JPH1051115A - Anisotropic conducting film sticking equipment and anisotropic conducting film dividing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the time necessary for dividing an anisotropic conducting film into sticking region parts for sticking the film on a board. SOLUTION: A notch is formed on an anisotropic conducting film 14 of base material 12 supplied from a base material supplying means 11, and the anisotropic conducting film 14 is divided into sticking region parts 14A and separating region parts for separating each of the sticking region parts 14A. The separating region parts are eliminated from a base film 13, pinching them. The sticking region parts 14A are stuck on a board 17. The base film 13 which is left after the sticking region parts 14A are stuck on a board 17 is wound up. Thereby the time necessary for dividing the anisotropic conducting film 14 into sticking region parts 14A can be remarkably reduced. Hence an anisotropic conducting film sticking equipment 10 wherein productivity can be more improved by a simple method and an isotropic conducting film dividing method can be realized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[Table of Contents] The present invention will be described in the following order. Technical field to which the invention pertains Prior art (FIG. 6) Problems to be solved by the invention Means for solving the problems Embodiments of the invention (FIGS. 1 to 5) Effects of the invention

[0002]

The present invention relates to an anisotropic conductive film sticking apparatus and an anisotropic conductive film dividing method, and more particularly to an anisotropic conductive film (AC) on a circuit board.
It is suitable to be applied when attaching F).

[0003]

2. Description of the Related Art Conventionally, in this type of anisotropic conductive film sticking apparatus, a tape-like structure in which an anisotropic conductive film is adhered on one surface of a base film using an anisotropic conductive film cutting device. Is divided into regions each having a predetermined length for sticking the anisotropic conductive film of the base material on the circuit board (hereinafter, this region is referred to as a sticking region), and the region where the anisotropic conductive film is stuck The bonding area is bonded to the circuit board by thermocompression bonding the part to the circuit board.

As shown in FIG. 6, an anisotropic conductive film 3 is applied to a base film 2 in the form of a tape, and a cover film 4 is further laminated on the anisotropic conductive film 3 as shown in FIG. It is configured. There is also a substrate 1 in which an anisotropic conductive film 3 is simply applied to a base film 2.

Japanese Patent Application No. 6-23804 proposes an anisotropic conductive film cutting apparatus and a cutting method used in this type of anisotropic conductive film sticking apparatus. In this anisotropic conductive film cutting device, two cuts are formed in the anisotropic conductive film by two half-cuts, and a region formed by the two cuts in the anisotropic conductive film ( (Hereinafter, this is referred to as a separation region portion) and after being divided into a pasting region portion, the separation region portion is peeled off from the base film by peeling means.

[0006]

However, in this anisotropic conductive film cutting device, a cut is formed in the anisotropic conductive film by two half-cuts, and then an adhesive tape is attached to the separation region. The step of forming a cut in the anisotropic conductive film and the step of removing the separation region from the base film are performed by different means, such as removing the separation region from the base film. If the steps can be continuously performed in one step using the same means, the time required to separate the attachment region from the anisotropic conductive film can be reduced, and as a result, a simple method can be used. It is considered that productivity in the anisotropic conductive film sticking apparatus can be further improved.

Further, in the anisotropic conductive film cutting device, a sticking mechanism for sticking an adhesive tape to the separation region,
Since a peeling mechanism for peeling the separation area from the base film and a feed mechanism for sending the adhesive tape after peeling the separation area from the base film are required,
If these mechanisms can be eliminated, it is considered that the configuration of the anisotropic conductive film cutting device can be further simplified and downsized, and the failure rate in the anisotropic conductive film cutting device can be further reduced, and It is considered that maintenance of the anisotropic conductive film cutting device can be further simplified.

In addition, since the width of the separation region (ie, the width of the cutting edge of the two cutters) depends on the width of the adhesive tape, if the width of the separation region does not depend on the width of the adhesive tape, It is considered that the anisotropic conductive film can be used more efficiently. In this case, it is conceivable to reduce the width of the adhesive tape.However, when the width of the adhesive tape is reduced, the adhesive force required to peel off the separation area decreases, and the separation area cannot be reliably peeled off. It is possible. Accordingly, it would be desirable if the size of the separation region could be reduced and the separation region could be reliably removed.

