an uncured state with a through hole having a through hole. Step of processing into one plate-like body and step of forming a second plate-like body filled with a thermosetting conductive substance in a through-hole by filling the through-hole with a thermosetting conductive substance. Forming a wiring pattern on one main surface of the first release film, and mounting circuit components on the wiring pattern; and providing a second plate-like body on one main surface side of the first release film. Forming a third plate-like body in which circuit components are buried by aligning and stacking and pressurizing,
Forming a fourth plate-like body by peeling the release film from the third plate-like body, aligning and stacking a plurality of fourth plate-like bodies, and further forming a wiring pattern on one main surface. The second release film on which the is formed is aligned so that the wiring pattern faces the fourth plate-shaped body, and is superposed, pressurized and heated to cure the thermosetting resin and the conductive material to form a multilayer. The method includes a step of forming a fifth plate-shaped body having a structure, and a step of peeling the second release film from the fifth plate-shaped body.

According to the third manufacturing method, the circuit component built-in module having a multilayer structure of the present invention can be easily manufactured. The fourth method for producing a module with a built-in circuit component of the present invention is a method for producing a module with a built-in circuit component having a multilayer structure.
Processing a mixture containing 5% by weight (based on the mixture) and an uncured thermosetting resin into a first plate-shaped body having a through-hole; Forming a second plate-like body in which a thermosetting conductive substance is filled in the through-hole by filling the first release film; and forming a wiring pattern on one main surface of the first release film. A third step in which the circuit component is embedded by pressing the circuit component on the first release film and aligning and pressing the second plate-shaped body on one main surface side of the first release film. A step of forming a plate-like body, a step of forming a fourth plate-like body by peeling the first release film from the third plate-like body,
By aligning and stacking a plurality of fourth plate-shaped bodies, further stacking a copper foil thereon, and pressing and heating the same, the thermosetting resin and the conductive substance are hardened to form a fifth structure having a multilayer structure. The method includes a step of forming a plate-like body and a step of processing a copper foil of the fifth plate-like body to form a wiring pattern.

According to the fourth manufacturing method, the circuit component built-in module having a multilayer structure of the present invention can be easily manufactured. In the first to fourth methods of manufacturing a module with a built-in circuit component, the circuit component includes an active component,
Preferably, the conductive substance is made of a conductive resin composition. By including the active component in the circuit component, a circuit component having a desired function can be formed. In addition, when the conductive substance is made of a conductive resin composition, it is easy to fill and harden the through-hole, so that the production is facilitated.

In the first to fourth methods of manufacturing a module with a built-in circuit component, after mounting the circuit component on the copper foil or the wiring pattern, a sealing resin is injected between the copper foil or the wiring pattern and the circuit component. Preferably, the method further includes a step. By this step, it is possible to prevent a space from being formed between the circuit component and the wiring pattern, and to strengthen the connection between the circuit component and the wiring pattern.

In the first to fourth methods for manufacturing a circuit component built-in module, the temperature at which the thermosetting resin and the conductive substance are heated and cured is preferably 150 ° C. or more and 260 ° C. or less. By heating in this temperature range, the thermosetting resin can be cured without causing significant damage to circuit components.

In the first to fourth methods for manufacturing a circuit component built-in module, when the thermosetting resin and the conductive substance are cured by heating, the thermosetting resin and the conductive substance are heated to 10 kg / cm.
It is preferable to pressurize at a pressure of ^{2 to} 200 kg / cm ² . By applying pressure while heating, a module with built-in circuit components having excellent mechanical strength can be obtained.

In the first to fourth methods for manufacturing a module with a built-in circuit component, the step of forming the first plate-like body includes the following steps:
After the mixture is formed into a plate, the plate-shaped mixture is subjected to a heat treatment at a temperature lower than the curing temperature of the thermosetting resin (for example, a temperature lower than the curing start temperature), thereby losing the tackiness of the plate-shaped mixture. Preferably, a step is included. The reason for this is that the loss of tackiness of the plate-like mixture facilitates the subsequent steps.

In the first to fourth methods of manufacturing a module with a built-in circuit component, the step of forming the third plate by embedding the circuit component in the second plate includes a step of forming the third plate with a thermosetting resin. It is preferable to carry out at a temperature lower than the curing temperature. By performing the process at a temperature lower than the curing temperature of the thermosetting resin, the thermosetting resin can be softened without being cured, so that the circuit component can be easily embedded in the second plate-shaped body. In addition, the surface of the circuit component built-in module can be smoothed.

In the first to fourth methods of manufacturing a module with a built-in circuit component, the step of mounting the circuit component on the wiring pattern includes a step of electrically and mechanically connecting the circuit component and the wiring pattern by soldering. Is preferred. According to the above process, when heating is performed to cure the thermosetting resin, it is possible to prevent the occurrence of connection failure between the circuit component and the wiring pattern due to the heating.

In the first to fourth methods of manufacturing a module with a built-in circuit component, when mounting the active component on the wiring pattern, the gold bump of the active component and the wiring pattern are electrically connected by a conductive adhesive. Is preferred. By using the conductive adhesive, it is possible to prevent poor connection and misalignment of components when heating in a later step.

In the first to fourth methods for manufacturing a circuit component built-in module, the thermosetting resin is an epoxy resin,
It preferably contains at least one thermosetting resin selected from a phenol resin and a cyanate resin. This is because these resins are excellent in heat resistance and electrical insulation.

In the first to fourth methods of manufacturing a module with a built-in circuit component, the inorganic filler may be Al ₂ O ₃ , Mg
It is preferable to include at least one inorganic filler selected from O, BN, AlN and SiO ₂ . By using these inorganic fillers, an electrically insulating substrate having excellent heat dissipation properties can be obtained. In addition, M as an inorganic filler
When gO is used, the coefficient of linear expansion of the electrically insulating substrate can be increased. Also, Si as an inorganic filler
When O ₂ (especially amorphous SiO ₂ ) is used, the dielectric constant of the electrically insulating substrate can be reduced. When BN is used as the inorganic filler, the coefficient of linear expansion can be reduced.

In the first to fourth methods of manufacturing a circuit component built-in module, the wiring pattern preferably contains copper. This is because copper has a small electric resistance and can form a fine wiring pattern.

In the first to fourth methods for manufacturing a module with a built-in circuit component, the wiring pattern preferably contains a conductive resin composition. By using the conductive resin composition, a wiring pattern can be easily formed.

In the first to fourth methods of manufacturing a module with a built-in circuit component, the circuit component preferably includes a semiconductor bare chip, and the semiconductor bare chip is preferably flip-chip bonded to a wiring pattern. By flip-chip bonding a semiconductor bare chip, semiconductor elements can be mounted at a high density.

In the first to fourth methods of manufacturing a circuit component built-in module, the conductive resin composition contains metal particles containing at least one metal selected from gold, silver, copper and nickel as a conductive component. And an epoxy resin as a resin component. This is because the metal has low electric resistance, and the epoxy resin has excellent heat resistance and electric insulation.

In the first to fourth methods of manufacturing a module with a built-in circuit component, the wiring pattern is preferably formed of a lead frame of a metal plate formed by an etching method or a punching method. This is because a lead frame made of a metal plate has a low electric resistance. By using the etching method, a fine wiring pattern can be formed. By using the punching method, a wiring pattern can be formed with simple equipment.

