JPH1093373A - Support structure for piezoelectric vibrator and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a support structure for a piezoelectric vibrator with higher reliability in which a mechanical impact resistance is improved and to provide its manufacture. SOLUTION: In the support structure for the piezoelectric vibrator, there is a base 1 having lead terminals 2, 2, support plates 3, 3 supporting a piezoelectric board 4 are provided above the lead terminals 2, 2, the piezoelectric board 4 is inserted to a slit of the supports 3, 3 and fixed electrically and mechanically with a conductive bond K, a cap is covered to the base 1 to make air-tight sealing. In this case, a soft bond N is bonded to both upper/lower ends of the slit of the supports 3, 3 so that the piezoelectric board 4 is mounted such that the board is not brought into contact with both the upper/lower ends of the slit of the supports 3, 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric vibrator and a piezoelectric filter using a piezoelectric plate made of quartz or the like, and more particularly to a support structure for a piezoelectric plate.

[0002]

2. Description of the Related Art A conventional structure for supporting a piezoelectric vibrator will be described with reference to the drawings. FIG. 6 is a front view showing a conventional example, and FIG.
7 is a side view of FIG. The lead terminals 2 and 2 are hermetically and insulated and sealed to the base 1 via glass, and a slit 33 (only one is shown) is formed on the inner leads of the lead terminals 2 and 2 by a method such as spot welding. Plated supports 3, 3 are attached. The piezoelectric plate 4 is inserted and mounted in the slits 33 (only one is shown) of the supports 3, 3, and is electrically and mechanically connected by the conductive bonding material K. The piezoelectric plate 4 is made of, for example, an AT-cut disk-shaped quartz plate, and an excitation electrode 5 (the back surface is not shown) is formed on the front and back surfaces. Then, a cap (not shown) is put on the base 1 and hermetically sealed to produce a final piezoelectric vibrator.

[0003]

However, in the conventional structure, the slit corner portions (321a, 321b, 322) are not provided.
a, 322b) directly touched by the piezoelectric plate, causing the piezoelectric plate to be damaged by an impact such as a drop.

An object of the present invention is to provide a more reliable piezoelectric vibrator support structure with improved mechanical shock resistance, and a method of manufacturing the same.

[0005]

Accordingly, a supporting structure for a piezoelectric vibrator according to the present invention includes a base having a plurality of lead terminals, and a plate-like support for supporting a piezoelectric plate above the plurality of lead terminals. Wherein a piezoelectric plate is inserted into a slit of the support, electrically and mechanically fixed by a conductive bonding material, and a cap is placed on the base to hermetically seal the piezoelectric vibrator. Are mounted via a bonding material so as not to contact the slit corners of the support.

[0006] With this configuration, the piezoelectric plate does not contact the slit corner, and the mechanical shock resistance is improved.

A base having a plurality of lead terminals is provided. A plate-like support for supporting a piezoelectric plate is provided above the plurality of lead terminals. In a support structure of a piezoelectric vibrator which is electrically and mechanically fixed by a bonding material, and is hermetically sealed by covering the base with a cap, a soft bonding material is bonded at upper and lower ends of a slit of the support opposed to each other, The piezoelectric plate is mounted so as not to contact the upper and lower ends of the slit of the support.

With this configuration, the piezoelectric plate does not come into contact with the slit corner, and the mechanical shock from the upper and lower ends of the slit is not directly transmitted to the piezoelectric plate. Absorbs this mechanical shock and transmits it softly, improving mechanical shock resistance.

There is also a base having a plurality of lead terminals, a plate-like support for supporting a piezoelectric plate is provided above the plurality of lead terminals, and a conductive plate is provided by inserting the piezoelectric plate into a slit of the support. In a support structure of a piezoelectric vibrator which is electrically and mechanically fixed by a bonding material, and is hermetically sealed by covering the base with a cap, a soft bonding material is opposed to an inner side of upper and lower ends of the slit of the support opposed to each other. The support is mounted so that the piezoelectric plate does not contact the upper and lower ends of the slit of the support.

With this configuration, the piezoelectric plate does not come into contact with the slit corners, and the mechanical shock from the upper and lower ends of the slit is not directly transmitted to the piezoelectric plate. The bonding material absorbs the mechanical shock and transmits it softly, improving the mechanical shock resistance.

In each of the above structures, the support and the piezoelectric plate are joined by a hard conductive joining material.

With this configuration, the piezoelectric plate does not come into contact with the slit corner, and the mechanical shock resistance is improved. And the hard conductive bonding material has aging resistance properties, and
Improves heat resistance.