[0009] If the separation region can be peeled off from the base film without using an adhesive tape, it is considered that the method of dividing the anisotropic conductive film can be further simplified. Furthermore, since the separation region is removed using an adhesive tape, it is conceivable that the separation region cannot be reliably removed when the adhesive strength of the adhesive tape is reduced.

The present invention has been made in view of the above points, and proposes an anisotropic conductive film sticking apparatus and an anisotropic conductive film dividing method which can further improve productivity by a simple method. It is.

[0011]

According to the present invention, there is provided an anisotropic conductive film provided with a base material supplied from a base material supply means, by forming a cut in a predetermined position of the anisotropic conductive film. The conductive film is divided into an attachment region for attaching to the substrate and a separation region for separating the attachment regions from each other, and the separation region is removed by being pinched from the base film. Since the step of dividing the anisotropic conductive film into the attachment region and the separation region and the step of removing the separation region from the base film can be continuously performed in one step, the anisotropic conductive film Can be greatly reduced in time required to divide the data into the pasting region.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings.

In FIG. 1, reference numeral 10 denotes an anisotropic conductive film sticking apparatus as a whole, and an anisotropic conductive film adhered to a base film 13 of a tape-shaped base material 12 supplied from a base material supply reel 11. Anisotropic conductive film dividing device 15 for film 14
The anisotropic conductive film 1 is formed by forming a cut by
4 is separated into a bonding area 14A and a separation area 14B, the separation area 14B is pinched and removed, and the bonding area 14A is attached to the circuit board 17 by a thermocompression head 16.
Thermocompression bonding to one surface of the anisotropic conductive film 14
Is attached to the circuit board 17.

The base material supply reel 11 moves the base material 12 in a direction opposite to the direction shown by the arrow Z in the figure based on a control signal S ₁ sent from a control device 19 in response to an operation of an operation panel 18 by an operator. (Hereinafter referred to as the reverse Z direction). The substrate 12 sent out from the substrate supply reel 11
Is a unit frame 20 having a substantially U-shaped cross section.
The four guide pins 22A, 22 are in contact with a base 21 provided on the inner wall surface of the side wall 20A through an opening 20B provided at the bottom of the unit frame 20.
The base material is guided by B, 22C and 22D and wound on the substrate take-up reel 23. In this case, the substrate supply reel 11
Supplies the base material 12 so that the base film 13 of the base material 12 contacts the base support 21.

Based on a control signal S ₁ sent from the control device 19, the substrate take-up reel 23
Winds the substrate 12 (in this case, the base film 13) at the timing of supplying the substrate 12,
As a result, a constant tension is applied to the base material 12. Here, the base material supply reel 11 and the base material take-up reel 23 can be moved in the Z-axis direction by predetermined driving means.

The guide pins 22A to 22D are provided along the Y-axis direction. The guide pin 22A guides the base material 12 supplied from the opening 20B of the unit frame 20 obliquely downward to the thermocompression bonding head 16 side.
2D guides to the substrate take-up reel 23 side. The guide pins 22B and 22C are
It is provided in parallel with the circuit board 17 provided below 2C, and thereby positions the sticking area 14A stuck to the base material 12 so as to be parallel to the circuit board 17. Here, the circuit board 17 is supported on a board support 24. The guide pins 22B and 22C are movable in the Z-axis direction by a predetermined driving means (not shown), and the guide pins 22C are moved in the Y-axis by a predetermined driving means (not shown). It is made to be able to move in the direction.

The thermocompression bonding head 16 is provided above the guide pins 22B and 22C, and moves in the Z-axis direction under the control of the head driving unit 16A. As will be described later, this thermocompression bonding head 16 is lowered in the reverse Z direction during thermocompression bonding, so that the base material positioned parallel to the circuit board 17 by the guide pins 22B and 22C. By pressing the base film 13 side of the base film 12, the bonded area portion 14 A of the anisotropic conductive film 14 is thermocompression-bonded to the circuit board 17.

