JPH10307647A - Computer device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve heat radiation effect and to mount a semiconductor element with large calorific heating value in a housing structure of small volume by devising the heat sink and its fitting structure of the computer device equipped with a mechanism which cools a semiconductor element such as a CPU chip generating heat in its operation by using a cooling fan. SOLUTION: Cooling air taken in the housing 32 through an air vent 33a forming an air intake is guided into the housing 32 through guide fins 52 serving as wind-direction plates forming 1st fins of the heat sink 50 provided facing the air intake in the housing 32; and the direction of the air is restricted by the guide fins 52 at this time and guided so that it is concentrated on the mount direction of the CPU chip 41. Pin type fins 53 as many 2nd fins are provided on the flow passage of the cooling air having its direction restricted by the guide fins 52 to form an air passage with good cooling efficiency.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a computer device having a mechanism for cooling a semiconductor element such as a CPU chip which generates heat during operation by using a cooling fan.

[0002]

2. Description of the Related Art Conventionally, a CPU in a computer device
The means for cooling the high heat-generating IC such as a chip is such that a heat sink is attached to the IC package or fixed by a plate spring or the like.
The heat generated in the IC package is radiated. Furthermore,
In order to increase the heat radiation efficiency, a structure in which cooling air is applied to the heat sink was adopted.

The prior art at this time will be described with reference to drawings. FIG. 12 is a plan view of a heat dissipation structure according to the related art.
The cooling fan 71 provided on the inner back surface of the housing 70 discharges air that has taken heat from the inside of the housing to the outside of the housing. This allows the outside air to pass through the ventilation holes on the side of the housing.
Get inside. That is, an air flow is generated in which the cooling air taken into the housing 70 from the ventilation holes is discharged to the outside of the housing via the fan 71 on the rear surface of the housing. By positioning the high heat generation IC 83 such as a CPU chip in the flow of air, the high heat generation IC 83 is cooled.

FIG. 13 shows a typical method of fixing a heat sink to the high heat generating IC 83 such as the CPU chip. The high heat generating IC 83 is fixed to a circuit board (PWB) 81 via a socket 82, and the heat sink 85 hooks a leaf spring 86 on hooks 84 provided on both side surfaces of the socket 82 to generate high heat. It is fixed to IC83.

However, in the above-mentioned prior art, since the heat is dissipated only by the diffused air flow inside the housing using the heat sink, the IC which generates a large amount of heat is required.
Larger heat sinks had to be used, and thus were difficult to use in small volume enclosures.

[0006]

As described above, in the conventional heat dissipation structure using the cooling fan and the heat sink, the heat is dissipated only by the diffused air flow inside the housing using the heat sink. , I, which generates a large amount of heat
A heat sink as large as C must be used, and there is a problem that it is difficult to use the heat sink in a small-sized housing.

[0007] The present invention has been made in view of the above circumstances,
In a computer device equipped with a mechanism for cooling a semiconductor element such as a CPU chip which generates heat during operation using a cooling fan, a housing by the action of the cooling fan by devising a heat sink and a structure around the heat sink. The flow of the internal cooling air is concentrated on the heat sink to form an air passage with high cooling efficiency, thereby significantly improving the heat radiation effect and enabling the mounting of a semiconductor element with a large calorific value in a small-sized housing structure. It is intended to provide a computer device.

[0008]

SUMMARY OF THE INVENTION The present invention relates to a computer apparatus having a mechanism for cooling a semiconductor element such as a CPU chip which generates heat during operation by using a cooling fan.
By devising the heat sink and the surrounding structure, the flow of cooling air inside the housing due to the action of the cooling fan is concentrated on the heat sink to form an air passage with good cooling efficiency, resulting in a small volume housing structure. It is characterized in that a semiconductor element generating a large amount of heat can be mounted.

That is, the present invention relates to a computer device having a mechanism for cooling a semiconductor element such as a CPU chip which generates heat during operation by using a cooling fan. A built-in circuit board, and a semiconductor element with heat generated during operation mounted on the circuit board, and provided on a side wall of the housing, an air intake for taking cooling air into the housing, A cooling fan provided on a predetermined surface portion of the housing, for discharging air in the housing to the outside, and a cooling fan provided near an air intake in the housing, and cooling air taken in from the air intake. And a heat sink for the semiconductor element having a fin also serving as a wind direction plate for guiding the semiconductor element toward the semiconductor element.

