JPH10224696A - Solid-state image pickup element and image system using the solid-state image pickup element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a CMOS solid-state image pickup element with sophisticated functions. SOLUTION: Various function circuits manufactured by using the CMOS process are formed in the solid-state image pickup element 100 that is an application of a CMOS sensor, a plurality of modes are provided in picture element selection sections 103, 104 or a signal processing section 107 in the solid-state image pickup element, a function of inputting an external command to an interface section 108 is provided and the mode is selected by a system command using the solid-state image pickup element and an output suitable for the system is attained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a configuration of a solid-state imaging device and a system using the solid-state imaging device.

[0002]

2. Description of the Related Art Conventional image input systems using solid-state imaging devices include video cameras and surveillance cameras for recording moving images on tape, electronic camera systems for recording still images on video floppy disks and digital memory media, and industrial use. Most of these cameras use an area CCD sensor.

An area CCD sensor has a photoelectric conversion unit in which photoelectric conversion elements corresponding to pixels are two-dimensionally arranged. By forming an optical image on the photoelectric conversion unit, the photoelectric conversion unit becomes electric charge. Vertical transfer CCD and horizontal transfer C
This is a type in which the signal of each pixel is sequentially read out on a CD.

In addition, there is a CMOS type sensor as a solid-state imaging device. The CMOS sensor does not use a CCD for vertical and horizontal transfer, and a pixel selected by a selection line formed of an aluminum line or the like like a memory device is read by a read line. CMOS sensors
At one time, it was commercialized for use in video cameras, but because of its higher noise than CCD sensors, it was driven off by CCD sensors.

[0005] However, the CMOS sensor has features not found in the CCD sensor. For example, a CCD sensor is driven by a single power supply, while a CMOS sensor is driven by a single power supply.

That is, in order to drive the CCD sensor, a plurality of positive and negative power supply potentials such as +20 [V], +15 [V], and -10 [V] are required.
The OS sensor requires only one power supply potential, for example, a single power supply of +5 [V], and can use the same power supply voltage as other circuits constituting an imaging system such as an amplifier circuit and a control circuit. The number of power supplies can be reduced.

[0007] Further, the CMOS sensor has a power consumption of CC.
It is smaller than the D sensor.

Another CMOS sensor is CCD.
Has features not found in sensors. That is, a logic circuit, an analog circuit, an analog-to-digital conversion circuit, and the like can be easily formed on the sensor using the same CMOS circuit manufacturing process. The ease with which peripheral circuits and other related circuits are formed together on a CMOS sensor during CMOS sensor manufacturing is well known, and as an example, a prototype has been presented at an academic conference. (For example, 1
996 ISSCC).

As described above, the CMOS sensor has features not found in the CCD sensor, but in order to make use of these features, a circuit configuration in the sensor suitable for the system to be used and an interface with other circuit parts are required. . For example, if the interface is not appropriate, the number of pins will increase, the chip area of the sensor will increase, the package will increase, and the cost will increase.

Image compression techniques such as TV conferences and TV telephones have been standardized, but with the spread of personal computers (PCs) and personal computer communications, desktop conferences using personal computers have become reality. It also uses image compression technology.

[0011] A video camera recorder or a small video camera is used for an image capturing section of these image systems. These camera outputs are still analog video outputs, but it is expected that an era will come when personal computers are directly connected to digital or personal computers with built-in cameras are commonplace. If there is a solid-state image pickup device equipped with an image pickup processing circuit as an image pickup device for such an application, the number of components is reduced, and the cost is reduced.

[0012]

As described above, a CMOS sensor as a solid-state image sensor has a C sensor except for noise.
There are many advantages over CD sensors, and with the development of noise suppression technology, they are trying to gather the spotlight again. When the CMOS sensor is used as an imaging device, not only the function as the imaging device but also functions such as pixel selection, image compression, image drop control, and image data conversion are performed by the CMOS circuit using the CMOS circuit. If it is built on the same chip, it becomes possible to use only the processing results. The burden is reduced.

That is, if there is a solid-state image pickup device equipped with an image pickup processing circuit as an image pickup device, the number of components can be reduced and the cost can be reduced.

However, even if these imaging processing circuits are simply formed on a CMOS sensor chip, a problem remains in terms of usability when the chip is applied to a system. For example, if a function is designed based on the specifications required by the user, it becomes a single-function element, and becomes a dedicated device, that is, a device close to a device for a specific application, and loses versatility.

Considering the social background of the information society and the heyday of multimedia, the use of image acquisition will be required in various fields in the future. Because of the necessity of miniaturization and low power consumption, the emergence of a high-performance, highly versatile solid-state imaging device applicable to a CMOS sensor that can satisfy the requirements based on these needs is urgent.

Therefore, the object of the present invention is to:
It is an object of the present invention to provide a solid-state imaging device for a CMOS sensor that is small, has high functionality and high versatility, and can save energy. Another object of the present invention is to provide an image system using the solid-state imaging device.

[0017]

To achieve the above object, the present invention is as follows. That is, first, an area sensor unit in which pixels for performing photoelectric conversion are two-dimensionally arranged, a pixel selection unit that selects pixels of the area sensor unit and reads an image signal, and an image signal read from the pixel An analog signal processing unit that performs signal processing, an analog-to-digital conversion unit that converts the processed signal into a digital signal, a digital signal processing unit that performs signal processing to convert the digital signal into a digital signal of a required signal format, The solid-state imaging device includes an interface unit that outputs the digital signal to the outside, can input a command signal from the outside, and performs an operation corresponding to the command.

According to the present invention, in a configuration of a pixel selection circuit and a signal processing circuit of a sensor unit in an image pickup device, a plurality of pixel reading modes, a plurality of signal processing modes, or a plurality of signal output mode modes are provided. By providing an interface unit for inputting a command from the outside, these modes can be switched, and an output suitable for, or necessary for, or useful for a system using an image sensor can be output.

A system using an image sensor can input a command to the image sensor through a terminal provided on the image sensor. In accordance with this command, the image sensor outputs the format of output data required by the system.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A specific example of the present invention will be described below with reference to the drawings.

First, an outline of the CMOS sensor will be described.

(Outline of CMOS Sensor) A CMOS sensor is a solid-state image pickup device that can be driven by a single power supply and can be reduced in power consumption and voltage, and uses an amplification type transistor. This solid-state imaging device amplifies a signal detected by a photodiode in each cell by a transistor, and has a feature of high sensitivity.

Unlike a CCD sensor using a special manufacturing process, a CMOS sensor is produced by a MOS process that is frequently used in processors, semiconductor memories such as DRAMs, logic circuits, and the like. Therefore, the CMOS sensor has advantages such as being formed on the same semiconductor chip as the semiconductor memory and the processor, and being easy to share a production line with the semiconductor memory and the processor.

However, the conventional CMOS sensor (amplification type CMOS sensor) using the above-described amplification transistor has the following disadvantages: luminance unevenness called fixed pattern noise is unavoidable and difficult to remove; The CMOS sensor has a dynamic range of only about 60 dB, which is insufficient compared with 90 dB of a silver halide film and 70 dB of a CCD sensor.
Therefore, incorporating an amplification type CMOS sensor into an image system device such as a video camera has a practically large limitation in terms of image quality.

However, these problems have been solved technically in recent years, and practical use has become possible.

FIG. 72 is a circuit diagram showing a conventional solid-state imaging device using an amplification type CMOS sensor. The unit cells P0-ij corresponding to the pixels are vertically and horizontally arranged in a two-dimensional matrix. Although only 2 × 2 is shown in the figure, the array is actually several hundreds × several hundreds. i is a variable in the horizontal (row) direction, and j is a variable in the vertical (column) direction. Each unit cell P0-ij is connected to the photodiode 1
−ij, an amplification transistor 2-ij, a vertical selection transistor 3-ij, and a reset transistor 4-ij.
ij. There are a vertical address circuit 5 and a horizontal address circuit 13 for sequentially selecting the unit cells P0-1-1,... P0-ij,. The vertical address circuit 5 forms a vertical scanning circuit, and the horizontal address circuit 13 forms a horizontal scanning circuit.

The vertical address circuit 5 has unit cells P0-1-1,... P0- in a two-dimensional matrix array of an n × m configuration.
There are a number of pairs of address output terminals and reset signal terminals corresponding to n, which is the number of horizontal arrangements (the number of arrangements in the horizontal (row) direction) of ij,. Unit cells P0-1-1 in a dimensional matrix array,
There is an address output terminal corresponding to m, which is the number of vertical arrangements (the number of arrangements in the vertical (column) direction) of... P0-ij,. Note that m, n, i, and j are arbitrary integers.

.., P0-1-2,..., P0-2-j,..., One by one along the horizontal (row) direction. Are sequentially wired in the direction, and these vertical address lines 6-1, 6-2,. Connected to the corresponding one.

The unit cells P arranged in the horizontal (row) direction
, P0-1-2,..., P0-2-j,..., One by one, from the vertical address circuit 5 in the horizontal direction (row) in the reset signal lines 7-1, 7-2,. Are sequentially connected, and these reset signal lines 7-1, 7-2,... Are connected to corresponding one of the n reset signal terminals of the vertical address circuit 5, respectively.

Also, the unit cells P0-1-
, P0-1-2,..., P0-2-j,.
-1, 8-2,... Are sequentially wired, and these vertical signal lines 8-1, 8-2,.
3 are connected to the corresponding one of the m address output terminals.

The vertical address lines 6-1, 6-2,... Arranged in the horizontal direction from the vertical address circuit 5 are connected to the gates of the vertical selection transistors 3-1-1,. The horizontal line from which is read is determined.
Similarly, the reset lines 7-1, 7-2,... Arranged in the horizontal direction from the vertical address circuit 5 are connected to the gates of the reset transistors 4-1-1,.

