JPH104152A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the deterioration of the characteristics of an electronic component, which is caused by adhesion of a bonding agent, by a method wherein sealing materials are extended so as to connect with the electrodes of an element in the part in a case and, at the same time, the outer peripheral parts of through holes on metal films are covered with the sealing materials in the outer part of the case. SOLUTION: A case is constituted of a frame material 1 and plate materials 4 and 5, and a semiconductor IC chip 3 is housed in the case. A plurality of through holes 6 are formed in the plate material 4 with a diameter longer in the side facing the IC chip 3 than in the external side. A metal film 7 is formed in the internal side of the through hole 6 and in the outer periphery of the through hole 6 in the external side of the plate member 7. Solders 8, which are used as sealing materials, are respectively provided on these films 7. These solders 8 are respectively connected with the respective input/output electrodes 9 of the chip 3 in an open part 2 of the case and are respectively connected with external electrodes 10 in such a way as to cover the outer peripheral parts of the holes 6 on the films 7 in the outer part of the case. Accordingly, the deterioration of the characteristics of an electronic component, which is caused by adhesion of a bonding agent, can be prevented from being generated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a SAW filter,
The present invention relates to an electronic component such as a SAW oscillator or a quartz oscillator.

[0002]

2. Description of the Related Art For example, the characteristics of a SAW filter, a SAW oscillator, or a crystal oscillator fluctuate in accordance with an external atmosphere. Therefore, these elements are sealed in a case.

[0003]

In the above conventional device, the input / output electrodes of the element are connected to the external lead-out electrodes of the case using lead wires, and the element is fixed with an adhesive. Therefore, there is a problem that a part of the adhesive is scattered and adheres to the element to deteriorate its characteristics.

[0004] The present invention prevents the deterioration of characteristics due to the adhesion of the adhesive by fixing the element and connecting the external lead electrode without using a lead wire or an adhesive and at the same time, by sealing the element. It is intended for.

[0005]

In order to achieve this object, the present invention comprises a case which is insulative and has at least a non-brazing surface, and an electrode provided on one side provided in the case. An element, at least one or more through-holes in which the diameter of the opening is larger on the outside of the case than on the inside of the case formed in the case portion corresponding to the electrode of the element; A metal film provided on an outer peripheral portion of the through-hole, and a sealing member provided on the metal film and made of a brazing material for sealing the through-hole, and the sealing member includes a sealing member of the element in the case inner portion. The metal film is extended so as to be connected to the electrode and covers at least the outer peripheral portion of the through hole of the metal film in the outer portion of the case.

With the above construction, an electronic component having high strength and extremely high hermeticity without deterioration in characteristics can be obtained.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention relates to a case which is insulative and has at least a non-brazing surface, and an element provided in this case and having an electrode on one surface. At least one or more through-holes in which the diameter of the opening is larger on the outside of the case than on the inside of the case formed on the case corresponding to the electrode of the element; A metal film provided on an outer peripheral portion of the hole, and a sealing member provided on the metal film and made of a brazing material for sealing the through hole, and the sealing member is provided on the electrode of the element in the case inner portion. It is configured to be extended so as to be connected and to cover at least the outer peripheral portion of the through hole of the metal film in the outer portion of the case,
The airtightness is excellent, the strength is strong, and there is no characteristic deterioration.

According to a second aspect of the present invention, the element is formed of a surface acoustic wave device, and a sealing member is connected to the input / output electrode of the device. Slightly away from the
The element is reliably vibrated.

According to a third aspect of the present invention, there is provided a case which is insulative and has at least a non-brazing surface, an element provided in the case and having an electrode on one surface, and an electrode corresponding to the element. At least one formed in the case part
And more than one first through-hole, a metal film provided on the inner surface of the first through-hole and the outer peripheral portion of the first through-hole outside the case,
A first sealing body made of a brazing material provided on the metal film and sealing the first through-hole is provided, and the first sealing body has at least a first element inside the case inside the case. It is extended slightly away from the inner wall surface on the side of one through hole, and the diameter of the inner portion of the case of the first sealing body is slightly larger than the diameter of the opening of the inner portion of the case of the first through hole. Formed, the first sealing body is connected to the electrode of the element, and is configured to cover at least an outer peripheral portion of the first through hole of the metal film in an outer portion of the case, and a first portion of the case is formed. At least one or more second through holes are provided on a surface opposite to the surface on which the through holes are provided, and a second sealing body made of an inorganic material for sealing the second through holes is provided. In addition, injection of the sealing body becomes easy.