The present invention also relates to a computer device having a mechanism for cooling a semiconductor element such as a CPU chip which generates heat during operation by using a cooling fan. A built-in circuit board, and a semiconductor element with heat generated during operation mounted on the circuit board, and provided on a side wall of the housing, an air intake for taking cooling air into the housing, A cooling fan provided on a predetermined surface portion of the housing, for discharging air in the housing to the outside, and a cooling fan provided near an air intake in the housing, and cooling air taken in from the air intake. A first fin serving also as a wind direction plate leading to the semiconductor element; and a heat sink for the semiconductor element including a second fin provided in a flow path of cooling air led to the first fin. Characterized by To.

In the above-mentioned computer device, part or all of the periphery of the housing is covered by an exterior cover having a vent, and cooling air is taken in from the air intake through the vent of the exterior cover. Characterized by the structure of

Further, in the above-mentioned computer apparatus, the semiconductor device is characterized in that the bottom surface of the heat sink is in surface contact with the upper surface of the semiconductor element, and the semiconductor element is directly cooled by the heat sink.

Further, in the above-mentioned computer device, the air intake port is characterized by a structure formed by a plurality of small holes, a plurality of slit holes, or one opening. By using a heat sink that also serves as a wind direction plate for guiding the cooling air taken into the housing toward the semiconductor element as described above, the flow of the cooling air inside the housing due to the action of the cooling fan is concentrated on the heat sink. By adopting a heat dissipation structure that forms an air flow path with good cooling efficiency, the heat dissipation effect is significantly improved, and a semiconductor element having a large heat generation can be mounted in a small-sized housing structure.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. 1 is a perspective view showing an external structure of a setup box type computer device according to an embodiment of the present invention, FIG. 2 is a front view thereof, FIG. 3 is a rear view thereof, FIG. 4 is a left side view thereof, and FIG. FIG. 6 is a perspective view showing a state in which the disk tray is opened, FIG. 6 is a view showing a state in which components inside the apparatus are arranged when the computer apparatus is viewed from the front, and FIG. FIG. 8 is a perspective view showing a state of a heat sink mounting portion inside the computer device. FIG. 9 is a diagram showing a flow path of cooling air in the computer device. FIG. 10 is a perspective view showing the external structure of an infrared remote controller for operating the computer device, and FIG. 11 is a side sectional view of the same.

Referring to FIG. 1, reference numeral 10 denotes a setup box type computer device (hereinafter simply referred to as the device body), 11 denotes an operation panel, and 12 denotes a DVD (Digital Ve
rsatile Disk), a disk tray of a disk drive using the medium as a medium, 12a is an eject button of the disk tray 12, 12b is a lamp for displaying an operation of the disk drive, 13 is a power switch of the apparatus, 14 is an infrared light receiving section,
15 is a headphone terminal, 16 is a PC card insertion section, 17
Is a PC card eject button, and 18 and 19 are controller terminals, respectively (see FIGS. 1, 2 and 5).

Reference numeral 20 denotes a cooling fan provided on the rear surface of the housing of the apparatus main body 10, and reference numerals 21A to 21C denote various interface connectors (see FIGS. 3 and 9). 31 is an exterior cover (decorative cover) of the apparatus main body 10, and 32 is an apparatus main body 10
32a is a left side surface portion of the housing 32, and 33 is a housing 32
Air intake ports 33a, 3a provided in the left side surface portion 32a
Reference numerals 3a,... Denote a plurality of ventilation holes forming the air intake port 33 (see FIGS. 6, 7, and 8).

Reference numerals 41 to 46, and 50 denote mounting components incorporated in the housing 32 of the apparatus main body 10, and reference numeral 41 denotes a semiconductor element to be cooled. Here, a CPU chip is taken as an example. 42 is a leaf spring for fixing the CPU chip 41, and 43 is a C for mounting the CPU chip 41.
It is a PU socket. 44 is a system power supply unit, 4
5 is a hard disk drive (HDD) unit, 46
Is a DVD drive unit (see FIG. 6).

Reference numeral 50 denotes a heat sink for removing heat from the CPU chip 41 and releasing the heat to the outside of the apparatus main body 10.
It is fixed to the left side surface portion 32a of the housing 32 in a state where the lower surface is in surface contact so as to cover the upper surface of the CPU chip 41.

