JPH10321075A - Membrane-type switch - Google Patents

Membrane-type switch

Info

Publication number
JPH10321075A
JPH10321075A JP14091197A JP14091197A JPH10321075A JP H10321075 A JPH10321075 A JP H10321075A JP 14091197 A JP14091197 A JP 14091197A JP 14091197 A JP14091197 A JP 14091197A JP H10321075 A JPH10321075 A JP H10321075A
Authority
JP
Japan
Prior art keywords
pressure
substrate
resistive film
sensitive resistive
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14091197A
Other languages
Japanese (ja)
Inventor
Satoshi Koizumi
敏 小泉
Yoshizumi Ooi
義積 大井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teikoku Tsushin Kogyo Co Ltd
Original Assignee
Teikoku Tsushin Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teikoku Tsushin Kogyo Co Ltd filed Critical Teikoku Tsushin Kogyo Co Ltd
Priority to JP14091197A priority Critical patent/JPH10321075A/en
Publication of JPH10321075A publication Critical patent/JPH10321075A/en
Pending legal-status Critical Current

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  • Push-Button Switches (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a switch which can be easily equipped with a complete waterproof structure, also having durability, is easy to manufacture, able to have manufacturing cost reduced, is simple in structure, and further having a structure not only able to be reduced in thickness but enabling on-off sensitivity to be kept well. SOLUTION: This switch is equipped with a first basic material 10, wherein an electrode pattern 13 is formed by printing on a flexible board 11 and a pressure-sensing resistance film 15 is formed thereon by printing, and a second basic material 20 wherein an electrode pattern 23 is formed by printing on a flexible board 21. Here, this switch is constituted such that the first basic material 10 and the second basic material 20 are placed one over the other, such that the pressure-sensing resistance film 15 formed on the first basic material 10 and the electrode pattern 23 formed on the second basic material 20 are brought into contact with each other.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は感圧抵抗膜を用いた
メンブレン型スイッチに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a membrane switch using a pressure-sensitive resistive film.

【0002】[0002]

【従来の技術】従来のメンブレン型スイッチとしては、
以下のような構造のものがあった。 図13に示すように、2枚のフレキシブル基板10
1,121にそれぞれ電極パターン103,123を印
刷形成し、これら2枚のフレキシブル基板101,12
1をスペーサ131を介して重ね合わせ、スペーサ13
1に設けた空隙133内において前記両電極パターン1
03,123を対向させ、上側のフレキシブル基板12
1を押圧することで電極パターン123を下降させて両
電極パターン103,123間をオンする構造のもの。
2. Description of the Related Art Conventional membrane type switches include:
There was the following structure. As shown in FIG. 13, two flexible substrates 10
The electrode patterns 103 and 123 are formed by printing on the first and second flexible substrates 101 and 121 respectively.
1 are overlapped via a spacer 131, and the spacer 13
1 in the space 133 provided in the first electrode pattern 1
03 and 123, and the upper flexible substrate 12
A structure in which the electrode pattern 123 is lowered by pressing 1 to turn on both electrode patterns 103 and 123.

【0003】図14に示すように、基板161上に電
極パターン163を印刷形成し、該電極パターン163
上に感圧抵抗膜165を印刷形成し、さらに該感圧抵抗
膜165の上に電極パターン167を印刷形成してなる
構造のもの。
As shown in FIG. 14, an electrode pattern 163 is formed on a substrate 161 by printing.
A structure in which a pressure-sensitive resistive film 165 is printed and formed thereon, and an electrode pattern 167 is further printed and formed on the pressure-sensitive resistive film 165.

【0004】そして電極パターン167の表面をキート
ップ等によって矢印a方向に押圧すれば、前記感圧抵抗
膜165に厚み方向の圧力が加わって該感圧抵抗膜16
5の圧力が加わった部分の厚み方向の抵抗値が減少し、
両電極パターン163,167間の抵抗値が減少してオ
ン状態となる。
When the surface of the electrode pattern 167 is pressed in the direction of arrow a by a key top or the like, pressure is applied to the pressure-sensitive resistive film 165 in the thickness direction, and the pressure-sensitive resistive film 16
The resistance value in the thickness direction of the part where the pressure of 5 is applied decreases,
The resistance between the two electrode patterns 163 and 167 decreases, and the electrode patterns are turned on.

【0005】[0005]

【発明が解決しようとする課題】しかしながら図13に
示す従来例の場合、フレキシブル基板121を押圧し
た際に空隙133内の空気を外に追い出すためのエア逃
げ孔を設けなければならず、完全防水構造とすることが
困難であった。
However, in the case of the conventional example shown in FIG. 13, when the flexible substrate 121 is pressed, an air escape hole must be provided for expelling the air in the gap 133 to the outside. It was difficult to make the structure.

【0006】また両電極パターン103,123間に、
ある程度の絶縁距離を必要とするので、更なる薄型化の
要求には対応できない。
Further, between the two electrode patterns 103 and 123,
Since a certain insulation distance is required, it is not possible to cope with a demand for further thinning.

【0007】一方薄型化の為にフレキシブル基板121
の板厚をさらに薄くした場合は、該フレキシブル基板1
21への押圧を多数回繰り返して該フレキシブル基板1
21を可動させているうちに、該フレキシブル基板12
1がヘタってしまい、その耐久性に問題が生じる。
On the other hand, in order to reduce the thickness, the flexible substrate 121 is used.
When the thickness of the flexible substrate is further reduced,
The flexible substrate 1 is repeatedly pressed many times.
21 while the flexible substrate 12 is being moved.
1 is fattered, and a problem arises in its durability.

【0008】次に図14に示す従来例の場合、1枚の
基板161上に三層の膜を形成するだけで良いので、そ
の厚みの薄型化は十分図れる。
Next, in the case of the conventional example shown in FIG. 14, since only three layers of films are required to be formed on one substrate 161, the thickness can be sufficiently reduced.

【0009】しかしながらこのメンブレン型スイッチの
場合、電極パターン163と感圧抵抗膜165と電極パ
ターン167とをスクリーン印刷にて積層する構造なの
で、各積層膜間の密着度が高く、各密着面における接触
抵抗値はかなり小さくなってしまう。
However, in the case of this membrane type switch, the electrode pattern 163, the pressure-sensitive resistive film 165, and the electrode pattern 167 are laminated by screen printing. The resistance value becomes considerably small.

【0010】このため両電極パターン163,167間
を無押圧状態にて確実にオフさせておくためには、前記
感圧抵抗膜165の抵抗値を確実に大きい状態に保って
おくため、感圧抵抗膜165の材質として感度の低い材
質のもの、即ち応力変化に対してその抵抗値が変化しに
くい材質のもの(具体的には混練する導電粉の少なくも
の)を使用しなければならない。
Therefore, in order to surely turn off the electrode patterns 163 and 167 in a non-pressed state, it is necessary to maintain the resistance value of the pressure-sensitive resistive film 165 in a large state. As the material of the resistance film 165, a material having low sensitivity, that is, a material whose resistance value does not easily change due to a change in stress (specifically, a material with less conductive powder to be kneaded) must be used.

【0011】しかしながら前記感圧抵抗膜165として
感度の低い材質のものを使用した場合、こんどはこのス
イッチを押圧した際になかなかオンしにくくなってしま
うという問題点が生じてしまう。
However, when a material having low sensitivity is used as the pressure-sensitive resistance film 165, there is a problem that it is difficult to turn on the switch when the switch is pressed.

【0012】本発明は上述の点に鑑みてなされたもので
ありその目的は、容易に完全防水構造とすることがで
き、また耐久性があり、製造が容易で、製造コストの低
減化が図れ、構造が簡単で、さらに薄型化が図れるばか
りか、オンオフ感度を良好に保てる構造のメンブレン型
スイッチを提供することにある。
SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has as its object the purpose of being able to easily provide a completely waterproof structure, being durable, easy to manufacture, and reducing manufacturing costs. Another object of the present invention is to provide a membrane-type switch having a structure that is simple in structure, can be made thinner, and can maintain good on / off sensitivity.

