JPH11121808A - Device for led display - Google Patents
Device for led displayInfo
- Publication number
- JPH11121808A JPH11121808A JP9282036A JP28203697A JPH11121808A JP H11121808 A JPH11121808 A JP H11121808A JP 9282036 A JP9282036 A JP 9282036A JP 28203697 A JP28203697 A JP 28203697A JP H11121808 A JPH11121808 A JP H11121808A
- Authority
- JP
- Japan
- Prior art keywords
- light
- substrate
- resin
- wavelength
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
Landscapes
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、ＬＥＤを光源として
白色光を含む任意の色の光を一定面積の照射面に対して
略均一な輝度により照射することができる面光源を構成
するＬＥＤ表示用デバイスに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED display which constitutes a surface light source capable of irradiating light of an arbitrary color including white light to an irradiation surface of a constant area with substantially uniform luminance using an LED as a light source. For devices.
【０００２】[0002]
【従来の技術】近年、小型化及び低消費電力化の要請に
従い、表示用光源としてＬＥＤが多数用いられている。
一般的な表示用光源では、形状や面積が任意の照射面に
対して、任意の色の光を十分な輝度の光で照射すること
が要求され、これはＬＥＤを用いた表示用光源において
も同様である。2. Description of the Related Art In recent years, in accordance with demands for miniaturization and low power consumption, many LEDs have been used as display light sources.
In general display light sources, it is required to irradiate light of an arbitrary color with light of sufficient luminance to an irradiation surface having an arbitrary shape and area, and this is also required for a display light source using LEDs. The same is true.
【０００３】このため、従来より発光する光の波長が異
なる種々のＬＥＤが製品化されており、特開平５−１５
２６０９号公報には、ステム上において青色以下の波長
の光を発光する発光素子をモールドする樹脂中に、発光
素子の光の波長を変換する蛍光材料を添加することによ
り、輝度の高い白色光を発光するようにしたＬＥＤが開
示されている。[0003] For this reason, various types of LEDs having different wavelengths of emitted light have been commercialized conventionally, and are disclosed in
No. 2609 discloses a white light having high luminance by adding a fluorescent material for converting the light wavelength of the light emitting element to a resin for molding the light emitting element which emits light having a wavelength of blue or less on the stem. An LED that emits light is disclosed.
【０００４】また、特開平７−９９３４５号公報には、
発光素子を載置したカップ内に波長変換材料を含有した
第１の樹脂を充填した後、第１の樹脂を第２の樹脂によ
って包囲することにより、波長変換された光をカップの
内面において反射させて波長変換光の輝度及び集光効率
を向上するようにしたＬＥＤが開示されている。[0004] Also, JP-A-7-99345 discloses that
After filling the first resin containing the wavelength conversion material into the cup on which the light emitting element is mounted, the wavelength-converted light is reflected on the inner surface of the cup by surrounding the first resin with the second resin. There is disclosed an LED in which the brightness and the light collection efficiency of the wavelength-converted light are improved.
【０００５】したがって、これら従来のＬＥＤの構成に
よれば、発光素子の光の波長、及び、波長変換材料を適
当に選択することにより、任意の色の光を発光するＬＥ
Ｄを得ることができる。[0005] Therefore, according to the configuration of these conventional LEDs, by appropriately selecting the wavelength of light of the light emitting element and the wavelength conversion material, an LE that emits light of any color can be obtained.
D can be obtained.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、従来の
ＬＥＤの構成によれば、任意の色について輝度の高い光
を照射する光源を得ることはできるものの、複数の発光
素子によって一定面積の照射面に光を照射する光源を構
成する場合、個々の発光素子が一定径のモールドにより
包囲されているために発光素子の密度を十分に高くでき
ないこと、及び、個々のＬＥＤにおいて集光効率が高め
られることから、一定面積の照射面に対して均一な輝度
の光を照射することができない問題がある。However, according to the structure of the conventional LED, it is possible to obtain a light source for irradiating high-brightness light for an arbitrary color, but it is necessary to provide a light-emitting surface having a fixed area by a plurality of light-emitting elements. When configuring a light source for irradiating light, the density of the light emitting elements cannot be sufficiently increased because each light emitting element is surrounded by a mold having a constant diameter, and the light collection efficiency of each LED is increased. Therefore, there is a problem that it is not possible to irradiate light with uniform brightness to an irradiation surface having a fixed area.
