JPH11144904A - Chip electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent solders used for adjacent electrode parts from contacting each other, by forming one or more groove parts completely traversing a surface part of a board, and passing between two electrode parts arranged closely to each other with no electric element body existing between the electrode parts. SOLUTION: A connection electrode body 4A has a surface electrode 5a formed on the surface of an end part of a board 1, a back side electrode 5b formed on the backside of the end of the board 1, an end surface electrode 5c, and a plating layer 6 covering the surface electrode 5a, the backside electrode 5b and the end surface electrode 5c. The end surface electrode 5c formed to extend between the surface electrode 5a and the backside electrode 5b, over a recessed part 1a having a semicircular cross section formed on a lateral part of the board 1 and extending in the direction of thickness of the board 1. On the surface part of the board 1, three groove parts 8... passing between two adjacent electrode parts 4A and 4A arrayed along one end part and between two electrode parts 4B and 4B arrayed along the other end part and facing the electrode parts 4A and 4A are formed on each of both sides of the board 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to chip electronic components such as chip resistors and chip capacitors.

[0002]

2. Description of the Related Art In general, a chip electronic component has a plurality of electrodes formed on a substrate made of an insulating material by using a printing technique and a plating technique, and is electrically connected to these electrodes to form a resistor or a dielectric. Is formed on a substrate. For example, chip electronic components consisting of multiple chip resistors are:
A plurality of electrode portions are formed on one end surface of the substrate at intervals along the end surface, and a plurality of electrode portions are formed on the other end surface of the substrate so as to face the plurality of electrode portions, respectively. To form Then, a resistor is formed so as to straddle between a pair of opposing electrode portions, and is manufactured. Such multiple chip resistors are mounted on the circuit board by soldering the respective electrode portions to predetermined positions on the circuit board. However, when soldering is performed in this manner, there is a possibility that the solders used for the adjacent electrode portions of the multiple chip resistor may erroneously come into contact with each other to cause a short circuit. Therefore,
Conventionally, a groove extending in the thickness direction of the substrate between adjacent electrode portions has been provided on the side of the substrate. By providing such a groove, the creepage distance between adjacent electrode portions is increased, and mutual contact of the solders used for the adjacent electrode portions can be prevented.

[0003]

However, providing such a groove extending in the thickness direction of the substrate on the side of the substrate is troublesome, and there has been a problem that the manufacture of chip electronic components becomes complicated.

An object of the present invention is to provide a chip electronic component which can prevent mutual contact of solders used for adjacent electrode portions and can be easily manufactured.

It is another object of the present invention to provide a chip electronic component which can prevent mutual contact of platings used when forming adjacent electrode portions.

[0006]

According to the present invention, an electrode portion is formed on a substrate made of an insulating material by using a printing technique and a plating technique, and a resistor, a dielectric, or the like electrically connected to the electrode section. A chip electronic component in which an electric element body is formed on at least one surface of a substrate is to be improved. In the present invention,
One or more grooves are formed in the surface portion of the substrate without any electric element body therebetween and passing completely between the two electrode portions disposed close to each other and completely across the surface portion of the substrate. When the groove is formed as in the present invention, the creepage distance between adjacent electrode portions can be increased. Therefore, when soldering the electrode portion to the circuit board or forming the plated electrode portion, it is possible to prevent the solder or the plating used for the adjacent electrode portions from coming into contact with each other. Particularly, in the present invention, since the groove is formed so as to completely cross the surface portion of the substrate, the groove for extending the creeping distance between the adjacent electrode portions can be easily formed.

A specific example of a chip electronic component for forming a plated electrode portion is a substrate made of an insulating material such as ceramics, and a pair of surfaces formed by using a conductive paste at both ends of the surface of the substrate. An electrode, a pair of back electrodes formed using a conductive paste on the back surface of the substrate so as to face the pair of front electrodes, and a straddle between the facing front electrode and the back electrode with the substrate interposed therebetween. A pair of end face electrodes formed using a conductive paste, an electric element body such as a resistor or a dielectric formed so as to straddle between the pair of surface electrodes, and formed using an insulating paste material An overcoat that covers the electrical element body, and at least one or more plating layers that cover the front surface electrode, the back surface electrode, and the end surface electrode. Then, one or more grooves are formed on the back surface of the substrate, passing between the pair of back electrodes and completely crossing the back surface. With this configuration of the chip electronic component, the creepage distance between one back electrode and the other back electrode can be increased by the groove. Therefore, it is possible to prevent the plating that forms the plating layer that covers one back electrode and the plating that forms the plating layer that covers the other back electrode from coming into contact with each other.