In the first to fourth methods of manufacturing a module with a built-in circuit component, the circuit component preferably includes at least one component selected from a chip-shaped resistor, a chip-shaped capacitor and a chip-shaped inductor. By using a chip-shaped component, the component can be easily embedded in the electrically insulating substrate.

[0042]

Embodiments of the present invention will be described below with reference to the drawings. (Embodiment 1) Embodiment 1 is an example of a circuit component built-in module of the present invention, and FIG. 1 is a perspective sectional view of a circuit component built-in module 100 of this embodiment.

Referring to FIG. 1, a circuit component built-in module 100 of this embodiment includes an electric insulating substrate 101 and wiring patterns 102a and 102b formed on one main surface and the other main surface of electric insulating substrate 101. And a circuit component 103 connected to the wiring pattern 102b and arranged inside the electrically insulating substrate 101, and an inner via 104 for electrically connecting the wiring patterns 102a and 102b.

The electrically insulating substrate 101 is made of a mixture containing an inorganic filler and a thermosetting resin. As the inorganic filler, for example, Al ₂ O ₃ , MgO, BN, AlN, SiO ₂ or the like can be used. The inorganic filler is
Preferably it is from 70% to 95% by weight of the mixture. The average particle size of the inorganic filler is from 0.1 μm
It is preferably 100 μm or less. As the thermosetting resin, for example, an epoxy resin, a phenol resin or a cyanate resin having high heat resistance is preferable. Epoxy resins are particularly preferred because of their particularly high heat resistance. The mixture may further contain a dispersant, a colorant, a coupling agent, or a release agent.

The wiring patterns 102a and 102b are
It is made of a substance having electrical conductivity, for example, a copper foil or a conductive resin composition. When a copper foil is used as the wiring pattern, for example, a copper foil having a thickness of about 18 μm to 35 μm produced by electrolytic plating can be used. Copper foil is
In order to improve the adhesiveness with the electrically insulating substrate 101, it is desirable to roughen the surface in contact with the electrically insulating substrate 101. Further, as the copper foil, a copper foil surface subjected to a coupling treatment or a copper foil surface plated with tin, zinc or nickel may be used in order to improve adhesion and oxidation resistance. In addition, a lead frame of a metal plate formed by an etching method or a punching method may be used for the wiring patterns 102a and 102b.

The circuit component 103 includes, for example, the active component 1
03a and the passive component 103b. Active component 103
As a, for example, a semiconductor element such as a transistor, an IC, or an LSI is used. The semiconductor element may be a semiconductor bare chip. As the passive component 103b, a chip resistor, a chip capacitor, a chip inductor, or the like is used. The circuit component 10
3 may not include the passive component 103b.

The wiring pattern 102b and the active component 103a
For example, flip-chip bonding is used for the connection with. The inner via 104 is made of, for example, a thermosetting conductive material. As the thermosetting conductive substance, for example, a conductive resin composition obtained by mixing metal particles and a thermosetting resin can be used. As the metal particles, gold, silver, copper, nickel, or the like can be used. Gold, silver, copper or nickel is preferable because of high conductivity, and copper is particularly preferable because of high conductivity and low migration. As the thermosetting resin, for example, an epoxy resin, a phenol resin or a cyanate resin can be used. Epoxy resins are particularly preferred because of their high heat resistance.

In the circuit component built-in module 100 shown in the first embodiment, the wiring pattern 102a and the wiring pattern 102b are connected by the inner via 104 filled in the through hole of the electrically insulating substrate 101. Therefore, in the circuit component built-in module 100, the circuit components 103 can be mounted at a high density.

In the circuit component built-in module 100, the heat generated in the circuit components is quickly conducted by the inorganic filler contained in the electrically insulating substrate 101. Therefore, a highly reliable circuit component built-in module can be obtained.

In the circuit component built-in module 100, the coefficient of linear expansion, thermal conductivity, dielectric constant, etc. of the electrically insulating substrate 101 can be easily controlled by selecting the inorganic filler used for the electrically insulating substrate 101. Can be. When the coefficient of linear expansion of the electrically insulating substrate 101 is substantially equal to that of the semiconductor element, it is possible to prevent the occurrence of cracks due to a temperature change, so that a highly reliable circuit component built-in module can be obtained. When the thermal conductivity of the electrically insulating substrate 101 is improved, a highly reliable circuit component built-in module can be obtained even when circuit components are mounted at high density.
By reducing the dielectric constant of the electrically insulating substrate 101, a high-frequency circuit module with a small dielectric loss can be obtained.

In the circuit component built-in module 100, since the circuit component 103 can be shielded from the outside air by the electrically insulating substrate 101, it is possible to prevent a decrease in reliability due to humidity.

The circuit component built-in module 1 of the present invention
No. 00 uses a mixture of an inorganic filler and a thermosetting resin as the material of the electrically insulating substrate 101, and therefore does not need to be fired at a high temperature and is easy to manufacture, unlike a ceramic substrate.

In the circuit component built-in module 100 shown in FIG. 1, the case where the wiring pattern 102a is not embedded in the electrically insulating substrate 101 is shown, but the wiring pattern 102a is embedded in the electrically insulating substrate 101. (See FIG. 3 (h)).

In the circuit component built-in module 100 shown in FIG. 1, the case where no circuit component is mounted on the wiring pattern 102a is shown.
A circuit component may be mounted thereon, and the module with a built-in circuit component may be resin-molded (the same applies to the following embodiments). By mounting the circuit components on the wiring pattern 102a, the circuit components can be mounted at a higher density.

(Embodiment 2) In Embodiment 2, FIG.
An embodiment of a method of manufacturing the circuit component built-in module shown in FIG. The materials and circuit components used in the second embodiment are the same as those described in the first embodiment.

FIGS. 2A to 2H are cross-sectional views showing one embodiment of a process for manufacturing a circuit component built-in module. First, as shown in FIG. 2A, a plate-like mixture 200 is formed by processing a mixture containing an inorganic filler and a thermosetting resin. The plate-shaped mixture 200 can be formed by mixing an inorganic filler and an uncured thermosetting resin into a paste-like kneaded material, and molding the paste-like kneaded material to a certain thickness.

The plate-like mixture 200 may be heat-treated at a temperature lower than the curing temperature of the thermosetting resin. By performing the heat treatment, the tackiness can be removed while maintaining the flexibility of the mixture 200, so that the subsequent processing is facilitated. Further, in a mixture in which a thermosetting resin is dissolved by a solvent, a part of the solvent can be removed by heat treatment.

Thereafter, as shown in FIG. 2B, a through-hole 201 is formed at a desired position of the mixture 200 to form a plate having the through-hole 201 formed therein. The through-hole 201 can be formed by, for example, laser processing, processing by a drill, or processing by a mold. Laser processing is preferable because the through holes 201 can be formed at a fine pitch and no shavings are generated. In laser processing, processing is easy if a carbon dioxide gas laser or an excimer laser is used. The through-holes 201 may be formed at the same time as the plate-shaped mixture 200 is formed by molding the paste-like kneaded material.

Thereafter, as shown in FIG. 2C, the through hole 201 is filled with the conductive resin composition 202 to form a plate-like body in which the through hole 201 is filled with the conductive resin composition 202. I do.