【0013】[0013]

【課題を解決するための手段】上記問題点を解決するた
め本発明は、基板上に電極パターンを形成しさらにその
上に感圧抵抗膜を形成してなる第一の基材と、基板上に
電極パターンを形成してなるか或いはさらに該電極パタ
ーン上に感圧抵抗膜を形成してなる第二の基材とを具備
し、前記第一の基材に形成した感圧抵抗膜と、前記第二
の基材に形成した電極パターン又は該電極パターン上に
さらに形成した感圧抵抗膜とを接触させるように前記第
一の基材と第二の基材を重ね合わせてメンブレン型スイ
ッチを構成した。また本発明は、基板上に複数の電極パ
ターンを接近させて形成しさらに該複数の電極パターン
の上を覆うように感圧抵抗膜を形成してなる第一の基材
と、基板上に導体パターンを形成してなるか或いはさら
に該導電パターン上に感圧抵抗膜を形成してなる第二の
基材とを具備し、前記第一の基材に形成した感圧抵抗膜
と、前記第二の基材に形成した導体パターン又は該導体
パターン上にさらに形成した感圧抵抗膜とを接触させる
ように前記第一の基材と第二の基材を重ね合わせてメン
ブレン型スイッチを構成した。また本発明は、基板上に
複数の電極パターンを接近させて形成してなる第一の基
材と、基板上に導体パターンを形成しさらにその上に感
圧抵抗膜を形成してなる第二の基材とを具備し、前記第
一の基材に形成した複数の電極パターンと前記第二の基
材に形成した感圧抵抗膜とを接触させるように前記第一
の基材と第二の基材を重ね合わせてメンブレン型スイッ
チを構成した。また本発明は、基板上に電極パターンを
形成しさらにその上に感圧抵抗膜を形成してなる第一の
基材と、基板上に電極パターンを形成してなるか或いは
さらに該電極パターン上に感圧抵抗膜を形成してなる第
二の基材とを具備し、前記第一の基材に形成した感圧抵
抗膜と、前記第二の基材に形成した電極パターン又は該
電極パターン上にさらに形成した感圧抵抗膜とを所定間
隔離間して対向する状態で前記第一の基材と第二の基材
を重ね合わせてメンブレン型スイッチを構成した。また
本発明は、基板上に複数の電極パターンを接近させて形
成しさらに該複数の電極パターンの上を覆うように感圧
抵抗膜を形成してなる第一の基材と、基板上に導体パタ
ーンを形成してなるか或いはさらに該導電パターン上に
感圧抵抗膜を形成してなる第二の基材とを具備し、前記
第一の基材に形成した感圧抵抗膜と、前記第二の基材に
形成した導体パターン又は該導体パターン上にさらに形
成した感圧抵抗膜とを所定間隔離間して対向する状態で
前記第一の基材と第二の基材を重ね合わせてメンブレン
型スイッチを構成した。また本発明は、基板上に複数の
電極パターンを接近させて形成してなる第一の基材と、
基板上に導体パターンを形成しさらにその上に感圧抵抗
膜を形成してなる第二の基材とを具備し、前記第一の基
材に形成した複数の電極パターンと前記第二の基材に形
成した感圧抵抗膜とを所定間隔離間して対向する状態で
前記第一の基材と第二の基材を重ね合わせてメンブレン
型スイッチを構成した。
SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a first substrate having an electrode pattern formed on a substrate and a pressure-sensitive resistive film formed thereon, A second substrate formed with an electrode pattern formed thereon or a pressure-sensitive resistive film is further formed on the electrode pattern, and a pressure-sensitive resistive film formed on the first substrate, Membrane switch by laminating the first substrate and the second substrate so as to contact the electrode pattern formed on the second substrate or the pressure-sensitive resistive film further formed on the electrode pattern Configured. The present invention also provides a first base material having a plurality of electrode patterns formed close to each other on a substrate, and a pressure-sensitive resistive film formed on the plurality of electrode patterns so as to cover the plurality of electrode patterns; A second substrate formed with a pattern or further formed with a pressure-sensitive resistive film on the conductive pattern, the pressure-sensitive resistive film formed on the first substrate, The first substrate and the second substrate were overlapped so as to contact the conductor pattern formed on the second substrate or the pressure-sensitive resistance film further formed on the conductor pattern to form a membrane switch. . In addition, the present invention provides a first base material formed by bringing a plurality of electrode patterns close to each other on a substrate, and a second base material formed by forming a conductor pattern on the substrate and further forming a pressure-sensitive resistive film thereon. The first substrate and the second substrate so as to contact the plurality of electrode patterns formed on the first substrate and the pressure-sensitive resistive film formed on the second substrate. Were laminated to form a membrane switch. Also, the present invention provides a first base material having an electrode pattern formed on a substrate and a pressure-sensitive resistive film formed thereon, and an electrode pattern formed on the substrate or A second substrate formed with a pressure-sensitive resistive film, the pressure-sensitive resistive film formed on the first substrate, and the electrode pattern or the electrode pattern formed on the second substrate The first substrate and the second substrate were overlapped with each other in a state where the pressure-sensitive resistance film further formed thereon was opposed to the pressure-sensitive resistance film by a predetermined distance to form a membrane switch. The present invention also provides a first base material having a plurality of electrode patterns formed close to each other on a substrate, and a pressure-sensitive resistive film formed on the plurality of electrode patterns so as to cover the plurality of electrode patterns; A second substrate formed with a pattern or further formed with a pressure-sensitive resistive film on the conductive pattern, the pressure-sensitive resistive film formed on the first substrate, The first substrate and the second substrate are overlapped with each other in a state where the conductor pattern formed on the second substrate or the pressure-sensitive resistive film further formed on the conductor pattern is opposed to each other with a predetermined distance therebetween, and a membrane is formed. A type switch was constructed. Further, the present invention, a first base material formed by approaching a plurality of electrode patterns on the substrate,
A second substrate having a conductor pattern formed on a substrate and a pressure-sensitive resistive film formed thereon, further comprising a plurality of electrode patterns formed on the first substrate and the second substrate; The first substrate and the second substrate were overlapped with each other in a state where the pressure-sensitive resistance film formed on the material was opposed to the pressure-sensitive resistance film by a predetermined distance to form a membrane switch.

【0014】[0014]

【発明の実施の形態】以下、本発明の実施形態を図面に
基づいて詳細に説明する。 〔第一実施形態〕図1(a),(b)は本発明の第一実
施形態にかかるメンブレン型スイッチを示す図であり、
同図(a)は要部平面図、同図(b)は要部側断面図で
ある。また図2はこのメンブレン型スイッチの製造方法
を示す図である。両図に示すようにこのメンブレン型ス
イッチは、第一の基材10と第二の基材20を重ね合わ
せることによって構成されている。以下各構成部分につ
いて説明する。
Embodiments of the present invention will be described below in detail with reference to the drawings. [First Embodiment] FIGS. 1A and 1B are diagrams showing a membrane switch according to a first embodiment of the present invention.
2A is a plan view of a main part, and FIG. 2B is a sectional side view of the main part. FIG. 2 is a view showing a method of manufacturing the membrane type switch. As shown in both figures, this membrane switch is configured by overlapping a first base material 10 and a second base material 20. Hereinafter, each component will be described.

【0015】第一の基材10は、フレキシブル基板11
上に電極パターン13をスクリーン印刷形成し、さらに
その上に感圧抵抗膜15をスクリーン印刷形成して構成
されている。
The first substrate 10 comprises a flexible substrate 11
An electrode pattern 13 is formed by screen printing, and a pressure-sensitive resistive film 15 is further formed by screen printing.