A step of attaching a support to the lead terminal of the base having a lead terminal for electrically leading out to the outside; and a step of applying a soft bonding material to upper and lower ends of the slit of the support and drying. Inserting a piezoelectric plate into the slit of the support and mounting the same; applying a conductive bonding material to the support on which the piezoelectric plate is mounted to electrically and mechanically bond the support and the piezoelectric plate And a method for manufacturing a piezoelectric vibrator.

According to this manufacturing method, the piezoelectric plate can be mounted in a state where the soft bonding material is hardened at the upper and lower ends of the slit, so that the piezoelectric plate does not contact the slit corner. When the support and the piezoelectric plate are joined by the conductive joining material, the piezoelectric plate is displaced and does not contact the slit corner. Therefore, a method for manufacturing a piezoelectric vibrator that improves mechanical shock resistance can be obtained.

[0015]

Next, a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing a first embodiment of the present invention, and FIG. 2 is an enlarged view of a support cross section of FIG. 1 (illustrating a conductive bonding material K for clarity). ). Note that the same parts as those in the related art are denoted by the same reference numerals.

The piezoelectric plate 4 is made of, for example, an AT-cut disk-shaped quartz plate, and has an excitation electrode 5 (for example, silver or gold) as a main component on the front and back surfaces by vapor deposition or the like (the back surface is not shown). ) Is formed.

The supports 3 and 3 are made of, for example, Cu-Ni-Zn
A slit 33 (only one is shown) for inserting a disc-shaped piezoelectric plate, which will be described later, is made of a metal plate of a base alloy, SUS, nickel silver, or the like. These supports can be formed by, for example, pressing or etching.

The base 1 has the lead terminals 2 and 2 hermetically and insulated and sealed via the glass 11 and is attached to the inner leads of the lead terminals 2 and 2 by a method such as a laser welding method or a spot welding method. Accordingly, the supports 3 and 3 are mounted facing each other.

A soft bonding material N is provided on both upper and lower ends (321, 322, 321 and 322) of the slit of each support.
Is applied and dried, then the piezoelectric plate 4 is inserted into the slits 33 (only one is shown) of the support, and is mounted in contact with four points of the soft conductive bonding material N formed at the upper and lower ends of each slit. Is done.

The piezoelectric plate 4 is coated with a conductive bonding material K over substantially the entire surface of the slit of the support and cured, so that the supports 3, 3 and the piezoelectric plate 4 are electrically mechanically connected. A strong joint is made. As described above, the lead terminals 2 and 2 are electrically connected to the supports 3 and 3 and further from the supports 3 and 3 to the respective excitation electrodes 5 on the front and back of the piezoelectric plate 4.

Then, a cap (not shown) is put on the base 1 and hermetically sealed by, for example, resistance welding, cold pressing or the like.

Next, the soft bonding material N and the conductive bonding material K shown in the first embodiment of the present invention will be described. Preferred as the soft bonding material is a bonding material such as an epoxy-based resin, a urethane-based resin, or a silicon-based resin, and a material having a pencil hardness of 6B to 6B may be used after curing. The soft bonding material may be conductive or may be insulating made of resin itself. As the conductive bonding material K, in a normal piezoelectric vibrator, a hard material may be used, or a soft material may be used. In a piezoelectric vibrator requiring heat resistance, a hard material is used. . Preferred as the hard conductive bonding material is a conductive adhesive made of an epoxy resin.
H to H may be used. Further, Pb-Sn-based high-temperature solder, Pb-Sn-Ag solder, or the like may be used.

Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 3 is a cross-sectional view showing a second embodiment of the present invention, and FIG. 4 is an enlarged view of a support cross-section of FIG. 3 (for clarity, the conductive bonding material K is omitted. ). Conventionally, the same parts as those in the first embodiment have the same reference numerals.

The piezoelectric plate 4 is made of, for example, an AT-cut disk-shaped quartz plate, and has an excitation electrode 5 mainly composed of, for example, silver or gold (the back surface is not shown) on the front and back surfaces by a method such as vapor deposition. ) Is formed.

The supports 3 and 3 are made of, for example, Cu--Ni--Zn
A slit 33 (only one is shown) for inserting a disc-shaped piezoelectric plate, which will be described later, is made of a metal plate of a base alloy, SUS, nickel silver, or the like. These supports can be formed by, for example, pressing or etching.