As shown in FIG. 2D, a circuit component 204 is flip-chip bonded to the copper foil 203 in parallel with the steps shown in FIGS. The circuit component 204 is
It is electrically connected to the copper foil 203 via the conductive adhesive 205. For example, gold,
What kneaded silver, copper, silver-palladium alloy, etc. with a thermosetting resin can be used. Also, instead of the conductive adhesive 205, bumps or solder bumps formed by a gold wire bonding method are previously formed on the circuit component side,
The heat treatment dissolves the gold or solder and causes the circuit component 204 to melt.
It is also possible to implement Furthermore, it is also possible to use a solder bump and a conductive adhesive together.

The circuit components 20 mounted on the copper foil 203
4 and the copper foil 203 (in the following embodiment, the sealing resin is injected between the circuit component and the copper foil or between the circuit component and the wiring pattern). Is also the same). By injecting the sealing resin, it is possible to prevent a gap from being formed between the semiconductor element and the wiring pattern when the semiconductor element is embedded in the plate-like body in a later step. An underfill resin used for normal flip chip bonding can be used as the sealing resin.

A copper foil 206 is formed in parallel with the steps shown in FIGS. After that, as shown in FIG. 2F, the copper foil 203 on which the circuit component 204 is mounted, and FIG.
And the copper foil 206 are aligned and overlapped.

Thereafter, as shown in FIG. 2 (g), the circuit components 2
After forming a plate-like body in which the conductive resin composition 2 is embedded, the mixture 200 and the conductive resin composition 2 are heated.
02 is cured to form a plate in which the circuit component 204 is embedded. Heating is performed at a temperature (for example, 150 ° C. to 260 ° C.) or higher at which the thermosetting resin in the mixture 200 and the conductive resin composition 202 cures, and the mixture 200 becomes the electrically insulating substrate 207 and the conductive resin composition The object becomes the inner via 208. By this step, the copper foils 203 and 206, the circuit component 204, and the electrically insulating substrate 207 are mechanically and strongly bonded. Further, the copper foils 203 and 2 are formed by the inner via 208.
06 is electrically connected. At the time of curing the thermosetting resin in the mixture 200 and the conductive resin composition 202 by heating, while heating 10 kg / cm ² to 2
By applying a pressure of 00 kg / cm ² , the mechanical strength of the circuit component module can be improved (the same applies to the following embodiments).

Thereafter, as shown in FIG.
03 and 206 are processed to form wiring patterns 209 and 210. Thus, the module with a built-in circuit component described in the first embodiment is formed. According to the manufacturing method, the module with a built-in circuit component described in the first embodiment can be easily manufactured.

In the second embodiment, the conductive resin composition 202 is used as the conductive material to be filled in the through hole 201. However, any conductive material may be used as long as it is a thermosetting conductive material. is there).

(Embodiment 3) In Embodiment 3, FIG.
Another embodiment of the method for manufacturing the circuit component built-in module shown in FIG. The materials and circuit components used in the third embodiment are the same as those described in the first embodiment.

FIGS. 3A to 3H are cross-sectional views showing the steps of manufacturing the circuit component built-in module according to the third embodiment. First, as shown in FIG. 3A, a plate-shaped mixture 300 is formed by processing a mixture containing an inorganic filler and a thermosetting resin. Since this step is the same as that in FIG. 2A, the overlapping description will be omitted.

Thereafter, as shown in FIG. 3B, through holes 301 are formed at desired positions of the mixture 300. Since this step is the same as that in FIG. 2B, the duplicate description will be omitted.

Thereafter, as shown in FIG. 3C, the through-hole 301 is filled with the conductive resin composition 302 to form a plate-like body in which the through-hole 301 is filled with the conductive resin composition 302. I do.

In parallel with the steps of FIGS. 3A to 3C, as shown in FIG. 3D, a wiring pattern 303 is formed on a release film 305, and a circuit component 304 is formed on the wiring pattern 303. Implement. The method of mounting the circuit component 304 is as follows.
Since the method is the same as the method described with reference to FIG. 2D, a duplicate description will be omitted. The release film 305 includes, for example,
A film of polyethylene terephthalate or polyphenylene sulfite can be used. Wiring pattern 3
03 can be formed, for example, by bonding a copper foil to the release film 305 and then performing a photolithography process and an etching process. Further, as the wiring pattern 303, a lead frame of a metal plate formed by an etching method or a punching method may be used.

In parallel with the steps of FIGS. 3A to 3C, a wiring pattern 306 is formed on the release film 307 as shown in FIG. The wiring pattern 306 can be formed in the same manner as the wiring pattern 303.

Thereafter, as shown in FIG. 3 (f), the release film 305, FIG.
The plate-like body (c) and the release film 307 are aligned and stacked.

After that, as shown in FIG. 3 (g), the thermosetting resin in the mixture 300 and the conductive resin composition 302 is cured by pressurizing and heating the aligned and superposed ones, thereby forming a circuit. A plate-like body in which the component 304 and the wiring patterns 303 and 306 are embedded is formed. Heating is performed at a temperature equal to or higher than the temperature at which the thermosetting resin in the mixture 300 and the conductive resin composition 302 is cured (for example, 15 ° C.).
(0 ° C. to 260 ° C.), the mixture 300 becomes the electrically insulating substrate 308, and the conductive resin composition 302 becomes the inner via 309. The wiring patterns 303 and 306 are electrically connected by the inner via 309.

Thereafter, as shown in FIG. 3 (h), the release films 305 and 307 are peeled off from the plate of FIG. 3 (g). Thus, the module with a built-in circuit component described in the first embodiment is formed. According to the manufacturing method, the module with a built-in circuit component described in the first embodiment can be easily manufactured.

In this method, since the release film 307 on which the wiring pattern 306 is formed in advance is used,
The wiring pattern 306 is embedded in the electrically insulating substrate 308, so that a circuit component built-in module having a flat surface can be manufactured.
Since the surface is flat, components can be mounted on the wiring pattern 306 with high density, so that circuit components can be mounted with higher density.

(Embodiment 4) In Embodiment 4, an embodiment of a circuit component built-in module having a multilayer structure according to the present invention will be described. FIG. 4 is a perspective sectional view of the circuit component built-in module 400 according to the fourth embodiment.

Referring to FIG. 4, a circuit component built-in module 400 of this embodiment has
01a, 401b and 401c, and wiring patterns 402a, 402b and 402c formed on the main surface and inside of the insulating substrate 401.
And 402d, a circuit component 403 disposed inside the electrically insulating substrate 401 and connected to the wiring pattern 402a, 402b or 402c, and a wiring pattern 402a,
402b, 402c, and 402d, and an inner via 404 that electrically connects them.

The electrically insulating substrates 401a, 401b and 401c are made of a mixture containing an inorganic filler and a thermosetting resin. Examples of the inorganic filler include Al ₂ O ₃ ,
MgO, BN, AlN, SiO ₂ or the like can be used. 70% by weight of inorganic filler based on the mixture
Preferably it is ~ 95% by weight. The average particle diameter of the inorganic filler is preferably from 0.1 μm to 100 μm. As the thermosetting resin, for example, an epoxy resin, a phenol resin or a cyanate resin having high heat resistance is preferable. Epoxy resins are particularly preferred because of their particularly high heat resistance. The mixture may further contain a dispersant, a colorant, a coupling agent, or a release agent.

The wiring patterns 402a, 402b, 402
Since c and 402d are the same as the wiring patterns 102a and 102b described in the first embodiment, duplicate description will be omitted.