【０００７】また、従来のモールド型のＬＥＤでは、発
光素子に対する配線用のステム及びポストを構成するリ
ードフレームが樹脂モールドの底面から下方に延出して
おり、このリードフレームの干渉により、複数の発光素
子を配置する際の自由度が低く、任意の形状の光源を容
易に構成することができない問題があった。In a conventional molded LED, a lead frame constituting a wiring stem and a post for a light emitting element extends downward from a bottom surface of a resin mold. There is a problem that the degree of freedom in arranging the elements is low, and a light source of an arbitrary shape cannot be easily configured.
【０００８】この発明の目的は、複数の発光素子の配置
密度を十分に高くすることができるようにして一定面積
の照射面に対して均一な輝度の光を照射することができ
るとともに、任意の形状の光源を容易に構成することが
できるＬＥＤ表示用デバイスを提供することにある。SUMMARY OF THE INVENTION It is an object of the present invention to make it possible to sufficiently increase the arrangement density of a plurality of light emitting elements, to irradiate light with uniform luminance to an irradiation surface having a fixed area, and to provide an arbitrary light. An object of the present invention is to provide an LED display device that can easily form a light source having a shape.
【０００９】[0009]
【課題を解決するための手段】請求項１に記載した発明
は、回路を形成した任意の形状及び面積のプリント基板
上に青色光の波長以下の波長の光を発光する複数の発光
素子を配置し、各発光素子を波長変換材料が含有された
透光性樹脂によって被覆したことを特徴とする。According to the first aspect of the present invention, a plurality of light emitting elements that emit light having a wavelength equal to or less than the wavelength of blue light are arranged on a printed circuit board having an arbitrary shape and area on which a circuit is formed. Each light-emitting element is covered with a light-transmitting resin containing a wavelength conversion material.
【００１０】請求項１に記載した発明においては、基板
上に配置された短波長光を発光する複数の発光素子が波
長変換材料を含有した透光性樹脂により被覆される。し
たがって、波長変換される光を発光する複数の発光素子
を、樹脂モールドの径、及び、リードフレームの干渉に
影響されることのない間隔で配置することができ、光の
照射面の全面において略均一な照度が得られる。According to the first aspect of the present invention, a plurality of light emitting elements that emit short-wavelength light disposed on a substrate are covered with a light-transmitting resin containing a wavelength conversion material. Therefore, a plurality of light-emitting elements that emit light whose wavelength is converted can be arranged at intervals that are not affected by the diameter of the resin mold and the interference of the lead frame. Uniform illuminance can be obtained.
【００１１】請求項２に記載した発明は、前記波長変換
材料が含有された透光性樹脂を含む前記基板上の全面
を、別の透光性樹脂により被覆したことを特徴とする。The invention described in claim 2 is characterized in that the entire surface of the substrate including the light-transmitting resin containing the wavelength conversion material is covered with another light-transmitting resin.
【００１２】請求項２に記載した発明においては、発光
素子から照射された後に透光性樹脂に含有された波長変
換材料によって波長変換された光が、別の透光性樹脂を
透過して直接外部に配光されるとともに、透光性樹脂と
基板上面との間で反射した後に外部に配光される。した
がって、波長変換された光が照射面に対してより広い範
囲に配光され、照射面の全面においてより均一な照度が
得られる。According to the second aspect of the present invention, the light which has been irradiated from the light emitting element and which has been wavelength-converted by the wavelength conversion material contained in the translucent resin is directly transmitted through another translucent resin. The light is distributed to the outside, and is reflected to the outside after being reflected between the translucent resin and the upper surface of the substrate. Therefore, the wavelength-converted light is distributed over a wider area with respect to the irradiation surface, and more uniform illuminance can be obtained over the entire irradiation surface.