The base 1 has the lead terminals 2 and 2 hermetically and insulated and sealed via a glass 11. The base terminal 1 is attached to the inner leads of the lead terminals 2 and 2 by a method such as a laser welding method or a spot welding method. Accordingly, the supports 3 and 3 are mounted facing each other.

Then, a soft bonding material N is applied to the inner side of the upper and lower ends (321, 322, 321 and 322) of the slits of each support, and after drying, the piezoelectric plate 4 is connected to the slits 33 (one side) of the support. (Only shown), and four soft bonding members N formed on the inner sides of both upper and lower ends of each slit.
It is mounted in contact with.

The piezoelectric plate 4 is coated with a conductive bonding material K over substantially the entire surface of the slit of the support and cured, so that the supports 3 and 3 and the piezoelectric plate 4 are electrically and mechanically connected. A strong joint is made. As described above, the lead terminals 2 and 2 are electrically connected to the supports 3 and 3 and further from the supports 3 and 3 to the respective excitation electrodes 5 on the front and back of the piezoelectric plate 4.

Then, the base 1 is covered with a cap (not shown), and hermetically sealed by, for example, resistance welding, cold pressing or the like.

The soft bonding material N and the conductive bonding material K shown in the second embodiment of the present invention will be described. Preferred as the soft bonding material is a bonding material such as an epoxy-based resin, a urethane-based resin, or a silicon-based resin, and a material having a pencil hardness of 6B to 6B may be used after curing.
The soft bonding material may be conductive or may be insulating made of resin itself. Conductive bonding material K
May be either a hard or a soft piezoelectric vibrator, but a hard piezoelectric vibrator that requires heat resistance is used. Preferred as the hard conductive bonding material is a conductive adhesive of an epoxy resin, and the cured material has a pencil hardness of 7H or more.
H may be used. Further, Pb-Sn-based high-temperature solder, Pb-Sn-Ag solder, or the like may be used.

Next, a third embodiment of the present invention will be described with reference to the drawings. FIG. 5 is an enlarged view of a support front portion showing a third embodiment of the present invention (illustrated by omitting a conductive bonding material K for more clarity). Note that the same parts as those in the above embodiment are denoted by the same reference numerals.

The piezoelectric plate 4 is made of, for example, an AT-cut disk-shaped quartz plate, and has an excitation electrode (not shown) mainly composed of, for example, silver or gold on its front and back surfaces by a method such as vapor deposition.
Are formed.

The support 3 (only one is shown) is made of, for example, Cu
A slit 33 made of a metal plate such as a Ni-Zn alloy, SUS, or nickel silver, and into which a disk-shaped piezoelectric plate described later is inserted;
(Only one is shown) is formed. These supports can be formed by, for example, pressing or etching.

After applying a soft bonding material N to the slit corners of each support and drying it, the piezoelectric plate 4 is inserted into the slits 33 (only one is shown) of the support, and is formed at each slit corner. It is mounted in contact with the soft bonding material N.

The piezoelectric plate 4 is provided with a conductive bonding material K (not shown) over substantially the entire surface of the support slit.
Is applied and cured to form an electromechanically strong permanent bond. The piezoelectric plate 4 is coated with a conductive bonding material K (not shown) over substantially the entire surface of the slit of the support and cured, whereby the support and the piezoelectric plate are electrically and mechanically connected. Strong bonding is achieved. As described above, the lead terminals are electrically connected to the support, and further, the support is electrically connected to the respective excitation electrodes on the front and back of the piezoelectric plate.

The soft bonding material N and the conductive bonding material K shown in the third embodiment of the present invention will be described. Preferred as the soft bonding material is a bonding material such as an epoxy-based resin, a urethane-based resin, or a silicon-based resin, and a material having a pencil hardness of 6B to 6B may be used after curing.
The soft bonding material may be conductive or may be insulating made of resin itself. Conductive bonding material K
May be either a hard or a soft piezoelectric vibrator, but a hard piezoelectric vibrator that requires heat resistance is used. Preferred as the hard conductive bonding material is a conductive adhesive of an epoxy resin, and the cured material has a pencil hardness of 7H or more.
H may be used. Further, Pb-Sn-based high-temperature solder, Pb-Sn-Ag solder, or the like may be used.

Although a quartz plate is used as the piezoelectric plate in each of the above embodiments, another single crystal piezoelectric material such as lithium tantalate or a piezoelectric ceramic may be used. Also,
Although the thickness shear vibration of the AT cut is exemplified as the vibration mode, it is needless to say that the present invention can be applied to a piezoelectric vibrator of another vibration mode. Further, the present invention can be applied not only to the crystal resonator but also to a crystal filter. The shape of the piezoelectric plate is not limited to the disk shape, and there is no particular problem even if the shape is a rectangular shape.