The circuit component 403 includes, for example, the active component 4
03a and passive components 403b. As the active component 403a, for example, a semiconductor element such as a transistor, an IC, and an LSI is used. The semiconductor element may be a semiconductor bare chip. As the passive component 403b, a chip-shaped resistor, a chip-shaped capacitor, a chip-shaped inductor, or the like is used. The circuit component 403 is
The case where the passive component 403b is not included may be sufficient.

Wiring patterns 402a, 402b and 4
For example, flip chip bonding is used to connect the active component 403a to the active component 403a. Inner Via 4
04 is made of, for example, a thermosetting conductive substance. As the inner via 404, for example, a conductive resin composition in which metal particles and a thermosetting resin are mixed can be used. As a material of the metal particles, a metal such as gold, silver, copper, or nickel can be used. Gold, silver, copper or nickel is preferable because of high conductivity, and copper is particularly preferable because of high conductivity and low migration. As the thermosetting resin, for example, epoxy resin,
Phenolic or cyanate resins can be used. Epoxy resins are particularly preferred because of their high heat resistance.

The circuit component built-in module 400 shown in FIG.
Although the case where it is not buried in 01c is shown, the wiring pattern 402d may be buried in the electrically insulating substrate 401c (see FIG. 6 (g)).

Although FIG. 4 shows the circuit component built-in module 400 having a three-layer structure, the circuit component built-in module 400 may have a multilayer structure according to the design (the same applies to the following embodiments). (Fifth Embodiment) In a fifth embodiment, an embodiment of a method of manufacturing the circuit component built-in module shown in the fourth embodiment will be described. The materials and circuit components used in the fifth embodiment are the same as those described in the fourth embodiment.

Referring to FIG. 5, an example of a method for manufacturing the circuit component built-in module shown in the fourth embodiment will be described. FIG.
(A)-(h) is sectional drawing which shows the manufacturing process of the module with built-in circuit components of this embodiment.

First, as shown in FIG. 5 (a), a plate-shaped mixture 500 is formed by processing a mixture containing an inorganic filler and a thermosetting resin, and the conductive resin composition 501 is placed in the through holes. By filling, a plate-like body in which the conductive resin composition 501 is filled in the through holes is formed. This step is the same as the step described with reference to FIGS. 2A to 2C, and thus, duplicate description will be omitted.

On the other hand, a wiring pattern 506 is formed on the release film 503, and the active component 5 is formed on the wiring pattern 506.
04 and the passive component 505 are mounted. This step is the same as that described with reference to FIG. 3D, and a duplicate description will be omitted.

Thereafter, as shown in FIG.
After the plate-like body and the release film 503 in (a) were aligned and overlapped and pressed, the release film 503 was peeled off, so that the wiring pattern 506, the active component 504, and the passive component 505 were embedded. Form a plate.

In parallel with the steps shown in FIGS. 5A and 5B, a plurality of plate-like bodies in which wiring patterns 506 and circuit components are embedded are formed in the same steps as FIGS. 5A and 5B. (See FIGS. 5C and 5D and FIGS. 5E and 5F). Note that the wiring pattern 506 and the circuit components are different for each layer according to the design.

Thereafter, as shown in FIG.
The plate bodies of (b), (d) and (f) are aligned and stacked, and a copper foil 507 is further stacked on the main surface of the plate body of FIG. 5 (f) where no wiring pattern is formed.

Thereafter, as shown in FIG.
The plate and the copper foil 507 overlapped in (g) are pressed and heated to form a plate having a multilayer structure. The heating is performed at a temperature equal to or higher than the temperature at which the thermosetting resin in the mixture 500 and the conductive resin composition 501 is cured (for example, 15 ° C.).
(0 ° C. to 260 ° C.), the mixture 500 becomes the electrically insulating substrate 508, and the conductive resin composition 501 becomes the inner via 509. By this step, the circuit components 504 and 505, the copper foil 507, and the electrically insulating substrate 508 are mechanically and firmly bonded. The wiring pattern 506 and the copper foil 507 are electrically connected by the inner via 509. After that, the copper foil 507 is processed to form the wiring pattern 510.

Thus, a circuit component built-in module having a multilayer structure can be formed. According to the above-described manufacturing method, a circuit component built-in module having a multilayer structure can be easily manufactured.

(Embodiment 6) In Embodiment 6, another embodiment of the method of manufacturing the circuit component built-in module described in Embodiment 4 will be described. The materials and circuit components used in the sixth embodiment are the same as those described in the fourth embodiment.

Referring to FIG. 6, an example of a method for manufacturing a circuit component built-in module in this embodiment will be described. 6 (a) to 6 (g) are cross-sectional views showing the steps of manufacturing the circuit component built-in module according to this embodiment.

First, as shown in FIG. 6A, a mixture containing an inorganic filler and a thermosetting resin is processed to form a plate-like mixture 600, and the through-hole is filled with a conductive material 601. Thereby, a plate-like body in which the conductive resin composition 601 is filled in the through holes is formed. This step is
This is the same as that described with reference to FIGS. 2A to 2C, and redundant description will be omitted. On the other hand, a wiring pattern 606 is formed on the release film 603, and the active component 604 and the passive component 605 are mounted on the wiring pattern 606. This step is the same as that described with reference to FIG. 3D, and a duplicate description will be omitted.

Thereafter, as shown in FIG.
After the plate-shaped mixture 600 of (a) and the release film 603 are aligned and overlapped and pressed, the release film 603 is pressed.
Is peeled off to form a plate-like body in which the wiring pattern 606, the active component 604, and the passive component 605 are embedded.

In parallel with the steps of FIGS. 6A and 6B, a plate-like body in which the wiring pattern 606 and circuit components are embedded is formed in the same steps as in FIGS. 6A and 6B. (See FIGS. 6C and 6D). Note that the wiring pattern 606 and the circuit components are different for each layer according to the design.

In parallel with the steps of FIGS. 6A and 6B, a wiring pattern 607 is formed on the release film 603 as shown in FIG. 6E. Then, FIG.
As shown in FIG. 6 (f), the plate-shaped members of FIGS. 6 (b) and 6 (d) are aligned and overlapped, and the plate-shaped member of FIG. And FIG.
The release film 603 of (e) is overlaid so that the wiring pattern 607 is on the inside.

Thereafter, as shown in FIG.
By pressing and heating the plate-like body and the release film 603 stacked in (f), a plate-like body having a multilayer structure is formed. The heating is performed at a temperature (for example, 150 ° C. to 260 ° C.) or higher at which the thermosetting resin in the mixture 600 and the conductive resin composition 601 is cured, and the mixture 600 becomes an electrically insulating substrate 608 and The object 601 becomes the inner via 609. By this step, the active component 604, the passive component 605, the wiring patterns 606 and 607, and the electrically insulating substrate 608 are mechanically and strongly bonded. The wiring patterns 606 and 607 are electrically connected by the inner via 609.

Thereafter, the release film 603 is peeled off from the plate-like body having the multilayer structure, thereby forming the circuit component built-in module having the multilayer structure. Thus, according to the above-described manufacturing method, a circuit component built-in module having a multilayer structure can be easily manufactured.

[0100]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described. (Example 1) An example of a method for producing an electrically insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin in producing the module with a built-in circuit component of the present invention will be described.

In this example, an electrically insulating substrate was produced with the composition shown in Table 1. A comparative example is shown in Sample No. 1.