【0016】ここでフレキシブル基板11としては、例
えば可撓性を有する合成樹脂フイルム(例えばPET
(ポリエチレンテレフタレート)フイルム製でその厚み
75μm〜188μm程度のものが好適である)が使用
されている。
The flexible substrate 11 is made of, for example, a synthetic resin film having flexibility (eg, PET).
(Polyethylene terephthalate) film having a thickness of about 75 μm to 188 μm is preferable).

【0017】次に電極パターン13は銀ペーストを略円
形にスクリーン印刷することによって形成されており、
該電極パターン13からは該電極パターン13と同時に
形成される回路パターン17が引き出されている。なお
この電極パターン13の厚みはこの実施形態では10μ
m程度である(該厚みは4μm〜20μm程度が好適で
ある)。
Next, the electrode pattern 13 is formed by screen printing a silver paste into a substantially circular shape.
A circuit pattern 17 formed simultaneously with the electrode pattern 13 is drawn out of the electrode pattern 13. The thickness of the electrode pattern 13 is 10 μm in this embodiment.
m (the thickness is preferably about 4 μm to 20 μm).

【0018】次に感圧抵抗膜15は厚み方向へ押圧する
ことで該厚み方向の抵抗値を小さくする機能を有する感
圧材料を印刷することで形成されている。なおこの感圧
抵抗膜15の厚みは15〜100μm程度が好適であ
る。
Next, the pressure-sensitive resistance film 15 is formed by printing a pressure-sensitive material having a function of reducing the resistance value in the thickness direction by pressing in the thickness direction. The thickness of the pressure-sensitive resistance film 15 is preferably about 15 to 100 μm.

【0019】本実施形態にかかる感圧抵抗膜15では、
押圧方向だけ(即ち厚み方向だけ)抵抗値が変化し、そ
れ以外の方向では絶縁状態のままである異方性感圧抵抗
膜を使用した。この感圧抵抗膜15の材質としては、弾
性材中に導電粉を混合したものを用いている。具体的に
この実施形態においては、弾性材としてシリコンゴム、
導電粉としてカーボン粉を使用し、シリコンゴム5.0
〜20.0重量部に対してカーボン粉1.0重量部(場
合によってはさらに絶縁フィラーをシリコンに対して
0.1〜2.0重量部)を混合し、これを例えば高沸点
エステルなどからなる溶剤に溶かしたものを用いてい
る。またカーボン粉としてはサブミクロンオーダーの微
粉末状の一般的なカーボンブラックを使用している。
In the pressure-sensitive resistive film 15 according to the present embodiment,
An anisotropic pressure-sensitive resistive film whose resistance changed only in the pressing direction (that is, only in the thickness direction) and remained insulated in other directions was used. As the material of the pressure-sensitive resistance film 15, a material obtained by mixing conductive powder in an elastic material is used. Specifically, in this embodiment, silicon rubber is used as the elastic material,
Using carbon powder as conductive powder, silicon rubber 5.0
1.0 to 2.0 parts by weight of carbon powder (0.1 to 2.0 parts by weight of an insulating filler with respect to silicon depending on the case) is mixed with the high-boiling ester. Used in a solvent. Further, as the carbon powder, general carbon black in the form of fine powder in the order of submicrons is used.

【0020】なお弾性材としては、シリコンゴムに限定
されず、他の各種ゴム材(例えばブタジエンゴム,アク
リルニトリル・ブタジエン・スチレンゴム等)、又は熱
可塑性エラストマー(例えばスチレン系熱可塑性エラス
トマー,オレフィン系熱可塑性エラストマー等)、又は
塩ビ・酢ビ系樹脂材、又はポリエチレン等の各種弾性を
有する材料が使用できる。
The elastic material is not limited to silicone rubber, but may be other various rubber materials (for example, butadiene rubber, acrylonitrile / butadiene / styrene rubber), or thermoplastic elastomers (for example, styrene-based thermoplastic elastomer, olefin-based rubber). Materials having various elasticity such as thermoplastic elastomers), polyvinyl chloride / vinyl acetate resin materials, and polyethylene can be used.

【0021】また導電粉の材質としては、カーボンブラ
ックの他に、球状黒鉛,ビーズ状黒鉛,鱗状黒鉛,フレ
ーク状黒鉛,土状黒鉛等が使用でき、またこれらの混合
体であっても良い。また他の導電金属粉でも良い。
As the material of the conductive powder, besides carbon black, spherical graphite, bead-like graphite, scale-like graphite, flake-like graphite, earth-like graphite and the like may be used, or a mixture thereof. Other conductive metal powders may be used.

【0022】一方第二の基材20は、フレキシブル基板
21上に電極パターン23と該電極パターン23から引
き出される回路パターン25とをスクリーン印刷形成し
て構成されている。
On the other hand, the second substrate 20 is formed by screen-printing an electrode pattern 23 and a circuit pattern 25 drawn from the electrode pattern 23 on a flexible substrate 21.

【0023】ここでフレキシブル基板21としては、前
記フレキシブル基板11と同一のものを用いている。
Here, the same flexible substrate 21 as the flexible substrate 11 is used.

【0024】また電極パターン23も、前記電極パター
ン13と同様のものを用いている。
The same electrode pattern 23 as that of the electrode pattern 13 is used.

【0025】そしてこのメンブレン型スイッチを製造す
るには、図2に示すように、1枚のPETフイルムの同
一面に、それぞれ電極パターン13,23と回路パター
ン17,25をスクリーン印刷し、一方の電極パターン
13の上に感圧抵抗膜15を印刷形成し、このPETフ
イルムを両電極パターン13,23が対向するように2
つ折りに折り重ねて、2つの電極パターン13,23を
感圧抵抗膜15を介して対向せしめ、これによって図1
に示すメンブレン型スイッチを構成している。
To manufacture this membrane type switch, as shown in FIG. 2, electrode patterns 13 and 23 and circuit patterns 17 and 25 are screen-printed on the same surface of one PET film. A pressure-sensitive resistive film 15 is formed on the electrode pattern 13 by printing, and the PET film is placed on the electrode pattern 13 so that the two electrode patterns 13 and 23 face each other.
The two electrode patterns 13 and 23 are opposed to each other via the pressure-sensitive resistive film 15 by being folded in half.
The membrane type switch shown in FIG.

【0026】本実施形態の場合、感圧抵抗膜15と一方
の電極パターン23との間は何ら接着されておらず、単
に両者は触れ合っている状態となっている。従って両者
の接触面における接触抵抗値は大きい。
In the case of the present embodiment, the pressure-sensitive resistive film 15 and one of the electrode patterns 23 are not bonded at all, and are simply in a state of touching each other. Therefore, the contact resistance value at the contact surface between the two is large.

【0027】このため感圧抵抗膜15の材質として感度
の高いもの、即ち応力変化に対してその抵抗値が変化し
やすい材質のものを使用しても、接触抵抗値を大きく保
てるので、無押圧状態において両電極パターン13,2
3間を確実にオフ状態に保つことができる。
Therefore, even if a material having high sensitivity as the material of the pressure-sensitive resistive film 15, that is, a material whose resistance value is easily changed with respect to a change in stress, is used, the contact resistance value can be kept large. In the state, both electrode patterns 13 and 2
3 can be reliably kept in the off state.

【0028】一方電極パターン23を図1(b)に示す
矢印Fのようにフレキシブル基板21の上側から押圧し
た際は、押圧した部分の感圧抵抗膜15の厚み方向の抵
抗値が小さくなるので、両電極パターン13,23間が
オンする。
On the other hand, when the electrode pattern 23 is pressed from above the flexible substrate 21 as shown by an arrow F in FIG. 1B, the resistance of the pressed portion in the thickness direction of the pressure-sensitive resistive film 15 becomes small. Then, between the two electrode patterns 13 and 23 is turned on.