Reference numeral 51 denotes a support portion having a tap hole for screwing for fixing the heat sink 50 to the left side surface portion 32a of the housing 32. Reference numeral 52 denotes a guide fin serving as a first fin of the heat sink 50 provided facing the air intake port 33 provided on the left side surface portion 32 a of the housing 32, and serves as a cooling fin taken in from the air intake port 33. A comb-shaped fin structure which also serves as a wind direction plate for guiding air to the CPU chip 41 is formed.

Reference numeral 53 denotes a pin-shaped fin serving as a second fin of the heat sink 50, and is provided upright at a predetermined interval on a flow path of cooling air guided by the guide fin 52. In this example, the length of the pin-shaped fin corresponding to the mounting position of the DVD drive unit 46 is shortened to avoid contact (see FIGS. 6, 7, and 8).

With such a fin structure of the heat sink, the flow of the cooling air inside the housing by the action of the cooling fan 20 can be concentrated on the heat sink 50 to form an air passage with high cooling efficiency (see FIG. 9).

Reference numeral 60 denotes an infrared remote controller for operating the apparatus main body 10; 60a, a step formed on the rear operation unit of the remote controller 60; 61, a pointing provided on the front thumb operation unit of the remote controller 60; Device, 62 is an operation button provided on the index finger operation unit at the tip of the step 60a, 63 is an operation button provided on the middle finger operation unit at the rear end of the step 60a, 6
5, 66 are operation buttons provided on the surface of the remote controller 60;
This is an infrared light emitting section provided at the tip of the “0” (see FIGS. 10 and 11).

As described above, the remote controller 6
0, a pointing device 61 is provided on the front thumb operation unit, the index finger operation unit at the tip of the step unit 60a with the back step unit 60a of the remote controller 60 interposed therebetween, and the step unit 6
0a Operation buttons 62 and 63 are provided on the middle finger operation unit at the rear end, respectively.
With the structure provided with, it is possible to provide an infrared remote controller that has good familiarity with the palm and excellent operability.

The heat radiating action in the above embodiment will be described. The cooling fan 20 provided on the back of the housing of the apparatus main body 10 is rotated to provide the cooling fan 20 on the side of the exterior cover (decorative cover) 31 of the apparatus main body 10. The cooling air is taken in from the air intake port 33 provided in the left side surface part 32a of the housing 32 of the apparatus main body 10 through the numerous vents thus provided.

The cooling air taken into the housing 32 from the air inlet 33 is used as a first fin of the heat sink 50 provided facing the air inlet 33 in the housing 32. It is guided into the inside of the housing 32 through the guide fins 52 also serving as a plate.

At this time, the direction of the cooling air taken into the casing 32 from the air intake port 33 is regulated by the guide fins 52, and as shown in FIG. The cooling air is guided so as to concentrate on the air.

At this time, since a large number of pin-shaped fins 53 serving as second fins are provided on the flow path of the cooling air whose wind direction is regulated by the guide fins 52, an air flow path with good cooling efficiency is provided. It is formed. Therefore, this
The heat radiation effect can be remarkably improved, so that a semiconductor element having a large calorific value can be mounted on a small-sized housing structure.

In the above-described embodiment, a setup box type computer device as shown in FIGS. 1 to 7 has been described as an example. However, the present invention is not limited to this. For example, in a desktop type device, The present invention can be applied to a key structure in which the periphery of the housing is not covered with the outer cover, a key structure in which the air intake port is formed by one opening, or the like. Further, the shape and the like of the heat sink 50 are not limited to those of the above-described embodiment, but can be variously modified according to a mounting environment, specifications, and the like.

[0029]

As described above in detail, according to the present invention, in a computer apparatus having a mechanism for cooling a semiconductor element such as a CPU chip which generates heat during operation by using a cooling fan, the cooling fan is provided. The flow of the cooling air inside the housing by the action of is concentrated on the heat sink to form an air passage with good cooling efficiency, so that the heat dissipation effect is significantly improved and the semiconductor element with a large amount of heat generation has a small volume housing structure. A computer device that can be mounted on a computer can be provided.

[Brief description of the drawings]

FIG. 1 is an exemplary perspective view showing the external structure of a setup box type computer device according to an embodiment of the present invention.