【００１３】[0013]
【発明の実施の形態】図１（Ａ）及び（Ｂ）は、この発
明の実施形態に係るＬＥＤ表示用デバイスの平面図及び
部分拡大断面図である。この実施形態に係るＬＥＤ表示
用デバイス１は、表面に配線パターンを形成した基板２
の表面に複数の発光素子３を構成し、この発光素子３を
ワイヤ４を介して配線パターンにボンディングした後
に、透光性樹脂５により被覆し、さらに、透光性樹脂５
を含む基板２の上面の全面を透光性樹脂６により被覆し
て構成されている。1A and 1B are a plan view and a partially enlarged sectional view of an LED display device according to an embodiment of the present invention. The LED display device 1 according to this embodiment includes a substrate 2 having a wiring pattern formed on a surface thereof.
A plurality of light emitting elements 3 are formed on the surface of the light emitting element 3. After bonding the light emitting elements 3 to a wiring pattern via wires 4, the light emitting elements 3 are covered with a light transmitting resin 5,
The entire surface of the upper surface of the substrate 2 is covered with the translucent resin 6.
【００１４】発光素子３は、波長変換の容易性、及び、
波長変換後の光の輝度を考慮して、より光子エネルギの
高い短波長の光を発光するものを用いるべきであり、青
色光の波長以下の波長の光を発光する発光素子が望まし
い。透光性樹脂５は、波長変換材料を均等に含有してい
る。この波長変換材料は、例えば、青色光により励起さ
れて青色光と異なる波長の蛍光を発する蛍光染料や蛍光
顔料を用いることができる。The light-emitting element 3 is easy to convert wavelengths, and
In consideration of the brightness of the light after the wavelength conversion, a device that emits light of a short wavelength having a higher photon energy should be used, and a light emitting element that emits light of a wavelength equal to or less than the wavelength of blue light is desirable. The translucent resin 5 uniformly contains the wavelength conversion material. As this wavelength conversion material, for example, a fluorescent dye or a fluorescent pigment which is excited by blue light and emits fluorescence having a wavelength different from that of blue light can be used.
【００１５】この透光性樹脂５は基板２の上面において
少なくともワイヤ４を含む発光素子３を被覆する大きさ
であれば良く、直径１．５ｍｍ、高さ１ｍｍ程度に塗布
される。したがって、基板２の表面における発光素子３
の配置間隔は最小１．５ｍｍ程度とすることができ、基
板２の表面における発光素子３の密度を極めて高くする
ことができる。The translucent resin 5 has only to be large enough to cover at least the light emitting element 3 including the wire 4 on the upper surface of the substrate 2, and is applied with a diameter of 1.5 mm and a height of about 1 mm. Therefore, the light emitting element 3 on the surface of the substrate 2
Can be set to a minimum of about 1.5 mm, and the density of the light emitting elements 3 on the surface of the substrate 2 can be extremely increased.
【００１６】また、透光性樹脂６は、透光性樹脂５を被
覆する１．５ｍｍ〜２ｍｍ程度の厚みに塗布される。し
たがって、基板２の厚みが一般的に１ｍｍ程度であるこ
とを考慮すれば、ＬＥＤ表示用デバイス１は全体として
２．５ｍｍ〜３ｍｍ程度の厚みとなり、極めて薄型に構
成される。The translucent resin 6 is applied to a thickness of about 1.5 mm to 2 mm to cover the translucent resin 5. Therefore, considering that the thickness of the substrate 2 is generally about 1 mm, the LED display device 1 has a thickness of about 2.5 mm to 3 mm as a whole, and is extremely thin.
【００１７】なお、基板２の表面における反射による光
の拡散効果、及び、透光性樹脂５を含む基板２の表面の
保護効果を必要としない場合には、透光性樹脂６を省略
することもでき、この場合にはＬＥＤ表示用デバイス１
をさらに薄型に構成することができる。If the effect of light diffusion due to the reflection on the surface of the substrate 2 and the effect of protecting the surface of the substrate 2 including the translucent resin 5 are not required, the translucent resin 6 may be omitted. In this case, the LED display device 1
Can be made thinner.