【0029】ところでこの押圧の際、該押圧力によって
電極パターン23は感圧抵抗膜15に強く押し付けられ
るので、両者の接触面における接触抵抗値は小さくな
る。同時に本発明の場合前述のように感度の良い感圧抵
抗膜15を使用しているので、前記押圧に対して両電極
パターン13,23間は即座にオンする。
By the way, at the time of this pressing, the electrode pattern 23 is strongly pressed against the pressure-sensitive resistance film 15 by the pressing force, so that the contact resistance value on the contact surface between them is reduced. At the same time, in the case of the present invention, since the highly sensitive pressure-sensitive resistive film 15 is used as described above, the space between the two electrode patterns 13 and 23 is immediately turned on in response to the pressing.

【0030】つまり本実施形態においては、感圧抵抗膜
15の上に電極パターン23を印刷せず、それぞれを別
々の基板に形成した上で両者を接触するように重ね合わ
せたので、無押圧状態では両電極パターン13,23間
の抵抗値を大きく維持できて確実にオフ状態を保持で
き、押圧状態では感度良く両電極パターン13,23間
をオンできる。
That is, in the present embodiment, the electrode patterns 23 are not printed on the pressure-sensitive resistive film 15, but are formed on separate substrates, and are superposed so that they are in contact with each other. In this case, the resistance between the two electrode patterns 13 and 23 can be maintained large, and the off state can be reliably maintained. In the pressed state, the two electrode patterns 13 and 23 can be turned on with high sensitivity.

【0031】〔第二実施形態〕図3は本発明の第二実施
形態にかかるメンブレン型スイッチの要部側断面図であ
る。また図4はこのメンブレン型スイッチの製造方法を
示す図である。両図に示すようにこのメンブレン型スイ
ッチも、第一の基材30と第二の基材40を重ね合わせ
ることによって構成されている。なお前記第一実施形態
と同一部分には同一符号を付してその詳細な説明は省略
する。
[Second Embodiment] FIG. 3 is a side sectional view of a main part of a membrane switch according to a second embodiment of the present invention. FIG. 4 is a diagram showing a method of manufacturing the membrane switch. As shown in both figures, this membrane-type switch is also configured by overlapping a first base material 30 and a second base material 40. The same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

【0032】この実施形態において第一実施形態と相違
する点は、図4に示すように、電極パターン13の上に
感圧抵抗膜15−1を印刷形成するだけでなく、電極パ
ターン23の上にも感圧抵抗膜15−2を印刷形成した
点のみである。
This embodiment differs from the first embodiment only in that not only the pressure-sensitive resistive film 15-1 is formed on the electrode pattern 13 by printing, but also on the electrode pattern 23, as shown in FIG. The only difference is that the pressure-sensitive resistive film 15-2 is formed by printing.

【0033】そして両感圧抵抗膜15−1,15−2間
は何ら接着されておらず、単に両者は触れ合っている状
態となっている。従って両者の接触面における接触抵抗
値は大きい。
The two pressure-sensitive resistive films 15-1 and 15-2 are not bonded at all, but are simply in contact with each other. Therefore, the contact resistance value at the contact surface between the two is large.

【0034】このためこの実施形態においても、感圧抵
抗膜15−1,2の材質として感度の高いものを使用し
ても、両者の接触抵抗値を大きく保てるので、無押圧状
態においては確実にオフ状態を保つことができ、一方こ
れを押圧した際は、接触抵抗値が減少すると同時に感度
の良い感圧抵抗膜15−1,2によって感度良く両電極
パターン13,23間がオンできる。
For this reason, even in this embodiment, even if a material having high sensitivity is used as the material of the pressure-sensitive resistive films 15-1 and 15-2, the contact resistance value between them can be kept large, so that the pressure-sensitive resistive films 15-1 and 15-1 can be reliably maintained in the non-pressed state. The off state can be maintained. On the other hand, when this is pressed, the contact resistance value is reduced, and at the same time, the electrode patterns 13 and 23 can be turned on with high sensitivity by the highly sensitive pressure-sensitive resistance films 15-1 and 15-2.

【0035】〔第三実施形態〕図5(a),(b),
(c)は本発明の第三実施形態にかかるメンブレン型ス
イッチを示す図であり、同図(a)は要部平面図、同図
(b)は要部側断面図、同図(c)は要部裏面図であ
る。また図6はこのメンブレン型スイッチの製造方法を
示す図である。両図に示すようにこのメンブレン型スイ
ッチの場合は、第一の基材50と第二の基材60を重ね
合わせることによって構成されている。
[Third Embodiment] FIGS. 5A, 5B,
(C) is a diagram showing a membrane switch according to a third embodiment of the present invention, wherein (a) is a plan view of a main part, (b) is a cross-sectional view of a main part, and (c) of FIG. FIG. FIG. 6 is a diagram showing a method of manufacturing the membrane switch. As shown in both figures, in the case of this membrane switch, the first base member 50 and the second base member 60 are overlapped.

【0036】この実施形態においては、フレキシブル基
板51上に2つの電極パターン53,55を接近させて
印刷形成し、さらに該2つの電極パターン53,55の
接近させた部分の上を覆うように感圧抵抗膜57を印刷
形成してなる第一の基材50と、フレキシブル基板61
上に導体パターン63を印刷形成してなる第二の基材6
0とを具備し、前記第一の基材50に形成した感圧抵抗
膜57と前記第二の基材60に形成した導体パターン6
3とを接触させるように前記第一の基材50と第二の基
材60を重ね合わせて構成されている。
In this embodiment, the two electrode patterns 53 and 55 are printed on the flexible substrate 51 so as to be close to each other, and furthermore, a sense is provided so as to cover a portion where the two electrode patterns 53 and 55 are close to each other. A first substrate 50 formed by printing and forming a piezoresistive film 57;
Second base material 6 on which conductor pattern 63 is formed by printing
0, the pressure-sensitive resistive film 57 formed on the first base material 50 and the conductor pattern 6 formed on the second base material 60.
The first base member 50 and the second base member 60 are overlapped so as to contact the third base member 3.

【0037】なおこの実施形態においても、感圧抵抗膜
57と導体パターン63間は何ら接着されておらず、両
者は単に触れ合っている状態となっている。従って両者
の接触面における接触抵抗値は大きい。
Also in this embodiment, the pressure-sensitive resistive film 57 and the conductor pattern 63 are not bonded at all, and are in a state where they are simply in contact with each other. Therefore, the contact resistance value at the contact surface between the two is large.

【0038】一方導体パターン63をフレキシブル基板
61の上側から押圧した際は、感圧抵抗膜57の押圧し
た部分の厚み方向の抵抗値が小さくなるので、電極パタ
ーン53と導体パターン63間、及び電極パターン55
と導体パターン63間の抵抗値がそれぞれ小さくなり、
その結果両電極パターン53,55間がオンする。
On the other hand, when the conductor pattern 63 is pressed from above the flexible substrate 61, the resistance in the thickness direction of the pressed portion of the pressure-sensitive resistive film 57 becomes small. Pattern 55
And the resistance value between the conductor pattern 63 becomes smaller,
As a result, the space between the two electrode patterns 53 and 55 is turned on.

【0039】ところで前記押圧の際、該押圧力によって
導体パターン63は感圧抵抗膜57に強く押し付けられ
るので、両者の接触面における接触抵抗値は小さくな
る。同時に本発明の場合前述のように感度の良い感圧抵
抗膜57を使用しているので、前記押圧に対して両電極
パターン53,55間は即座にオンする。
By the way, at the time of the pressing, the conductor pattern 63 is strongly pressed against the pressure-sensitive resistance film 57 by the pressing force, so that the contact resistance value at the contact surface between the two is reduced. At the same time, in the case of the present invention, since the highly sensitive pressure-sensitive resistive film 57 is used as described above, the space between the two electrode patterns 53 and 55 is immediately turned on in response to the pressing.