Preferably, two or more such grooves are formed, and an insulating layer made of an insulating paste material is formed on the back surface of the substrate located between two adjacent grooves.
By doing so, the creeping distance between one back electrode and the other back electrode can be further increased.

In a specific example of a multi-chip electronic component in which an electrode portion is soldered to a circuit board, one end surface of a substrate made of an insulating material such as ceramic is provided with an interval along the end surface. A plurality of electrode portions are formed using printing technology and plating technology, and a plurality of electrode portions are formed on the other end surface of the substrate so as to face the plurality of electrode portions formed on one end surface, respectively. Are formed using a printing technique and a plating technique, and an electric element body such as a resistor or a dielectric is formed on a surface of a substrate so as to extend between a pair of opposed electrode portions. Then, on the surface portion of the substrate, between two adjacent electrode portions of the plurality of electrode portions arranged along one end portion and between two electrode portions arranged along the other end portion and opposed to the two electrode portions. Each extends to form a groove across the surface portion. By configuring a multi-chip electronic component in this way,
The groove portion can increase the creepage distance between two adjacent electrode portions at one end or the other end. Therefore, when soldering the electrode portions to predetermined positions on the circuit board and attaching the multiple chip electronic component to the circuit board, it is possible to prevent the solders used for the adjacent electrode portions from being inadvertently contacting each other. Can be. Further, migration between two adjacent electrode portions can be prevented. In particular, since the groove is formed so as to cross the surface portion of the substrate, the creepage distance between adjacent electrode portions can be easily increased. For example, in the case where a multi-chip electronic component is manufactured by taking a large number of pieces using a large substrate material, there is an advantage that a groove for extending the creepage distance can be formed simultaneously with the slit for dividing the substrate.

The multiple chip electronic component includes a front electrode formed on the surface of the substrate using a conductive paste, a back electrode formed on the back surface of the substrate using the conductive paste, and a substrate. An electrode portion is formed from an end surface electrode formed so as to straddle the front surface electrode and the back surface electrode which are opposed to each other. The end surface electrode is formed on a side portion of the substrate and extends over a concave portion extending in the thickness direction of the substrate. Are formed. In this type of multi-chip electronic component, there is a high possibility that the solder adheres to the region of the electrode portion close to the electric element body, and that the solders used for the two adjacent electrode portions contact each other by mistake. Become. In addition, migration between two adjacent electrode portions is likely to occur. Therefore, the effect of the present invention is enhanced.

[0011]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing an embodiment of a chip electronic component of the present invention applied to a multiple chip resistor. FIG. 1 is a schematic plan view of a multiple chip resistor according to the present embodiment, and FIG.
FIG. 3 is a schematic partial cross-sectional view taken along a line. As shown in both figures, the multiple chip resistor of the present embodiment is configured by forming a plurality of (four) resistor component portions 2 on a substrate 1 made of an insulating material such as ceramics. I have. As shown in the lowermost resistor configuration portion 2 in FIG.
A resistor 3 and connection electrode bodies 4A, 4A electrically connected to the resistor 3 and formed on both ends of the substrate 1, respectively.
B. Since the connection electrode bodies 4A and 4B have the same structure, the connection electrode body 4
The structure of the connection electrode bodies 4A and 4B will be described with reference to FIG. The connection electrode body 4A includes a surface electrode 5a formed on the surface of the end of the substrate 1, a back electrode 5b formed on the back surface of the end of the substrate 1, an end surface electrode 5c, and these surface electrodes 5a. , Plating layer 6 covering back electrode 5b and end face electrode 5c
And The end face electrode 5c is formed in a concave portion 1 formed on a side portion of the substrate 1 and extending in the thickness direction of the substrate 1 and having a semicircular cross section.
a is formed so as to extend over the front electrode 5a and the back electrode 5b. The front electrode 5a and the back electrode 5b
It is formed by printing and firing a conductive paste made of resin silver containing silver powder in a thermosetting resin. The end face electrode 5c is formed by plating or the like.
The plating layer 6 includes a lower plating layer 6a having a thickness of 4 to 5 μm made of Ni plating or Ni · Cr plating, and Cu plating having good solder wettability formed on the lower plating layer 6a.
The upper plating layer 6b is made of Ag plating or Au plating and has a thickness of 4 to 5 μm.