【００１８】また、透光性樹脂６としては、透明樹脂の
みならず半透明樹脂又は光拡散樹脂を用いることができ
る。As the translucent resin 6, not only a transparent resin but also a translucent resin or a light diffusing resin can be used.
【００１９】さらに、基板２としては、可撓性を有する
フレキシブル基板を用いることができ、この場合には、
ＬＥＤ表示用デバイス１をさらに薄型に構成することが
できる。Further, as the substrate 2, a flexible substrate having flexibility can be used. In this case,
The LED display device 1 can be configured to be thinner.
【００２０】図２は、上記ＬＥＤ表示用デバイスにおけ
る光の照射状態を示す図である。発光素子３の光は、透
光性樹脂５が含有する波長変換材料により波長変換され
た後、基板２の表面側における透光性樹脂５の外部の全
方向に配光される。透光性樹脂５から外部に配光された
光の一部は、透光性樹脂６を透過して直接照射面１１に
達する。透光性樹脂５から外部に配光された光の他の一
部は、透光性樹脂６と空気との境界面、及び、基板２の
表面において反射した後に、透光性樹脂６を透過して照
射面１１に達する。FIG. 2 is a view showing a light irradiation state of the LED display device. After the light of the light emitting element 3 is wavelength-converted by the wavelength conversion material contained in the translucent resin 5, the light is distributed in all directions outside the translucent resin 5 on the surface side of the substrate 2. Part of the light distributed from the light transmitting resin 5 to the outside passes through the light transmitting resin 6 and directly reaches the irradiation surface 11. Another part of the light distributed from the translucent resin 5 to the outside transmits through the translucent resin 6 after being reflected on the boundary surface between the translucent resin 6 and the air and on the surface of the substrate 2. And reaches the irradiation surface 11.
【００２１】したがって、ＬＥＤ表示用デバイス１を構
成する基板２の表面の広い範囲から照射面１１に対して
光が照射され、照射面１１においてＬＥＤ表示用デバイ
ス１に対向する範囲の明度を略一様にすることができ、
ＬＥＤ表示用デバイス１を面光源として用いることがで
きる。Therefore, light is irradiated from a wide range of the surface of the substrate 2 constituting the LED display device 1 to the irradiation surface 11, and the brightness of the range facing the LED display device 1 on the irradiation surface 11 is reduced by approximately one unit. Like
The LED display device 1 can be used as a surface light source.
【００２２】なお、透光性樹脂６を省略した場合には、
基板２の表面における反射光を照射面１１に配光するこ
とはできなくなるが、この場合でも、透光性樹脂５の全
面から波長変換後の光が配光されるため、照射面１１に
おいて明度の明確な差異を生じることはない。When the translucent resin 6 is omitted,
Although the reflected light on the surface of the substrate 2 cannot be distributed to the irradiation surface 11, even in this case, the light after the wavelength conversion is distributed from the entire surface of the translucent resin 5. Will not make a clear difference.
【００２３】また、透光性樹脂６として半透明樹脂又は
光拡散樹脂を用いた場合には、ＬＥＤ表示用デバイス１
を構成する基板２の表面において光源としての透光性樹
脂５のイメージをなくすことができ、ＬＥＤ表示用デバ
イス１を面発光の光源とすることができる。When a translucent resin or a light diffusing resin is used as the translucent resin 6, the LED display device 1
The image of the translucent resin 5 as a light source can be eliminated on the surface of the substrate 2 constituting the device, and the LED display device 1 can be used as a surface-emitting light source.
【００２４】図３は、この発明の別の実施形態に係るＬ
ＥＤ表示用デバイスを示す図である。図３（Ａ）に示す
ＬＥＤ表示用デバイス２１は、透光性樹脂５で被覆した
発光素子３を基板２の表裏両面に複数設けたものであ
る。このように構成することにより、表裏両面に光を配
光する極めて薄型の面光源を形成することができる。FIG. 3 is a diagram showing an L according to another embodiment of the present invention.