[0102]

[Table 1]

In this example, the liquid epoxy resin includes:
Epoxy resin (WE-20) manufactured by Nippon Pernox Co., Ltd.
25, including an acid anhydride-based curing agent). As the phenol resin, a phenol resin (Phenolite, VH4150) manufactured by Dainippon Ink and Chemicals, Inc. was used. As the cyanate resin, a cyanate resin manufactured by Asahi Ciba Co., Ltd. (AroCy, M
-30) was used. In this example, carbon black or a dispersant was added as an additive.

For the production of the plate-like body, first, a predetermined amount of a paste-like mixture mixed with the composition shown in Table 1 is dropped on a release film. The paste-like mixture was prepared by mixing the inorganic filler and the liquid thermosetting resin for about 10 minutes with a stirring mixer. The stirring and mixing machine used is a device in which an inorganic filler and a liquid thermosetting resin are charged into a container having a predetermined capacity and revolved while rotating the container itself. Even if the viscosity of the mixture is relatively high, sufficient dispersion can be achieved. The state is obtained.
A 75 μm-thick polyethylene terephthalate film was used as the release film, and the film surface was subjected to release treatment with silicon.

Next, the release film is further superimposed on the paste-like mixture on the release film, and a thickness of 50 μm is pressed by a press.
The mixture was pressed to 0 μm to obtain a plate-like mixture.
Next, the plate-shaped mixture sandwiched between the release films was heated together with the release film, and heat-treated under the condition that the plate-shaped mixture became non-tacky. The heat treatment is held at a temperature of 120 ° C. for 15 minutes. By this heat treatment, the adhesiveness of the plate-shaped mixture is lost, so that the release film can be easily separated.
The liquid epoxy resin used in this example had a curing temperature of 1
Since it is 30 ° C., it is in an uncured state (B stage) under these heat treatment conditions.

Next, the release film was peeled from the plate-like mixture, and the plate-like mixture was sandwiched between heat-resistant release films (PPS: polyphenylene sulphite, thickness 75 μm).
The plate-shaped mixture was cured by heating at a temperature of 170 ° C. while applying a pressure of 50 kg / cm ² .

Next, the heat-resistant release film was peeled off from the cured plate-like mixture to obtain an electrically insulating substrate. This electrically insulating substrate was processed into a predetermined size, and the thermal conductivity, the coefficient of linear expansion, and the like were measured. Thermal conductivity is 10
The surface of the sample cut into a square of mm was heated by bringing it into contact with a heater, and was calculated from the temperature rise on the opposite surface. The linear expansion coefficient was obtained by measuring a dimensional change of the electrically insulating substrate when the temperature was increased from room temperature to 140 ° C., and was obtained from an average value of the dimensional change. The dielectric strength was obtained by calculating the dielectric strength when an AC voltage was applied in the thickness direction of the electrically insulating substrate, and calculating the dielectric strength per unit thickness.

As shown in Table 1, it was manufactured by the above method.
The electrically insulating substrate was made of Al as an inorganic filler._TwoO_ThreeFor
If you have a conventional glass-epoxy substrate (thermal conductivity
0.2 w / mK to 0.3 w / mK)
It was about 10 times or more. Al _TwoO_Three85% by weight or more
By setting the thermal conductivity to 2.8 w / mK or more,
We were able to. Al_TwoO_ThreeIs the advantage of low cost
There is also.

Further, AlN, MgO are used as inorganic fillers.
In the case of using Al, thermal conductivity equal to or higher than that in the case of using Al ₂ O ₃ was obtained. When amorphous SiO ₂ was used as the inorganic filler, the linear expansion coefficient was closer to that of a silicon semiconductor (linear expansion coefficient: 3 × 10 ⁻⁶ / ° C.). Therefore, an electrically insulating substrate using amorphous SiO ₂ as an inorganic filler is preferable as a flip-chip substrate on which a semiconductor is directly mounted.

When SiO ₂ was used as the inorganic filler, an electrically insulating substrate having a low dielectric constant was obtained.
SiO ₂ also has the advantage of low specific gravity. A circuit component built-in module using SiO ₂ as an inorganic filler is preferable as a high-frequency module such as a mobile phone.

When BN was used as the inorganic filler, an electrically insulating substrate having a high thermal conductivity and a low coefficient of linear expansion was obtained. As shown in the comparative example (sample number 1) in Table 1, except for the case where 60% by weight of Al ₂ O ₃ was used as the inorganic filler, the withstand voltage of the electrically insulating substrate was 10 kV.
/ Mm or more. The withstand voltage of the electrically insulating substrate is an index of the adhesiveness between the inorganic filler, which is a material of the electrically insulating substrate, and the thermosetting resin. That is, if the adhesiveness between the inorganic filler and the thermosetting resin is poor, a minute gap is generated therebetween, and the withstand voltage decreases. Such a small gap causes a decrease in the reliability of the module with a built-in circuit component. In general, if the dielectric strength is 10 kV / mm or more, it can be determined that the adhesion between the inorganic filler and the thermosetting resin is good. Therefore, the amount of the inorganic filler is preferably 70% by weight or more.

When the content of the thermosetting resin is low, the strength of the electrically insulating substrate is reduced.
It is preferably at least 8% by weight. (Example 2) Example 2 is an example in which a circuit component built-in module is manufactured by the method described in the second embodiment.

The composition of the electrically insulating substrate used in this example was as follows: Al ₂ O ₃ (AS-40, manufactured by Showa Denko KK, spherical, average particle diameter: 12 μm): 90% by weight, liquid epoxy resin (Nippon Rec. 9.5-wt% of carbon black (manufactured by Toyo Carbon Co., Ltd.).
2% by weight, and 0.3% by weight of a coupling agent (manufactured by Ajinomoto Co., Inc., titanate, 46B).

By treating the above material under the same conditions as in Example 1, a plate-like body (thickness: 500 μm) was produced. The plate was cut into a predetermined size, and a through hole (diameter: 0.15 mm) for connecting to an inner via hole was formed using a carbon dioxide gas laser (see FIG. 2B).

The through holes were filled with a conductive resin composition by screen printing (see FIG. 2C). The conductive resin composition is composed of 85% by weight of spherical copper particles, 3% by weight of a bisphenol A type epoxy resin (manufactured by Yuka Shell Epoxy, Epicoat 828), and a glycidyl ester-based epoxy resin (YD-171 manufactured by Toto Kasei). ) 9% by weight and 3% by weight of amine adduct curing agent (manufactured by Ajinomoto, MY-24)
And kneaded.

Next, one side of a copper foil having a thickness of 35 μm was roughened, and a semiconductor element was flip-chip bonded to the roughened surface using a conductive adhesive (see FIG. 2D). Next, the copper foil on which the semiconductor element was mounted, the plate-like body filled with the conductive resin composition, and the separately prepared copper foil (thickness of one side of the copper foil was 35 μm) were aligned. It overlapped (refer FIG.2 (f)). At this time, the copper foil was overlapped so that the roughened surface was on the plate-like body side.

Next, this was heated and pressed by a hot press at a press temperature of 120 ° C. and a pressure of 10 kg / cm ² for 5 minutes. Heating at a temperature lower than the curing temperature softens the thermosetting resin in the plate-shaped body, so that the semiconductor element was easily buried in the plate-shaped body.