As shown in FIGS. 1 and 2, in the anisotropic conductive film dividing device 15, a cutting cylinder 25 is fixed to the inner wall surface of the side wall 20C of the unit frame 20. The cylinder shaft 25A of the cutting cylinder 25 is provided so as to penetrate the side wall 20C of the unit frame 20 along the Y-axis direction.
Moves the cylinder shaft 25A in the Y-axis direction. In practice,
Katsuhito cylinder 25 in response to the valve control signal S ₂ sent from the control unit 19 in response to operator's operation of the operation panel 18, the vacuum valve portion 27 having a built-in vacuum sources 26
The cylinder shaft 25A is moved in the Y-axis direction by opening and closing the internal vacuum valve 27A.

Here, a stopper 28 is provided at the end of the cylinder shaft 25A, that is, on the side penetrating the side wall 20C of the frame unit 20, and the cylinder shaft 25A is positioned at a position where the stopper 28 abuts the side wall 20C. The direction opposite to the direction indicated by the arrow Y (hereinafter referred to as the reverse Y direction)
Stop moving to. Here, a thread is formed at a position where the stopper 28 of the cylinder shaft 25A is provided,
Thereby, the position of the stopper 28 can be adjusted. Therefore, by adjusting the position of the stopper 28, the moving distance of the cylinder shaft 25A in the reverse Y direction can be adjusted.

On the other hand, the tip of the cylinder shaft 25A is fixed to the cylinder shaft mounting surface 29A of the chuck cylinder 29. The chuck cylinder 29 is fixed on a slider 31 which is movable in the Y-axis direction using a guide rail 30 provided on the bottom of the unit frame 20 in the Y-axis direction as a guide. Two cutters 32A and 32B are provided in parallel on a cutter mounting surface 29B of the chuck cylinder 29 facing the cylinder shaft mounting surface 29A so as to face each other in the Z-axis direction. The cutters 32 </ b> A and 32 </ b> B
Provided in a direction perpendicular to the anisotropic conductive film 14 of the base material 12 supplied from the
The lateral width of the cutting edge of B is equal to or greater than the width of the anisotropic conductive film 14.

Accordingly, in the anisotropic conductive film dividing device 15, the cuts are formed in the anisotropic conductive film 14 by the cutters 32A and 32B by moving the cylinder shaft 25A of the cutting cylinder 25 in the reverse Y direction. It is made so that it can be formed. The chuck cylinder 29 is
According to the valve control signal S ₃ sent from the control unit 19 in response to operator's operation of the operation panel 18, by the valve of the vacuum valve 27B is opened and closed, Katsuta 32A
And 32B are moved in the longitudinal direction of the anisotropic conductive film 14 in directions approaching each other and moving away from each other.

Accordingly, in the anisotropic conductive film dividing device 15, after the notch is formed in the anisotropic conductive film 14, the check cylinder 29 is driven to move the cutters 32A and 32B in the direction approaching each other. As a result, the separation regions 14B of the anisotropic conductive film 14 are separated by the cutters 32A and 32B.
It can be pinched by pinching.

Here, in the case of this embodiment, the stopper 28
The position of the stopper 28 is selected so that the cutting edges of the cutters 32A and 32B stop at the boundary between the anisotropic conductive film 13 and the base film 12 when the cylinder shaft 25A is moved in the reverse Y direction. I have. Therefore, in the anisotropic conductive film dividing apparatus 15, the base film 13 can be prevented from being cut by the cutters 32A and 32B.

A suction nozzle 33 connected to the vacuum valve section 27 is provided near the cutters 32A and 32B. The separation regions 14B of the anisotropic conductive film 14 which have been peeled off from the base film 13 by the cutters 32A and 32B are sucked. In practice, the suction nozzle 33 operates the vacuum valve 27 in response to the valve control signal S ₄ sent from the control device 19 in response to the operation of the operation panel 18 by the operator.
When the valve C is opened, the separation area 14B is sucked.

In the case of this embodiment, the substrate supply reel 1
As shown in FIG. 1, based on a control signal S ₁ from the control device 19, the bonding region 1 is formed from the anisotropic conductive film 14.
When the 4A ₃ is divided, the length of the attachment region 14A ₃ is the same as the length of the attachment regions 14A ₁ and 14A ₂ previously divided from the anisotropic conductive film 14, and as joining region portion 14A ₁ is positioned in the thermocompression bonding position, it is adapted to feed the substrate 12 at a constant length. In this case, the size of the attachment region 14A is divided into a size corresponding to the substrate 17.

