JPH10219080A - Liquid sealing resin composition - Google Patents
Liquid sealing resin compositionInfo
- Publication number
- JPH10219080A JPH10219080A JP3559197A JP3559197A JPH10219080A JP H10219080 A JPH10219080 A JP H10219080A JP 3559197 A JP3559197 A JP 3559197A JP 3559197 A JP3559197 A JP 3559197A JP H10219080 A JPH10219080 A JP H10219080A
- Authority
- JP
- Japan
- Prior art keywords
- fused silica
- resin composition
- parts
- liquid sealing
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体機器におけ
るＣＯＢ（チップ・オン・ボード）用及びＣＯＧ（チッ
プ・オン・グラス）用の封止に好適な、液状封止用樹脂
組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid sealing resin composition suitable for sealing COB (chip-on-board) and COG (chip-on-glass) in semiconductor equipment.
【０００２】[0002]
【従来の技術】半導体機器等の処理に用いられる液状封
止用樹脂のうち、ＣＯＢ用及びＣＯＧ用等に使用される
ものは、作業性に優れていること、不純物イオンが少な
く、耐湿性に優れていること、耐熱性、電気絶縁性、熱
放散性に優れていること、チップにかかる応力が小さい
こと等が要求される。従来は、熱放散性を高め、しかも
チップにかかる応力を低減する方法として、溶融シリカ
を添加することが一般的に採用されてきた。2. Description of the Related Art Among liquid sealing resins used for processing semiconductor devices and the like, those used for COB and COG are excellent in workability, contain few impurity ions, and have high moisture resistance. It is required to be excellent, to be excellent in heat resistance, electric insulation, heat dissipation, and to apply a small stress to the chip. Heretofore, addition of fused silica has generally been employed as a method of increasing the heat dissipation and reducing the stress applied to the chip.
【０００３】[0003]
【発明が解決しようとする課題】しかし、溶融シリカを
多量に添加する方法は、作業性を著しく阻害する傾向に
あり、熱放散性についてはなお不満足であった。However, the method of adding a large amount of fused silica tends to significantly impair the workability, and the heat dissipation is still unsatisfactory.
【０００４】本発明は、上記の事情に鑑みてなされたも
ので、作業性を損なうことなく、応力を低減し、なおか
つ熱放散性を一段と向上させた液状封止用樹脂組成物を
提供するものである。The present invention has been made in view of the above circumstances, and provides a resin composition for liquid encapsulation which has reduced stress and further improved heat dissipation without impairing workability. It is.
【０００５】[0005]
【課題を解決するための手段】本発明者は、上記の目的
を達成しようと鋭意研究を進めた結果、2 種類の粒径の
異なる溶融シリカを用いた後述の樹脂組成物を用いるこ
とにより、上記目的を達成できることを見いだし、本発
明を完成したものである。Means for Solving the Problems The present inventor has made intensive studies to achieve the above-mentioned object, and as a result, by using a resin composition described below using fused silica having two different particle sizes, The inventors have found that the above object can be achieved, and have completed the present invention.
【０００６】即ち、本発明は、（Ａ）エポキシ樹脂、
（Ｂ）平均粒径20〜50μｍの溶融シリカＡ及び平均粒径
0.5 〜1 μｍの溶融シリカＢが混合された溶融シリカ、
（Ｃ）脂環式酸無水物硬化剤並びに（Ｄ）硬化促進剤を
必須成分とすることを特徴とする液状封止用樹脂組成物
である。That is, the present invention provides (A) an epoxy resin,
(B) Fused silica A having an average particle size of 20 to 50 μm and average particle size
Fused silica mixed with 0.5 to 1 μm of fused silica B,
A liquid sealing resin composition comprising (C) an alicyclic acid anhydride curing agent and (D) a curing accelerator as essential components.
【０００７】以下、本発明を詳細に説明する。Hereinafter, the present invention will be described in detail.
【０００８】本発明に用いる（Ａ）エポキシ樹脂として
は、1 分子中に2 個以上のエポキシ基を有する化合物で
あればよく、液状エポキシ樹脂、固形エポキシ樹脂等特
に制限なく広く使用することができる。例えば、汎用さ
れているビスフェノールＡ型エポキシ樹脂、ビスフェノ
ールＦ型エポキシ樹脂、ポリカルボン酸のグリシジルエ
ステル、シクロヘキサン誘導体のエポキシ化によって得
られるエポキシ樹脂等が挙げられ、これらは単独または
2 種以上混合して使用することができる。また、これら
のエポキシ樹脂に、必要に応じて、液状のモノエポキシ
樹脂等を併用することができる。The epoxy resin (A) used in the present invention may be any compound having two or more epoxy groups in one molecule, and can be widely used without any particular limitation, such as liquid epoxy resin and solid epoxy resin. . For example, commonly used bisphenol A type epoxy resin, bisphenol F type epoxy resin, glycidyl ester of polycarboxylic acid, epoxy resin obtained by epoxidation of cyclohexane derivative and the like, and these may be used alone or
Two or more kinds can be used in combination. In addition, a liquid monoepoxy resin or the like can be used in combination with these epoxy resins as necessary.