Photodiode 1-i for detecting incident light
-J forms a light receiving portion for detecting incident light, generates signal charges corresponding to the amount of received light, and forms one pixel with one photodiode. The amplifying transistor 2-ij amplifies the signal charge generated by the photodiode 1-ij and outputs it as a detection signal. The cathode of the photodiode 1-ij is connected to its own gate. Thus, the signal charge of the photodiode 1-ij is amplified, and an amplified output corresponding to the signal charge is generated on the drain side as a detection signal.

The vertical selection transistor 3-ij has its own source-drain connected between the DC system power supply and the drain side of the amplification transistor 2-ij, and its gate side has a vertical address. It is connected to the vertical address line 6-j of the circuit 5.

The reset transistor 4-ij has its own source-drain connected between the DC system power supply and the cathode of the photodiode 1-ij, and operates in response to the signal of the photodiode 1-ij. Reset the charge.

That is, specifically, the source side of the vertical selection transistor 3-ij and the reset transistor 4-i-
The source side of j is commonly connected to a drain voltage terminal of a DC system power supply so that a drain voltage is supplied.

As described above, the vertical address lines 6-1 and 6-
2,... Are the vertical selection transistors 3-1 of the unit cells in each row.
The horizontal lines connected to the gates of -1,... For reading out signals are determined. Similarly, reset lines 7-1, 7-2,...
Are connected to the gates of the reset transistors 4-1-1,... In each row.

Therefore, in reading out the pixels of the n × m configuration (array configuration of n rows and m columns), the vertical address circuit 5 is used to activate the n horizontal lines (row direction lines) in the reading scanning order. Are activated in order to sequentially activate the vertical address lines 6-1, 6-2,... And to output signals to the output terminals so as to reset the signal charges of the pixels.

The above is the description of the image detecting section. In addition to the image detecting section, there is an output section for reading out the image detected by the image detecting section. The output part is load transistors 9-1 and 9-
2,..., The signal transfer transistors 10-1, 10-2,
.., Storage capacitors 11-1, 11-2,..., And horizontal (row) selection transistors 12-1, 12-2,.

That is, the source sides of the amplification transistors 2-1-1, 1-2-2,... Of the unit cells in each column are among the vertical signal lines 8-1, 8-2,. , Are respectively connected to the corresponding columns. Also,
One load transistor 9-1, 9-2,... Is provided for each unit cell in each column, and one end of the vertical signal lines 8-1, 8-2,. -1, 9-2,..., And the source-drain side of the load transistor to a DC system power supply.

The other ends of the vertical signal lines 8-1, 8-2,...
Storage capacitors 11-1, 11-2 for storing one row of signals via one of 0-1, 10-2,.
,... Selected by the horizontal address pulse supplied from the horizontal address circuit 13, It is connected to a signal output terminal (horizontal signal line) 15 through the connection.

That is, the other ends of the vertical signal lines 8-1, 8-2,... Are connected to the signal transfer transistors 10-1, 10-2,.
Are connected to one end of a corresponding one of the storage capacitors 11-1, 11-2,... Via the source-drain of the corresponding one of the transistors.
Horizontal (row) selection transistors 12-1, 12-2,...
Are connected to a signal output terminal (horizontal signal line) 15 via a source-drain of a corresponding one of the transistors. The other ends of the storage capacitors 11-1, 11-2,... Are grounded, and the signal transfer transistors 10-1, 10-2,.
Are connected to the common gate 14. A signal transfer pulse is applied to the common gate 14 at a timing at which the signal is to be transferred, so that the signal transfer transistor 10
-1, 10-2,... Are turned on, and the vertical signal lines 8-1,
8-2,... Are amplified by the amplified signal storage capacitor 11-.
, 11-2,... And can be stored.

The horizontal address circuit 13 is for sequentially selecting a pixel position to be read out per one horizontal line, and in reading out a pixel of an n × m configuration (n rows and m columns), one horizontal line is read. In accordance with the line scanning speed, the horizontal (ro
w) The horizontal address pulse is generated so as to activate the selection transistors 12-1, 12-2,...

Therefore, in the reading of the pixels of the n × m configuration (the configuration of the n rows and the m columns), it is possible to control the scanning in which the signal of the pixels in the line is read while the line position is sequentially changed.

The operation will be described. Referring to the timing chart of FIG. 73, the operation of this MOS type solid-state imaging device is as follows. Vertical address circuit 5
Thus, the vertical address line 6-i is connected to the vertical address line 6-i.
When an address pulse for setting i to a high level is applied,
The selection transistors 3-i-1, 3-i-2,.
ON only, and the amplification transistor 2-i-
, 1,2-i-2,... And load transistors 9-1, 9-
The source follower circuit is composed of 2,.

As a result, the amplification transistor 2-i-
Are applied to the vertical signal lines 8-1, 8-2,..., That is, voltages substantially equal to the voltages of the photodiodes 1-i-1, 1-i-2,. appear.

At this time, the signal transfer transistor 10-
When a signal transfer pulse is applied to the common gate 14 of 1, 10-2,..., The amplified signal storage capacitors 11-1, 11-2,.
, An amplified signal charge represented by the product of the voltage appearing on the vertical signal lines 8-1, 8-2,...

The amplified signal storage capacitors 11-1, 11-2,...
After the signal charge is stored in the vertical address circuit 5, the vertical address circuit 5 applies a reset pulse to the reset line 7-i. This reset pulse causes the reset transistor 4
Are turned on, and the signal charges stored in the photodiodes 1-i-1, 1-i-2,... Are reset by the reset transistors 4-i-1, 4-i-. It is discharged through 2,. Thereby, the photodiode 1-i
-1, 1-i-2,... Have been reset.

Next, the horizontal address pulse is supplied from the horizontal address circuit 13 to the horizontal selection transistors 12-1 and 12-.
Are sequentially applied. Then, the horizontal selection transistors 12-1, 12-2,... Are turned on while the horizontal address pulse is being applied. The signal charges stored in the amplified signal storage capacitors 11-1, 11-2,...
Are output from the storage signal output terminal (horizontal signal line) 15 through −2,. Thus, an image signal for one row is obtained as an output signal.

By continuing this operation sequentially to the next row (horizontal line) and the next row, all signals of the photodiodes arranged two-dimensionally can be read.

As described above, by sequentially performing read control while changing the line position, image signals for one screen can be sequentially taken out, and a moving image can be obtained by repeating this operation continuously. .

By the way, the unit cell P0-ij of the conventional MOS type solid-state imaging device described above is
-Amplifying transistor 2 for amplifying the charge signal from i-j
-Ij, a vertical selection transistor 3-ij for selecting a line from which a signal is read, and a reset transistor 4-ij for charging / discharging the gate of the amplification transistor are required. That is, 3 photodiodes per light receiving unit corresponding to a unit pixel
It becomes a transistor configuration.

The charges generated by the photodiode 1-ij are amplified and output using the amplifying transistor 2-ij.
The problem of noise due to j remains. That is, the amplifying transistor 2-ij is provided for each unit cell which is a pixel, but the amplifying transistor generates an output even when the photodiode is not receiving light. This is due to unavoidable dark current and thermal noise due to the characteristics of the amplifying transistor, and variations in the threshold voltage, which are different and unique to each pixel cell in a matrix arrangement. Even if light is applied to the entire light receiving surface, the level of the obtained image signal is not uniform for each pixel, and the image signal has uneven brightness. The image having uneven brightness is noise in which noise is distributed two-dimensionally, that is, noise distributed in a plane called a screen, and is called fixed pattern noise in the sense that it is fixed in place. The problem of this noise is serious, and by making pixels smaller,
Because it becomes remarkable, if you do not improve it for imaging,
Practical application is unclear.

Under such a background, as a result of various studies, a circuit technique for canceling noise of the amplifying transistor for each unit pixel has recently been developed, and a MOS type circuit employing such a circuit technique has been developed. When the imaging device was developed, these problems were finally solved at once.

An example will be described. For example, in a unit cell, a transistor having a code of a reset transistor (4-ij (i, j = 1, 2, 3, 4,...) In the example of FIG. 72), and a code of 66 in FIG. 73 (see FIG. 1) in a configuration in which the fixed pattern noise is reduced by performing a feedback operation on the fixed transistor.
As shown in 7), before the horizontal selection transistor 12,
This is because a noise removing circuit (noise canceller circuit) provided with a circuit for further suppressing the reduced fixed pattern noise is used.

The principle of the threshold voltage correction of the amplification transistor 64 by the unit cell feedback operation, which is a feature of this configuration example, is as follows. This will be described with reference to FIG. FIG. 74 shows a cell circuit diagram.

The unit cell of the CMOS type solid-state image pickup device shown in the figure includes a photodiode (1-ij) 62, an amplification transistor (2-ij) 64, and a vertical selection transistor (3-ij). 65, and a reset transistor 66. In the unit cell, the photodiode 62 for detecting incident light has its cathode connected to the gate of an amplification transistor for amplifying a detection signal of the photodiode 62. . Then, the amplification transistor 64
A reset transistor 66 performing a feedback operation and an amplifying transistor 64
And a vertical selection transistor 65 for selecting a horizontal line from which a signal is read out.

With such a connection configuration, when the vertical selection transistor 65 is turned off and the reset transistor 66 is turned on, and the reference voltage is applied to the vertical signal line 8, the gate channel of the reset transistor 66 is turned off. When electrons flow into the drain of the reset transistor 66 through the gate, the drain voltage of the reset transistor 66 decreases.

Since the reset transistor 66 is turned on and connected between the drain and the gate of the reset transistor 66, the gate voltage is also reduced and the number of flowing electrons is reduced. Eventually, the reference voltage applied to the source and the channel potential become substantially equal. In this state, the channel potential becomes a voltage externally applied, so that there is no variation in the structure of the transistor.