Thus, in the anisotropic conductive film dividing device 15, the cuts are formed at regular intervals in the anisotropic conductive film 14 using the cutters 32A and 32B, and the anisotropic conductive film 14 is attached to the region 14A. And the separation region 14B, and the separation region 14B is
The anisotropic conductive film 14 can be removed by being pinched from the adhesive region portion 14 having a predetermined length.
A can be divided.

In practice, this anisotropic conductive film sticking apparatus 10
In the above, when the operation of attaching the anisotropic conductive film 14 is started by the operator operating the operation panel 18,
First, the base material 12 is supplied from the base material supply reel 11 by a predetermined length. Subsequently, the anisotropic conductive film sticking device 10
By driving the check cylinder 29, the cutters 32A and 32A are driven.
While setting the interval between the cutting edges of 2B to 1 [mm], for example,
The cutters 32A and 32B are set at predetermined cut positions (positions facing the substrate receiving table). Next, as shown in FIG. 3A, the anisotropic conductive film sticking apparatus 10 moves the cutters 32A and 32B in the reverse Y direction by driving the cylinder 25 to drive the cylinder shaft 25A in the reverse Y direction. Thus, a cut is formed in the anisotropic conductive film 14.

In this case, the cutting edges of the cutters 32A and 32B are stopped by the stopper 28 at the boundary between the anisotropic conductive film 14 and the base film 13. Further, since the base material receiving base 21 is provided at the position where the cutters 32A and 32B face each other (ie, the cut position) via the base material 12, the cutters 32A and 32B are moved toward the anisotropic conductive film 14. Even if this is done, it is possible to prevent the notches from being formed in the anisotropic conductive film 14 due to the escape of the substrate 12 in the reverse Y direction, and the substrate 12 is given a predetermined tension. By doing so, it is possible to easily and surely form the cut in the anisotropic conductive film 14.

Subsequently, as shown in FIG. 3 (B), the anisotropic conductive film sticking apparatus 10 drives the chuck cylinder 29 to move the cutters 32A and 32B in a direction approaching each other, thereby forming the cutters 32A and 32B. After pinching the separation region portion 14B by the pin 32B, as shown in FIG.
As shown in (C), the cutting cylinder 25 is driven to move the cylinder shaft 25A by a predetermined distance in a direction opposite to the reverse Y direction (hereinafter referred to as the Y direction).

Next, the anisotropic conductive film sticking apparatus 10 opens the vacuum valve 27C to draw air from the suction nozzle 33, and then drives the check cylinder 29 to move the cutters 32A and 32B away from each other. By doing so, the separation region 14B is collected. Subsequently, the anisotropic conductive film sticking apparatus 10 sends out the base material 12 from the base material supply reel 11 by a predetermined length.

The anisotropic conductive film sticking apparatus 10 repeats the above operation three times to divide the _three sticking regions 14A (14A ₁ , 14A ₂ and 14A ₃ ) from the anisotropic conductive film 14 (FIG. 4 (a)), an anisotropic conductive film 14A ₁ which are positioned in the thermocompression bonding position to perform the step of attaching the circuit board 17. That is, as shown in FIG. 4B, the anisotropic conductive film sticking apparatus 10
And substrate winding reel 23 and guide pins 22B and 22
And C are integrally lowered in the reverse Z direction so that the bonding area portion 14A
₁ is brought into contact with one surface of the circuit board 17.

Thereafter, the anisotropic conductive film sticking apparatus 10
By pressing the thermocompression bonding head 16 to the base film 13 between the guide pins 22B and 22C by the head driving unit 16A is driven to lower the thermal compression head 16 in the opposite Z direction, the joining area part 14A ₁ circuit board 17 Thermocompression bonding. Here, the thermocompression bonding time is several seconds. Next, as shown in FIG. 4 (C), the anisotropic conductive film sticking apparatus 10 drives the head driving unit 16A to move the thermocompression bonding head 16 to a predetermined position in a direction opposite to the reverse Z direction (hereinafter referred to as “this direction”). Is called the Z direction).