[0038]

According to the first aspect of the present invention, it is possible to provide a more reliable piezoelectric vibrator support structure in which the piezoelectric plate does not come into contact with the slit corner portion and the mechanical shock resistance is improved.

According to the second aspect, the piezoelectric plate does not contact the slit corner, and the mechanical shock from the upper and lower ends of the slit is not directly transmitted to the piezoelectric plate. It is possible to provide a more reliable piezoelectric vibrator support structure in which the material absorbs the mechanical shock while transmitting softly, and the mechanical shock resistance is improved.

According to the third aspect, the piezoelectric plate does not come into contact with the slit corner portion, and the mechanical shock from the upper and lower ends of the slit is not directly transmitted to the piezoelectric plate. It is possible to provide a more reliable piezoelectric vibrator support structure in which the material absorbs the mechanical shock while transmitting softly, and the mechanical shock resistance is improved.

According to the fourth aspect, the piezoelectric plate does not come into contact with the slit corner, and the mechanical shock resistance is improved. And the hard conductive bonding material has aging resistance properties, and
Improves heat resistance.

According to the fifth aspect, since the piezoelectric plate can be mounted in a state where the soft bonding material is hardened at the upper and lower ends of the slit, the piezoelectric plate does not contact the slit corner. When the support and the piezoelectric plate are joined by the conductive joining material, the piezoelectric plate is displaced and does not contact the slit corner. Therefore, a method for manufacturing a piezoelectric vibrator that improves mechanical shock resistance can be obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first embodiment of the present invention.

FIG. 2 is an enlarged view of a support section of FIG. 1;

FIG. 3 is a sectional view showing a second embodiment of the present invention.

FIG. 4 is an enlarged view of a support cross section of FIG. 3;

FIG. 5 is an enlarged view of a support front part showing a third embodiment of the present invention.

FIG. 6 is a plan view showing a conventional example.

FIG. 7 is a side view of FIG. 6;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Base 2 ... Lead terminal 3 ... Support 33 ... Support slit 4 ... Piezoelectric plate 5 ... Excitation electrode N ... Soft joining material K ... Conductive joining material

Claims (5)

[Claims] A base having a plurality of lead terminals is provided, and a plate-like support for supporting a piezoelectric plate is provided above the plurality of lead terminals. In a support structure of a piezoelectric vibrator which is electrically and mechanically fixed by a bonding material, and is hermetically sealed by covering the base with a cap, the bonding material is provided via a bonding material so that the piezoelectric plate does not contact a slit corner of the support. A support structure for a piezoelectric vibrator, which is mounted. 2. A base having a plurality of lead terminals, a plate-like support for supporting a piezoelectric plate is provided above the plurality of lead terminals, and a piezoelectric plate is inserted into a slit of the support so as to be electrically conductive. In a support structure of a piezoelectric vibrator which is electrically and mechanically fixed by a bonding material, and is hermetically sealed by covering the base with a cap, a soft bonding material is bonded at upper and lower ends of a slit of the support opposed to each other, A support structure for a piezoelectric vibrator, wherein a piezoelectric plate is mounted so as not to contact upper and lower ends of the slit of the support. 3. A base having a plurality of lead terminals, a plate-like support for supporting a piezoelectric plate is provided above the plurality of lead terminals, and the piezoelectric plate is inserted into a slit of the support to be electrically conductive. In a support structure of a piezoelectric vibrator which is electrically and mechanically fixed by a bonding material, and is hermetically sealed by covering the base with a cap, a soft bonding material is opposed to an inner side of upper and lower ends of the slit of the support opposed to each other. A support structure for a piezoelectric vibrator, wherein the piezoelectric plate is mounted so as not to contact the upper and lower ends of the slit of the support. 4. The support structure for a piezoelectric vibrator according to claim 1, wherein said support and said piezoelectric plate are bonded by a hard conductive bonding material. 5. A step of attaching a support to the lead terminal of a base having a lead terminal for electrically leading out to the outside, and a step of applying a soft bonding material to upper and lower ends of a slit of the support and drying the same. Inserting a piezoelectric plate into the slit of the support and mounting the same; applying a conductive bonding material to the support on which the piezoelectric plate is mounted to electrically and mechanically bond the support and the piezoelectric plate And a method for manufacturing a piezoelectric vibrator.