That is, according to this example, a threshold voltage variation can be corrected by inserting a feedback transistor (reset transistor 66) between the gate and the drain of the amplification transistor 64 and applying a constant voltage to the source. .

FIG. 75 shows the structure of an improved type solid-state imaging device as an example. The unit cells P4-ij are vertically and horizontally arranged in a two-dimensional matrix. In the figure, 2 ×
Although only two are shown, there are actually several thousand by several thousand. i
Is a variable in the horizontal direction (row), and j is a variable in the vertical direction (column). Details of each unit cell P4-ij are as shown in FIG.

The application fields of this solid-state imaging device include a video camera, an electronic still camera, a digital camera, a facsimile, a copying machine, a scanner and the like.

A vertical address line 6 extending in the horizontal direction from a vertical address circuit 5 constituting the vertical scanning circuit portion
.. Are connected to the unit cells of each row and determine horizontal lines from which signals are read. Similarly, a reset line 7-
, Are connected to the unit cells in each column.

The unit cells in each column are connected to vertical signal lines 8-1, 8-2,... Arranged in the column direction.
, 8-2,.
−2,... Are provided. Load transistor 9-1,
The gates and drains of 9-2,... Are commonly connected to the drain voltage terminal 20.

The other ends of the vertical signal lines 8-1, 8-2,.
Are connected to the gates of MOS transistors 26-1, 26-2,.... MOS transistors 26-1, 26-2,
Are the sources of the MOS transistors 28-1, 28-2,
Are connected to the drains of the MOS transistors 26-
, 28-1, 28-2,... Operate as source follower circuits. MOS transistor 28-
, 28-2,... Are connected to the common gate terminal 36.

MOS transistors 26-1, 26-2,
And the MOS transistors 28-1, 28-2, ... are connected to the sample-and-hold transistors 30-1, 30-
Are connected to one ends of the clamp capacitors 32-1, 32-2,. The clamp capacities 32-1, 32-2,
Are connected to the other ends of the sample hold capacitors 34-1 and 34-
, And the clamp transistors 40-1, 40-2,.
Are connected in parallel. Sample hold capacity 34−
The other ends of 1, 34-2,... Are grounded. The other ends of the clamp capacitors 32-1, 32-2,... Are also connected to a signal output terminal (horizontal signal line) 15 via horizontal selection transistors 12-1, 12-2,.

The vertical address circuit 5 includes a plurality of
FIG. 76, FIG. 7
7, and is realized by any one of the circuits in FIG. Figure 77
In the example, the output of the address circuit 44 for sequentially shifting and outputting the input signal 46 from a large number of output terminals is combined with the two input signals 50 by the multiplexer 48. In the example of FIG. 77, the output of the decoder 52 that decodes the encode input 54 is combined with the two-input signal 58 by the multiplexer 56. In the example of FIG. 78, two address circuits 60a,
The outputs of 60b are bundled to form control signal lines for each row.

The circuit shown in FIG. 74 is used as the unit cell P4-1-1 in the circuit shown in FIG. Here, only the configuration of the unit cell P4-1-1 is shown, but the same configuration is adopted for the other unit cells P4-1-2,.

Next, the operation of the MOS-type solid-state imaging device thus configured will be described with reference to the timing chart of FIG. Since the common drain terminal 20 of the load transistor 9, the common gate terminal 36 of the transistor 28 of the impedance conversion circuit, and the common source terminal 38 of the clamp transistor 40 are driven by DC, they are omitted from the timing chart.

When a high-level address pulse is applied to the vertical address line 6-1, the unit cells P4-1-1, P4-1-2, P4-1-2 connected to the vertical address line 6-1 are connected.
Are turned on, and the source follower circuit is constituted by the amplification transistor 64 and the load transistors 9-1, 9-2,.

The sample hold transistors 30-1,
The common gate 37 of 30-2,... Is set to a high level to turn on the sample-and-hold transistors 30-1, 30-2,. Thereafter, the clamp transistors 40-1 and 40
The common gate 42 of −2,... Is set to a high level to turn on the clamp transistors 40-1, 40-2,.

Next, the clamp transistors 40-1, 4
The common gate 42 of 0-2,... Is set to low level to turn off the clamp transistors 40-1, 40-2,. Therefore, the signal plus noise components appearing on the vertical signal lines 8-1, 8-2,...
Stored in ...

Thereafter, after the vertical address pulse is returned to the low level, when a high-level reset pulse is applied to the reset line 7-1, the unit cell P4-1-1 connected to the reset line 7-1 is applied. , P4-1-2,... Are turned on, and the charges at the input terminals of the output circuit 68 are reset.

When a high-level address pulse is applied to the vertical address line 6-1 again,
-1 connected to unit cells P4-1-1, P4-1
The vertical selection transistors 65 of −2,... Are turned on, and the amplification transistor 64 and the load transistors 9-1, 9-
2,... Constitute a source follower circuit, and only the noise components whose signal components have been reset are output to the vertical signal lines 8-1, 8-.
Appear in 2, ...

As described above, the clamp capacitors 32-1,
.. Have a signal plus noise component stored therein, so that the clamp nodes 41-1, 41-2,. Only the signal voltage without fixed pattern noise, which is obtained by subtracting the noise component from the component plus the noise component, appears.

Then, the sample hold transistor 3
The common gate 37 of 0-1, 30-2,... Is set to low level, and the sample and hold transistors 30-1, 30-
Turn off 2, ... Therefore, the clamp node 41−
, 41-2, ... are stored in the sample and hold capacitors 34-1, 34-2, ....

Thereafter, the horizontal selection transistors 12-1 and 12-1,
By sequentially applying horizontal address pulses to 12-2,..., Sample-and-hold capacitances 34-1, 34-2,.
Is read from the output terminal (horizontal signal line) 15 without noise.

Hereinafter, similarly, the vertical address lines 6-2, 6
By repeating the above operation for −3,.
Signals of all cells arranged in a dimension can be extracted.

Here, the relationship between the timing and the timing shown in FIG. 79 will be described. The required order is as follows.

"Rising edge of vertical address pulse / rising edge of sample / hold pulse / rising edge of clamp pulse" → "rising edge of reset pulse" → "falling edge of reset pulse" → "falling edge of sample / hold pulse" → "vertical address pulse Falling of "
It is.

The rising of the vertical address pulse
The order of the rise of the sample hold pulse and the rise of the clamp pulse is arbitrary, but is preferably in the order described above.

As described above, according to the operation of FIG. 79, when there is a signal (plus noise) at the clamp node 41,
Since the voltage of the difference when the gate of the amplification transistor is reset and there is no signal appears, the fixed pattern noise due to the threshold variation of the amplification transistor 64 that cannot be completely removed by the feedback operation of the unit cell for some reason is compensated. That is, the clamp transistor 3
A circuit including 0, a clamp capacitor 31, a sample hold transistor 40, and a sample hold capacitor 34 functions as a noise canceller.

The noise canceller of the present embodiment is composed of the impedance conversion circuits 26, 2 comprising a source follower circuit.
8 is connected to the vertical signal line 8. That is,
The vertical signal line is connected to the gate of the transistor 26. Since the gate capacitance is very small, the amplifying transistor 64 of the cell charges only the vertical signal lines 8-1, 8-2,..., So that the CR has a short time constant and immediately enters a steady state. Therefore, the reset pulse application timing can be advanced, and the noise cancel operation can be performed in a short time.

FIG. 80 is a block diagram showing a schematic circuit configuration of such a CMOS sensor.

The present invention is to provide an imaging device with high functionality by using such a CMOS sensor and further forming peripheral circuits by a CMOS process. Next, an example thereof will be specifically described.

(First Specific Example) FIG. 1 is a block diagram showing a schematic internal configuration of an image pickup device as a specific example of the present invention. In the figure, reference numeral 100 denotes an image sensor. As shown in the figure, the image sensor 100 includes a timing generator 101, an area sensor 102, a vertical scanning unit 103 for selecting pixel output, and a horizontal scanning unit 104. An analog signal processing unit 105, an A / D unit (A / D conversion unit) 106 for performing analog / digital conversion, a digital signal processing unit 107 for converting a digitized signal into an output signal,
An interface unit 108 for outputting digital image data to the outside and receiving command data from the outside is provided.

The area sensor unit 102 is the CMOS
The vertical scanning unit 103 is a CMOS sensor 10
2 for performing vertical scanning control on the horizontal scanning unit 1
Reference numeral 04 denotes a component for performing horizontal scanning control of the CMOS sensor 102. These components are configured to perform required scanning control based on an output signal of the timing generator 101.

What is important in this specific example is that a command can be input from the outside, and
The point is that the mode of 00, the output signal form, the signal output timing, and the like can be controlled. The interface unit 108 is provided for this purpose. When a required command is given to the interface unit 108 from the outside, the interface unit 108 controls various components so as to perform control corresponding to the received command. carry out.
In addition, the interface unit 108 performs the digital signal processing 10.
Digital image data output through the imaging device 1
It also has the function of outputting to the outside of 00.

The analog signal processing unit 105 performs necessary signal processing on the image signal read from the area sensor unit 102 and outputs the processed signal to the A / D unit 106.
The D unit 106 converts the image signal into a digital signal and outputs the digital signal.
Is for outputting the image data which is digitally converted and output by the A / D unit 106 to the interface unit 108.

The timing generation section 101 generates a timing signal for reading out an image signal photoelectrically converted in each pixel based on an external signal, and the vertical and horizontal scanning sections generate the timing signal in the pixel according to the timing signal. The photoelectrically converted charge is read out in step.

The external signal may be a master clock as a reference frequency, a synchronization signal, or both.