FIG. 2 is an exemplary front view of the computer device according to the embodiment;

FIG. 3 is an exemplary rear view of the computer device according to the embodiment;

FIG. 4 is a left side view of the computer device in the embodiment.

FIG. 5 is an exemplary perspective view showing a state in which a disk tray of the computer device in the embodiment is opened;

FIG. 6 is an exemplary view showing a component arrangement state inside the computer device as viewed from the front in the embodiment.

FIG. 7 is a left side view of the computer device in the embodiment, with an exterior cover (decorative cover) removed.

FIG. 8 is an exemplary perspective view showing a state of a heat sink mounting portion of the computer device in the embodiment.

FIG. 9 is a diagram showing a flow path of cooling air of the computer device in the embodiment.

FIG. 10 is an exemplary perspective view showing the external structure of an infrared remote controller for operating the computer device in the embodiment.

FIG. 11 is a side sectional view of an infrared remote controller for operating the computer device in the embodiment.

FIG. 12 is a plan view of a heat dissipation structure according to the related art.

FIG. 13 is a view showing a typical fixing means of the heat sink.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Setup box type computer apparatus main body (apparatus main body), 11 ... Operation panel part, 12 ... Disk drive disk tray, 12a ... Disk tray 12 eject button, 12b ... Disk drive operation display lamp, 13 ... Device , A power switch, 14 an infrared ray receiving section, 15 a headphone terminal, 16 a PC card insertion section, 17 a PC card eject button, 18, 19 a controller terminal, 20 a cooling fan, 21A, 21B, 21C an interface Connector, 31: exterior cover (decorative cover) of the apparatus main body 10, 32: housing of the main body 10, 32a: left side of the housing 32, 33: air intake provided on the left side 32a of the housing 32 The openings 33a are ventilation holes forming the air intake 33, 41 are cooling objects. Semiconductor element (CPU chip), 42: leaf spring for fixing CPU chip 41, 43: CPU socket, 44: system power supply unit, 45: hard disk drive (HDD) unit, 46: DVD drive unit, 50: heat sink, 51: a support portion having a tapped hole for screwing; 52: a guide fin serving as a first fin of the heat sink 50; 53: a pin-shaped fin serving as a second fin of the heat sink 50; 60: operating the apparatus body 10 60a: a step formed on the rear operation unit of the remote controller 60; 61, a pointing device provided on the front thumb operation unit; 62, a forefinger operation unit provided at the tip of the step 60a. Operation buttons, 63 ... Middle finger operation at the rear end of the step 60a Operation buttons 65, 66 ... operation buttons provided on the surface; 68 ... infrared light emitting unit.

Claims (5)

[Claims] 1. A housing of a computer main body, a circuit board built in the housing, a semiconductor element mounted on the circuit board and generating heat during operation, and a housing provided on a side wall of the housing. An air intake for taking in cooling air into the body, a cooling fan provided on a predetermined surface of the housing, for discharging air in the housing to the outside, and an air intake in the housing in the vicinity of the air intake. A computer device, comprising: a heat sink for the semiconductor element, the heat sink having a fin that also serves as a wind direction plate for guiding cooling air taken in from an air intake port toward the semiconductor element. 2. A housing of a computer main body, a circuit board built in the housing, a semiconductor element mounted on the circuit board and generating heat during operation, and a housing provided on a side wall of the housing. An air intake for taking in cooling air into the body, a cooling fan provided on a predetermined surface of the housing, for discharging air in the housing to the outside, and an air intake in the housing in the vicinity of the air intake. A first fin which also serves as a wind direction plate for guiding cooling air taken in from the air intake port toward the semiconductor element; and a first fin provided in a flow path of the cooling air led to the first fin. And a heat sink for the semiconductor element having a second fin. 3. The air conditioner according to claim 1, wherein a part or the entire periphery of the housing is covered with an exterior cover having a vent, and cooling air is taken in from an air intake through the vent of the exterior cover. Computer equipment. 4. The computer device according to claim 1, wherein a bottom surface of the heat sink is in surface contact with an upper surface of the semiconductor element, and the semiconductor element is directly cooled by the heat sink. 5. The air intake according to claim 1, wherein the air intake is constituted by a plurality of small holes, a plurality of slit holes, or one opening.
A computer device as described.