【０００９】本発明に用いる（Ｂ）溶融シリカは、平均
粒径20〜50μｍの溶融シリカＡと平均粒径0.5 〜1 μｍ
の溶融シリカＢとが混合されたもので、粒径以外には特
に制限なく広く使用できる。溶融シリカの具体的な銘柄
として、ＦＢ−４８Ｘ，ＦＢ−７４Ｘ（旭電化社製、商
品名）、ＳＯ−２５Ｈ（アドマファイン社製、商品名）
等が挙げられる。これら溶融シリカＡと溶融シリカＢの
配合量は、任意の量で組み合わせて使用することができ
る。The fused silica (B) used in the present invention comprises fused silica A having an average particle size of 20 to 50 μm and an average particle size of 0.5 to 1 μm.
And fused silica B, and can be widely used without any particular limitation except for the particle size. As specific brands of fused silica, FB-48X, FB-74X (trade name, manufactured by Asahi Denka Co., Ltd.), SO-25H (trade name, manufactured by Adma Fine Co., Ltd.)
And the like. The blending amounts of the fused silica A and the fused silica B can be used in any combination.
【００１０】本発明に用いる（Ｃ）脂環式酸無水物硬化
剤としては、メチルテトラヒドロ無水フタル酸、メチル
ヘキサヒドロ無水フタル酸、無水メチルハイミック酸な
ど、通常、エポキシ樹脂の硬化剤として使用されるもの
であればよく、特に制限されるものではない。As the alicyclic acid anhydride curing agent (C) used in the present invention, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylhymic anhydride and the like are usually used as curing agents for epoxy resins. It is not particularly limited as long as it is performed.
【００１１】本発明に用いる（Ｄ）硬化促進剤は、イミ
ダゾール系のカプセルタイプ等が好適なものとして挙げ
られ、具体的な化合物としては、ＨＸ−３７４２（旭電
化社製、商品名）等が挙げられる。The (D) curing accelerator used in the present invention is preferably an imidazole capsule type, and specific compounds include HX-3742 (trade name, manufactured by Asahi Denka Co., Ltd.). No.
【００１２】本発明の液状封止用樹脂組成物は、上述し
たエポキシ樹脂、2 種類の粒径の異なる溶融シリカ、脂
環式酸無水物硬化剤および硬化促進剤を必須成分とする
が、本発明の目的に反しない範囲において、その他の無
機充填材、カップリング剤、消泡剤、顔料その他の成分
を添加配合することができる。無機充填材としては、タ
ルク、炭酸カルシウム、水酸化アルミニウムどが挙げら
れ、これらは単独または2 種以上混合して使用すること
ができる。The liquid encapsulating resin composition of the present invention comprises the above-mentioned epoxy resin, fused silica having two different particle sizes, an alicyclic acid anhydride curing agent and a curing accelerator as essential components. Other inorganic fillers, coupling agents, defoamers, pigments, and other components can be added and compounded within a range not contrary to the object of the invention. Examples of the inorganic filler include talc, calcium carbonate, and aluminum hydroxide, and these can be used alone or as a mixture of two or more.
【００１３】これらの各成分すなわち、エポキシ樹脂、
2 種類の粒径の異なる溶融シリカ、脂環式酸無水物硬化
剤および硬化促進剤等を、常法により混合して、十分攪
拌して容易に本発明の液状封止用樹脂組成物を製造する
ことができる。Each of these components, ie, an epoxy resin,
Two kinds of fused silica having different particle diameters, an alicyclic acid anhydride curing agent, a curing accelerator, and the like are mixed by an ordinary method, and sufficiently stirred to easily produce the liquid sealing resin composition of the present invention. can do.