As described above, in the multiple chip resistor, a plurality of electrode portions 4A are formed on one end surface of the substrate 1 at intervals along the end surface, and the other end portion is formed. A plurality of electrode parts 4B are formed on the surface of each part so as to face the electrode parts 4A. And resistor 3
Are a pair of electrode portions 4A, 4A facing the surface of the resistor substrate.
B is formed so as to extend between the respective surface electrodes 5a, 5a. The resistor 3 is formed by printing a paste containing ruthenium oxide, and is covered with an overcoat 7 including a glass coat for facilitating trimming and a protective resin coat for covering the glass coat. ing.

On a surface portion of the substrate 1, two adjacent electrode portions 4 of a plurality of electrode portions 4A arranged along one end are provided.
A and 4A, and along the other end, the electrode portions 4A and 4
Three grooves 8 are formed on both sides of the substrate 1 so as to extend between the two electrode portions 4B, 4B facing each other and cross the surface portion. The groove 8 has a V-shaped cross section. The specific dimensions of the cross section are such that the length l1 of the side of the opening on the surface of the substrate 1 is 0.1 mm, and the lengths l2, l2 of the two sides forming the V-shape are each 0.3 mm.

In this embodiment, the creepage distance between two adjacent electrode portions 4A, 4A or 4B, 4B can be extended by 0.5 mm (2 × 12−11) by the groove portion 8. Therefore, when soldering the electrode portions 4A..., 4B... To predetermined positions on the circuit board and attaching the multiple chip resistor to the circuit board, respectively, between the adjacent electrode portions 4A and 4A or between the adjacent electrode portions 4B and 4B. It is possible to prevent the used solders from contacting each other by mistake. Particularly, in this example, the substrate 1
Recess 1a extending in the thickness direction of substrate 1 formed on the side of
Since the end face electrode 5c is formed so as to extend upward,
When the multiple chip resistors are mounted on the circuit board, the solder adheres to the regions of the electrode portions 4A and 4B close to the resistor 3.
Therefore, there is a high possibility that the solders will erroneously come into contact with each other. In addition, migration between two adjacent electrode portions is likely to occur. Therefore, the effect of the groove 8 is enhanced. Further, since the groove 8 is formed so as to cross the surface portion of the substrate 1, the adjacent electrode portion 4 can be easily formed.
The creepage distance between A and 4A or between 4B and 4B can be increased. For example, in the case of manufacturing a multiple chip resistor by taking a large number of pieces using a large-sized substrate material, there is an advantage that the groove 8 for extending the creepage distance can be formed simultaneously with the slit for dividing the substrate.

FIG. 3 is a schematic sectional view of a chip electronic component according to another embodiment of the present invention applied to a chip resistor.
As shown in the figure, a chip resistor according to the present embodiment includes a substrate 11 made of an insulating material such as a ceramic, and a substrate 1.
A pair of surface electrodes 15a, 15a formed using conductive paste at both ends of the front surface of the substrate 1 and a pair of surface electrodes 15a, 15a formed on the back surface of the substrate 11 using the conductive paste. A pair of back electrodes 15b, 15b
A pair of end surface electrodes 15c, 15c formed by using a conductive paste, respectively, over the front surface electrode 15a and the back surface electrode 15b opposed to each other with the substrate 11 therebetween, and between the pair of front surface electrodes 15a, 15a. And an overcoat 17 formed of a glass coat and a resin coat and covering the resistor 12, a surface electrode 15a, and a back electrode 15b.
And two plating layers 16, 16 covering the end surface electrodes 15c. The back surface of the substrate 11 has three grooves 18A to 18C passing between the pair of back electrodes 15b and 15b and completely crossing the back surface. Groove 18
Each of A to 18C has a V-shaped cross section, similarly to the multiple chip resistor shown in FIGS. The insulating layers 19 are formed on the back surface of the substrate 11 located between the adjacent grooves 18A and 18B and between the grooves 18B and 18C. The insulating layer 19 is formed of an insulating paste material made of a glaze-based polyimide resin, and the back electrode 1 is mounted so that a chip resistor can be attached to a circuit board.
It has a thickness substantially equal to 5b. According to the present embodiment, the creepage distance between one back electrode 15b and the other back electrode 15b can be extended by grooves 18A to 18C and insulating layers 19, 19. Therefore, it is possible to prevent the plating forming the plating layer 16 covering the one back electrode 15b and the plating forming the plating layer 16 covering the other back electrode 15b from coming into contact with each other.