According to a fourth aspect of the present invention, the same metal film as the first through hole is provided on the inner surface of the second through hole and the outer peripheral portion of the second through hole outside the case, and provided on the metal film. A second sealing body using the same material as the first sealing body that seals the second through-hole, and the second sealing body has at least the metal film in the outer portion of the case. Since the outer peripheral portion of the second through hole is configured to be covered, the airtightness can be improved.

According to a fifth aspect of the present invention, the diameter of the inside of the case of the sealing body is formed to be slightly larger than the diameter of the opening in the inside of the case of the through hole. The connection strength can be improved.

According to a sixth aspect of the present invention, there is provided a case formed of a glass material, an element comprising a surface acoustic wave device provided in the case, and a case formed in a case portion corresponding to an electrode of the element. At least one or more through-holes in which the outer portion of the case has a larger opening diameter than the inner portion, and at least the surface provided on the inner surface of the through-hole and the outer peripheral portion of the through-hole outside the case is made of gold or tin. And a sealing body made of a solder material provided on the metal film and sealing the through-hole, and the sealing body has an element inside the case at least on the through-hole side inside the case. It is extended so as to be slightly away from the wall surface, and the diameter of the inner part of the case of the sealing body is formed to be slightly larger than the diameter of the opening of the inner part of the case of the through hole. Connected In case outside portions are those configured to cover the outer peripheral portion of at least the through hole of the metal film, so that can be improved to improve the airtightness of the connection strength between the elements.

According to a seventh aspect of the present invention, there is provided a case formed of a glass material, an element comprising a surface acoustic wave device provided in the case, and a case formed in a case portion corresponding to an electrode of the element. At least one or more first through holes in which the diameter of the opening portion is larger on the outside of the case than on the inner portion, and on the inner surface of the first through hole and the outer peripheral portion of the first through hole outside the case. A metal film having at least a surface of gold or tin provided thereon, and a first sealing body made of a solder material provided on the metal film and sealing the first through hole; The body is extended in the case inner part so that the element is slightly away from the inner wall surface on the side of at least the first through hole inside the case, and the diameter of the case inner part of the first sealing body is the diameter of the first through hole. Slightly larger than the diameter of the opening inside the case The first sealing member is formed so as to be tighter, and the first sealing member is connected to the electrode of the element, and is configured to cover at least an outer peripheral portion of the first through hole of the metal film in an outer portion of the case. At least one or more second through holes are provided on a surface facing the surface provided with one through hole, and a first through hole is provided on an inner surface of the second through hole and an outer peripheral portion of the second through hole outside the case. A metal film similar to the through-hole, and a second sealing body using the same material as the first sealing body provided on the metal film and sealing the second through-hole, The second sealing member is configured so as to cover at least the outer peripheral portion of the second through hole of the metal film in the outer portion of the case, so that the sealing member can be easily formed and the airtightness can be improved. .

According to an eighth aspect of the present invention, a spacer is provided between the element and the inner wall surface on the side of the through hole inside the case, so that vibration of the element can be reliably ensured.

According to a ninth aspect of the present invention, the spacer is made of an inorganic material, and is formed at a portion other than the comb-shaped electrode and the input / output electrode of the element made of the surface acoustic wave device. Vibration can be secured.

According to a tenth aspect of the present invention, a dike is provided between the element and the inner wall surface on the side of the through hole inside the case and around the opening of the through hole inside the case. Short circuit can be prevented by the sealing body.

Hereinafter, specific embodiments will be described with reference to the drawings. (Embodiment 1) A first embodiment will be described with reference to FIG. In FIG. 1, reference numeral 1 denotes a frame made of, for example, borosilicate glass. A semiconductor IC chip 3 is housed in the opening 2 of the frame 1 as an example of an element. Frame 1
First and second plate members 4 and 5 made of borosilicate glass are respectively connected to the upper and lower surfaces by direct bonding between the glasses.

The first plate 4 has a plurality of through-holes 6 whose outer diameters are larger on the outer surface than on the element-side surface.
A metal film 7 is formed on an inner surface of the through hole 6 and an outer peripheral portion of the through hole 6 on an outer surface of the first plate body 4, and a solder 8 is formed on the metal film 7 as an example of a sealing body. The solder 8 is connected to the input / output electrodes 9 of each semiconductor IC chip 3 in the opening 2, and on the outer surface of the first plate 4, Metal film 7 provided
At least the outer periphery of the through hole 6 is covered with the solder 8
Is connected to the external electrode 10 on the outer surface of the first plate 4. That is, the frame 1, the frames 4 and 5 form a case, and the semiconductor IC chip 3 is housed in the case.