Next, the heating temperature was raised to 175 ° C. for 6 hours.
Heated for 0 minutes (see FIG. 2 (g)). By this heating, the epoxy resin in the plate and the epoxy resin in the conductive resin composition were cured, and the semiconductor element and the copper foil were mechanically and firmly connected to the plate. In addition, by this heating, the conductive resin composition and the copper foil were electrically (inner-via connected) and mechanically connected.

Next, the copper foil on the surface of the plate-like body in which the semiconductor element was embedded was etched by a photolithography step and an etching step to form a wiring pattern (FIG. 2).
(H)). Thus, a circuit component built-in module was created.

A solder reflow test and a temperature cycle test were performed to evaluate the reliability of the module with a built-in circuit component manufactured according to this example. The solder reflow test uses a belt-type reflow tester, and the maximum temperature is 260
The cycle was repeated 10 times at 10 ° C. for 10 times.
In the temperature cycle test, after holding at 125 ° C. for 30 minutes,
The process of holding at a temperature of −60 ° C. for 30 minutes was performed by repeating 200 cycles.

In both the solder reflow test and the temperature cycle test, no cracks occurred in the circuit component built-in module of this example, and no particular abnormality was observed even when the ultrasonic flaw detector was used. From this test, it can be seen that the semiconductor element and the electrically insulating substrate are firmly adhered. Also, the resistance value of the inner via connection by the conductive resin composition hardly changed before and after the start of the test.

Example 3 Example 3 is an example in which a circuit component built-in module was manufactured by the method described in the third embodiment.

First, in the same manner as in Example 2, a plate-like body (thickness: 500 μm) in which the conductive resin composition was filled in the through hole was provided.
m) (see FIG. 3 (c)). Next, a release film (made of polyphenylene sulphite, thickness 150 μm)
Then, a copper foil having a thickness of 35 μm was bonded with an adhesive. This copper foil was roughened on one side and bonded so that the glossy side was on the adhesive side.

Next, the copper foil on the release film is etched by a photolithography process and an etching process.
A wiring pattern was formed. Further, a semiconductor element was flip-chip bonded on this wiring pattern using solder bumps (see FIG. 3D).

Next, a sealing resin was injected into a gap between the semiconductor element mounted on the wiring pattern and the wiring pattern. Specifically, a hot plate heated to 70 ° C. is tilted, a release film having a wiring pattern on which a semiconductor element is mounted is placed on the hot plate, and then a syringe is gradually inserted between the semiconductor element and the wiring pattern. Was injected with a sealing resin.
The sealing resin could be injected between the semiconductor element and the wiring pattern in about 10 seconds. The reason for heating with a hot plate is to lower the viscosity of the sealing resin so that the resin can be injected in a short time. In addition, the hot plate is inclined to facilitate injection. EL18B manufactured by Techno Alpha Co., Ltd. was used as the sealing resin. EL18B is a resin obtained by mixing SiO ₂ powder in a one-part epoxy resin.

On the other hand, in parallel with the above step, a release film (made of polyphenylene sulphite, thickness 150 μm) having a wiring pattern formed on one side was prepared in the same manner as the above step (see FIG. 3E). .

Next, the release film having the semiconductor element bonded thereto, the plate-like body in which the conductive resin composition is filled in the through holes, and the release film having the wiring pattern formed on one side are aligned. (See FIG. 3 (f)).

Next, this was heated and pressed by a hot press at a press temperature of 120 ° C. and a pressure of 10 kg / cm ² for 5 minutes. Heating at a temperature lower than the curing temperature softened the thermosetting resin in the plate, so that the semiconductor element and the wiring pattern were easily buried in the plate.

Next, the heating temperature was raised to 175 ° C. for 6 hours.
Heated for 0 minutes (see FIG. 3 (g)). By this heating, the plate-like body and the epoxy resin in the conductive resin composition are cured, so that the semiconductor element and the wiring pattern are mechanically and firmly connected to the plate-like body. Further, by this heating, the conductive resin composition and the wiring pattern were electrically (inner-via connected) and mechanically connected. Further, by this heating, the sealing resin injected between the semiconductor element and the wiring pattern was also cured.

Next, the release film was peeled off from the plate (see FIG. 3 (h)). The release film made of polyphenylene sulfite has heat resistance higher than the above heating temperature. Further, the roughened surface of the copper foil is bonded to the plate-like body and the inner via, and the glossy surface of the copper foil is bonded to the release film.
Therefore, since the adhesive strength between the plate-like body and the inner via and the copper foil is greater than the adhesive strength between the release film and the copper foil, only the release film can be peeled off. Thus, a circuit component built-in module was created.

In order to evaluate the reliability of the circuit component built-in module manufactured in Example 3, a solder reflow test and a temperature cycle test were performed under the same conditions as in Example 2.

In both the solder reflow test and the temperature cycle test, no crack occurred in the circuit component built-in module of Example 3, and no particular abnormality was observed even when the ultrasonic flaw detector was used. From this test, it can be seen that the semiconductor element and the electrically insulating substrate are firmly adhered. Also, the resistance value of the inner via connection by the conductive resin composition hardly changed before and after the start of the test.

(Embodiment 4) This embodiment 4 is a modification of the fifth embodiment.
7 is an example in which a circuit component built-in module having a multilayer structure is manufactured by the method described in 1).

In Example 4, semiconductor elements and chip parts were used as circuit parts. First, a plate-like body in which the conductive resin composition was filled in the through hole was formed in the same manner as in Example 2.

Next, the plate-like body in which the conductive resin composition is filled in the through-hole and the release film (made of polyphenylene sulphite) having the wiring pattern to which the circuit components are flip-chip bonded are aligned. (See FIG. 5A).

Next, this is pressed by a hot press machine.
Temperature 120 ° C, pressure 10kg / cm ^TwoFor 5 minutes
did. By heating at a temperature lower than the curing temperature,
Since the thermosetting resin in the interior softens, circuit components
Buried easily. And release the film from the plate
By peeling, a plate-like body with embedded circuit components is formed.
(See FIG. 5B).

A plurality of the plate-like bodies were prepared, and a plurality of plate-like bodies were prepared.
The body and the copper foil were aligned and stacked (see FIG. 5 (g)).
See). Next, this was pressed by a hot press at a press temperature of 1
75 ° C, pressure 50kg / cm ^TwoPress and heat for 60 minutes
Was. The circuit components were buried by this heating and pressing process.
A plurality of plate-like bodies and copper foil are integrated into one plate-like body.
Been formed. By this heating and pressing treatment, the plate-shaped body and
The epoxy resin in the conductive resin composition cures to form circuit components.
And the wiring pattern and the plate are mechanically firmly connected.
Was. The heat and pressure treatment also causes the copper foil and distribution
The line pattern and the conductive resin composition are electrically (inner
A connection), mechanically connected.

Next, a wiring pattern was formed by etching the copper foil on the surface of the plate-like body in which the circuit components were embedded by a photolithography step and an etching step (see FIG. 5H). Thus, a circuit component built-in module having a multilayer structure was manufactured.

In order to evaluate the reliability of the circuit component built-in module manufactured in Example 4, a solder reflow test and a temperature cycle test were performed under the same conditions as in Example 2.

In both the solder reflow test and the temperature cycle test, no cracks occurred in the circuit component built-in module of Example 4, and no particular abnormality was observed even when the ultrasonic flaw detector was used. From this test, it can be seen that the semiconductor element and the electrically insulating substrate are firmly adhered. Also, the resistance value of the inner via connection by the conductive resin composition hardly changed before and after the start of the test.