[0016]

According to the present invention, the creeping distance between adjacent electrode portions can be increased. Therefore, when soldering the electrode portion to the circuit board or forming the plated electrode portion, it is possible to prevent the solder or the plating used for the adjacent electrode portions from coming into contact with each other. Particularly, in the present invention, since the groove is formed so as to completely cross the surface portion of the substrate, the groove for extending the creeping distance between the adjacent electrode portions can be easily formed.

[Brief description of the drawings]

FIG. 1 is a schematic plan view of a multiple chip resistor according to the present embodiment.

FIG. 2 is a schematic partial cross-sectional view of a multiple chip resistor according to the present embodiment.

FIG. 3 is a schematic sectional view of a chip electronic component according to another embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 1,11 Substrate 2 Resistor component 3,12 Resistor 4A, 4B Connection electrode body 5a, 15a Surface electrode 5b, 15b Back electrode 5c, 15c End electrode 6,16 Plating layer 7,17 Overcoat 8 ..., 18A ~ 18C Groove 19 Insulation layer

Claims (5)

[Claims] An electrode part is formed on a substrate made of an insulating material using a printing technique and a plating technique, and an electric element such as a resistor or a dielectric electrically connected to the electrode part is formed on the substrate. A chip electronic component formed on at least one surface, wherein the electric element body does not exist between the surface portions of the substrate and passes through between the two electrode portions arranged close to each other. A chip electronic component, wherein one or more grooves are formed completely across the surface portion of the substrate. 2. A substrate made of an insulating material such as ceramics, a pair of front electrodes formed by using a conductive paste on both ends of the front surface of the substrate, and a pair of front electrodes facing the back surface of the substrate. A pair of back electrodes formed using a conductive paste, and a pair formed using a conductive paste over the front electrode and the back electrode facing each other with the substrate interposed therebetween. An end face electrode, an electric element body such as a resistor or a dielectric formed so as to extend between the pair of surface electrodes, and an overcoat formed using an insulating paste material and covering the electric element body. And a chip electronic component comprising at least one or more plating layers covering the front surface electrode, the rear surface electrode, and the end surface electrode, wherein the rear surface of the substrate passes between the pair of rear electrodes and the rear surface. A chip electronic component, wherein one or more grooves are formed completely across the part. 3. The one or more groove portions are formed two or more, and an insulating layer made of an insulating paste material is formed on a back surface portion of the substrate located between two adjacent groove portions. Item 3. A chip electronic component according to item 2. 4. A plurality of electrode portions are formed on one end surface of a substrate made of an insulating material such as ceramics at intervals along the end surface by using a printing technique and a plating technique. On the other end surface, a plurality of electrode portions are formed using a printing technique and a plating technique so as to respectively face the plurality of electrode portions formed on the one end surface, and are formed on the surface of the substrate. Is a multiple chip electronic component in which an electric element body such as a resistor or a dielectric is formed so as to straddle between a pair of the opposing electrode portions. The surface portion extends between two adjacent electrode portions of the plurality of electrode portions arranged along an edge of the electrode portion and between two electrode portions opposed to the two electrode portions arranged along the other end portion. Characterized by a groove that crosses Chip electronic components. 5. An electrode section comprising: a front electrode formed on the surface of the substrate using a conductive paste; a back electrode formed on the back surface of the substrate using a conductive paste; And an end surface electrode formed so as to straddle the front surface electrode and the back surface electrode facing each other. The end surface electrode extends on a concave portion formed on a side portion of the substrate and extending in a thickness direction of the substrate. The chip electronic component according to claim 4, wherein the chip electronic component is formed as follows.