Subsequently, as shown in FIGS. 5A and 5B, the anisotropic conductive film sticking apparatus 10 moves the guide pin 22C in the Y direction and simultaneously operates the take-up reel 23, peeling the joining region portion 14A ₁ from the base film 13. At this time, the base material supply reel 11 is in a stopped state. Because it can maintain a predetermined Tenshiyon given in accordance connexion substrate 12 are adapted to the joining region portion 14A ₁ from the base film 13 can be easily peeled off. The guide pin 22C is the guide pin 22B in the joining area part 14A ₁ at the time of contact with is peeled off from the base film 13.

Next, the anisotropic conductive film sticking apparatus 10 moves the substrate supply reel 11 and the substrate take-up reel 13 and the guide pins 22B and 22C integrally to a predetermined position in the reverse Z direction. The pin 22C is moved in the reverse Y direction to a predetermined position. At this time, the substrate supply reel 11 sends out the substrate 12. Subsequently, anisotropic conductive film sticking device 1
0, after the base material supply reel 11 is driven to supply the base material 12 by a predetermined length (the state shown in FIG. 4), the anisotropic conductive film 14 is controlled by the cutters 32A and 32B as described above. After the anisotropic conductive film 14 is divided into an attachment region 14A and a separation region 14B, the separation region 14B is removed by being pinched from the base film 13, and the separation region 14B is collected. Thereafter, the anisotropic conductive film joining apparatus 10, thermocompression bonding the anisotropic conductive film 14A ₂ which is positioned in thermocompression bonding position to another circuit board 17.

Hereinafter, this anisotropic conductive film sticking apparatus 10
Is anisotropic conductive film 14 by cutters 32A and 32B.
Forming a notch in the base film 13 to divide the anisotropic conductive film 14 into an attachment region 14A and a separation region 14B, and then removing the separation region 14B from the base film 13 to collect the separation region 14B. And the step of thermocompression bonding the pasting area portion 14A obtained three times to the circuit board 17 are repeated as necessary.

In the above-described configuration, in the anisotropic conductive film sticking apparatus 10, the cutters 32A and 32B move in the direction approaching the anisotropic conductive film 14 to form cuts in the anisotropic conductive film 14. After moving in a direction approaching each other to pinch the separation region portion 14 </ b> B and then moving in a direction away from the anisotropic conductive film 14. Therefore, in the anisotropic conductive film sticking apparatus 10, the anisotropic conductive film 14
Can be performed continuously in one step, and the step of dividing the base film 13 into the separation region 14B and the separation region 14B can be performed continuously. Compared with the cutting device and the cutting method, the time required for dividing the anisotropic conductive film 14 into the bonding region 14A can be greatly reduced.

Further, in the anisotropic conductive film sticking apparatus 10, as in the conventional anisotropic conductive film cutting apparatus, a sticking mechanism for sticking an adhesive tape to the separation area of the anisotropic conductive film and a separation area are provided. Since there is no need for a peeling mechanism for peeling off the base film or a mechanism for feeding the adhesive tape, the anisotropic conductive film dividing device 15 can be made smaller and simpler, and the occurrence of a failure rate can be reduced. In addition, maintenance can be further simplified. As a result, the anisotropic conductive film sticking apparatus 10 can be reduced in size and simplified, and the maintenance of the anisotropic conductive film sticking apparatus 10 can be simplified.

In the anisotropic conductive film sticking apparatus 10, the width of the separation region 14B, that is, the size of the separation region 14 depends on the distance between the cutters 32A and 32B. Since it can be made variable, the distance between the two cutters is not limited by the width of the adhesive tape as in the related art. Therefore, since the interval between the cutters 32A and 32B can be narrower than the width of the adhesive tape, the anisotropic conductive film 14 can be used more efficiently. As a result, the exchange cycle of the base material 12 can be further shortened, and the operation rate of the anisotropic conductive film sticking apparatus 10 can be improved.