【0040】つまり本実施形態においても、感圧抵抗膜
57の上に導体パターン63を印刷せず、それぞれを別
々の基板に形成した上で両者を接触するように重ね合わ
せたので、無押圧状態では両電極パターン53,55間
の抵抗値を大きく維持できて確実にオフ状態を保持で
き、押圧状態では感度良く両電極パターン53,55間
をオンできる。
That is, also in the present embodiment, the conductor pattern 63 is not printed on the pressure-sensitive resistive film 57, but is formed on separate substrates and then superposed so that they are in contact with each other. In this case, the resistance between the two electrode patterns 53 and 55 can be maintained large, and the OFF state can be reliably maintained. In the pressed state, the space between the two electrode patterns 53 and 55 can be turned on with high sensitivity.

【0041】〔第四実施形態〕図7は本発明の第四実施
形態にかかるメンブレン型スイッチの要部側断面図であ
る。また図8はこのメンブレン型スイッチの製造方法を
示す図である。この実施形態において前記第三実施形態
と同一部分には同一符号を付してその詳細な説明は省略
する。
[Fourth Embodiment] FIG. 7 is a side sectional view of a main part of a membrane switch according to a fourth embodiment of the present invention. FIG. 8 is a diagram showing a method of manufacturing the membrane switch. In this embodiment, the same parts as those in the third embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

【0042】この実施形態において第三実施形態と相違
する点は、図7,図8に示すように、電極パターン5
3,55の上に感圧抵抗膜57−1を印刷形成するだけ
でなく、導体パターン63の上にも感圧抵抗膜57−2
を印刷形成した点のみである。
This embodiment is different from the third embodiment in that, as shown in FIGS.
The pressure-sensitive resistive film 57-1 is not only formed on the conductive patterns 63 and 55 by printing, but also on the conductive pattern 63.
Is printed only.

【0043】そして両感圧抵抗膜57−1,57−2間
は何ら接着されておらず、単に両者は触れ合っている状
態となっている。従って両者の接触面における接触抵抗
値は大きい。
The two pressure-sensitive resistive films 57-1 and 57-2 are not bonded at all, and are simply in a state of touching each other. Therefore, the contact resistance value at the contact surface between the two is large.

【0044】このためこの実施形態においても、感圧抵
抗膜57−1,2の材質として感度の高いものを使用し
ても、両者の接触抵抗値を大きく保てるので、無押圧状
態においては確実にオフ状態を保つことができ、一方こ
れを押圧した際は、接触抵抗値が減少すると同時に感度
の良い感圧抵抗膜57−1,2によって感度良く両電極
パターン53,55間がオンできる。
For this reason, even in this embodiment, even if a material having high sensitivity is used as the material of the pressure-sensitive resistive films 57-1 and 57-2, a large contact resistance value can be maintained between the two, so that the pressure-sensitive resistive films 57-1 and 57-2 can be reliably maintained in a non-pressed state. The off state can be maintained. On the other hand, when this is pressed, the contact resistance value is reduced, and at the same time, the pressure sensitive resistance films 57-1 and 57-2 with high sensitivity can turn on both electrode patterns 53 and 55 with high sensitivity.

【0045】〔第五実施形態〕図9は本発明の第五実施
形態にかかるメンブレン型スイッチの要部側断面図であ
る。また図10はこのメンブレン型スイッチの製造方法
を示す図である。この実施形態において前記第三実施形
態と同一部分には同一符号を付してその詳細な説明は省
略する。
[Fifth Embodiment] FIG. 9 is a side sectional view of a main part of a membrane switch according to a fifth embodiment of the present invention. FIG. 10 is a view showing a method of manufacturing the membrane switch. In this embodiment, the same parts as those in the third embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

【0046】この実施形態において第三実施形態と相違
する点は、図9,図10に示すように、感圧抵抗膜を電
極パターン53,55の上に印刷する代わりに、導体パ
ターン63の上に感圧抵抗膜65を印刷形成した点のみ
である。
This embodiment is different from the third embodiment in that, as shown in FIGS. 9 and 10, instead of printing a pressure-sensitive resistive film on the electrode patterns 53 and 55, The only difference is that the pressure-sensitive resistance film 65 is formed by printing.

【0047】そして電極パターン53,55と感圧抵抗
膜65間は何ら接着されておらず、単に両者は触れ合っ
ている状態となっている。従って両者の接触面における
接触抵抗値は大きい。
There is no adhesion between the electrode patterns 53 and 55 and the pressure-sensitive resistive film 65, and the two are simply in contact with each other. Therefore, the contact resistance value at the contact surface between the two is large.

【0048】このためこの実施形態においても、感圧抵
抗膜65の材質として感度の高いものを使用しても、両
電極パターン53,55との接触抵抗値を大きく保てる
ので、無押圧状態においては確実にオフ状態を保つこと
ができ、一方これを押圧した際は、接触抵抗値が減少す
ると同時に感度の良い感圧抵抗膜65によって感度良く
両電極パターン53,55間がオンできる。
For this reason, even in this embodiment, even if a material having high sensitivity is used as the material of the pressure-sensitive resistance film 65, the contact resistance value between the electrode patterns 53 and 55 can be kept large. The off state can be reliably maintained. On the other hand, when this is pressed, the contact resistance value is reduced, and at the same time, the electrode patterns 53 and 55 can be turned on with high sensitivity by the pressure sensitive resistance film 65 having high sensitivity.

【0049】〔第六実施形態〕図11は本発明の第六実
施形態にかかるメンブレン型スイッチの要部側断面図で
ある。同図に示すようにこのメンブレン型スイッチも、
第一の基材10と第二の基材20を重ね合わせることに
よって構成されている。なお前記第一実施形態と同一部
分には同一符号を付してその詳細な説明は省略する。
[Sixth Embodiment] FIG. 11 is a side sectional view of a main part of a membrane switch according to a sixth embodiment of the present invention. As shown in the figure, this membrane switch also
The first base member 10 and the second base member 20 are overlapped with each other. The same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

【0050】この実施形態において第一実施形態と相違
する点は、第一の基材10と第二の基材20の間にスペ
ーサ70を介在させ、これによってスペーサ70に設け
た孔71の部分で第一の基材10に設けた感圧抵抗膜1
5と、第二の基材20に設けた電極パターン23とを所
定間隔離間して対向させた点のみである。
The difference between this embodiment and the first embodiment is that a spacer 70 is interposed between the first base material 10 and the second base material 20, and thereby a portion of the hole 71 provided in the spacer 70 is provided. Pressure-sensitive resistive film 1 provided on first base material 10
5 and the electrode pattern 23 provided on the second base material 20 is opposed to each other with a predetermined space therebetween.

【0051】この実施形態の場合、無押圧状態において
は感圧抵抗膜15と電極パターン23間は確実に離間し
ており、従って両者のオフ状態はさらに確実になり、一
方電極パターン23を矢印Fのようにフレキシブル基板
21の上側から押圧した際は、フレキシブル基板21が
撓んで、電極パターン23が感圧抵抗膜15に圧接さ
れ、両者の接触面における接触抵抗値が小さくなると同
時に、感圧抵抗膜15の押圧した部分の厚み方向の抵抗
値が小さくなって両電極パターン13,23間は即座且
つ確実にオンする。
In this embodiment, in the non-pressing state, the pressure-sensitive resistive film 15 and the electrode pattern 23 are surely separated from each other, so that both of them are more reliably turned off. When the flexible substrate 21 is pressed from above, the flexible substrate 21 bends and the electrode pattern 23 is pressed against the pressure-sensitive resistive film 15, so that the contact resistance value at the contact surface between the two is reduced, and at the same time, the pressure-sensitive resistance is reduced. The resistance in the thickness direction of the pressed portion of the film 15 decreases, and the space between the two electrode patterns 13 and 23 is immediately and reliably turned on.