FIG. 2 is a sectional view of the first embodiment of FIG. The thickness of the frame 1 is 400 μm, the thickness of the first plate 4 is 200 μm, the thickness of the second plate 5 is 200 μm,
Further, the thickness of the semiconductor IC chip 3 is 340 μm. That is, since the semiconductor IC chip 3 is thinner than the frame 1, a space 11 is always formed between one or both of the upper and lower plates 4, 5 or both inner wall surfaces. here,
For an element such as the semiconductor IC chip 3 that does not require space on the wiring pattern, when the solder 8 is connected to the electrode 9, the surface of the wiring pattern of the semiconductor IC chip 3 and the inner wall surface of the first plate 4 The space 11 does not need to be formed between them. Further, the through hole 6 is formed so that the diameter decreases from the outside toward the surface on the semiconductor IC chip 3 side to facilitate the injection of the solder 8.

As described above, the input / output electrodes 9 of the semiconductor IC chip 3 are alloy-connected to the solders 8 at several locations, and the connection strength is sufficient to fix the semiconductor IC chip 3. In addition, there is no displacement in the front, rear, left and right directions in the case. Further, since the solder 8 covers at least the outer periphery of the through-hole 6 on the metal film 7 provided on the outer periphery of the through-hole 6 on the outer surface of the first plate body 4, the airtightness in the case is extremely high. You will be drooped.

(Embodiment 2) The second embodiment is shown in FIG.
It is explained together with. In FIG. 3, reference numeral 1 denotes a frame made of, for example, borosilicate glass. A SAW filter chip (a SAW oscillator chip or the like) 12 is housed in the opening 2 of the frame 1 as an example of an element. Frame 1
First and second plates 4 and 5 made of borosilicate glass are connected to the upper and lower surfaces by direct bonding between the glasses.

The first plate 4 has a plurality of through-holes 6 whose outer surface has a larger diameter on the outer surface than the surface on the element side.
A metal film 7 is formed on an inner surface of the through hole 6 and an outer peripheral portion of the through hole 6 on an outer surface of the first plate body 4, and a solder 8 is formed on the metal film 7 as an example of a sealing body. The solder 8 is connected to the input / output electrodes 13 of the respective SAW filter chips 12 in the opening 2, and on the outer surface of the first plate 4, The solder 8 is connected to the external electrode 10 on the outer surface of the first plate 4 so as to cover at least the outer periphery of the through hole 6 on the provided metal film 7. That is, a case is constituted by the frame 1, the plates 4 and 5, and the SAW filter chip 12 is housed in the case.

FIG. 4 is a sectional view of the second embodiment of FIG. The thickness of the frame 1 is 400 μm, the thickness of the first plate 4 is 200 μm, the thickness of the second plate 5 is 200 μm,
Further, the plate thickness of the SAW filter chip 12 is 340 μm. That is, the SAW filter chip 12 is
Since the plate thickness is smaller than that, a space 11 is always formed between one or both of the upper and lower plate members 4 and 5 or both inner wall surfaces. Here, if the SAW filter chip 12 comes into contact with the inner wall surface of the first plate member 4 as shown in FIG. 2, the vibration of the SAW filter chip 12 is hindered. A space 14 required for vibration is required between the first plate 4 and the inner wall surface.

In this case, when the solder 8 is injected into the through hole 6, the solder 8 is connected to the input / output electrodes 13 of the SAW filter chip 12 in the opening 2, and simultaneously, the solder 8 is pressed. The pressure presses the SAW filter chip 12 in the direction of the second plate 5 to form a space 14 necessary for vibration. At this time, since the through hole 6 is formed so as to decrease in diameter from the outside toward the inner surface of the case, the through-hole 6 has a structure in which the solder 8 can be easily injected and the pressing force of the upper solder 8 can be easily obtained.

That is, the input / output electrodes 13 of the SAW filter chip 12 are alloy-connected while being pressed in the direction of the second plate 5 by the solders 8 at these several places, and the connection strength is SA.
Since it has sufficient strength to fix the W filter chip 12, there is no occurrence of displacement in the front, rear, left and right directions in the case.