In the anisotropic conductive film sticking apparatus 10, a cutter 32 for forming a cut in the anisotropic conductive film 14 is provided.
Since the separation region portion 14B can be peeled off from the base film 13 using A and 32B, the method of dividing the anisotropic conductive film 14 can be simplified. In the anisotropic conductive film sticking apparatus 10, the cutters 32A and 32A
Since the separation region 14B is peeled off from the base film 13 using B, the separation region 14B can be easily and reliably peeled off.

[0040] Further, in the anisotropic conductive film application device 10, when the joining area part 14A ₃ from the anisotropic conductive film 14 is divided, the length of the joining region portion 14A ₃ is anisotropic earlier Attachment area 14A ₁ divided from conductive film 14
And the same length as the length of 14A _2, and so joining region portion 14A ₁ is positioned in the thermocompression bonding position, by which to send out the substrate 12 from the substrate feed reel 11 at a predetermined length Since the cutting position with respect to the anisotropic conductive film 14 and the thermocompression bonding position of the bonding region 14A can be synchronized, the productivity of the anisotropic conductive film bonding apparatus 10 can be further improved.

According to the above configuration, the two cutters 32A
And 32B are moved in a direction close to the anisotropic conductive film 14 to form cuts in the anisotropic conductive film 14, and the anisotropic conductive film 14 is divided into a bonding region 14A and a separation region 14B. After the cutters 32A and 32B are moved in a direction approaching each other to pinch the separation region 14B, the cutters 32A and 32B are moved in a direction away from the anisotropic conductive film 14 to collect the separation region 14B. Then, the anisotropic conductive film 14 is divided into an attachment region 14A and a separation region 14B by attaching the attachment region 14A of the anisotropic conductive film 14 onto the substrate 17 using the thermocompression bonding head 16. Since the step and the step of removing the separation region portion 14B from the base film can be continuously performed in one step, the bonding region portion 14A is divided from the anisotropic conductive film 14. The time required to be able to significantly reduce. Thus, an anisotropic conductive film sticking apparatus and an anisotropic conductive film dividing method which can further improve the productivity by a simple method can be realized.

In the above-described embodiment, the case where the base material 12 in which the anisotropic conductive film 14 is adhered on one surface of the base film 13 has been described, but the present invention is not limited to this. The base material 12 in which the anisotropic conductive film 13 is attached on one surface of the base film 13 and the cover film is further laminated on the anisotropic conductive film 13 may be used. In this case, a peeling means for peeling the cover film from the base material 12 supplied from the base material supply reel 11 is provided, and the base material 12 is supplied in a state where the cover film is peeled off by the peeling means.

In the above embodiment, three cuts are formed in the anisotropic conductive film 14 so that the anisotropic conductive film 14
One of the time divided into joining region portion 14A _1, 14A ₂ and 14A _3, the case joining region portion 14A ₁ is to be positioned thermocompression bonding position, which is the base material supply reel 11 to feed the substrate 12 As described above, the present invention is not limited to this. In short, when the cut region is formed by the cutters 32A and 32B in the anisotropic conductive film 14, if the bonding region 14A can be positioned at the thermocompression bonding position, The base material 12 may be supplied such that when the cuts are formed two or four times or more in the anisotropic conductive film 14, the attachment region 14 </ b> A is positioned at the thermocompression bonding position. Further, when the cuts are formed, it is not necessary to position the attachment region 14A at the thermocompression bonding position.

Further, in the above embodiment, the cutter 3
The case where the gap between the cutting edges of the cutters 32A and 32B when piercing the 2A and 32B into the anisotropic conductive film 14 is set to 1 [mm] has been described, but the present invention is not limited to this.
The intervals between the cutting edges of the cutters 32A and 32B may be set to other various numerical values. Further, in the above embodiment,
Although the case where two cutters 32A and 32B are used has been described, the present invention is not limited to this, and the point is that the anisotropic conductive film 1 is used.
4 may be used as long as it can be removed by dividing the divided region portion 14B into the pasting region portion 14A and the separation region portion 14B.