【００１４】[0014]
【作用】本発明の液状封止用樹脂組成物は、エポキシ樹
脂、2 種の異なる粒径の溶融シリカ、硬化剤および硬化
促進剤を必須成分として用いることによって、従来の樹
脂組成物に比較して、低粘度が可能となった。それに伴
って、熱放散性および応力の低減も可能になった。The liquid encapsulating resin composition of the present invention uses an epoxy resin, fused silica having two different particle diameters, a curing agent and a curing accelerator as essential components, and can be compared with conventional resin compositions. As a result, low viscosity has become possible. Accordingly, heat dissipation and reduction of stress have become possible.
【００１５】[0015]
【発明の実施の形態】次に、本発明を実施例によって具
体的に説明する。本発明は、これらの実施例によって限
定されるものではない。以下の実施例および比較例にお
いて「部」とは「重量部」を意味する。Next, the present invention will be specifically described with reference to examples. The present invention is not limited by these examples. In the following Examples and Comparative Examples, “parts” means “parts by weight”.
【００１６】実施例１ ビスフェノールＡジグリシジルエーテルのＥＸＡ８３０
ＣＲＰ（大日本インク社製、商品名）100 部、消泡剤の
ＴＳＡ７２０（東芝シリコーン社製、商品名）0.1 部、
シランカップリング剤0.5 部、平均粒径35μｍ溶融シリ
カのＦＢ−７４Ｘ（旭電化社製、商品名）315 部、およ
び平均粒径0.75μｍ溶融シリカのＳＯ−２５Ｈ（アドマ
テックス社製、商品名）135 部を混合し、次いで硬化剤
としてメチルテトラヒドロ無水フタル酸90部と、硬化促
進剤としてＨＸ−３７４２（旭電化社製、商品名）10部
とを加えて液状封止用樹脂組成物を製造した。Example 1 EXA830 of bisphenol A diglycidyl ether
100 parts of CRP (trade name, manufactured by Dainippon Ink), 0.1 parts of TSA720 (trade name, manufactured by Toshiba Silicone Co., Ltd.)
0.5 parts of a silane coupling agent, 315 parts of FB-74X of fused silica having an average particle diameter of 35 μm (trade name, manufactured by Asahi Denka Co., Ltd.), and SO-25H of fused silica having an average particle diameter of 0.75 μm (trade name, manufactured by Admatechs) 135 parts were mixed, and then 90 parts of methyltetrahydrophthalic anhydride as a curing agent and 10 parts of HX-3742 (trade name, manufactured by Asahi Denka Co., Ltd.) as a curing accelerator were added to produce a liquid sealing resin composition. did.
【００１７】実施例２ ビスフェノールＡジグリシジルエーテルのＥＸＡ８３０
ＣＲＰ（大日本インク社製、商品名）100 部、消泡剤の
ＴＳＡ７２０（東芝シリコーン社製、商品名）0.1 部、
シランカップリング剤0.5 部、平均粒径35μｍ溶融シリ
カのＦＢ−４８Ｘ（旭化成社製、商品名）315 部、およ
び平均粒径0.75μｍ溶融シリカのＳＯ−２５Ｈ（アドマ
テックス社製、商品名）135 部を混合し、次いで硬化剤
としてメチルテトラヒドロ無水フタル酸90部と、硬化促
進剤としてＨＸ−３７４２（旭化成社製、商品名）15部
とを加えて液状封止用樹脂組成物を製造した。EXAMPLE 2 EXA830 of bisphenol A diglycidyl ether
100 parts of CRP (trade name, manufactured by Dainippon Ink), 0.1 parts of TSA720 (trade name, manufactured by Toshiba Silicone Co., Ltd.)
0.5 parts of a silane coupling agent, 315 parts of FB-48X of a fused silica having an average particle diameter of 35 μm (trade name, manufactured by Asahi Kasei Corporation), and 135 parts of SO-25H of a fused silica having an average particle diameter of 0.75 μm (trade name, manufactured by Admatechs) 135 Then, 90 parts of methyltetrahydrophthalic anhydride as a curing agent and 15 parts of HX-3742 (trade name, manufactured by Asahi Kasei Corporation) as a curing accelerator were added to prepare a liquid sealing resin composition.
【００１８】比較例１ ビスフェノールＡジグリシジルエーテルのＥＸＡ８３０
ＣＲＰ（大日本インク社製、商品名）100 部、消泡剤の
ＴＳＡ７２０（東芝シリコーン社製、商品名）0.1 部、
シランカップリング剤0.5 部、溶融シリカのＭ２５７４
（日本化学工業社製、商品名）450 部を混合して、次い
で硬化剤としてメチルテトラヒドロ無水フタル酸90部
と、硬化促進剤としてＨＸ−３７４２（旭化成社製、商
品名）10部とを加えて液状封止用樹脂組成物を製造し
た。Comparative Example 1 EXA830 of bisphenol A diglycidyl ether
100 parts of CRP (trade name, manufactured by Dainippon Ink), 0.1 parts of TSA720 (trade name, manufactured by Toshiba Silicone Co., Ltd.)