【0052】この実施形態の場合、スペーサ70を介在
して電極パターン23と感圧抵抗膜15の間に所定の隙
間を設けたので、メンブレン型スイッチの厚みは前記各
実施形態に比べて厚くなるが、電極パターン23と感圧
抵抗膜15は触れることがあっても良いので、該隙間は
前記図13に示す従来技術の場合における両電極パター
ン103,123の隙間に比べてかなり薄くすることが
できる。
In this embodiment, since a predetermined gap is provided between the electrode pattern 23 and the pressure-sensitive resistive film 15 with the spacer 70 interposed, the thickness of the membrane switch is larger than that of each of the above embodiments. However, since the electrode pattern 23 and the pressure-sensitive resistive film 15 may come into contact with each other, the gap may be considerably thinner than the gap between the two electrode patterns 103 and 123 in the case of the prior art shown in FIG. it can.

【0053】なおこの実施形態(以下の実施形態でも同
様)の場合、無押圧状態においては感圧抵抗膜15と電
極パターン23は確実に離間しているので、感圧抵抗膜
15の感度を高くすることでオン時の感度を向上させる
こともできる。
In this embodiment (the same applies to the following embodiments), the pressure-sensitive resistive film 15 and the electrode pattern 23 are surely separated from each other in the non-pressed state. By doing so, the sensitivity at the time of ON can be improved.

【0054】また以上のように電極パターン23と感圧
抵抗膜15の間の隙間を薄くできるので、これをオンさ
せるためにフレキシブル基板21を押圧した際に該フレ
キシブル基板21が撓む量を小さくできるので、該フレ
キシブル基板21のヘタりも小さい。
Since the gap between the electrode pattern 23 and the pressure-sensitive resistive film 15 can be reduced as described above, the amount of flexing of the flexible substrate 21 when the flexible substrate 21 is pressed to turn it on is reduced. Since it is possible, the settling of the flexible substrate 21 is also small.

【0055】なおスペーサ70は印刷によって形成して
も良いし、樹脂フイルムによって形成しても良い。
The spacer 70 may be formed by printing or a resin film.

【0056】また電極パターン23と感圧抵抗膜15の
間が所定間隔離間して対向する構造であれば、必ずしも
スペーサ70は必要ではない。
If the electrode pattern 23 and the pressure-sensitive resistive film 15 are opposed to each other with a predetermined space therebetween, the spacer 70 is not necessarily required.

【0057】なおこの実施形態を図3に示す第二実施形
態に適用し、両感圧抵抗膜15−1,15−2間をスペ
ーサ等によって離間しておくように構成しても良い。
Note that this embodiment may be applied to the second embodiment shown in FIG. 3, and the pressure-sensitive resistive films 15-1 and 15-2 may be separated by a spacer or the like.

【0058】〔第七実施形態〕図12は本発明の第七実
施形態にかかるメンブレン型スイッチの要部側断面図で
ある。同図に示すメンブレン型スイッチも、前記第三実
施形態と同様に、第一の基材50と第二の基材60を重
ね合わせることによって構成されている。なお前記第三
実施形態と同一部分には同一符号を付してその詳細な説
明は省略する。
[Seventh Embodiment] FIG. 12 is a side sectional view of a main part of a membrane switch according to a seventh embodiment of the present invention. The membrane-type switch shown in the figure is also configured by overlapping the first base member 50 and the second base member 60, as in the third embodiment. The same portions as those in the third embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

【0059】この実施形態において第三実施形態と相違
する点は、第一の基材50と第二の基材60の間にスペ
ーサ75を介在させ、これによってスペーサ75に設け
た孔76の部分で第一の基材50に設けた感圧抵抗膜5
7と、第二の基材60に設けた導体パターン63とを所
定間隔離間して対向させた点のみである。
The difference between this embodiment and the third embodiment is that a spacer 75 is interposed between the first base material 50 and the second base material 60, whereby a portion of the hole 76 provided in the spacer 75 is formed. The pressure-sensitive resistive film 5 provided on the first substrate 50
7 and the conductor pattern 63 provided on the second base material 60 is opposed to each other with a predetermined space therebetween.

【0060】この実施形態の場合、無押圧状態において
は感圧抵抗膜57と導体パターン63間は確実に離間し
ており、従って両者のオフ状態はさらに確実になり、一
方導体パターン63を矢印Fのようにフレキシブル基板
61の上側から押圧した際は、フレキシブル基板61が
撓んで、該導体パターン63が感圧抵抗膜57に圧接さ
れ、両者の接触面における接触抵抗値が小さくなると同
時に、感圧抵抗膜57の押圧した部分の厚み方向の抵抗
値が小さくなって両電極パターン53,55間は即座且
つ確実にオンする。
In the case of this embodiment, in the non-pressed state, the pressure-sensitive resistive film 57 and the conductor pattern 63 are surely separated from each other. Therefore, the off state of both is further ensured. When the flexible substrate 61 is pressed from above, the flexible substrate 61 bends and the conductor pattern 63 is pressed against the pressure-sensitive resistance film 57, so that the contact resistance value on the contact surface between the two becomes small and The resistance in the thickness direction of the pressed portion of the resistance film 57 decreases, and the space between the two electrode patterns 53 and 55 is immediately and reliably turned on.

【0061】この実施形態の場合、スペーサ75を介在
して導体パターン63と感圧抵抗膜57の間に所定の隙
間を設けたので、メンブレン型スイッチの厚みは前記各
実施形態に比べて厚くなるが、導体パターン63と感圧
抵抗膜57は触れることがあっても良いので、該隙間は
前記図13に示す従来技術の場合における両電極パター
ン103,123の隙間に比べてかなり薄くすることが
できる。
In this embodiment, since a predetermined gap is provided between the conductor pattern 63 and the pressure-sensitive resistive film 57 with the spacer 75 interposed therebetween, the thickness of the membrane switch is larger than that of each of the above embodiments. However, since the conductor pattern 63 and the pressure-sensitive resistive film 57 may come into contact with each other, the gap may be considerably thinner than the gap between the two electrode patterns 103 and 123 in the case of the prior art shown in FIG. it can.

【0062】また以上のように導体パターン63と感圧
抵抗膜57の間の隙間を薄くできるので、これをオンさ
せるためにフレキシブル基板61を押圧した際に該フレ
キシブル基板61が撓む量を小さくできるので、該フレ
キシブル基板61のヘタりも小さい。
Since the gap between the conductor pattern 63 and the pressure-sensitive resistive film 57 can be reduced as described above, the amount of flexing of the flexible substrate 61 when the flexible substrate 61 is pressed to turn it on is reduced. Since it is possible, the flexible substrate 61 has a small settling.

【0063】なおスペーサ75は印刷によって形成して
も良いし、樹脂フイルムによって形成しても良い。
The spacer 75 may be formed by printing or a resin film.

【0064】また導体パターン63と感圧抵抗膜57の
間が所定間隔離間して対向する構造であれば、必ずしも
スペーサ75は必要ない。
If the conductor pattern 63 and the pressure-sensitive resistive film 57 face each other with a predetermined space therebetween, the spacer 75 is not necessarily required.

【0065】なおこの実施形態を図7に示す第四実施形
態に適用し、両感圧抵抗膜57−1,57−2間をスペ
ーサ等によって離間しておくように構成しても良い。ま
たこの実施形態を図9に示す第五実施形態に適用し、両
電極パターン53,55と感圧抵抗膜65間をスペーサ
等によって離間しておくように構成しても良い。
This embodiment may be applied to the fourth embodiment shown in FIG. 7 so that both the pressure-sensitive resistive films 57-1 and 57-2 are separated from each other by a spacer or the like. Further, this embodiment may be applied to the fifth embodiment shown in FIG. 9, and the both electrode patterns 53 and 55 and the pressure-sensitive resistive film 65 may be separated by a spacer or the like.

【0066】以上本発明の各種実施形態を詳細に説明し
たが本発明はこれらの実施形態に限定されるものではな
く、例えば以下に示すような種々の変形が可能である。
Although various embodiments of the present invention have been described in detail above, the present invention is not limited to these embodiments, and various modifications as described below are possible, for example.