FIGS. 2 and 3 show a specific example of the timing generator 101. FIG. In the figure, 101a is a vertical scanning signal generator, 101b is a horizontal scanning signal generator, 101c is a signal generator for digital processing, and the vertical scanning signal generator 101a receives a clock signal, a horizontal synchronizing signal, and a vertical synchronizing signal, and A vertical scanning signal indicating a scanning timing is generated. The horizontal scanning signal generator 101b receives a clock signal, a horizontal synchronization signal, and a vertical synchronization signal, and generates a horizontal scanning signal indicating horizontal scanning timing. The digital processing signal generator 101c receives the clock signal, the horizontal synchronizing signal and the vertical synchronizing signal, and generates a signal indicating required digital processing timing.

The external signal may be a master clock as a reference frequency and / or a synchronizing signal, or both of them. The configuration example shown in FIG. 1 is an example in which both are input, and specific examples thereof are as described above. FIG. 2 shows a clock, a horizontal synchronizing signal, and a vertical synchronizing signal. From these three types of signals, the timing generator 101
Is generated and supplied to each unit in the image sensor 100.

The configuration shown in FIG. 3 is an example in which only a clock is supplied from outside the image sensor 100 and a synchronization signal is also generated by the timing generator 101 of the image sensor. In order to internally generate a synchronization signal, a vertical scanning signal signal, a horizontal scanning signal signal, and the like in response to an external clock, in the configuration of FIG. 3, the vertical scanning signal generator 101a, the horizontal scanning signal generator 101b, Digital processing signal generator 101
In addition to c, a synchronization signal generation unit 101d is further provided. The synchronization signal generation unit 101d generates a vertical synchronization signal and a horizontal synchronization signal based on a clock signal input from the outside, and outputs these to the outside. In addition, the configuration is provided to the vertical scanning signal generator 101a, the horizontal scanning signal generator 101b, and the digital processing signal generator 101c.

In the configuration shown in FIG.
The vertical synchronization signal and the horizontal synchronization signal are output to the outside from 1d in order to supply the synchronization signal to the outside for a system requiring a timing signal outside the image sensor.

FIG. 4 is an overall block diagram of the image sensor 100 at this time. Except for the timing generator, the operation is the same. The analog signal processing unit 105 reduces noise,
Amplification, gamma processing and clamp processing are performed, and the A / D unit 106
Is converted into a digital signal.

The digital signal processor 107 converts the pixel array signal into an output signal suitable for external output. For example, a luminance signal, an RGB signal, a luminance / color difference signal (YCrC
b, YUV).

The order in which the signals are output may be in units of pixels, or in sequence. Note that this also includes the case where the pixel arrangement data is used as it is without performing the signal processing.

Further, signal processing may be performed based on these signals. For example, a still image data compression process represented by JPEG based on a luminance / color difference signal,
261 and H.E. Video processing for conference applications such as H.263, MP
EG1 and MPEG2, and MPs whose standards are currently under discussion
EG4 signal processing and the like can be mounted. The digital signal processing unit 10 is not an analog signal processing unit.
It is also conceivable that gamma processing is performed in step S7.

This digital signal processing unit 107 includes
And the memory 107 in addition to the signal processing circuit 107a.
It may be configured to accompany b. This memory 107
b stores one or a plurality of lines, one or a plurality of blocks, and one or a plurality of frames of image data necessary for signal processing, and uses them for signal processing in the signal processing circuit 107a. Digital signal processing unit 1
07a is processed by the interface unit 108.
This is output to the outside of the image sensor 100. The interface unit 108 also serves to take in a command from outside into the image sensor.

The image pickup device 100 of the present invention is characterized in that a mode corresponding to the command input is entered by inputting a command from the outside, so that processing corresponding to the command can be performed. This will be described in detail below. .

[First Internal Configuration Example of Command Switching Type Imaging Element] <Example of Image Switching Configuration> In a first internal configuration example, this imaging element has a plurality of output formats. This is an example in which output data can be changed by selecting output format switching.

FIG. 6 shows one specific example. In this example, the digital signal processing unit 107 is configured by a luminance signal chrominance signal generation circuit (YCrCb generation circuit) as a signal processing circuit 107a, and further includes a switching circuit 107b. The switching circuit 107b has two switching terminals, one switching terminal is connected to the output side of the luminance signal chrominance signal generation circuit 107a, and the other switching terminal is connected to the input side of the luminance signal chrominance signal generation circuit 107a. The output of the luminance signal / color difference signal generation circuit 107a and the A /
One of the outputs of the D unit 106 can be selectively output as the output of the digital signal processing unit 107. The switching control of the switching circuit 107b can be performed by the interface unit 108 sending a switching signal to the digital signal processing unit 107 in response to a reception command of the interface unit 108.

That is, in this configuration, the digital signal processing unit 107 has a path for outputting the pixel data itself and a path for converting the YCrCb signal into a YCrCb signal through a digital circuit. By enabling the switching operation to select one of the paths, the data of the path designated to be switched is output.

The configuration shown in FIG. 7 has a moving image signal processing unit 107c for processing a moving image signal and a still image signal processing unit 107d for processing a still image signal. In such a manner as to select one of the outputs. In general, moving images and still images have different signal processing methods. By providing these two signal processing units and adopting a configuration that can be switched so as to select either output by a command, higher quality images can be obtained. Is obtained.

The configuration of the digital signal processing unit 107 is configured as shown in FIG. In the configuration of FIG. 8, various signal processing units 107e to 107n are provided, and these are switched by the switching circuit 107b. With this configuration, the output format can be specified by the system with a single command, so that an appropriate output can be output. The signal output formats of the signal processing units 107e to 107n include those described above.
A format for recording a still image by a computer, such as an ICT format, a GIF format, or a TIFF format, is also conceivable.

FIG. 9 shows an example in which the output order of images captured by the area sensor unit 102 is changed. The area sensor unit 102 is an image sensor having an array of n pixels (n is the number of pixels of the area sensor unit).
The image signal is sequentially read and output in pixel units formed by a set of cells of each color of (green) and B (blue), or the image signal is read out in a frame unit of each color of R, G, and B. This is an example in which it is switched by a command whether or not to read and output “screen sequential”.

In the example shown in FIG.
The numbers in parentheses are displayed in units of one pixel, and in this example, three colors of RGB are generated by signal processing for each pixel in the image sensor. The output order is switched between pixel sequential output and plane sequential output by a command.

The above is an example in which the type of image to be output can be selected by a command. (Second invention) A second invention is to output data in response to an external command.

An image pickup device for a normal video camera is a TV set.
Since it is a system for displaying images on a monitor, in the case of the NTSC system, it always outputs at a rate of 30 frames / sec. However, in applications such as TV conferences, TV telephones, and desktop conferences, the number of frames per second is often smaller than 30 due to transmission capacity limitations, and it is not always necessary to output an imaging signal.

When there is an external output request, data is output, and when there is no request, unnecessary circuit operation on the image sensor is stopped to reduce power consumption. .

FIG. 10 shows a timing chart of one specific example. In this example, the area sensor unit 10 of the image sensor 100 is used.
In No. 2, a valid accumulation operation is always performed, and when a read command is given, a signal is read from the beginning of the next frame to the analog signal processing stage and thereafter, and a signal circuit is operated and output. Is shown.

FIG. 11 is a time chart as another specific example, in which an effective accumulation operation of the area sensor is performed only after an output command is input. In response to the output command, the timing generator 101 generates necessary signals in various places. Based on the signals, an effective accumulation operation is performed in the area sensor 102, and the read signals are converted into digital signals by the digital signal processor 107. After receiving the signal processing, the image sensor 10 is converted into image data via the interface unit 108.
Output outside 0. The area sensor unit 102 performs an effective accumulation operation for each one frame period in a pixel unit or a line unit, or a column unit or a block unit, and then reads out the data (FIG. 11 shows an example of accumulation reading in a line unit). After the output command (shown), data is output at least one frame period later. However,
When the electronic shutter operation is being performed, the effective accumulation operation period is shortened.

Next, another example will be described.

(Second Specific Example) The second specific example is an example in which the output frame rate from the image sensor 100 is set stepwise, and can be switched by an external command. .

A plurality of settings of M frames / second are prepared, where M is a rational number, and these can be switched, and a frame rate suitable for the conditions of the system used or selected by the user is selected. Command to
The setting of the above M is switched.

In this case, the timing generation circuit 101 has a function of realizing a plurality of reading methods, and is configured to be able to select one of them and change the output rate by the above command.

In this case, for example, as shown in FIG. 12, “30 frames / sec”, “15 frames / sec”,
If the reference frame rate, ie, N frames / sec, is set to 1 / n, such as “7.5 frames / sec” or “3.75 frames / sec”, the circuit configuration Is easy. In this example, N = 30, n =
It becomes 2.

As a method of selecting a frame rate, for example, there is the following method.

One is to provide a built-in camera 301a using the image pickup device 100 of the present invention in a personal computer 300 as shown in FIG.
A configuration in which a PHS (simple mobile phone terminal) is connected via an (interface), or an IF (interface) in which a personal computer camera 301b using the image sensor 100 of the present invention is connected to a personal computer 300 as shown in FIG. The PC 300 is connected to a network line via a built-in communication interface, and in a system for holding a desktop conference with a remote place, a data transfer rate of a line used for transmission is checked at the time of startup, and software Is a method of selecting a frame rate.

FIG. 15 shows a built-in or personal computer camera 3.
01a and 301b, which are examples of the configuration of the imaging device 1 of the present invention.
00, a lens system (optical system) 302 for forming an optical image on the image sensor 100, an image encoder 303 for encoding an image output from the image sensor 100, and a command given from the outside to decode the image sensor. It comprises a command decoder 304 to be given to 100.