Further, the inside of the case of the solder 8 (through hole 6)
Of the SAW filter chip 12 extending to the input / output electrode 13) is slightly larger than the diameter of the opening inside the case of the through-hole 6, so that the connection strength can be further improved. SAW filter chip 1
2 never falls off. Also, the solder 8 is used as the first plate 4
Metal film 7 provided on the outer surface of through hole 6 on the outer surface of
By covering at least the outer periphery of the through hole 6 above, the airtightness in the case is kept extremely high.

(Embodiment 3) The third embodiment is shown in FIG.
It is explained together with. FIG. 5 shows a second plate 5 in which a second through hole 15 is provided in FIG. With this structure, when the solder 8 is formed in the through-hole 6, the air in the case escapes from the second through-hole 15 and the injection of the solder 8 becomes very easy. At this time, since the through-hole 6 is formed such that the diameter decreases from the outside toward the element-side surface, the structure is such that the solder 8 can be easily injected.

In addition, it is possible to easily secure a space 14 between the SAW filter chip 12 and the inner wall surface of the first plate 4 so as not to hinder the vibration of the SAW filter chip 12. After the solder 8 is formed, it is necessary to hermetically seal the second through hole 15 with a material such as low-melting glass in order to hermetically seal the case.

However, when the element inside the case is not so heat-resistant as the SAW filter chip 12, a low melting point glass cannot be used, and it is appropriate to use a soldering material having a lower melting point, for example. . Therefore, in the third embodiment of the present invention, the same thing as the sealing structure in which the solder 8 is provided in the through hole 6 is applied to the second through hole 15. A second metal film 16 is formed on the inner surface and the outer peripheral portion of the through hole on the outer surface of the second plate member 5, and the solder 8 is provided on the second metal film 16 to form the second plate member 5. At least the second through-hole 15 on the second metal film 16 provided on the outer surface at the outer peripheral portion of the second through-hole 15
Is covered. With such a structure, the airtightness in the case is kept extremely high.

(Embodiment 4) A fourth embodiment is shown in FIG.
It is explained together with. FIG. 6 is a sectional view of the fourth embodiment. The thickness of the frame 1 is 400 μm, the thickness of the first plate 4 is 200 μm, the thickness of the second plate 5 is 200 μm, and the thickness of the SAW filter chip 12 is 340 μm. That is, since the SAW filter chip 12 has a smaller thickness than the frame 1, a space 11 is always formed between one or both of the upper and lower plates 4, 5 or both inner wall surfaces.

Here, when the SAW filter chip 12 comes into contact with the inner wall surface of the first plate 4 as shown in FIG.
Since the vibration of the AW filter chip 12 is hindered, the SA
A space 14 necessary for vibration is required between the surface of the wiring pattern of the W filter chip 12 and the inner wall surface of the first plate 4.

Therefore, the SAW filter chip 12 is located at a position different from the input / output
In a part that does not hinder the vibration of the filter chip 12,
For example, the solder 8 is provided by forming a spacer 17 using an inorganic material that can be easily deformed such as Au using a method of bonding only a ball portion formed at the time of wire bonding (or also called a wire bump). A space 14 necessary for vibration between the SAW filter chip 12 and the inner wall surface of the first plate 4 is secured beforehand so that the vibration of the SAW filter chip 12 is not hindered. It is injected and connected to the input / output electrodes 13 of the SAW filter chip 12 in the opening 2 respectively.

At this time, since the diameter of the through-hole 6 decreases from the outside toward the element-side surface, the structure is such that the solder 8 can be easily injected. That is, the SAW filter chip 12 secures a space 14 so as not to hinder the vibration by the spacer 17, and its input / output electrodes 13 are alloy-connected by these several solders 8, and the connection strength of the SAW filter chip 12 is fixed. Therefore, there is no displacement in the front, rear, left and right directions in the case. Further, the solder 8 covers at least the outer periphery of the through hole 6 on the metal film 7 provided on the outer peripheral portion of the through hole 6 on the outer surface of the first plate body 4,
The airtightness in the case is kept extremely high.

(Embodiment 5) The fifth embodiment is shown in FIG.
It is explained together with. FIG. 7 is a sectional view of the fifth embodiment. The thickness of the frame 1 is 400 μm, the thickness of the first plate 4 is 200 μm, the thickness of the second plate 5 is 200 μm, and the thickness of the SAW filter chip 12 is 340 μm. That is, since the SAW filter chip 12 has a smaller thickness than the frame 1, a space 11 is always formed between one or both of the upper and lower plates 4, 5 or both inner wall surfaces.