(Embodiment 5) This embodiment 5 corresponds to the embodiment 6
7 is an example in which a circuit component built-in module having a multilayer structure is manufactured by the method described in 1).

First, a plate-like body in which the conductive resin composition was filled in the through hole was formed in the same manner as in Example 2. Next, a plate-like body filled with a conductive resin composition in the through-hole,
A release film (made of polyphenylene sulphide) having a wiring pattern to which circuit components were flip-chip bonded was aligned and overlaid (see FIG. 6A).

Next, this is pressed by a hot press machine.
Temperature 120 ° C, pressure 10kg / cm ^TwoFor 5 minutes
did. By heating at a temperature lower than the curing temperature,
Since the thermosetting resin in the interior softens, circuit components
Buried easily. And release the film from the plate
A plate was formed by peeling (see FIG. 6B).
See). Similarly, formed a plate-shaped body with embedded circuit components
(See FIG. 6D).

Next, a wiring pattern was formed on one side of the release film (made of polyphenylene sulphite) (FIG. 6).
(E)). Next, the two plate-like bodies in which the circuit components were embedded and the release film on which the wiring pattern was formed were aligned and overlapped (see FIG. 6F).

Next, this is pressed by a hot press machine.
Temperature 175 ° C, pressure 50kg / cm ^TwoHeating for 60 minutes
Pressed. This heating and pressurizing process embeds circuit components
The plurality of plate-shaped objects and the release film are
Two platelets were formed. By this heat and pressure treatment,
The epoxy resin in the plate is cured, and circuit components and wiring
The pattern and the plate were firmly connected mechanically. Ma
In addition, by this heat and pressure treatment, air in the conductive resin composition is removed.
The epoxy resin cures and the wiring pattern and conductive resin composition
And electrical (inner via connection), mechanically connected
Was.

Next, the release film was peeled off from the integrated plate-like body to produce a circuit component built-in module having a multilayer structure (see FIG. 6 (g)). In order to evaluate the reliability of the module with a built-in circuit component manufactured in Example 5, a solder reflow test and a temperature cycle test were performed under the same conditions as in Example 2.

In both the solder reflow test and the temperature cycle test, no crack occurred in the circuit component built-in module of Example 5, and no particular abnormality was observed even when the ultrasonic flaw detector was used. From this test, it can be seen that the semiconductor element and the electrically insulating substrate are firmly adhered. Also, the resistance value of the inner via connection by the conductive resin composition hardly changed before and after the start of the test.

[0148]

As described above, the circuit component built-in module of the present invention uses an electrically insulating substrate made of a mixture of an inorganic filler and a thermosetting resin and uses an inner via hole connection method. Circuit components can be mounted at a high density and heat dissipation is high. Therefore, in the circuit component built-in module of the present invention, a circuit component built-in module having high reliability in which circuit components are mounted at a high density can be obtained.

In the circuit component built-in module of the present invention, the circuit component can be mounted at a higher density by adopting a multilayer structure. Furthermore, in the circuit component built-in module of the present invention, it is possible to control the thermal conductivity, the coefficient of linear expansion, the dielectric constant, and the like of the electrically insulating substrate by selecting the inorganic filler. Therefore, in the module with a built-in circuit component of the present invention, the coefficient of linear expansion of the electrically insulating substrate can be made substantially the same as that of the semiconductor element. Further, since the thermal conductivity of the electrically insulating substrate can be improved, it is preferable as a circuit component built-in module having a built-in semiconductor element or the like that requires heat radiation. Further, since the dielectric constant of the electrically insulating substrate can be reduced, it is preferable as a circuit component built-in module for a high-frequency circuit.

According to the method of manufacturing a module with a built-in circuit component of the present invention, the module with a built-in circuit component can be easily manufactured. In the method for manufacturing a module with a built-in circuit component according to the present invention, since the wiring pattern can be embedded in the electrically insulating substrate by using the release film having the wiring pattern formed thereon, the module with the built-in circuit component has a smooth surface. Is obtained. Therefore, when circuit components are further mounted on the wiring pattern on the surface, the circuit components can be mounted at a high density.

[Brief description of the drawings]

FIG. 1 is a perspective sectional view showing an embodiment of a circuit component built-in module of the present invention.

FIG. 2 is a process chart showing one embodiment of a method for manufacturing a circuit component built-in module of the present invention.

FIG. 3 is a process chart showing another embodiment of the method for manufacturing a circuit component built-in module of the present invention.

FIG. 4 is a perspective sectional view showing another embodiment of the circuit component built-in module of the present invention.

FIG. 5 is a process chart showing another embodiment of the method for manufacturing a circuit component built-in module of the present invention.

FIG. 6 is a process chart showing another embodiment of the method for manufacturing a circuit component built-in module of the present invention.

[Explanation of symbols]

100, 400 Circuit component built-in module 101, 401, 401a, 401b, 401c
Electrical insulating substrates 102a, 102b, 402a, 402b, 402c,
402d Wiring pattern 103, 403 Circuit component 103a, 403a Active component 103b, 403b Passive component 104, 404 Inner via

Claims (35)