Built-in or personal computer camera 3 shown in FIG.
Examples of the configuration of 01a and 301b include a lens system (optical system) 302 for forming an optical image on the image sensor 100 and the image sensor 10
0, a video signal multiplexing encoder 306 for formatting image data output from the information source encoder 305, and an output of the video signal multiplexing encoder 306. A transmission buffer 307 for temporarily storing data for transmission, a system multiplexing encoder 308 for multiplexing data temporarily stored in the transmission buffer 307 and transmitting the multiplexed data to a transmission path;
In order to control the read and transfer of the image signal according to the capacity of the image signal 7, the information source encoder 305, the image sensor 100, and the encoding controller 309 which controls the video signal multiplex encoder 306.

Such a built-in or personal computer camera 301 is connected to the personal computer 300 for use. In the case of the built-in or personal computer camera 301 having the configuration shown in FIG. 15, the frame rate is selected by giving a command for that purpose. The decoder 304 interprets the data so that the frame rate becomes the frame rate corresponding to the command.
Side, decodes and controls switching.
00 side, the controller (C
A PU (processor) or the like may be configured to issue an output rate setting command to the image sensor 100.

When the camera 301 has a configuration as shown in FIG. 16, since the camera 301 is configured by a combination of an imaging unit, a moving image coding device, and a transmitting unit, the hardware constituting the moving image coding device is used. In FIG. 16, as an example, the data occupation amount of the transmission buffer memory 307 of the encoded data is monitored by the system of the camera 301 and is set as one of the criteria for issuing a command as shown in FIG.

For example, the transmission buffer 30 in FIG.
When the occupancy of the memory in the memory 7 becomes smaller than a predetermined value, an output command is issued. Alternatively, FIG. 15 or FIG.
6, the moving picture transmission system (for example, H.263 or H.2) is implemented by software or hardware.
61), the user decides whether to emphasize the frame rate or the image quality, and based on this, software or hardware can send a command.

In recent years, small and lightweight portable terminals such as notebook-type pen personal computers have become widespread. For example, as shown in FIG. 17, a communication means and an image sensor 100 are incorporated in a portable information device. When the configuration is such that image communication can be performed by using a control method, as shown in FIG. 18, a control method is adopted in which the CPU detects the remaining amount of the battery BT serving as the power supply of the portable information device, and thereby determines the output frame rate. Then, it is possible to suppress interruption during communication due to battery exhaustion and complete required communication. In other words, by employing this method, the operation time can be extended even when the remaining battery power is low. And
By checking the battery of the device and, when the battery is low, by controlling to reduce the output frame rate,
Power consumption is reduced, and necessary operation can be ensured even if quality is sacrificed to some extent.

FIG. 13 or FIG. 14 or FIG.
The system of No. 7 has a power save mode, and when the save mode is operated, an example in which the frame rate of the image sensor is reduced may be considered.

(Third Specific Example) A third specific example is an example in which the output order of pixels can be changed or a readout pixel can be selected by a command given from the outside.

The image sensor 100 of the present invention uses a CMOS sensor as an area sensor. This CMOS sensor is different from a CCD sensor by selectively activating horizontal scanning lines and vertical scanning lines. Can be configured to be read.

In a system for outputting to a monitor of a TV or a personal computer, it is usual to read out in units of lines. In a system for compressing data using, for example, a block coding method, a frame image having an n × m pixel configuration is read. Normal processing is to perform processing in blocks of 8 × 8 pixels or 16 × 16 pixels. In order to cope with the plurality of reading methods, the timing generating unit 101, the digital signal processing unit 107, or both incorporate the plurality of reading methods or the reading methods and a plurality of processing circuits corresponding thereto. If these can be switched by an external command, it is possible to provide a configuration that can easily cope with the above processing.

An example will be described below.

For example, FIGS. 19A and 19B show an example of an image reading order when displaying an image on a monitor. FIG.
9 (a) shows non-interlaced scanning, FIG. 19 (b)
Is an example of performing interlaced scanning.

FIG. This is a reading order when the H.263 standard is used. According to this standard, a block composed of four blocks of 8 × 8 pixels is defined as a macro block.
The GOB (Group
of Blocks), pixel signals or signals converted into luminance and color components are read out. To cope with this, the timing generator 101 is configured as shown in FIG. That is, the timing generator 101 includes a vertical scanning signal generator 101a and a horizontal signal generator 101.
b, and an interlace mode control unit 101f, a non-interlace mode control unit 101g, a block mode control unit 101h, and these control units 101f, 101g, 1
Switching unit 101 for selectively switching 01h in response to a command
e is provided. Then, the mode is switched by an output switching command, and a signal to a scanning unit that scans the area sensor unit 102 is changed, so that the output order can be changed.

If the timing generator 101 is configured to be able to select a plurality of readout methods, the same image pickup device can be used.

(Fourth Specific Example) Image Sensor 100 of the Present Invention
Can selectively output pixels. Therefore, it is easy to perform sub-sampling every fixed pixels or to read out only a part of the image.

FIG. 22 shows the former example. FIGS. 22A to 22C each show a configuration of cells of four colors G, R, B, and G per pixel. In FIG. 22A, all cells are read out for the entire screen. Is an all-pixel reading method in which an image is read out.
This is a sub-sample reading method in which an image is read every pixel, and (c) is another sub-sample reading method in which an image is read in units of discrete cells. The resolution (here, the resolution indicates the number of pixels), a large resolution when capturing a still image, or changing the resolution according to the transmission capacity in a desktop conference can be handled. At this time, the timing generator 101 may be configured as shown in FIG. 23, and switching may be performed by an output switching command. That is, the timing generator 101 includes a vertical scanning signal generator 101a, a horizontal scanning signal generator 101b, a switching circuit 101e, an all-pixel output mode controller 101i, and a sub-sample mode controller 10.
1j.

The all-pixel output mode control unit 101i
Generates a timing signal that allows all pixels to be read based on the clock synchronization signal, and the sub-sample mode control unit 101j generates a timing signal that enables reading in the above-described sub-sample mode based on the clock synchronization signal. These are switched by a switching circuit 101e, and the vertical scanning signal generator 101a and the horizontal scanning signal generator 101a are switched.
b. The switching circuit 101e selects and extracts one of the outputs of the mode control units 101i and 101j according to the switching command given from the interface unit 108. The interface unit 108 is configured to receive an external command, generate a switching command corresponding to the command, and provide the switching command to the switching circuit 101e.

In reading an image, the operation shown in FIG.
As shown in (a), all pixels are read.

FIG. 22B shows an example of a Bayer array.
By outputting the image of the shaded cell in FIG. 22B among the cells of each color arranged in order in the vertical and horizontal directions, the horizontal “1” is output.
Since an image having a size of "1/2" and "1/2" in height is obtained, and there is no change in the reading color order, the digital signal processing unit 107 does not need to be changed.

FIG. 22C shows an example of a sub-sample for reading out only pixels of green (G) color. A black-and-white image is an image having only a gradation, and the gradation can be reproduced by a luminance signal of the image. Therefore, in this example, when a monochrome image is obtained, the green pixel closest to the luminance signal is used.

According to this, it is possible to use a green pixel closest to the luminance signal when taking in a black and white image.

Next, an example in which only a part of an image is output will be described. In the output of "only part of the image", which is an image of only a partial area of the screen, of the captured image, the moving part or the image of the part for which the details are desired are concentrated and output. Efficient video encoding is possible. in this case,
As shown in FIG. 24, a new output position designation command is prepared for the image sensor 100 of the present invention used as an image pickup unit of a camera, and when a certain point is designated in the image pickup area of the area sensor unit 102 by the command, It is configured to output an image of a specific area around the point.

Here, the periphery includes a fixed range centered on the point P specified as shown in FIGS. 25A and 25B or a point P specified as shown in FIG. 25C. One or a plurality of blocks or a range having the same character. Here, the identity is a range obtained by edge recognition around the point, or has the same motion vector value as the point as shown in FIG. The object, the block (FIG. 25 (e)), the value of the luminance signal is close, the hue is close, or a combination thereof. Alternatively, it is conceivable that a block is designated by a command instead of a point and an image of only the designated block is output as shown in FIG.

(Fifth Specific Example) The fifth specific example is an example in which the electronic shutter setting of the image sensor 100 can be changed by a command given from the outside. FIG.
As shown in FIG. 6, the image pickup device 100 is provided with a function of receiving an electronic shutter setting command, and a function means for recognizing the electronic shutter setting command and responding to the command is provided therein. The shutter can be set.

Details will be described with reference to FIG.

Although the CCD type image pickup device has the same charge accumulation time for all pixels, the image pickup device 1 used in the present invention has the same structure.
No. 00 uses a CMOS sensor as an area sensor, and the area sensor using this CMOS sensor has a structure in which reading can be performed in a pixel unit, a line unit, or a block unit. different. Here, an example of reading in line units is shown.

When pixels are read out in a line-sequential manner on the screen as shown in FIG. 27A, first, as shown in FIG. 27B, the invalid charges accumulated in the pixels are reset, and the effective accumulation operation is started. . After a certain period of time, the pixels are read out, and an imaging signal is given to the next signal processing. The effective accumulation operation period has different timing for each line, but each period has the same length.

When operating the electronic shutter, FIG.
By shifting the timing of resetting the pixel for resetting the invalid charge backward in time as shown in (c), the effective accumulation operation period can be shortened, and the electronic shutter operation is performed. This operation is performed by the electronic shutter command switching the mode of the timing generator 101.

Further, the setting of the effective accumulation operation in units of pixels, lines, or blocks can be performed by a command. FIG. 27D shows an example in which the effective accumulation period of the second column is different from the other lines. FIG. 28 divides the area sensor unit 102 into blocks,
This is an image sensor that reads out in divided blocks,
In this example, the effective accumulation operation period of “block 13”, which is the 13th block, from “block 1” to “block m” is different from the effective accumulation periods of the other blocks.