Here, when the SAW filter chip 12 comes into contact with the inner wall surface of the first plate 4 as shown in FIG.
Since the vibration of the AW filter chip 12 is hindered, the SA
A space 14 necessary for vibration is required between the surface of the wiring pattern of the W filter chip 12 and the inner wall surface of the first plate 4.

Therefore, a thin plate-like material such as a polyimide tape is processed into a donut shape in a portion of the SAW filter chip 12 around the input / output electrodes 13 where the vibration of the SAW filter chip 12 is not hindered. Forming the embankment body 18 by using the SAW before the solder 8 is provided.
The space 11 between the filter chip 12 and the inner wall surface of the first plate body 4 is secured so as not to hinder the vibration of the SAW filter chip 12, and when the solder 8 is injected into the through hole 6, 8 is prevented from protruding from the input / output electrodes 13 on the SAW filter chip 12 and short-circuiting with other electrodes, and is connected to the input / output electrodes 13 of the SAW filter chip 12 in the opening 2 respectively.

At this time, since the through hole 6 is formed so that the diameter decreases from the outside toward the element side surface, the structure is such that the solder 8 can be easily injected. In other words, the SAW filter chip 12 secures a space 14 for preventing the vibration from being hindered by the embankment body 18, prevents the solder 8 from protruding from the input / output electrode 13 on the SAW filter chip 12, and short-circuits with other electrodes. The output electrode 13 is alloy-connected by these several solders 8 and its connection strength is SA.
Since it has sufficient strength to fix the W filter chip 12, there is no occurrence of displacement in the front, rear, left and right directions in the case. Further, since the solder 8 covers at least the outer periphery of the through-hole 6 on the metal film 7 provided on the outer periphery of the through-hole 6 on the outer surface of the first plate body 4, the airtightness in the case is extremely high. You will be drooped.

In the first to fifth embodiments, the first and second plate members 4 and 5 are directly joined to each other on both sides of the frame 1 by means of glass. Of course, in order to join these, the frame 1 and the first and second plates 4,
The joint surface with 5 must be in a state where the mirror surface of the glass is held. Further, in order to further secure the direct joining of these three members, it is preferable to heat these three members while applying pressure. In other words, if such pressure is applied, even if a small amount of dust or the like is present on the bonding surface, the outer peripheral surface of the dust is strongly pressed, so that direct bonding can be performed.

[0039]

As described above, according to the present invention, the element can be electrically pulled out of the case through the sealing member in the through hole, and the diameter of the through hole can be made larger than that of the case inside portion. By making the outer part larger, it becomes easier to inject the sealing body in the molten state, and this sealing body adheres to the metal film in the through hole, and the diameter of the sealing body penetrates inside the case. The hole is formed to be larger than the diameter of the inner part of the case, so the strength is strong and it does not fall off.In addition, since the outer peripheral part of the through hole of the metal film is covered with this sealing body outside the case, it is airtight. The performance is extremely high, and as a result, the characteristics of the element do not deteriorate.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a first embodiment of an electronic component of the present invention.

FIG. 2 is a sectional view of the same.

FIG. 3 is an exploded perspective view of a second embodiment of the present invention.

FIG. 4 is a sectional view of the same.

FIG. 5 is an exploded perspective view of a third embodiment of the present invention.

FIG. 6 is a sectional view of a fourth embodiment of the present invention.

FIG. 7 is a sectional view of a fifth embodiment of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 frame 2 opening 3 semiconductor IC chip 4 first plate 5 second plate 6 through hole 7 metal film 8 solder 9 electrode of semiconductor IC chip 10 external electrode 11 space generated in case 12 SAW filter chip 13 SAW filter tip electrode 14 Space required for vibration 15 Second through hole 16 Second metal film 17 Spacer 18 Embankment

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Shinji Umeda 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd.