It is a figure which shows the device for ED display. The LED display device 21 shown in FIG. 3A includes a plurality of light emitting elements 3 covered with a translucent resin 5 provided on both front and back surfaces of a substrate 2. With this configuration, it is possible to form an extremely thin surface light source that distributes light to both the front and back surfaces.
【００２５】また、基板２は任意の２次元形状とするこ
とができるため、例えば、図３（Ｂ）に示すようにＬＥ
Ｄ表示用デバイス３１そのものを非常用誘導灯等の表示
装置として構成することもでき、図３（Ａ）に示した構
成と合わせて表裏両面から視認できる極めて薄型の非常
用誘導灯等の表示装置を構成することもできる。この場
合に、さらに透光性樹脂６として半透明樹脂又は光拡散
樹脂を用いることにより、ＬＥＤ表示用デバイス３１そ
のものを非常用誘導灯等の任意の形状で表裏両面から視
認できる面発光の薄型表示装置とすることもできる。Further, since the substrate 2 can have an arbitrary two-dimensional shape, for example, as shown in FIG.
The D display device 31 itself can also be configured as a display device such as an emergency guide light, and in combination with the configuration shown in FIG. Can also be configured. In this case, by using a translucent resin or a light-diffusing resin as the translucent resin 6, the LED display device 31 itself can be visually recognized from both the front and back surfaces in an arbitrary shape such as an emergency guide light, etc. It can also be a device.
【００２６】さらに、図３（Ｃ）に示すように、透光性
樹脂５で被覆した発光素子３を基板２の表面に複数設け
た複数のＬＥＤ表示用デバイス１を互いの端面において
接合することにより、周囲の３方向以上の視野から視認
できる多角形形状の警告灯等の表示装置を構成すること
ができる。Further, as shown in FIG. 3 (C), a plurality of LED display devices 1 in which a plurality of light emitting elements 3 covered with a translucent resin 5 are provided on the surface of a substrate 2 are joined to each other at their end faces. Accordingly, it is possible to configure a display device such as a polygonal warning light that can be visually recognized from three or more surrounding directions.
【００２７】加えて、基板２をフレキシブル基板とする
ことにより、図３（Ｄ）に示すように、ＬＥＤ表示用デ
バイス４１そのものにより円筒形の表示装置を構成する
こともできる。In addition, when the substrate 2 is a flexible substrate, as shown in FIG. 3D, a cylindrical display device can be formed by the LED display device 41 itself.
【００２８】[0028]
【発明の効果】請求項１に記載した発明によれば、基板
上に配置された短波長光を発光する複数の発光素子を波
長変換材料を含有した透光性樹脂により被覆することに
より、波長変換される光を発光する複数の発光素子を、
樹脂モールドの径、及び、リードフレームの干渉に影響
されることのない間隔で配置することができ、照射面の
全面において略均一な照度となる任意の色の光を照射す
ることができる。According to the first aspect of the present invention, a plurality of light-emitting elements that emit short-wavelength light disposed on a substrate are covered with a light-transmitting resin containing a wavelength conversion material, so that the wavelength is reduced. A plurality of light emitting elements that emit light to be converted,
It can be arranged at an interval that is not affected by the diameter of the resin mold and the interference of the lead frame, and can irradiate light of an arbitrary color with substantially uniform illuminance over the entire irradiation surface.
【００２９】請求項２に記載した発明によれば、発光素
子から照射された後に透光性樹脂に含有された波長変換
材料によって波長変換された光を、別の透光性樹脂を透
過して直接外部に配光するとともに、該別の透光性樹脂
と基板上面との間で反射させた後に外部に配光すること
により、波長変換された光を照射面に対してより広い範
囲に配光することができ、照射面の照度をより均一にす
ることができる。According to the second aspect of the present invention, the light that has been irradiated from the light emitting element and wavelength-converted by the wavelength conversion material contained in the light-transmitting resin is transmitted through another light-transmitting resin. By distributing the light directly to the outside, reflecting the light between the other light-transmitting resin and the upper surface of the substrate, and then distributing the light to the outside, the wavelength-converted light is distributed over a wider range with respect to the irradiation surface. Light can be emitted, and the illuminance on the irradiation surface can be made more uniform.