Further, in the above-described embodiment, when the cylinder shaft 25A is moved in the reverse Y direction, the cutting edges of the cutters 32A and 32B have the anisotropic conductive film 14 and the base film 1 as the cutting edges.
The case where the position of the stopper 28 is selected so as to stop at the boundary with the third film 3 has been described. However, the present invention is not limited to this. May be selected.

Further, in the above-described embodiment, the substrate supply reel 11 and the operation panel are used as substrate supply means for supplying a tape-shaped substrate having an anisotropic conductive film adhered to one surface of the base film. Although the case where the control device 18 and the control device 19 are used has been described, the present invention is not limited to this, and a base material supply for supplying a tape-shaped base material having an anisotropic conductive film adhered to one surface of a base film As the means, various other substrate supply means can be applied.

Further, in the above-described embodiment, a cut is formed at a predetermined position of the anisotropic conductive film of the base material supplied from the base material supply means, so that the anisotropic conductive film can be attached to the substrate. And an anisotropic conductive film dividing device 15 as division removing means for dividing the attached region portion into a separated region portion for separating the attached region portions from each other, and removing the separated region portion by pinching it from the base film. Although the case of using the anisotropic conductive film is not limited to this, the present invention is not limited thereto, by forming a cut at a predetermined position of the anisotropic conductive film of the base material supplied from the base material supply unit, the anisotropic conductive film, A dividing and removing unit that divides into a pasting region for pasting to the substrate and a separating region for separating the pasting regions from each other, and removes the separating region by pinching it from the base film. May apply various other dividing removal means.

Further, in the above-described embodiment, the thermocompression bonding head 16, the head driving section 16A, the operation panel 18 and the control device 19 are used as the bonding means for bonding the bonding region of the anisotropic conductive film on the substrate. Although the case has been described, the present invention is not limited to this, and various other attaching means can be applied as an attaching means for attaching the attaching area portion of the anisotropic conductive film on the substrate.

Further, in the above-described embodiment, the operation panel 18, the control device 19 and the substrate take-up reel 23 are used as a take-up means for taking up the remaining base film after attaching the attachment region onto the substrate. However, the present invention is not limited to this, and various other winding means can be applied as a winding means for winding the remaining base film after attaching the sticking area on the substrate.

Further, in the above-described embodiment, the control panel 18, the control device 19, and the control means for controlling the base material supply means, the division removing means, the sticking means and the winding means are provided.
Although the case where the vacuum valve section 27 is used has been described, the present invention is not limited to this, and various other control means are applied as control means for controlling the base material supply means, the division removing means, the attaching means and the winding means. I can do it.

Further, in the above-described embodiment, the first and second cutters having at least the width of the anisotropic conductive film and being arranged to be openable and closable and in parallel are provided with the cutter 32.
The case where A and 32B are used has been described. However, the present invention is not limited to this. Various other first and second cutters can be applied as cutters.

Further, in the above-described embodiment, the operation panel 18 and the control device serve as the first driving means for integrally moving the first and second cutters in the directions approaching and moving away from the anisotropic conductive film. 19, unit frame 20, vacuum source 26, vacuum valve 27A, cutting cylinder 25, cylinder shaft 25A, stopper 28, chuck cylinder 2
9, the case where the guide rail 30 and the slider 31 are used has been described. However, the present invention is not limited to this.
Various other first driving means may be applied as the first driving means for integrally moving the cutter in the direction of moving toward and away from the anisotropic conductive film.

Further, in the above-described embodiment, as the second driving means for opening and closing the first and second cutters, the operation panel 18, the control device 19, the vacuum source 26, the vacuum valve 2
7B and the case where the check cylinder 29 is used, but the present invention is not limited to this, and various other second driving means for opening and closing the first and second cutters may be used.
Can be applied.

Further, in the above-described embodiment, the substrate supply reel 11 and the operation panel 18 are used as substrate holding means for holding the substrate so that the anisotropic conductive film faces the first and second cutters. , Control device 19, unit frame 20,
Although the case where the substrate receiving base 21, the guide pins 20A to 20D, and the substrate take-up reel 23 are used has been described, the present invention is not limited to this, and the anisotropic conductive film faces the first and second cutters. As described above, various other substrate holding means can be applied as the substrate holding means for holding the substrate.