0.5 part of silane coupling agent, M2574 of fused silica
450 parts (manufactured by Nippon Chemical Industry Co., Ltd.) are mixed, and then 90 parts of methyltetrahydrophthalic anhydride as a curing agent and 10 parts of HX-3742 (manufactured by Asahi Kasei Corporation) as a curing accelerator are added. Thus, a liquid sealing resin composition was produced.
【００１９】比較例２ ビスフェノールＡジグリシジルエーテルのＥＸＡ８３０
ＣＲＰ（大日本インク社製、商品名）100 部、消泡剤の
ＴＳＡ７２０（東芝シリコーン社製、商品名）0.1 部、
シランカップリング剤0.5 部、溶融シリカのＦＢ−７４
Ｘ（旭電化社製、商品名）450 部を混合して、次いで硬
化剤としてメチルテトラヒドロ無水フタル酸90部と、硬
化促進剤としてＨＸ−３７４２（旭化成社製、商品名）
15部とを加えて液状封止用樹脂組成物を製造した。Comparative Example 2 EXA830 of bisphenol A diglycidyl ether
100 parts of CRP (trade name, manufactured by Dainippon Ink), 0.1 parts of TSA720 (trade name, manufactured by Toshiba Silicone Co., Ltd.)
0.5 parts of silane coupling agent, FB-74 of fused silica
X (Asahi Denka Co., Ltd., 450 parts), then 90 parts of methyltetrahydrophthalic anhydride as a curing agent, and HX-3742 (Asahi Kasei Co., Ltd., a trade name) as a curing accelerator.
Then, 15 parts were added to produce a liquid sealing resin composition.
【００２０】実施例１〜２及び比較例１〜２によって製
造した液状封止用樹脂組成物を用いて加熱硬化させた。
これらの液状及び硬化物特性（粘度、ガラス転移点、線
膨張係数、曲げ強さ）を試験したので、その結果を表１
に示した。本発明の効果を確認することができた。The liquid sealing resin compositions prepared in Examples 1 and 2 and Comparative Examples 1 and 2 were cured by heating.
These liquid and cured product properties (viscosity, glass transition point, coefficient of linear expansion, flexural strength) were tested.
It was shown to. The effect of the present invention could be confirmed.
【００２１】[0021]
【表１】 [Table 1]
Claims (1)
〜50μｍの溶融シリカＡ及び平均粒径0.5 〜1 μｍの溶
融シリカＢが混合された溶融シリカ、（Ｃ）脂環式酸無
水物硬化剤並びに（Ｄ）硬化促進剤を必須成分とするこ
とを特徴とする液状封止用樹脂組成物。(A) an epoxy resin, (B) an average particle diameter of 20
And (C) an alicyclic acid anhydride curing agent and (D) a curing accelerator as essential components. A fused silica obtained by mixing fused silica A having a particle size of 50 to 50 μm and fused silica B having an average particle size of 0.5 to 1 μm. Characteristic resin composition for liquid encapsulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3559197A JPH10219080A (en) | 1997-02-04 | 1997-02-04 | Liquid sealing resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3559197A JPH10219080A (en) | 1997-02-04 | 1997-02-04 | Liquid sealing resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10219080A true JPH10219080A (en) | 1998-08-18 |
Family
ID=12446044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3559197A Pending JPH10219080A (en) | 1997-02-04 | 1997-02-04 | Liquid sealing resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10219080A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007086324A1 (en) | 2006-01-27 | 2007-08-02 | Idemitsu Kosan Co., Ltd. | Adamantane derivative, resin composition containing same, and optoelectronic member and sealing agent for electronic circuit using those |
-
1997
- 1997-02-04 JP JP3559197A patent/JPH10219080A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007086324A1 (en) | 2006-01-27 | 2007-08-02 | Idemitsu Kosan Co., Ltd. | Adamantane derivative, resin composition containing same, and optoelectronic member and sealing agent for electronic circuit using those |
| US8084650B2 (en) | 2006-01-27 | 2011-12-27 | Idemitsu Kosan Co., Ltd. | Adamantane derivative, resin composition containing same, and optoelectronic member and sealing agent for electronic circuit using those |
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