【図１】この発明の実施形態に係るＬＥＤ表示用デバイ
スの正面図及び要部の拡大断面図であるFIG. 1 is a front view and an enlarged sectional view of a main part of an LED display device according to an embodiment of the present invention.
【図２】上記ＬＥＤ表示用デバイスにおける光の照射状
態を示す図である。FIG. 2 is a diagram showing a light irradiation state of the LED display device.
【図３】この発明の別の実施形態に係るＬＥＤ表示用デ
バイスの構成を示す図である。FIG. 3 is a diagram showing a configuration of an LED display device according to another embodiment of the present invention.
１、２１、３１、４１−ＬＥＤ表示用デバイス ２−基板 ３−発光素子 ４−ワイヤ ５−透光性樹脂 ６−透光性樹脂 1, 21, 31, 41-LED display device 2-Substrate 3-Light-emitting element 4-Wire 5-Transparent resin 6-Transparent resin
Claims (2)
ント基板上に青色光の波長以下の波長の光を発光する複
数の発光素子を配置し、各発光素子を波長変換材料が含
有された透光性樹脂によって被覆したことを特徴とする
ＬＥＤ表示用デバイス。1. A plurality of light emitting elements that emit light having a wavelength equal to or less than the wavelength of blue light are arranged on a printed circuit board having an arbitrary shape and area on which a circuit is formed, and each light emitting element contains a wavelength conversion material. An LED display device characterized by being coated with a translucent resin.
を含む前記基板上の全面を、別の透光性樹脂により被覆
した請求項１に記載のＬＥＤ表示用デバイス。2. The LED display device according to claim 1, wherein the entire surface of the substrate including the translucent resin containing the wavelength conversion material is covered with another translucent resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9282036A JPH11121808A (en) | 1997-10-15 | 1997-10-15 | Device for led display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9282036A JPH11121808A (en) | 1997-10-15 | 1997-10-15 | Device for led display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11121808A true JPH11121808A (en) | 1999-04-30 |
Family
ID=17647346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9282036A Pending JPH11121808A (en) | 1997-10-15 | 1997-10-15 | Device for led display |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11121808A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002017405A1 (en) * | 2000-08-23 | 2002-02-28 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for the production thereof, module and device comprising a module of this type |
| KR100372834B1 (en) * | 2000-05-25 | 2003-02-19 | 에이프로시스템즈 (주) | Light emitting semiconductor device for emitting lights having complex wavelengths through fluorescent material thereof |
| WO2003056636A1 (en) * | 2001-12-29 | 2003-07-10 | Hangzhou Fuyang Xinying Dianzi Ltd. | A led and led lamp |
| US7452103B2 (en) | 2004-04-05 | 2008-11-18 | Hoya Corporation | Illuminating device for photoshooting |
| JP2015015121A (en) * | 2013-07-04 | 2015-01-22 | 株式会社吾妻製作所 | Lamp and emission type labeling device |
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| JPH0677107U (en) * | 1993-02-19 | 1994-10-28 | アサヒ電機株式会社 | Signal light |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100372834B1 (en) * | 2000-05-25 | 2003-02-19 | 에이프로시스템즈 (주) | Light emitting semiconductor device for emitting lights having complex wavelengths through fluorescent material thereof |
| WO2002017405A1 (en) * | 2000-08-23 | 2002-02-28 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for the production thereof, module and device comprising a module of this type |
| US7446347B2 (en) | 2000-08-23 | 2008-11-04 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for the production thereof, module and device comprising a module of this type |
| WO2003056636A1 (en) * | 2001-12-29 | 2003-07-10 | Hangzhou Fuyang Xinying Dianzi Ltd. | A led and led lamp |
| US7452103B2 (en) | 2004-04-05 | 2008-11-18 | Hoya Corporation | Illuminating device for photoshooting |
| CN100458549C (en) * | 2004-04-05 | 2009-02-04 | Hoya株式会社 | Illuminating device for photoshooting |
| JP2015015121A (en) * | 2013-07-04 | 2015-01-22 | 株式会社吾妻製作所 | Lamp and emission type labeling device |
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