[0055]

As described above, according to the present invention, a cut is formed at a predetermined position of the anisotropic conductive film of the base material supplied from the base material supply means, so that the anisotropic conductive film is formed on the substrate. Is divided into a sticking area part for sticking to the base film and a separation area part for separating the sticking area parts from each other, and the separation area part is removed by being pinched from the base film, and the sticking area part is stuck on the substrate. Then, by winding the remaining base film after attaching the attachment region to the substrate, the time required to divide the anisotropic conductive film into the attachment region can be significantly reduced. Thus, an anisotropic conductive film sticking apparatus and an anisotropic conductive film dividing method which can further improve the productivity by a simple method can be realized.

[Brief description of the drawings]

FIG. 1 is a partially cutaway sectional view showing an embodiment of the anisotropic conductive film sticking apparatus of the present invention.

FIG. 2 is a schematic perspective view illustrating a configuration of an anisotropic conductive film dividing apparatus according to an embodiment.

FIG. 3 is a schematic side view for explaining a method of dividing an anisotropic conductive film.

FIG. 4 is a schematic side view for explaining a method of attaching an anisotropic conductive film.

FIG. 5 is a schematic side view for explaining a method of attaching an anisotropic conductive film.

FIG. 6 is a schematic perspective view for explaining a base material.

[Description of Signs] 10 ... anisotropic conductive film sticking device, 11 ... substrate supply reel, 12 ... substrate, 13 ... base film, 14 ...
... anisotropic conductive film, 14A ... sticking area part, 14B ...
Separation region, 15: Anisotropic conductive film dividing device, 16:
Thermocompression head, 17 ... board, 18 ... operation panel, 1
9 Control device, 20 Unit frame, 21
Substrate receiving stand, 23 ... Substrate winding reel, 25 ... Cylinder for cutting, 25A ... Cylinder shaft, 27 ... Vacuum valve section, 28 ... Stopper, 29 ... Cylinder for chuck, 32A, 32B ... ... cutter, 33 ... suction nozzle.

Claims (5)

[Claims] 1. An anisotropic conductive film sticking apparatus for sticking an anisotropic conductive film on a substrate, wherein a tape-shaped base material having an anisotropic conductive film adhered to one surface of a base film is supplied. A base material supply unit, by forming a cut in a predetermined position of the anisotropic conductive film of the base material supplied from the base material supply unit, to attach the anisotropic conductive film to the substrate. And a dividing and removing unit that divides the pasting region portion into a separation region portion for separating the pasting region portions from each other, and removes the separation region portion by pinching it from the base film. Attachment means for attaching the attachment area on the substrate; Winding means for winding the base film remaining after attaching the attachment area on the substrate; Base material supply means; The anisotropic conductive film sticking apparatus characterized by comprising a control means for controlling the joining means and the winding means. 2. The method according to claim 1, wherein the first and second cutters have a width at least equal to or greater than the width of the anisotropic conductive film, and are arranged to be openable and closable and parallel to each other. A first driving unit that integrally moves the second cutter in a direction to approach and separate from the anisotropic conductive film; a second driving unit that opens and closes the first and second cutters; 2. The anisotropic conductive film according to claim 1, further comprising: a base holding unit configured to hold the base so that the anisotropic conductive film faces the first and second cutters. 3. Pasting device. 3. The method according to claim 1, wherein the base material supply means has the same length in each of the pasting region portions, and the cutout is formed in the anisotropic conductive film by the dividing and removing means. 2. The anisotropic conductive film sticking apparatus according to claim 1, wherein the base material is supplied at a predetermined length so that the sticking area is positioned at a sticking position by the sticking means. 3. 4. A tape-shaped base material having an anisotropic conductive film adhered on one surface of a base film, and an anisotropic film divided into an attaching region for attaching the anisotropic conductive film to a substrate. In the conductive film dividing method, a cut is formed at a predetermined position of the anisotropic conductive film to form the anisotropic conductive film into the attachment region and a separation region for separating the attachment regions. A method of dividing an anisotropic conductive film, comprising dividing the base film and removing the separation region portion of the anisotropic conductive film from the base film. 5. The method according to claim 4, wherein a predetermined tension is applied to the substrate.