By making such an electronic shutter setting possible, it becomes possible to take a picture in accordance with the subject. For example, when a part of the subject is a light-emitting body, if the setting of the electronic shutter, that is, the effective accumulation operation period is adjusted to this light-emitting part, the other light-emitting part becomes dark.

However, if the effective accumulation operation period of the pixel, line, or block corresponding to the light emitting portion is set short separately from other portions, a good image can be obtained.

The timing generator 10 described so far.
As another specific example of the switching method 1, it is conceivable to adopt a configuration having a ROM 101l in the timing generation unit 101 as shown in FIG. And ROM 1
ROM address switch 10 capable of switching the address of 01l by a command
By switching by 1 m, the information read from the ROM is changed, and the output signal of the signal generator 101 k that generates a signal for digital processing is changed based on the read information, thereby generating a necessary signal. . The use of ROM reduces the chip area,
It leads to cost reduction.

The configuration of the timing generator 101 in the image sensor 100 according to the present invention has been described above. Next, an example in which a vector detection circuit for detecting a motion vector of a moving image is incorporated in the image sensor will be described.

(Sixth Specific Example) A sixth specific example is shown in FIG.
31 has a moving image data compression circuit 107q for compressing moving image data, or a moving image for compressing moving image data next to the imaging device 100 as shown in FIG. Image data compression circuit 400
This is an example in which a motion vector detection circuit 107r is built in the image sensor.

The motion vector detecting circuit 107r is a circuit for performing a process of detecting a motion vector of an image. What is input to the motion vector detecting circuit 107r and used for processing is the digital signal processing unit 107 This is a luminance signal (Y data). As the luminance signal, the output of the Y color difference signal processing circuit 107p for obtaining Y data and color difference data from the image data output from the A / D unit 106 is used.

In the example shown in FIG. 30, the image sensor 100 has a configuration as shown in FIG. 32 as the digital signal processing unit 107. In the example of FIG. 31, the Y color difference signal processing circuit 107p and the motion vector detection circuit 107q Figure 3 consisting of
The digital signal processing unit 107 has a configuration as shown in FIG. Or, instead of the luminance signal, the area sensor unit 102
An example is considered in which one of a plurality of color filters formed for each pixel is used.

Normally, when a single-chip image sensor is used, one color filter is formed on each pixel (more precisely, each cell that constitutes a pixel), and a plurality of color filters (normally, three color filters) are formed. Or four colors) to obtain a color image.

The plurality of color filters are arranged in a repetitive pattern in a mosaic pattern or a stripe pattern on each cell arrangement surface of the matrix arrangement. Vectors can be calculated, which simplifies the circuit.

For example, in the image sensor 100 having the Bayer array area sensor unit 102 as shown in FIG. 34, the luminance signal is substituted by using the output of the G pixel closest to the luminance signal. is there. FIG. 3 at this time
The configuration of the digital signal processing unit 107 in the third example is as shown in FIG. 35 in a block diagram. That is, the A / D unit 1
06, image data of G pixels is received, Y data and color difference data are created by a Y color difference signal processing circuit 107p, and these are output to the interface unit 108, and A / D
The motion vector detection circuit 107q uses the G pixel image data from the unit 106 to detect a motion vector and output the motion vector to the interface unit 108 as motion vector data.

When the moving image data compression circuit 400 is provided externally to the image sensor 100 as shown in FIG. 31, the motion vector detected by the digital signal processing unit 107 in the image sensor 100 has a code The data is sent from the interface unit 108 to the moving image data compression circuit 400 in the next stage. The data of this motion vector is H.264.
261 and H.E. 263, or MPEGI or MPEG
2, or a motion vector standard itself such as MPEG4 currently being standardized. Also, the standard itself requires a large circuit scale and high-speed processing,
It is also effective to provide auxiliary data of the moving image data compression circuit 400 at the next stage, such as an approximate motion vector, a direction, and whether or not there is a motion. These are advantageous in that the circuit scale of the next-stage moving image compression circuit 400 can be reduced, and high-speed processing can be omitted.

When a camera using the image pickup device 100 of the present invention is mounted on the portable information device described above (see FIG. 17), it is considered that the portable information device is used while being held by the user. At this time, the effect of camera shake may be considered. In this case, the following configuration is useful.

FIG. 36 shows an example in which a motion vector due to camera shake is calculated in the image pickup device 100, converted into data, and output to a moving image data compression circuit in the next stage.
The image data digitally converted by the A / D unit 106 is subjected to signal processing by a Y color difference signal processing circuit 107p to obtain a luminance signal (Y data) and color difference data, and a camera shake motion vector detection circuit 107s is provided. In this configuration, a camera shake motion is detected based on Y data, and the motion is converted into a motion vector and output as camera shake data.

FIG. 37 shows that a portable information device has a built-in sensor 401 for detecting a camera shake amount and outputting the detected amount as data.
The detection data of No. 01 is input to the image sensor 100 of the present invention having a moving image data compression circuit therein, and is incorporated as camera shake correction data in the calculation of a motion vector. It is assumed that the image sensor 100 is mounted on a portable information device as a camera.

At this time, the configuration of the digital signal processing unit 107 in the image sensor 100 is as shown in FIG. That is,
A Y color difference signal processing circuit 107p for obtaining color difference data and Y data from image data, a motion vector detection circuit 107q for detecting a motion vector from the Y data, and shaking data in motion vector data output from the motion vector detection circuit 107q. An adder 107t that adds (subtracts), corrects, and outputs the output is provided, and the output of the camera shake amount detection sensor 401 is provided to the adder 107t of the digital signal processing unit 107 via the interface unit 108.

FIG. 39 shows the next stage of moving image data compression (moving image data compression circuit 400 connected to the outside) based on the data of camera shake sensor 401 and the data of the motion vector output from image sensor 100 of the present invention. 2 shows an example of a configuration to be provided in a portable information device when calculating a motion vector effective for moving image data compression in (1). in this case,
Since the moving image data compression is provided after the image sensor 100, the adder 402 is provided at the output terminal of the motion vector data of the image sensor 100,
Here, the data of the detected camera shake amount and the motion vector data which is one of the outputs of the image sensor 100 are added (subtracted) here to obtain motion vector data in which the camera shake amount is corrected. Then, the motion vector data is provided to the moving image data compression circuit 400 to perform a compression process.

FIGS. 40 and 41 show the motion vector detecting circuit 10 included in the digital signal processor 107 of the image sensor 100.
This is an example in which a motion detection signal can be output outside 7q. The motion vector detection circuit 107 outputs the motion detection signal when the motion vector is detected.
q is configured in advance. Then, the motion vector detection circuit 10
The motion detection signal of No. 7 is drawn out of the image sensor 100 and can be used. When a motion is detected in the imaging range, the system can be notified by the detection signal.

In this way, for example, when this is used for a surveillance camera system, when a motion is detected, it is possible to record a surface image on a recording medium or to issue an alarm, which is beneficial. System construction is possible. Further, when the system is constructed by a personal computer, it is conceivable to make the motion detection signal correspond to the interrupt of the personal computer. The motion detection signal may be output to the outside using a status signal described later.

FIGS. 42 and 43 show the digital processing unit 107.
This is an example in which the effective accumulation period of a moving pixel detected by the motion vector detecting circuit 107q or a block including a moving pixel is changed. The motion vector signal of the motion vector detection circuit 107q is fed back to the timing generation unit 101 as an electronic shutter signal, and the timing generation unit 101 corrects various signals given to the vertical scanning unit 103 and the horizontal scanning unit 104 in correspondence with the motion vector. Then, reading of the area sensor unit 102 is controlled. That is, the electronic shutter is controlled.

In a moving part, the shorter the effective accumulation time, the less the image blurring. Changing the electronic shutter setting according to the magnitude of the motion vector as in this specific example results in further improvement in image quality.

In the case where there is no motion detecting circuit in the image sensor 100 and a moving image data compression circuit including a motion vector detecting unit is connected outside the image sensor 100, the motion vector detection result , The electronic shutter setting of the image sensor 100 may be changed in the form of a command input.

The configuration in which the digital processing unit 107 of the image sensor 100 of the present invention includes the motion vector detection circuit and its application have been described above. Next, the imaging device 10 of the present invention
The 0 interface unit 108 will be described.

(Seventh Specific Example) Interface Unit 108
A configuration example will be described.

FIG. 44 shows an example of the configuration of the interface unit 108, in which the digital image data signal line and the command signal line are different. The image data signal line is dedicated to output, is connected to the output side of an output unit 108a for controlling the output of a signal from the digital signal processing unit 107, and the command signal line is dedicated to input, and inputs an external command to the command decoder 108b. It is for.

In this configuration, although the number of signal lines is increased, connection to the outside is easy, and the configuration in the image pickup device 100 is not complicated. The image data is output according to an output enable signal generated from a signal for operating the image sensor 100.

If the output enable signal is output to the output terminal of the image sensor 100 via the buffer 108c as shown in FIG. 45, the next-stage circuit that receives the image data from the image sensor 100 outputs the output data. The receiving timing is clear and the configuration is simple. FIG. 46 shows the data output timing of the image sensor at this time.

Alternatively, by providing a temporary storage function in the image pickup device, it is possible to output image data in response to a data request from the system. FIG. 47 shows an example in which the command decoder 108b is configured to provide an output enable by an external command to the output unit 108a, and the output unit 108a also outputs image data when receiving the enable signal from the command decoder 108b. .

Thus, the example of FIG. 47 is an example in which data is output by output enable by a command, and the timing is shown in FIG. In this example, since the system can read data without worrying about the timing of the image sensor, the configuration after the image sensor is simplified.

Another example will be described. When the image sensor 100 performs readout in pixel units, a method of reading out one pixel of image data once or a method of reading out image data in plural times can be considered. The former is, for example, the output unit 108
The configuration a has a configuration in which the read data pins for the luminance signal and the chrominance signal are separately provided as in the example of FIG. 49, and is a configuration in which each can be read and output.