Claims (10)

[Claims] 1. A case that is insulative and has at least a non-brazing surface, an element provided in the case and having an electrode on one surface, and a case formed on a case portion corresponding to the electrode of the element. At least one or more through-holes in which the diameter of the opening portion is larger on the outside of the case than on the inner portion; a metal film provided on the inner surface of the through-hole and on the outer periphery of the through-hole outside the case; A sealing member made of a brazing material for sealing the through-hole provided on the upper portion, the sealing member being extended so as to be connected to the electrode of the element in the inner part of the case, and being formed in the outer part of the case. An electronic component configured to cover at least the outer peripheral portion of the through hole of the metal film. 2. An element comprising a surface acoustic wave device, wherein a sealing member is connected to an input / output electrode of the device, and the sealing member slightly separates the element from an inner wall surface of the case at least on a through hole side. 2. The electronic component according to 1. 3. A case that is insulative and has at least a non-brazing surface, an element provided with an electrode on one side provided in the case, and at least a case formed on a case portion corresponding to the electrode of the element. One or more first through holes, a metal film provided on an inner surface of the first through hole and an outer peripheral portion of the first through hole outside the case, and the first through hole provided on the metal film; A first sealing member made of a brazing material for sealing the hole, the first sealing member being such that the element in the case inner portion is slightly separated from an inner wall surface of at least the first through hole side inside the case. The diameter of the case inner portion of the first sealing body is formed to be slightly larger than the diameter of the opening of the case inner portion of the first through hole, and the first sealing body is Connected to the electrode of the element, and the metal film At least one or more second through-holes are provided on a surface of the case, which is configured to cover at least an outer peripheral portion of the first through-hole, and a surface of the case opposite to the surface where the first through-hole is provided. An electronic component comprising a second sealing body made of an inorganic material for sealing a through hole. 4. A metal film similar to the first through-hole on an inner surface of the second through-hole and on an outer peripheral portion of the second through-hole outside the case.
A second sealing body using the same material as the first sealing body that is provided on the metal film and seals the second through hole,
4. The electronic component according to claim 3, wherein the second sealing member is configured to cover at least an outer peripheral portion of the second through hole of the metal film in an outer portion of the case. 5. The electronic component according to claim 3, wherein the diameter of the inside of the case of the sealing body is formed to be slightly larger than the diameter of the opening in the inside of the case of the through hole. 6. A case formed of a glass material, an element formed of a surface acoustic wave device provided in the case, and a case outer part formed by a case inner part formed in a case part corresponding to an electrode of the element. At least one through-hole having a larger diameter of the opening, a metal film provided on the inner surface of the through-hole and the outer peripheral portion of the through-hole outside the case, and at least a surface of which is made of gold or tin; A sealing member provided on the membrane and made of a solder material for sealing the through hole, wherein the sealing member extends in the inner portion of the case so that the element is slightly away from at least the inner wall surface on the through hole side inside the case; The diameter of the inner part of the case of the sealing body is formed so as to be slightly larger than the diameter of the opening of the inner part of the case of the through hole, and the sealing body is connected to the electrode of the element and is formed at the outer part of the case. An electronic component configured to cover at least an outer peripheral portion of the through hole of the metal film. 7. A case formed of a glass material, an element formed of a surface acoustic wave device provided in the case, and a case outer part formed by a case inner part formed in a case part corresponding to an electrode of the element. At least one or more first through holes in which the diameter of the opening is larger, and at least the surface provided on the inner surface of the first through hole and the outer peripheral portion of the first through hole outside the case is made of gold or gold. A metal film made of tin,
A first sealing body made of a solder material provided on the metal film and sealing the first through-hole is provided, and the first sealing body has at least a first element inside the case inside the case. It is extended slightly away from the inner wall surface on the side of one through hole, and the diameter of the inner portion of the case of the first sealing body is slightly larger than the diameter of the opening of the inner portion of the case of the first through hole. Formed, the first sealing body is connected to the electrode of the element, and is configured to cover at least an outer peripheral portion of the first through hole of the metal film in an outer portion of the case, and a first portion of the case is formed. At least one or more second through holes are provided on a surface facing the surface on which the through holes are provided, and a first through hole is provided on an inner surface of the second through hole and an outer peripheral portion of the second through hole outside the case. A metal film similar to that described above, and the second through hole provided on the metal film is sealed. A second sealing member made of the same material as the first sealing member, and the second sealing member covers at least an outer peripheral portion of the second through hole of the metal film in an outer portion of the case. Electronic components configured as follows. 8. The electronic component according to claim 7, wherein a spacer is provided between the element and the inner wall surface on the through hole side inside the case. 9. The electronic component according to claim 8, wherein the spacer is made of an inorganic material and formed on a portion other than the comb-shaped electrode and the input / output electrode of the element made of the surface acoustic wave device. 10. The electronic component according to claim 9, wherein a dike is provided between the element and the inner wall surface on the side of the through hole inside the case and around the opening of the through hole inside the case.