【0067】上記各実施形態ではいずれも基板として
フレキシブル基板を用いたが、本発明はこれに限定され
るものではなく、必要に応じて硬質基板に代えても良
い。
In each of the above embodiments, a flexible substrate is used as a substrate. However, the present invention is not limited to this, and a rigid substrate may be used as necessary.

【0068】上記各実施形態では電極パターンとして
銀ペーストを用いたが、銀ペーストを多層に積層したも
のや、銀ペーストの他に更にカーボン皮膜等の層を多層
に形成したものや、銅箔エッチングによるものなど、他
の種々の構成のものが使用できる。
In each of the above embodiments, silver paste was used as the electrode pattern. However, silver paste was laminated in multiple layers, silver paste was further formed in multiple layers such as a carbon film, and copper foil etching was performed. Other various configurations such as those according to the above can be used.

【0069】同様に感圧抵抗膜も多層に積層したもの
や、前記実施形態で示した材質以外の材質のものを用い
たものなど、他の種々の構成のものが使用できる。
Similarly, various other structures such as a multi-layered pressure-sensitive resistive film or a material using a material other than the materials shown in the above embodiment can be used.

【0070】[0070]

【発明の効果】以上詳細に説明したように本発明によれ
ば以下のような優れた効果を有する。 感圧抵抗膜と該感圧抵抗膜上に形成すべき他の層(他
の感圧抵抗膜を含む)とを、それぞれを別々の基板(両
基板が1枚の基板である場合を含む)に形成した上で両
者を接触させるか、或いは所定間隔離間して対向するよ
うに重ね合わせたので、無押圧状態では両電極パターン
間の抵抗値を大きく維持できて確実にオフ状態を保持で
き、押圧状態では感度良く両電極パターン間をオンでき
る。
As described in detail above, the present invention has the following excellent effects. The pressure-sensitive resistive film and another layer (including another pressure-sensitive resistive film) to be formed on the pressure-sensitive resistive film are separately provided on separate substrates (including a case where both substrates are one substrate). Since they are formed in contact with each other, or they are overlapped so as to face each other with a predetermined separation, in the non-pressed state, the resistance value between the two electrode patterns can be kept large and the off state can be reliably maintained, In the pressed state, it is possible to turn on both electrode patterns with high sensitivity.

【0071】スイッチ部分に図11に示すような密閉
された空隙133を設ける必要がないので、エア逃げ用
の孔を設ける必要がなく、容易に完全防水構造とするこ
とができ、また耐塵対策が容易になる。
Since there is no need to provide a closed space 133 as shown in FIG. 11 in the switch portion, there is no need to provide a hole for air escape, and it is possible to easily achieve a completely waterproof structure and to take measures against dust. It will be easier.

【0072】両電極パターン間、または電極パターン
と導体パターン間は感圧抵抗膜を介して当接又は接近し
て対向しているので、その厚みの薄型化が図れる。
Since the two electrode patterns or the electrode pattern and the conductor pattern abut or approach each other with the pressure-sensitive resistive film interposed therebetween, the thickness can be reduced.

【0073】スイッチをオンするために基板を押圧し
ても該基板は撓まない(又は殆ど撓まない)ので、その
耐久性が向上する。また押圧した基板は撓まない(又は
殆ど撓まない)ので、さらに薄型化しても強度上問題な
く、さらなる厚みの薄型化が図れる。
Even if the substrate is pressed to turn on the switch, the substrate does not bend (or hardly bend), so that its durability is improved. Further, since the pressed substrate does not bend (or hardly bends), even if the substrate is further thinned, there is no problem in strength, and the thickness can be further reduced.

【0074】両基板にそれぞれ電極パターンや感圧抵
抗膜を印刷したものを重ね合わせるだけで製造できるの
で、その製造工程が容易となり、従ってその製造コスト
の低減化が図れる。
Since the two substrates can be manufactured simply by superimposing printed electrode patterns and pressure-sensitive resistive films on the two substrates, the manufacturing process is simplified, and the manufacturing cost can be reduced.

【0075】なおカーボン又は絶縁フィラーの配分に
より自由にオン時の押圧力を変更することも可能にな
る。
It is possible to freely change the pressing force at the time of ON by allocating the carbon or the insulating filler.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第一実施形態にかかるメンブレン型ス
イッチを示す図であり、同図(a)は要部平面図、同図
(b)は要部側断面図である。
FIGS. 1A and 1B are diagrams showing a membrane switch according to a first embodiment of the present invention, wherein FIG. 1A is a plan view of a main part, and FIG.

【図2】図1に示すメンブレン型スイッチの製造方法を
示す図である。
FIG. 2 is a diagram showing a method of manufacturing the membrane switch shown in FIG.

【図3】本発明の第二実施形態にかかるメンブレン型ス
イッチの要部側断面図である。
FIG. 3 is a side sectional view of a main part of a membrane switch according to a second embodiment of the present invention.

【図4】図3に示すメンブレン型スイッチの製造方法を
示す図である。
FIG. 4 is a diagram showing a method of manufacturing the membrane switch shown in FIG.

【図5】本発明の第三実施形態にかかるメンブレン型ス
イッチを示す図であり、同図(a)は要部平面図、同図
(b)は要部側断面図、同図(c)は要部裏面図であ
る。
5A and 5B are diagrams showing a membrane type switch according to a third embodiment of the present invention, wherein FIG. 5A is a plan view of a main part, FIG. 5B is a sectional side view of a main part, and FIG. FIG.

【図6】図5に示すメンブレン型スイッチの製造方法を
示す図である。
6 is a diagram illustrating a method of manufacturing the membrane switch illustrated in FIG.

【図7】本発明の第四実施形態にかかるメンブレン型ス
イッチの要部側断面図である。
FIG. 7 is a side sectional view of a main part of a membrane switch according to a fourth embodiment of the present invention.

【図8】図7に示すメンブレン型スイッチの製造方法を
示す図である。
8 is a diagram showing a method of manufacturing the membrane switch shown in FIG.

【図9】本発明の第五実施形態にかかるメンブレン型ス
イッチの要部側断面図である。
FIG. 9 is a side sectional view of a main part of a membrane switch according to a fifth embodiment of the present invention.

【図10】図9に示すメンブレン型スイッチの製造方法
を示す図である。
FIG. 10 is a view illustrating a method of manufacturing the membrane switch illustrated in FIG. 9;

【図11】本発明の第六実施形態にかかるメンブレン型
スイッチの要部側断面図である。
FIG. 11 is a side sectional view of a main part of a membrane switch according to a sixth embodiment of the present invention.

【図12】本発明の第七実施形態にかかるメンブレン型
スイッチの要部側断面図である。
FIG. 12 is a side sectional view of a main part of a membrane switch according to a seventh embodiment of the present invention.

【図13】従来のメンブレン型スイッチの要部側断面図
である。
FIG. 13 is a side sectional view of a main part of a conventional membrane switch.

【図14】従来のメンブレン型スイッチの要部側断面図
である。
FIG. 14 is a side sectional view of a main part of a conventional membrane switch.