In the latter case, for example, as shown in FIG. 50, the output section 108a alternately reads out a luminance signal and a chrominance signal every pixel, every line, every block, or every frame. It is configured. The timing at this time is shown in FIG.

It is also possible to divide a data bit of one pixel into a plurality of times.

For example, as shown in FIG. 52, image data having a resolution of, for example, p bits is read out twice by dividing the upper p / 2 bits and the lower p / 2 bits into two, as shown in FIG. Read it separately. By doing so, as shown in FIG. 53, the number of data signal lines of the image sensor 100 can be reduced by half. The timing at this time is shown in FIG. At this time, if the bit having a greater influence on the circuit at the subsequent stage is output first, the circuit at the subsequent stage is simplified.

For example, MSB (Most Signif)
icant Bit). Of course, if p bits are divided into q times, the number of signal lines can be reduced to p / q.

Another example will be described. FIG. 55 shows that when the image sensor 100 has a circuit for calculating a motion vector, the output unit 108a has an input terminal and an output terminal for image data and motion vector data. This is an example in which a motion vector can be output by a signal line.

FIG. 56 shows the output timing. In this example, the motion vector data is output in synchronization with the image data of the corresponding block in block units. The motion vector data is, for example, H.264. 261 and H.E. 263
Alternatively, a motion vector is output in accordance with standards such as MPEG1, MPEG2, and MPEG4.

FIG. 57 shows an example in which image data and motion vector data are output through a common signal line. By using the same, the number of signal lines of the image sensor can be reduced. The image data input and the motion vector data can be input to the output unit 108a of the interface unit 108, and these can be output to the output line according to the data switching signal. By doing so, both signals can be output on a common signal line.

FIG. 58 shows an example in which a signal determination line can be further output from the example shown in FIG. This is realized by taking out the data switching signal from the interface unit 108 via the buffer and leading it to the terminal of the image sensor 100. FIGS. 59 and 60 show examples of timing.
Shown in FIG. 59 shows switching of image data and motion vector data in accordance with a synchronization signal. In this example, image data is output during a non-blanking period in synchronization with horizontal synchronization, and a motion vector of the image data is output during a subsequent blanking period. It outputs data.

FIG. 60 shows an example in which image data is output in units of blocks, and subsequently, motion vectors of the blocks are output. In the case of the example of FIG. 58, the synchronization signal shown in FIG. 59 may be output by a data determination line, or the data switching signal shown in FIG. 60 may be output by a data determination line.

In the example of FIG. 57, it is necessary to use an external data discrimination signal (not shown). In FIG. 59 and FIG. 60, the motion vector data is placed after both corresponding image data, but may be placed before or in the middle of the image data.

FIG. 61 shows an example in which a command pin, which is a command input terminal provided on the image sensor 100, is an input / output type, and the interface 108 in the image sensor 100 is provided with a command decoder 108b and a status register 108c. . The status register 108c is configured so that its contents can be read by a status read signal, and performs this by externally applying a status read signal. The status such as the frame rate which can be changed by the command, the reading order, the signal processing method inside the image sensor 100, the compression / non-compression, or the number of output pixels and the output format is stored in the status register 108c, and this status is read from the outside This is an example that can be used.

[0189] By doing so, the system using the image sensor 100 can check the state of the image sensor 100.

FIG. 62 shows an example in which the output image data signal line and the command signal line are shared in the interface unit 108. By also using the same, the number of signal lines of the image sensor 100 can be reduced, which leads to cost reduction. The signal lines are input / output lines because they are shared.

As one means for determining data input / output,
Means for writing command data to the image sensor between image data outputs is conceivable.

FIG. 63 shows that when the synchronization signal is blanked,
FIG. 64 shows an example in which command input is enabled, and FIG. 64 shows an example in which a signal line for determining data output is prepared. The timing is shown in FIG. The image sensor 100 is provided with a command write signal terminal, and the command decoder 108b of the interface unit 108 incorporated in the image sensor 100 is configured to receive a command write signal from the command write signal terminal. When this command write signal is received, it is configured to recognize that a command has been input.

This is because when the image pickup device 100 of the present invention is configured such that image data output and command input are performed through a common terminal, the command input is reliably performed by the interface unit 108.
This is a procedure that can be passed to

According to this configuration, when image data is being output, a signal indicating the output state is output from the image sensor 100, and when both image data are not being output, command data can be written. The system using the image sensor 100 checks this signal and writes a command when there is no output of image data.

FIG. 66 shows an example in which image data, command and status signal lines are shared in the image sensor 100. The interface unit 108 has a status register 108c, and the image sensor 100 is provided with a status read signal terminal, to which a status read signal is input. The status read signal is sent to the status register 108
c, the status register 10
8c is configured to output the held status information to the outside.

The configuration shown in FIG. 66 has a data discrimination line indicating whether or not image data is being output, a command write signal line and a status read signal line. Writing and reading of status data can be performed. FIG. 67 shows an example of the timing at this time.

As shown at this timing, it is possible to write a command or read a status during a period in which no image data is being output. A command write request and a status data read request are output during the output of image data. Becomes invalid.

FIG. 68 shows a system in which reading of image data, writing of commands, and reading of status are all performed from the system side outside the image sensor 100.
By providing a storage function in the image sensor 100 as described above, the system can read out image data at an arbitrary time without worrying about a timing signal for operating the image sensor 100. Become. FIG. 69 shows an example of the timing at this time. Except for a request for writing or reading data, the data output of the image sensor has a high impedance. This structure is suitable for accessing the image sensor 100 from a computer.

FIG. 70 shows that an element information recording unit 109 is provided in the image sensor 100, and the characteristics and specifications of the image sensor itself are stored in the element information recording unit 109 and read out from the outside of the image sensor 100 via the interface unit 108. 5 is an example of an image sensor capable of performing the following. As an example of the characteristics and specifications, the image sensor 1
The number of pixels of 00, the aspect ratio of one pixel, the color filter array, the signal processing method, the output data format, the number of frames per second, and the like can be considered. The system can set the image sensor 100 and process data to be output based on this information.

Although the above description has been made with reference to the image pickup device having the basic structure shown in FIG. 1, each specific example can also be implemented by the image pickup device 100 having a structure without the A / D unit and the digital signal processing unit 107. FIG. 71 shows a configuration diagram at this time. The output of the image signal is analog and has a digital input terminal for receiving a command.

As described above, the present invention not only has an imaging function but also has a built-in peripheral circuit that enables various processing of an image to be performed. A functional image sensor can be provided.

[0202]

According to the above-mentioned invention, the present image sensor can output according to the requirements of the system using the same, reducing the number of parts of the entire system, easily adapting to the existing system, or the image sensor itself. It is possible to provide a high-performance imaging device that can achieve cost reduction and any effect that can be applied to a plurality of systems.

[Brief description of the drawings]

FIG. 1 is a block diagram illustrating a basic configuration of a solid-state imaging device according to the present invention.

FIG. 2 is a block diagram showing a configuration example of a timing generator of the image sensor shown in FIG.

FIG. 3 is a block diagram showing another example of the configuration of the timing generator in the image sensor of the present invention.

FIG. 4 is a block diagram of a solid-state imaging device including the timing generator shown in FIG. 3;

FIG. 5 is a configuration example of a digital signal processing unit shown in FIG. 1;

FIG. 6 is a block diagram illustrating another configuration example of a digital signal processing unit in the imaging device of the present invention.

FIG. 7 is another configuration example of a digital signal processing unit in the image sensor of the present invention.

FIG. 8 is a block diagram generalizing the configuration of a digital signal processing unit in the imaging device of the present invention.

FIG. 9 is a diagram illustrating a plurality of reading methods from a solid-state imaging device.

FIG. 10 is a timing chart illustrating how an image signal is output in response to an output command.

FIG. 11 is a timing chart illustrating another specific example of outputting an image signal in response to an output command.

FIG. 12 is a timing chart illustrating a specific example of switching an image signal output rate by a command.

FIG. 13 is an external view of a personal computer incorporating a solid-state imaging device of the present invention.

FIG. 14 is an external view of a personal computer to which the solid-state imaging device of the present invention is connected.

FIG. 15 illustrates a connection between a solid-state imaging device and a personal computer.

FIG. 16 is a configuration diagram of a moving image encoding device using a solid-state imaging device.

FIG. 17 is an external view of a portable information device incorporating a solid-state imaging device of the present invention.

FIG. 18 is a block diagram of a portable information device using a solid-state imaging device.

FIG. 19 is a diagram illustrating a pixel reading order of the solid-state imaging device.

FIG. 20 is a diagram illustrating another pixel reading order of the solid-state imaging device.

FIG. 21 is a block diagram of a timing generator for switching the order of reading pixels.

FIG. 22 is a diagram illustrating subsample reading of pixels.

FIG. 23 is a block diagram of a timing generator capable of reading out sub-samples of pixels.

FIG. 24 illustrates a solid-state imaging device capable of selectively reading out pixels.

FIG. 25 is a diagram illustrating selective reading of pixels.

FIG. 26 is a view for explaining a state in which electronic shutter setting is performed by a command.

FIGS. 27A and 27B are a diagram and a timing chart illustrating how the electronic shutter setting is changed.

FIG. 28 is a diagram and a timing chart for explaining how to set an electronic shutter in block units.

FIG. 29 is a configuration example of a timing generator.

FIG. 30 is a configuration diagram of a solid-state imaging device including a moving image data compression circuit and a motion vector detection unit.

FIG. 31 is a configuration example of a solid-state imaging device having a motion vector detection unit.