[Claims] 1. An electrically insulating substrate made of a mixture containing 70% to 95% by weight of an inorganic filler and a thermosetting resin; a plurality of wiring patterns formed on at least a main surface of the electrically insulating substrate; A circuit component disposed inside the electrically insulating substrate and electrically connected to the wiring pattern; and an inner via formed in the electrically insulating substrate so as to electrically connect the plurality of wiring patterns. A module with built-in circuit components. 2. The circuit component built-in module according to claim 1, wherein the wiring pattern is formed on a main surface and inside of the electrically insulating substrate. 3. The circuit component built-in module according to claim 1, wherein the circuit component includes an active component, and the inner via is made of a conductive resin composition. 4. The module with built-in circuit components according to claim 1, wherein the circuit components are shielded from the outside air by the electrically insulating substrate. 5. The circuit component built-in module according to claim 1, wherein said thermosetting resin includes at least one thermosetting resin selected from an epoxy resin, a phenol resin and a cyanate resin. 6. The method according to claim 1, wherein the inorganic filler is Al ₂ O ₃ , Mg.
O, the circuit component built-in module according to any one of claims 1 to 4 comprising at least one inorganic filler selected BN, from AlN and SiO _2. 7. An inorganic filler having an average particle size of 0.1.
The particle size is from μm to 100 μm.
The circuit component built-in module according to any one of the above. 8. The module according to claim 1, wherein the wiring pattern includes copper. 9. The circuit component built-in module according to claim 1, wherein the wiring pattern includes a conductive resin composition. 10. The semiconductor device according to claim 3, wherein the active component includes a semiconductor bare chip, and the semiconductor bare chip is flip-chip bonded to the wiring pattern.
A circuit component built-in module according to item 1. 11. The conductive resin composition according to claim 3, wherein the conductive resin composition contains metal particles containing one metal selected from gold, silver, copper and nickel as a conductive component, and an epoxy resin as a resin component. 10. The module with built-in circuit components according to any one of 9. 12. The circuit component built-in module according to claim 1, wherein the wiring pattern is formed of a lead frame of a metal plate formed by an etching method or a punching method. 13. The circuit component built-in module according to claim 1, wherein the circuit component includes at least one component selected from a chip-shaped resistor, a chip-shaped capacitor, and a chip-shaped inductor. 14. The circuit component built-in module according to claim 1, wherein the mixture further includes at least one additive selected from a dispersant, a colorant, a coupling agent, and a release agent. 15. The electric insulating substrate having a linear expansion coefficient of 8
The circuit component according to any one of claims 1 to 4, wherein the circuit component is × 10 ⁻⁶ / ° C. to 20 × 10 ⁻⁶ / ° C., and the thermal conductivity of the electrically insulating substrate is 1 w / mK to 10 w / mK. Built-in module. 16. 70% to 95% by weight of inorganic filler
Processing a mixture containing a thermosetting resin and a thermosetting resin in an uncured state into a first plate-shaped body having a through-hole; and filling the through-hole with a thermosetting conductive material to form a thermosetting resin. Forming a second plate-like body filled with the conductive substance in the through-hole; mounting a circuit component on one main surface of a first copper foil; A third plate-like body in which the circuit component is embedded by positioning and overlaying the second plate-like body on one main surface, and further overlaying and pressing a second copper foil thereon; Forming a wiring pattern; heating the third plate-shaped body to cure the thermosetting resin and the conductive substance; and processing the first and second copper foils to form a wiring pattern. Forming a circuit component built-in module. 17. 70% to 95% by weight of inorganic filler
Processing a mixture containing a thermosetting resin and a thermosetting resin in an uncured state into a first plate-shaped body having a through-hole; and filling the through-hole with a thermosetting conductive material to form a thermosetting resin. Forming a second plate-like body filled with the conductive material in the through-hole; forming a wiring pattern on one main surface of the first release film;
A step of mounting a circuit component on the wiring pattern; a step of forming a wiring pattern on one main surface of a second release film; the first release film, the second plate-like body, and the second 2
The release film is aligned in this order such that the wiring pattern faces the second plate-shaped body, and the laminate is pressed to form a third plate-shaped body in which the circuit components are embedded. Heating the third plate-shaped body to cure the thermosetting resin and the conductive material; and curing the first and second release films in the third cured state.
Peeling off from the plate-like body of the above. 18. A method for manufacturing a module with a built-in circuit component having a multilayer structure, comprising: mixing a mixture containing 70% by weight to 95% by weight of an inorganic filler and a thermosetting resin in an uncured state; Forming a second plate-like body filled with a thermosetting conductive material in the through-hole by filling the through-hole with a thermosetting conductive material. Forming a wiring pattern on one main surface of the first release film;
A step of mounting a circuit component on the wiring pattern; and a step of positioning and overlaying the second plate-shaped body on the one main surface side of the first release film, and pressing the circuit component. A step of forming a buried third plate-like body; a step of forming a fourth plate-like body by peeling the first release film from the third plate-like body; The fourth plate-shaped body is aligned and overlapped, and a second release film having a wiring pattern formed on one main surface is further positioned so that the wiring pattern faces the fourth plate-shaped body. A step of forming a fifth plate-like body having a multilayer structure by curing the thermosetting resin and the conductive material by applying pressure and heating, and forming the second release film into the fifth Peeling off from the plate-like body Manufacturing method of module with built-in circuit components. 19. A method for manufacturing a module with a built-in circuit component having a multilayer structure, comprising: mixing a mixture containing 70% by weight to 95% by weight of an inorganic filler and a thermosetting resin in an uncured state; Forming a second plate-like body filled with a thermosetting conductive material in the through-hole by filling the through-hole with a thermosetting conductive material. Forming a wiring pattern on one main surface of a first release film and mounting a circuit component on the wiring pattern; and forming the first release film on the one main surface side of the first release film. By aligning the two plate-like bodies and overlapping and pressing,
Forming a third plate having the circuit component embedded therein; and forming a fourth plate by peeling the first release film from the third plate. By aligning and stacking the plurality of fourth plate-like bodies, further stacking a copper foil thereon, and pressing and heating, the thermosetting resin and the conductive material are hardened to form a multilayer structure. A method for manufacturing a module with a built-in circuit component, comprising: a step of forming a fifth plate-shaped body having the same; and a step of forming a wiring pattern by processing the copper foil of the fifth plate-shaped body. 20. The method according to claim 16, wherein the circuit component includes an active component, and the conductive material is formed of a conductive resin composition. 21. The method according to claim 16, further comprising, after mounting the circuit component on the copper foil or the wiring pattern, injecting a sealing resin between the copper foil or the wiring pattern and the circuit component. 20. The method of manufacturing a module with built-in circuit components according to any one of 19 to 19. 22. A temperature at which the thermosetting resin and the conductive material are cured by heating to 150 ° C. or higher and 260 ° C.
20. The method for manufacturing a module with built-in circuit components according to claim 16, wherein the temperature is lower than or equal to ° C. 23. When the thermosetting resin and the conductive substance are cured by heating, 10 kg /
Claim pressurized at a pressure of cm ² ~200kg / cm ² 16
20. The method for manufacturing a module with built-in circuit components according to any one of claims to 19. 24. The step of forming the first plate-like body,
17. The method according to claim 16, further comprising a step of heat-treating the plate-like mixture at a temperature lower than a curing temperature of the thermosetting resin after the mixture is formed into a plate-like shape, thereby causing the plate-like mixture to lose tackiness. 20. The method for manufacturing a module with built-in circuit components according to any one of claims to 19. 25. The step of forming the third plate by embedding the circuit component in the second plate at a temperature lower than the curing temperature of the thermosetting resin. 20. The method of manufacturing a module with built-in circuit components according to any one of 16 to 19. 26. The method according to claim 16, wherein the step of mounting the circuit component on the wiring pattern comprises a step of electrically and mechanically connecting the circuit component and the wiring pattern by soldering. Of manufacturing a module with built-in circuit components. 27. When mounting the active component on the wiring pattern, gold bumps of the active component and the wiring pattern are electrically connected by a conductive adhesive.
20. The method of manufacturing a circuit component built-in module according to any one of 6 to 19. 28. The thermosetting resin is an epoxy resin,
20. At least one thermosetting resin selected from a phenol resin and a cyanate resin.
The method for producing a circuit component built-in module according to any one of the above. 29. The method according to claim 29, wherein the inorganic filler is Al ₂ O ₃ , Mg
O, BN, method for manufacturing a circuit component built-in module according to any one of claims 16 to 19 comprising at least one inorganic filler selected from AlN and SiO _2. 30. The method according to claim 16, wherein the wiring pattern contains copper. 31. The method according to claim 16, wherein the wiring pattern includes a conductive resin composition. 32. The method according to claim 20, wherein the circuit component includes a semiconductor bare chip, and the semiconductor bare chip is flip-chip bonded to the wiring pattern. 33. The conductive resin composition according to claim 20, wherein the conductive resin composition includes metal particles containing at least one metal selected from gold, silver, copper and nickel as a conductive component, and an epoxy resin as a resin component. 3. The method for producing a module with built-in circuit components according to claim 1. 34. The method for manufacturing a circuit component built-in module according to claim 16, wherein said wiring pattern is formed of a lead frame of a metal plate formed by an etching method or a punching method. 35. The circuit component according to claim 16, wherein the circuit component includes at least one component selected from a chip-shaped resistor, a chip-shaped capacitor, and a chip-shaped inductor.
10. The method for manufacturing a circuit component built-in module according to any one of the above items 9.