【符号の説明】[Explanation of symbols]

10 第一の基材 11 フレキシブル基板 13 電極パターン 15 感圧抵抗膜 20 第二の基材 21 フレキシブル基板 23 電極パターン 30 第一の基材 40 第二の基材 15−1 感圧抵抗膜 15−2 感圧抵抗膜 50 第一の基材 51 フレキシブル基板 53,55 電極パターン 57 感圧抵抗膜 60 第二の基材 61 フレキシブル基板 63 導体パターン 57−1 感圧抵抗膜 57−2 感圧抵抗膜 65 感圧抵抗膜 DESCRIPTION OF SYMBOLS 10 First base material 11 Flexible substrate 13 Electrode pattern 15 Pressure-sensitive resistive film 20 Second base material 21 Flexible substrate 23 Electrode pattern 30 First base material 40 Second base material 15-1 Pressure-sensitive resistive film 15- 2 pressure-sensitive resistive film 50 first substrate 51 flexible substrate 53, 55 electrode pattern 57 pressure-sensitive resistive film 60 second substrate 61 flexible substrate 63 conductor pattern 57-1 pressure-sensitive resistive film 57-2 pressure-sensitive resistive film 65 Pressure-sensitive resistive film

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 基板上に電極パターンを形成し、さらに
その上に感圧抵抗膜を形成してなる第一の基材と、 基板上に電極パターンを形成してなるか、或いはさらに
該電極パターン上に感圧抵抗膜を形成してなる第二の基
材とを具備し、 前記第一の基材に形成した感圧抵抗膜と、前記第二の基
材に形成した電極パターン又は該電極パターン上にさら
に形成した感圧抵抗膜とを接触させるように前記第一の
基材と第二の基材を重ね合わせてなることを特徴とする
メンブレン型スイッチ。
A first substrate having an electrode pattern formed on a substrate and a pressure-sensitive resistive film formed thereon, and an electrode pattern formed on the substrate, or A second substrate formed with a pressure-sensitive resistive film on a pattern, comprising a pressure-sensitive resistive film formed on the first substrate, and an electrode pattern formed on the second substrate or A membrane-type switch, wherein the first base material and the second base material are overlapped so that a pressure-sensitive resistive film further formed on an electrode pattern is brought into contact.
【請求項2】 基板上に複数の電極パターンを接近させ
て形成し、さらに該複数の電極パターンの上を覆うよう
に感圧抵抗膜を形成してなる第一の基材と、基板上に導
体パターンを形成してなるか、或いはさらに該導電パタ
ーン上に感圧抵抗膜を形成してなる第二の基材とを具備
し、 前記第一の基材に形成した感圧抵抗膜と、前記第二の基
材に形成した導体パターン又は該導体パターン上にさら
に形成した感圧抵抗膜とを接触させるように前記第一の
基材と第二の基材を重ね合わせてなることを特徴とする
メンブレン型スイッチ。
2. A first base material comprising a plurality of electrode patterns formed close to each other on a substrate, and a pressure-sensitive resistive film formed on the plurality of electrode patterns so as to cover the plurality of electrode patterns; Either a conductor pattern is formed, or further comprising a second substrate formed by forming a pressure-sensitive resistance film on the conductive pattern, a pressure-sensitive resistance film formed on the first substrate, The first base material and the second base material are overlapped so that the conductive pattern formed on the second base material or the pressure-sensitive resistance film further formed on the conductive pattern is brought into contact with the conductive pattern. Membrane switch.
【請求項3】 基板上に複数の電極パターンを接近させ
て形成してなる第一の基材と、 基板上に導体パターンを形成し、さらにその上に感圧抵
抗膜を形成してなる第二の基材とを具備し、 前記第一の基材に形成した複数の電極パターンと前記第
二の基材に形成した感圧抵抗膜とを接触させるように前
記第一の基材と第二の基材を重ね合わせてなることを特
徴とするメンブレン型スイッチ。
3. A first base material formed by forming a plurality of electrode patterns close to each other on a substrate, and a first base material formed by forming a conductor pattern on the substrate and further forming a pressure-sensitive resistive film thereon. Comprising a second substrate, a plurality of electrode patterns formed on the first substrate and the first substrate so as to contact the pressure-sensitive resistance film formed on the second substrate and the second substrate A membrane-type switch comprising two superposed substrates.
【請求項4】 基板上に電極パターンを形成し、さらに
その上に感圧抵抗膜を形成してなる第一の基材と、 基板上に電極パターンを形成してなるか、或いはさらに
該電極パターン上に感圧抵抗膜を形成してなる第二の基
材とを具備し、 前記第一の基材に形成した感圧抵抗膜と、前記第二の基
材に形成した電極パターン又は該電極パターン上にさら
に形成した感圧抵抗膜とを所定間隔離間して対向する状
態で前記第一の基材と第二の基材を重ね合わせてなるこ
とを特徴とするメンブレン型スイッチ。
4. An electrode pattern formed on a substrate, and a first base material having a pressure-sensitive resistive film formed thereon, and an electrode pattern formed on the substrate, or further comprising: A second substrate formed with a pressure-sensitive resistive film on a pattern, comprising a pressure-sensitive resistive film formed on the first substrate, and an electrode pattern formed on the second substrate or A membrane-type switch, wherein the first base material and the second base material are overlapped with each other so as to face a pressure-sensitive resistive film further formed on an electrode pattern at a predetermined interval.
【請求項5】 基板上に複数の電極パターンを接近させ
て形成し、さらに該複数の電極パターンの上を覆うよう
に感圧抵抗膜を形成してなる第一の基材と、 基板上に導体パターンを形成してなるか、或いはさらに
該導電パターン上に感圧抵抗膜を形成してなる第二の基
材とを具備し、 前記第一の基材に形成した感圧抵抗膜と、前記第二の基
材に形成した導体パターン又は該導体パターン上にさら
に形成した感圧抵抗膜とを所定間隔離間して対向する状
態で前記第一の基材と第二の基材を重ね合わせてなるこ
とを特徴とするメンブレン型スイッチ。
5. A first base material comprising: a plurality of electrode patterns formed close to each other on a substrate; and a pressure-sensitive resistive film formed on the plurality of electrode patterns to cover the plurality of electrode patterns; Either a conductor pattern is formed, or further comprising a second substrate formed by forming a pressure-sensitive resistance film on the conductive pattern, a pressure-sensitive resistance film formed on the first substrate, Laminating the first base material and the second base material in a state where the conductive pattern formed on the second base material or the pressure-sensitive resistive film further formed on the conductive pattern faces each other with a predetermined space therebetween. A membrane-type switch characterized by the following.
【請求項6】 基板上に複数の電極パターンを接近させ
て形成してなる第一の基材と、 基板上に導体パターンを形成し、さらにその上に感圧抵
抗膜を形成してなる第二の基材とを具備し、 前記第一の基材に形成した複数の電極パターンと前記第
二の基材に形成した感圧抵抗膜とを所定間隔離間して対
向する状態で前記第一の基材と第二の基材を重ね合わせ
てなることを特徴とするメンブレン型スイッチ。
6. A first base formed by forming a plurality of electrode patterns close to each other on a substrate, and a first base formed by forming a conductor pattern on the substrate and further forming a pressure-sensitive resistive film thereon. A plurality of electrode patterns formed on the first base material and a pressure-sensitive resistive film formed on the second base material in a state where the first and second pressure-sensitive resistive films face each other with a predetermined distance therebetween. A membrane switch comprising a substrate and a second substrate superposed on each other.
JP14091197A 1997-05-15 1997-05-15 Membrane-type switch Pending JPH10321075A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14091197A JPH10321075A (en) 1997-05-15 1997-05-15 Membrane-type switch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14091197A JPH10321075A (en) 1997-05-15 1997-05-15 Membrane-type switch

Publications (1)

Publication Number Publication Date
JPH10321075A true JPH10321075A (en) 1998-12-04

Family

ID=15279693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14091197A Pending JPH10321075A (en) 1997-05-15 1997-05-15 Membrane-type switch

Country Status (1)

Country Link
JP (1) JPH10321075A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014020915A (en) * 2012-07-18 2014-02-03 Canon Chemicals Inc Pressure-sensitive sensor
CN115020135A (en) * 2022-06-09 2022-09-06 温州港源电子有限公司 Tact switch and production process thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014020915A (en) * 2012-07-18 2014-02-03 Canon Chemicals Inc Pressure-sensitive sensor
CN115020135A (en) * 2022-06-09 2022-09-06 温州港源电子有限公司 Tact switch and production process thereof
CN115020135B (en) * 2022-06-09 2024-04-26 温州港源电子有限公司 Tact switch and production process thereof

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