FIG. 32 is a configuration diagram of an example of a digital signal processing unit of the solid-state imaging device in FIG. 30;

FIG. 33 is a configuration diagram of an example of a digital signal processing unit of the solid-state imaging device in FIG. 31;

FIG. 34 is a diagram illustrating a pixel configuration example of an area sensor unit of a solid-state imaging device having a motion vector detection unit.

FIG. 35 is a configuration diagram of another example of the digital signal processing unit of the solid-state imaging device.

FIG. 36 is a configuration diagram of another example of the digital signal processing unit of the solid-state imaging device.

FIG. 37 is a configuration example of a portable information device having a camera shake sensor and a solid-state imaging device.

38 is a configuration example of a digital signal processing unit of a solid-state imaging device used in a portable information device having the configuration of FIG. 37.

FIG. 39 is another configuration example of a portable information device having a camera shake sensor and a solid-state imaging device.

FIG. 40 is another specific example of a solid-state imaging device having a motion vector detection unit.

FIG. 41 is another specific example of a solid-state imaging device having a motion vector detection unit.

FIG. 42 is another specific example of a solid-state imaging device having a motion vector detection unit.

FIG. 43 is another specific example of a solid-state imaging device having a motion vector detection unit.

FIG. 44 is a specific example of an interface section of a solid-state imaging device.

FIG. 45 is another specific example of the interface section of the solid-state imaging device.

FIG. 46 is a timing chart of the configuration example in FIG. 45.

FIG. 47 is another specific example of the interface section of the solid-state imaging device.

FIG. 48 is a timing chart of the configuration example in FIG. 47;

FIG. 49 is another specific example of the interface section of the solid-state imaging device.

FIG. 50 is another specific example of the interface section of the solid-state imaging device.

FIG. 51 is a timing chart of the configuration example of FIGS. 49 and 50;

FIG. 52 is another specific example of the interface section of the solid-state imaging device.

FIG. 53 is another specific example of the interface section of the solid-state imaging device.

FIG. 54 is a timing chart of the configuration example of FIGS. 52 and 53;

FIG. 55 is another specific example of the interface section of the solid-state imaging device.

FIG. 56 is a timing chart of the configuration example in FIG. 55;

FIG. 57 is another specific example of the interface section of the solid-state imaging device.

FIG. 58 is another specific example of the interface section of the solid-state imaging device.

FIG. 59 is a timing chart of the configuration example shown in FIG. 57 or 58.

FIG. 60 is another timing chart of the configuration example of FIG. 57 or 58.

FIG. 61 is another specific example of the interface section of the solid-state imaging device.

FIG. 62 is another specific example of the interface section of the solid-state imaging device.

FIG. 63 is a timing chart of the configuration example in FIG. 62;

FIG. 64 is another specific example of the interface section of the solid-state imaging device.

FIG. 65 is a timing chart of the configuration example in FIG. 64;

FIG. 66 is another specific example of the interface section of the solid-state imaging device.

FIG. 67 is a timing chart of the configuration example in FIG. 66.

FIG. 68 is another specific example of the interface section of the solid-state imaging device.

FIG. 69 is a timing chart of the configuration example in FIG. 68.

FIG. 70 is a configuration diagram of another specific example of a solid-state imaging device.

FIG. 71 is a configuration diagram of another specific example of a solid-state imaging device.

FIG. 72 is a view illustrating a configuration example of a conventional CMOS sensor.

73 is a time chart illustrating the operation of the CMOS sensor in FIG. 72.

FIG. 74 is a circuit diagram showing a cell configuration example of the latest CMOS sensor.

75 is a view for explaining a configuration example of a latest CMOS sensor using the cell of FIG. 74.

FIG. 76 is a diagram showing a configuration example of a vertical address circuit.

FIG. 77 is a diagram showing a configuration example of a vertical address circuit.

FIG. 78 is a diagram showing a configuration example of a vertical address circuit.

FIG. 79 is a timing chart illustrating the operation of the CMOS sensor in FIG. 75;

FIG. 80 is a block diagram showing an overall configuration example of a CMOS sensor with reduced noise.

[Explanation of symbols]

 Reference Signs List 101 timing generation unit 102 area sensor unit 103 vertical scanning unit 104 horizontal scanning unit 105 analog signal processing unit 106 A / D conversion unit 107 digital signal processing unit 108 interface unit

Claims (30)

[Claims] 1. An area sensor unit in which pixels for performing photoelectric conversion are arranged two-dimensionally, a pixel selection unit that selects pixels of the area sensor unit and reads an image signal, and performs signal processing on an image signal read from the pixel. An analog-to-digital conversion unit that converts the processed signal into a digital signal; a digital signal processing unit that performs signal processing to convert the digital signal into a digital signal of a required signal format; A solid-state imaging device that outputs a signal to the outside and that can input a command signal from the outside and that performs an operation corresponding to the command; 2. The apparatus according to claim 1, wherein said signal processing section comprises a plurality of signal processing means having different signal formats, and said interface section selectively switches the signal processing means of the digital signal processing section in response to a command signal. 2. The solid-state imaging device according to claim 1, wherein a signal format to be output to the outside can be changed. 3. The solid-state imaging device according to claim 1, wherein the digital signal processing unit performs a moving image signal processing, and the moving image signal processing includes a function of detecting a motion vector. 4. A photoelectric conversion unit corresponding to a specific color filter for detecting a motion vector, wherein each photoelectric conversion unit of the area sensor unit is provided with a color filter for obtaining color image data. 4. The solid-state imaging device according to claim 3, wherein the output image data is used. 5. The solid-state imaging device according to claim 3, wherein the motion vector data is output to the outside. 6. The solid-state imaging device according to claim 5, wherein an external image data output signal line provided in the interface section also serves as a motion vector data output signal line. 7. The digital signal processing section has a signal generating function of notifying that a motion has occurred when a motion is detected in an image by a motion vector detecting function, and a signal line for outputting the notification signal to the outside. 4. The solid-state imaging device according to claim 3, wherein: 8. A portable image system using the solid-state imaging device according to claim 3, wherein a camera shake sensor for detecting a camera shake is built-in. 9. The solid-state imaging device according to claim 1, wherein an external image data output signal line provided in the interface section also serves as an external command input signal line. 10. The interface section has an output signal line for outputting image data to the outside, and this output signal line also serves as an external command input signal line and a status information output signal line inside the image sensor. The solid-state imaging device according to claim 1, wherein: 11. An area sensor unit in which pixels for performing photoelectric conversion are arranged two-dimensionally, a pixel selection unit for selecting pixels of the area sensor unit and reading out an image signal, and an analog signal processing for performing signal processing on the read out image signal. A solid-state imaging device comprising: an output unit for outputting the analog signal to the outside; and an interface unit to which a command signal from the outside can be input. 12. The solid-state imaging device according to claim 1, wherein one frame of digital image data is output to the outside in response to a command signal, or one frame of an analog image signal is output to the outside in response to a command signal. 13. The solid-state imaging device according to claim 12, wherein an effective accumulation operation is always performed in the solid-state imaging device. 14. The solid-state imaging device according to claim 12, wherein an effective accumulation operation is started by inputting a command in the solid-state imaging device. 15. The solid-state imaging device according to claim 1, wherein said solid-state imaging device has a plurality of output frame number setting means per second determined in advance, and the setting is switched by inputting a command. element. 16. An image system using the solid-state image pickup device according to claim 13, 14, or 15, wherein the solid-state image pickup device has a function of a system operating environment, a remaining battery level, or an instruction from a user. An image system comprising: means for determining the number of frames, and means for giving the determination as a command to a solid-state imaging device. 17. The solid-state imaging device according to claim 1, further comprising a pixel selection unit capable of changing a reading order of pixels of the area sensor unit by a command signal. 18. The solid-state imaging device according to claim 1, further comprising a pixel selection section that can select a readout pixel of the area sensor section by a command signal. 19. The solid-state imaging device according to claim 1, further comprising a pixel selection section capable of changing an electronic shutter operation setting by a command signal. 20. The operation setting of the electronic shutter is performed on a pixel-by-pixel basis.
20. The solid-state imaging device according to claim 19, wherein the setting can be made separately for each line or each block. 21. The solid-state imaging device according to claim 1, wherein the interface unit outputs status information in the imaging device to the outside. 22. The solid-state imaging device according to claim 21, wherein an external command input signal line provided in the interface section also serves as an externally output status information output signal line. 23. The solid-state image pickup device according to claim 1, wherein the image pickup device has element information indicating characteristics of the image pickup element itself, and outputs the information to the outside from an interface section. 24. An area sensor unit in which pixels for performing photoelectric conversion are two-dimensionally arranged, a pixel selection unit for selecting a pixel and reading an image signal, an analog signal processing unit for performing signal processing on the read image signal, An analog-to-digital converter for converting the processed signal into a digital signal; a digital signal processor for processing the digital signal; and an interface for outputting the digital signal to the outside. A solid-state imaging device including a motion vector detection function in a signal processing unit. 25. Each photoelectric conversion unit of the area sensor unit has a structure in which a color filter is provided in order to obtain color image data, and a motion vector is detected by a photoelectric conversion unit corresponding to a specific color filter. The solid-state imaging device according to claim 24, wherein output image data is used. 26. The solid-state imaging device according to claim 24, wherein the motion vector data is output to the outside. 27. The solid-state imaging device according to claim 26, wherein an external image data output signal line provided in the interface section also serves as a motion vector data output signal line. 28. A digital signal processing unit, wherein the motion vector detecting function has a function of notifying that a motion has occurred when a motion is detected in an image, and a signal line for outputting the notification information to the outside. 3. The method according to claim 2, wherein
4. The solid-state imaging device of 4. 29. A portable image system using the solid-state imaging device according to claim 24, wherein an image blur sensor is built-in. 30. The solid-state imaging device according to claim 3, further comprising a function of setting an electronic shutter operation in the area sensor section based on an output of the motion detection circuit.